COMPUTER-ON-MODULES - Konzept
Die Nutzung von Computer-on-Modules ist bei weitem das am häufigsten eingesetzte Embedded-Design-Prinzip. Es ermöglicht Ingenieuren, kostengünstig dedizierte Systeme zu entwerfen, indem sie anwendungsspezifische Trägerplatinen-Designs mit einsatzbereiten und einfach zu integrierenden Modulen kombinieren. Als Super-Komponenten beinhalten diese Module alle wichtigen Bausteine wie CPU, GPU und RAM sowie eine breite Palette von Standard-Schnittstellen in einem funktional validierten Komplettpaket.
Je nach Leistungs- und Platzanforderungen sind verschiedene Computer-on-Module-Formfaktor-Standards erhältlich. Namentlich: COM-HPC, COM Express, SMARC und Qseven. Computer-on-Module des gleichen Standards sind untereinander frei austauschbar, sowohl über Prozessor-Generationen hinweg als auch zwischen Herstellern. Dies gibt Designern volle Flexibilität beim Skalieren und Upgraden von Lösungen für eine langfristige Rendite auf NRE-Investitionen.
Die Nutzung von Computer-on-Modules ist bei weitem das am häufigsten eingesetzte Embedded-Design-Prinzip. Es ermöglicht Ingenieuren, kostengünstig dedizierte Systeme zu entwerfen, indem sie anwendungsspezifische Trägerplatinen-Designs mit einsatzbereiten und einfach zu integrierenden Modulen kombinieren. Als Super-Komponenten beinhalten diese Module alle wichtigen Bausteine wie CPU, GPU und RAM sowie eine breite Palette von Standard-Schnittstellen in einem funktional validierten Komplettpaket.
Je nach Leistungs- und Platzanforderungen sind verschiedene Computer-on-Module-Formfaktor-Standards erhältlich. Namentlich: COM-HPC, COM Express, SMARC und Qseven. Computer-on-Module des gleichen Standards sind untereinander frei austauschbar, sowohl über Prozessor-Generationen hinweg als auch zwischen Herstellern. Dies gibt Designern volle Flexibilität beim Skalieren und Upgraden von Lösungen für eine langfristige Rendite auf NRE-Investitionen.
Computer-On-Module
congatec conga-X7EVAL - Evaluation Board Evaluation Carrier Board for COM Express Type 7
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congatec conga-X7EVAL - Evaluation BoardEvaluation Carrier Board for COM Express Type 7
Beispiel Menü
/* CSS-Variable für die Breite der schwarzen Buttons */
:root {
--black-button-width: 120px;
}
/* Menüleiste: Flexbox für gleichmäßig verteilte Menüeinträge */
ul.menu {
list-style-type: none;
margin: 0;
padding: 0;
background-color: white;
overflow: hidden;
font-family: 'Ubuntu', sans-serif;
display: flex; /* Flexbox */
width: 100%;
}
/* Menüeinträge */
li.menu-item {
padding: 0;
text-align: center;
border-right: 5px solid white;
display: block;
text-align: center;
text-decoration: none;
border-radius: 3px;
transition: background-color 0.3s, color 0.3s; /* Smooth transition for hover effect */
}
li.menu-item a {
display: block;
color: white;
text-align: center;
text-decoration: none;
padding: 10px 20px;
font-size: 16px;
font-weight: 500;
border-radius: 3px;
transition: background-color 0.3s, color 0.3s; /* Smooth transition for hover effect */
}
/* Stretch-Element */
.stretch {
flex-grow: 1;
height: 30px;
}
li.menu-item a:hover {
color: black !important; /* Ensures text color change on hover */
background-color: #f7c13d !important; /* Ensures background color change on hover */
}
/* Aktiver Menüeintrag: Hintergrundfarbe und Schriftgewicht bei Aktivierung */
li.menu-item a:active {
color: #2b3136; /* Textfarbe beim aktiven Zustand */
font-weight: bolder; /* Fettere Schrift */
background-color: CornflowerBlue; /* Hintergrundfarbe beim aktiven Zustand */
}
Datenblatt
Handbuch
System Integration
Unverbindliche Beratung: +49(0)7665 9390 185
ÜbersichtKey FeaturesEvaluation Carrier Board für COM Express Type 7 ModuleSpezifikation
To achieve a quick start with COM Express Type 7 modules congatec offers an evaluation carrier board, which routes all the signals to standard interface connectors.
Internal connectors
32x PCIe lanes (1x PCIe (3.0) x16
1x PCIe(3.0)x8 | 5th lane shared with BMC | 2x PCIe (3.0) x4)
2x SATA Gen3
1x LPC header
1x I²C Bus | 1x SM Bus | 1x GPIO
1x FAN control
External connectors
4x USB 3.0/2.0 | 4th USB2.0 shared with BMC
1x VGA connecting DB-15 | 1x COM port from module
Ethernet
4x 10 Gigabit Ethernet SFP+ | 1x Gbe RJ45
Baseboard Management Controller
1x VGA | iKVM | virtual storage
Buttons
Power button | Reset button | Sleep button | LID button
Postcode
4x 7-Segment Postcode LEDs connected to GP_I2C bus
Power
Input ATX Power Supply | 12V/GND banana jacks
Temperature
Commercial: Operating: 0 .. +60°C | Storage: -40 .. +85°C
Industrial: Operating: -40 .. +85°C | Storage: -40 .. +85°C
Humidity
Operating: 10 - 90% r. H. non cond. | Storage: 5 - 95% r. H. non cond.
Size
294 x 244 mm (11.5” x 9.6”)
Produktvarianten / Zubehör065420conga-X7EVALcongatec COM Express Type7 evaluation carrier with 4x 10Gbe Ethernet. Commercial temperature range.065421conga-X7EVAL/industrialEvaluation Carrier Board for COM Express Type 7 modules with four 10GbE SFP+ fiber/copper ports. No BMC. Extended temperature range from -40°C to 85°C.Zubehör065420conga-X7EVALcongatec COM Express Type7 evaluation carrier with 4x 10Gbe Ethernet. Commercial temperature range.065421conga-X7EVAL/industrialEvaluation Carrier Board for COM Express Type 7 modules with four 10GbE SFP+ fiber/copper ports. No BMC. Extended temperature range from -40°C to 85°C.Bitte stellen Sie sicher, dass Sie stets die aktuellsten Version der Produktspezifikationen des Herstellers verwenden. Hersteller-Produktseite: conga-X7EVALMCTX Mobile & Embedded Computers GmbH IST UM DIE RICHTIGKEIT UND AKTUALITÄT DER DATEN AUF DIESER WEBSEITE BEMÜHT, ÜBERNIMMT JEDOCH KEINERLEI ZUSICHERUNG BEZÜGLICH DES INHALTS. EINE HAFTUNG ODER GARANTIE FÜR DIE AKTUALITÄT, RICHTIGKEIT UND VOLLSTÄNDIGKEIT DER ZUR VERFÜGUNG GESTELLTEN INFORMATIONEN IST FOLGLICH AUSGESCHLOSSEN.Technische Unterstützung & System Integration Services
Alle Dokumente auf dieser Seite werden ohne Benachrichtigung aktualisiert.DatenblattHandbuch
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congatec conga-TS570 - COM Express Basic Type 6 CPU-Modul mit Intel® Tiger Lake COM Express Type 6 Basic module based on 11th Generation Intel® Core™ processor family (code name "Tiger Lake-H")
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color: #4B70B2;}
.col_a {
background-color: #798490;
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.head_subsec {color: CornflowerBlue;
padding-top: 10px;padding-left: 10px;
padding-right: 25px;
vertical-align: bottom;
}
.chead {
border: 1px solid Lavender;
font-size: 90%;
font-weight: bolder;}
.ckey {
width: 25%;white-space: nowrap;text-align: left;font-size: 90%;
font-weight: bolder;
border: 1px solid Lavender;word-break: break-word;
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width: 25%;text-align: left;font-size: 90%;
font-weight: bolder;
border: 1px solid Lavender;word-break: break-word;
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width: auto;text-align: left;
border: 1px solid Lavender;
word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;}
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font-size: 110%;
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width: 250px;white-space: nowrap;text-align: left;
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width: 100%;
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table-layout: fixed;
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font-size: 100%;
line-height: 1.5;
padding-top: 5px;
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padding-bottom: 5px;
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th {
font-size: 90%;
padding-left: 25px;
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td {
word-break: break-word;
font-size: 90%;
padding-top: 10px;
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padding-right: 25px;
vertical-align: top;
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#prod_kf {
font-size: 100%;width: 100%;}
#prod_spec {
font-size: 100%;word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;
}
#prod_spec_embed {
word-break: break-word;
font-size: 90%;
padding-top: 10px;width: 100%;}
#prod_disc {
font-size: 90%;
width: 100%;}
#prod_cpo {font-size: 90%;
width: 100%;
word-break: break-word;
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#prod_var {
word-break: break-word;
font-size: 90%;
padding-top: 10px;
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congatec conga-TS570 - COM Express Basic Type 6 CPU-Modul mit Intel® Tiger LakeCOM Express Type 6 Basic module based on 11th Generation Intel® Core™ processor family (code name "Tiger Lake-H")
Beispiel Menü
/* CSS-Variable für die Breite der schwarzen Buttons */
:root {
--black-button-width: 120px;
}
/* Menüleiste: Flexbox für gleichmäßig verteilte Menüeinträge */
ul.menu {
list-style-type: none;
margin: 0;
padding: 0;
background-color: white;
overflow: hidden;
font-family: 'Ubuntu', sans-serif;
display: flex; /* Flexbox */
width: 100%;
}
/* Menüeinträge */
li.menu-item {
padding: 0;
text-align: center;
border-right: 5px solid white;
display: block;
text-align: center;
text-decoration: none;
border-radius: 3px;
transition: background-color 0.3s, color 0.3s; /* Smooth transition for hover effect */
}
li.menu-item a {
display: block;
color: white;
text-align: center;
text-decoration: none;
padding: 10px 20px;
font-size: 16px;
font-weight: 500;
border-radius: 3px;
transition: background-color 0.3s, color 0.3s; /* Smooth transition for hover effect */
}
/* Stretch-Element */
.stretch {
flex-grow: 1;
height: 30px;
}
li.menu-item a:hover {
color: black !important; /* Ensures text color change on hover */
background-color: #f7c13d !important; /* Ensures background color change on hover */
}
/* Aktiver Menüeintrag: Hintergrundfarbe und Schriftgewicht bei Aktivierung */
li.menu-item a:active {
color: #2b3136; /* Textfarbe beim aktiven Zustand */
font-weight: bolder; /* Fettere Schrift */
background-color: CornflowerBlue; /* Hintergrundfarbe beim aktiven Zustand */
}
Datenblatt
Handbuch
System Integration
Unverbindliche Beratung: +49(0)7665 9390 185
ÜbersichtKey FeaturesCPUEmbedded/Industrial use conditionExtended temperature options availablePCI Express Gen 4AI/DL Instruction Sets including VNNIOptional onboard NVMe SSDIntegrated Xe (Gen 12) graphics with 32 EUProduct video
CPU Produktfamilie: Intel® Tiger Lake
Intel® Xeon® W-11865MRE (24M Cache, bis zu 4.70 GHz)Intel® Xeon® W-11865MLE (24M Cache, bis zu 4.50 GHz)Intel® Xeon® W-11555MRE (12M Cache, bis zu 4.50 GHz)Intel® Xeon® W-11555MLE (12M Cache, bis zu 4.40 GHz)Intel® Xeon® W-11155MRE (8M Cache, bis zu 4.40 GHz)Intel® Xeon® W-11155MLE (8M Cache, bis zu 3.10 GHz)Intel® Core™ i7-11850HE (24M Cache, bis zu 4.70 GHz)Intel® Core™ i5-11500HE (12M Cache, bis zu 4.50 GHz)Intel® Core™ i3-11100HE (8M Cache, bis zu 4.40 GHz)Intel® Celeron® 6600HE (8M Cache, bis zu 2.60 GHz)CPU-Varianten
CPU
Processor Number
Cache
Total Cores
Total Threads
Max Turbo Frequency
Intel® Core™ i7-11850HE
i7-11850HE
24 MB Intel® Smart Cache
8
16
4.70 GHz
Intel® Core™ i5-11500HE
i5-11500HE
12 MB Intel® Smart Cache
6
12
4.50 GHz
Intel® Core™ i3-11100HE
i3-11100HE
8 MB Intel® Smart Cache
4
8
4.40 GHz
Intel® Xeon® W-11865MRE
W-11865MRE
24 MB Intel® Smart Cache
8
16
4.70 GHz
Intel® Xeon® W-11865MLE
W-11865MLE
24 MB Intel® Smart Cache
8
16
4.50 GHz
Intel® Xeon® W-11555MRE
W-11555MRE
12 MB Intel® Smart Cache
6
12
4.50 GHz
Intel® Xeon® W-11555MLE
W-11555MLE
12 MB Intel® Smart Cache
6
12
4.40 GHz
Intel® Xeon® W-11155MRE
W-11155MRE
8 MB Intel® Smart Cache
4
8
4.40 GHz
Intel® Xeon® W-11155MLE
W-11155MLE
8 MB Intel® Smart Cache
4
8
3.10 GHz
Intel® Celeron® 6600HE
6600HE
8 MB Intel® Smart Cache
2
2
SpezifikationFormfactorCOM Express BasicCPUIntel® Xeon® W-11155MLE(4 x 1.8 GHz, 8 MB cache, 25W)Intel® Xeon® W-11555MLE(6 x 1.9 GHz, 12 MB cache, 25W)Intel® Xeon® W-11865MLE(8 x 1.5 GHz, 24 MB cache, 25W)Intel® Xeon® W-11155MRE(4 x 2.4 GHz, 8 MB cache, 45W)Intel® Xeon® W-11555MRE(6 x 2.6 GHz, 12 MB cache, 45W)Intel® Xeon® W-11865MRE(8 x 2.6 GHz, 24 MB cache, 45W)Intel® Celeron® 6600HE(2 x 2.6 GHz, 8 MB cache, 35W)Intel® Core™ i3-11100HE(4 x 2.4 GHz, 8 MB cache, 45W)Intel® Core™ i5-11500HE(6 x 2.6 GHz, 12 MB cache, 45W)Intel® Core™ i7-11850HE(8 x 2.6 GHz, 24 MB cache, 45W)DRAMUp to 3 SO-DIMM sockets for DDR4 ECC memory modules up to 32 GByte each (96 GByte total) with 3200 MT/sEthernet1 x 2.5 GbE with TSN support via Intel® i226 Ethernet controller seriesI/O Interfaces8 x PCIe Gen3LPC bus8 x GPIOs2 x UARTSPI4 x SATA III (6Gb/s)8 x USB 2.04 x USB 3.1 Gen2PEG support x16 (PCIe Gen4)I²C busGraphicsIntegrated Xe (Gen 12) graphics engine with up to 32 EU (Execution Units) | Supporting 4 independent display units (4x 4k/2x 8K) | Enhanced media (AV1/12b) with up to 2 Vdbox | Next Gen IPU6 with DPHY2.1 | DP 1.4congatec Board ControllerMulti Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirectionembedded BIOS FeaturesAMI Aptio UEFI32 MByte serial SPI firmware flashOEM LogoOEM CMOS DefaultsLCD ControlDisplay Auto DetectionBacklight ControlFlash UpdateSecurityTrusted Platform Module (TPM 2.0)Power ManagementACPI 6.0 with battery supportOperating SystemsMicrosoft® Windows® 10Microsoft® Windows 10 IoT EnterpriseLinuxYoctoHypervisorRTS Real-Time HypervisorTemperatureCommercial: Operating: 0 to +60°C | Storage: -20 to +80°CIndustrial: Operating: -40 to +85°C | Storage: -40 to +85°CHumidityOperating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.Video Interfaces3x DP/DP++ | 1x eDP /LVDSSize95 x 125 mm (3.74" x 4.92")Produktvarianten / Zubehör050700conga-TS570/i7-11850HECOM Express Type 6 Basic module based on Intel® Core™ i7-11850HE 8-core processor with 2.6GHz up to 4.7GHz turbo boost, 24MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset QM580E | Intel® Tiger Lake-H | Commercial temperature range050701conga-TS570/i5-11500HECOM Express Type 6 Basic module based on Intel® Core™ i5-11500HE 6-core processor with 2.6GHz up to 4.5GHz turbo boost, 12MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset QM580E | Intel® Tiger Lake-H | Commercial temperature range050702conga-TS570/i3-11100HECOM Express Type 6 Basic module based on Intel® Core™ i3-11100HE 4-core processor with 2.4GHz up to 4.4GHz turbo boost, 8MB Intel® Smart Cache, Intel® UHD Graphics with 16EU and dual channel DDR4 3200 MT/s memory interface. | Chipset HM570E | Intel® Tiger Lake-H | Commercial temperature range050703conga-TS570/6600HECOM Express Type 6 Basic module based on Intel® Celeron® 6600HE 2-core processor with 2.6GHz base frequency, 8MB Intel® Smart Cache, Intel® UHD Graphics with 16EU and dual channel DDR4 3200 MT/s memory interface. | Chipset HM570E | Intel® Tiger Lake-H | Commercial temperature range050710conga-TS570/W-11865MRECOM Express Type 6 Basic module based on Intel® Xeon® W-11865MRE 8-core processor with 2.6GHz up to 4.7GHz turbo boost, 24MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Industrial temperature range050711conga-TS570/W-11555MRECOM Express Type 6 Basic module based on Intel® Xeon® W-11555MRE 6-core processor with 2.6GHz up to 4.5GHz turbo boost, 12MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Industrial temperature range050712conga-TS570/W-11155MRECOM Express Type 6 Basic module based on Intel® Xeon® W-11155MRE 4-core processor with 2.4GHz up to 4.4GHz turbo boost, 8MB Intel® Smart Cache, Intel® UHD Graphics with 16EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Industrial temperature range050713conga-TS570/W-11865MLECOM Express Type 6 Basic module based on Intel® Xeon® W-11865MLE 8-core processor with 1.5GHz up to 4.5GHz turbo boost, 24MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Commercial temperature range050714conga-TS570/W-11555MLECOM Express Type 6 Basic module based on Intel® Xeon® W-11555MLE 6-core processor with 1.9GHz up to 4.4GHz turbo boost, 12MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Commercial temperature range050715conga-TS570/W-11155MLECOM Express Type 6 Basic module based on Intel® Xeon® W-11155MLE 4-core processor with 1.8GHz up to 3.1GHz turbo boost, 8MB Intel® Smart Cache, Intel® UHD Graphics with 16EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Embedded temperature range 0°C to 60°C.Zubehör050750conga-TS570/CSA-HP-BStandard active cooling solution for high performance COM Express module conga-TS570 with integrated heat pipes, 29mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.050751conga-TS570/CSA-HP-TStandard active cooling solution for high performance COM Express module conga-TS570 with integrated heat pipes, 29mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.050752conga-TS570/CSP-HP-BStandard passive cooling solution for high performance COM Express module conga-TS570 with integrated heat pipes, 28mm overall heat sink height. All standoffs are with 2.7mm bore hole.050753conga-TS570/CSP-HP-TStandard passive cooling solution for high performance COM Express module conga-TS570 with integrated heat pipes, 28mm overall heat sink height. All standoffs are M2.5mm thread.050754conga-TS570/HSP-HP-BStandard heatspreader for high performance COM Express module conga-TS570 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole.050755conga-TS570/HSP-HP-TStandard heatspreader for high performance COM Express module conga-TS570 with integrated heat pipes, 11mm overall heat sink height. All standoffs are M2.5mm thread.050756conga-TS570/HPAStandard heatpipe adapter for high performance COM Express module conga-TS570.068793DDR4-SODIMM-3200 (4GB)DDR4 SODIMM memory module with 3200 MT/s and 4GB RAM068794DDR4-SODIMM-3200 (8GB)DDR4 SODIMM memory module with 3200 MT/s and 8GB RAM068798DDR4-SODIMM-3200 (16GB)DDR4 SODIMM memory module with 3200 MT/s and 16GB RAM068825DDR4-SODIMM-3200 (4GB) / i-tempDDR4 SODIMM memory module with up to 3200 MT/s and 4GB RAM, industrial temp -40°C to +85°C068826DDR4-SODIMM-3200 (8GB) / i-tempDDR4 SODIMM memory module with up to 3200 MT/s and 8GB RAM, industrial temp -40°C to +85°C068827DDR4-SODIMM-3200 (16GB) / i-tempDDR4 SODIMM memory module with up to 3200 MT/s and 16GB RAM, industrial temp -40°C to +85°C068837DDR4-SODIMM-3200 (32GB) / i-tempDDR4 SODIMM memory module with up to 3200 MT/s and 32GB RAM, industrial temp -40°C to +85°C068736DDR4-SODIMM-3200 ECC (4GB)DDR4 ECC SODIMM memory module with 3200 MT/s and 4GB RAM068737DDR4-SODIMM-3200 ECC (8GB)DDR4 ECC SODIMM memory module with 3200 MT/s and 8GB RAM068738DDR4-SODIMM-3200 ECC (16GB)DDR4 ECC SODIMM memory module with 3200 MT/s and 16GB RAM065810conga-TEVAL2Evaluation carrier board for COM Express Type6 Rev. 3.0 modules.27000001Design-In TrainingDesign-Training to develop carrier boards for Computer on ModulesBitte stellen Sie sicher, dass Sie stets die aktuellsten Version der Produktspezifikationen des Herstellers verwenden. Hersteller-Produktseite: conga-TS570MCTX Mobile & Embedded Computers GmbH IST UM DIE RICHTIGKEIT UND AKTUALITÄT DER DATEN AUF DIESER WEBSEITE BEMÜHT, ÜBERNIMMT JEDOCH KEINERLEI ZUSICHERUNG BEZÜGLICH DES INHALTS. EINE HAFTUNG ODER GARANTIE FÜR DIE AKTUALITÄT, RICHTIGKEIT UND VOLLSTÄNDIGKEIT DER ZUR VERFÜGUNG GESTELLTEN INFORMATIONEN IST FOLGLICH AUSGESCHLOSSEN.Technische Unterstützung & System Integration Services
Alle Dokumente auf dieser Seite werden ohne Benachrichtigung aktualisiert.DatenblattHandbuch
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congatec conga-TS370 - COM Express Basic Type 6 CPU-Modul mit Intel® Coffee Lake COM Express Type 6 Basic module based on 8th Generation Intel® Core™ processor family
.product-menu-page {
font-family: 'Ubuntu', sans-serif;
color: #3f4c58;
}
.text_bold {
font-weight: bolder;
}
.product-menu-page {
display: none;
}
.product-menu-page:target {
display: block;
}
.head_sec {
background-color: #e9e9f0;
color: #4B70B2;}
.col_a {
background-color: #798490;
}
.head_subsec {color: CornflowerBlue;
padding-top: 10px;padding-left: 10px;
padding-right: 25px;
vertical-align: bottom;
}
.chead {
border: 1px solid Lavender;
font-size: 90%;
font-weight: bolder;}
.ckey {
width: 25%;white-space: nowrap;text-align: left;font-size: 90%;
font-weight: bolder;
border: 1px solid Lavender;word-break: break-word;
}
.copt {
width: 25%;text-align: left;font-size: 90%;
font-weight: bolder;
border: 1px solid Lavender;word-break: break-word;
}
.cval {
width: auto;text-align: left;
border: 1px solid Lavender;
word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;}
.rowspecsim {
font-size: 110%;
white-space: nowrap;text-align: left;
}
.column_1 {
width: 250px;white-space: nowrap;text-align: left;
}
.column_2 {
width: 250px;white-space: nowrap;text-align: left;
}
table {
margin-top: 10px;
width: 100%;
border-collapse: collapse;
table-layout: fixed;
}
th, td {
border: 1px solid White;text-align: left;
word-break: break-word;
font-size: 100%;
line-height: 1.5;
padding-top: 5px;
padding-left: 10px;
padding-bottom: 5px;
}
th {
font-size: 90%;
padding-left: 25px;
}
td {
word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;
}
#prod_kf {
font-size: 100%;width: 100%;}
#prod_spec {
font-size: 100%;word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;
}
#prod_spec_embed {
word-break: break-word;
font-size: 90%;
padding-top: 10px;width: 100%;}
#prod_disc {
font-size: 90%;
width: 100%;}
#prod_cpo {font-size: 90%;
width: 100%;
word-break: break-word;
}
#prod_var {
word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;
}
congatec conga-TS370 - COM Express Basic Type 6 CPU-Modul mit Intel® Coffee LakeCOM Express Type 6 Basic module based on 8th Generation Intel® Core™ processor family
Beispiel Menü
/* CSS-Variable für die Breite der schwarzen Buttons */
:root {
--black-button-width: 120px;
}
/* Menüleiste: Flexbox für gleichmäßig verteilte Menüeinträge */
ul.menu {
list-style-type: none;
margin: 0;
padding: 0;
background-color: white;
overflow: hidden;
font-family: 'Ubuntu', sans-serif;
display: flex; /* Flexbox */
width: 100%;
}
/* Menüeinträge */
li.menu-item {
padding: 0;
text-align: center;
border-right: 5px solid white;
display: block;
text-align: center;
text-decoration: none;
border-radius: 3px;
transition: background-color 0.3s, color 0.3s; /* Smooth transition for hover effect */
}
li.menu-item a {
display: block;
color: white;
text-align: center;
text-decoration: none;
padding: 10px 20px;
font-size: 16px;
font-weight: 500;
border-radius: 3px;
transition: background-color 0.3s, color 0.3s; /* Smooth transition for hover effect */
}
/* Stretch-Element */
.stretch {
flex-grow: 1;
height: 30px;
}
li.menu-item a:hover {
color: black !important; /* Ensures text color change on hover */
background-color: #f7c13d !important; /* Ensures background color change on hover */
}
/* Aktiver Menüeintrag: Hintergrundfarbe und Schriftgewicht bei Aktivierung */
li.menu-item a:active {
color: #2b3136; /* Textfarbe beim aktiven Zustand */
font-weight: bolder; /* Fettere Schrift */
background-color: CornflowerBlue; /* Hintergrundfarbe beim aktiven Zustand */
}
Datenblatt
Handbuch
System Integration
Unverbindliche Beratung: +49(0)7665 9390 185
ÜbersichtKey FeaturesCPU8th Generation Intel® Core™ processor with up to 6 CoresIntel® Xeon® processors for data center applicationsSupport for USB 3.1 Gen2 with 10Gbit/sIntel® Optane™ memory supportECC memory supportUp to 64 GByte dual channel DDR4 memory
CPU Produktfamilie: Intel® Coffee Lake
Intel® Xeon® E-2276ML (12M Cache, 2.00 GHz)Intel® Xeon® E-2276ME (12M Cache, 2.80 GHz)Intel® Xeon® E-2254ML (8M Cache, 1.70 GHz)Intel® Xeon® E-2254ME (8M Cache, 2.60 GHz)Intel® Core™ i7-9850HL (9M Cache, bis zu 4.10 GHz)Intel® Core™ i7-9850HE (9M Cache, bis zu 4.40 GHz)Intel® Core™ i3-9100HL (6M Cache, bis zu 2.90 GHz)Intel® Celeron® G4932E (2M Cache, 1.90 GHz)Intel® Celeron® G4930E (2M Cache, 2.40 GHz)Intel® Xeon® E-2176M (12M Cache, bis zu 4.40 GHz)Intel® Core™ i7-8850H (9M Cache, bis zu 4.30 GHz)Intel® Core™ i5-8400H (8M Cache, bis zu 4.20 GHz)Intel® Core™ i3-8100H (6M Cache, 3.00 GHz)CPU-Varianten
CPU
Processor Number
Cache
Total Cores
Total Threads
PCI Express Revision
Max Turbo Frequency
Intel® Core™ i7-9850HL
i7-9850HL
9 MB
6
12
3.0
4.10 GHz
Intel® Core™ i7-9850HE
i7-9850HE
9 MB
6
12
3.0
4.40 GHz
Intel® Core™ i7-8850H
i7-8850H
9 MB Intel® Smart Cache
6
12
3.0
4.30 GHz
Intel® Core™ i5-8400H
i5-8400H
8 MB Intel® Smart Cache
4
8
3.0
4.20 GHz
Intel® Core™ i3-9100HL
i3-9100HL
6 MB
4
4
3.0
2.90 GHz
Intel® Core™ i3-8100H
i3-8100H
6 MB Intel® Smart Cache
4
4
3.0
Intel® Celeron® G4932E
G4932E
2 MB
2
2
3.0
1.90 GHz
Intel® Celeron® G4930E
G4930E
2 MB
2
2
3.0
2.40 GHz
Intel® Xeon® E-2276ML
E-2276ML
12 MB
6
12
3.0
4.20 GHz
Intel® Xeon® E-2276ME
E-2276ME
12 MB
6
12
3.0
4.50 GHz
Intel® Xeon® E-2254ML
E-2254ML
8 MB
4
8
3.0
3.50 GHz
Intel® Xeon® E-2254ME
E-2254ME
8 MB
4
8
3.0
3.80 GHz
Intel® Xeon® E-2176M
E-2176M
12 MB Intel® Smart Cache
6
12
3.0
4.40 GHz
SpezifikationFormfactorCOM Express BasicCPUIntel® Xeon® E-2176M(6 x 2.7 GHz, 12MB cache, 45W)Intel® Xeon® E-2276ME(6 x 2.8 GHz, 12MB cache, 45W)Intel® Xeon® E-2254ME(4 x 2.6 GHz, 8MB cache, 45W)Intel® Xeon® E-2276ML(6 x 2.0 GHz, 12MB cache, 25W)Intel® Xeon® E-2254ML(4 x 1.7 GHz, 8MB cache, 25W)Intel® Core™ i7-8850H(6 x 2.6 GHz, 9MB cache, 45W)Intel® Core™ i7-9850HE(6 x 2.7 GHz, 9MB cache, 45W)Intel® Core™ i7-9850HL(6 x 1.9 GHz, 9MB cache, 25W)Intel® Core™ i5-8400H(4 x 2.5 GHz, 8MB cache, 45W)Intel® Core™ i3-8100H(4 x 3.0 GHz, 6MB cache, 45W)Intel® Core™ i3-9100HL(4 x 1.6 GHz, 6MB cache, 25W)Intel® Celeron® G4930E(2 x 2.4 GHz, 2MB cache, 35W)Intel® Celeron® G4932E(2 x 1.9 GHz, 2MB cache, 25W)DRAMDual channel DDR4 up to 2666 MT/s | 2x SO-DIMM | up to 2x 32 GByte (optionally with ECC support for Intel® Xeon®)EthernetIntel® i219-LM GbE LAN Controller with AMT 12.0 supportI/O Interfaces8 x PCI Express GEN 3.0 lanes4 x Serial ATA Gen 34 x USB 3.1 Gen 2 @ 10 GBit/s8 x USB 2.01 x PEG x16 Gen 3LPC busI²C bus (fast mode, 400 kHz, multi-master)2 x UARTGraphicsIntel® Gen9 HD Graphics Engine with OpenCL 2.0, OpenGL 4.3/4.4 and DirectX 11/12up to three independent displays: DDI / DisplayPort 1.2 / eDP 1.4 | MPEG-2 , WMV9 (VC-1), H.265 decoding | HEVC, VP9 encodingcongatec Board ControllerMulti Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | LVDS backlight control I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Controlembedded BIOS FeaturesAMI AptioV® UEFI 2.x firmware32 MByte serial SPI firmware flashSecurityTPM 2.0 Infineon SLB9665Power ManagementACPI 4.0 with battery supportOperating SystemsMicrosoft® Windows 10 (64bit only)Microsoft® Windows 10 IoT Enterprise (64bit only)LinuxTemperatureCommercial: Operating: 0 .. +60°C | Storage: -40 .. +85°CExtended TemperatureScreening service on request:-25 to +80°C (burn-in & cold-soak) |
-40 to +85°C (burn-in & cold-soak)HumidityOperating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.Video Interfaces3x DDI / DisplayPort 1.2 with support for Multi-Stream Transport (MST) | resolutions up to 4kDual channel LVDS transmitter, Supports flat panels 2x24 Bit interface | VESA and openLDI colour mappings | resolutions up to 1920x1200 Automatic Panel Detection via EDID/EPI1 x VGASize95 x 125 mm (3.74" x 4.92")Produktvarianten / Zubehör049102conga-TS370/i7-9850HECOM Express Type 6 Basic module with Coffeelake-H Refresh Intel® Core™ i7-9850HE, 45W hexa core processor with 2.7GHz, 9MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface. Chipset QM370. TPM 2.0.049112conga-TS370/i7-9850HLCOM Express Type 6 Basic module with Coffeelake-H Refresh Intel® Core™ i7-9850HL, 25W hexa core processor with 1.9GHz, 9MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface. Chipset QM370. TPM 2.0.049113conga-TS370/i3-9100HLCOM Express Type 6 Basic module with Coffeelake-H Refresh Intel® Core™ i3-9100HL, 25W quad core processor with 1.6GHz, 6MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface. Chipset HM370. TPM 2.0.049100conga-TS370/E-2276MECOM Express Type 6 Basic module with Coffeelake-H Refresh Intel® Xeon® Processor E-2276ME, 45W hexa core processor with 2.8GHz, 12MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface with ECC support. Chipset CM246. TPM 2.0.049110conga-TS370/E-2276MLCOM Express Type 6 Basic module with Coffeelake-H Refresh Intel® Xeon® Processor E-2276ML, 25W hexa core processor with 2.0GHz, 12MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface with ECC support. Chipset CM246. TPM 2.0.049101conga-TS370/E-2254MECOM Express Type 6 Basic module with Coffeelake-H Refresh Intel® Xeon® Processor E-2254ME, 45W quad core processor with 2.6GHz, 8MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface with ECC support. Chipset CM246. TPM 2.0.049111conga-TS370/E-2254MLCOM Express Type 6 Basic module with Coffeelake-H Refresh Intel® Xeon® Processor E-2254ML, 25W quad core processor with 1.7GHz, 8MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface with ECC support. Chipset CM246. TPM 2.0.049104conga-TS370/G4930ECOM Express Type 6 Basic module with Coffeelake-H Refresh Intel® Celeron® Processor G4930E, 35W dual core processor with 2.4GHz, 2MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface. Chipset HM370. TPM 2.0.049114conga-TS370/G4932ECOM Express Type 6 Basic module with Coffeelake-H Refresh Intel® Celeron® Processor G4932E, 25W dual core processor with 1.9GHz, 2MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface. Chipset HM370. TPM 2.0.049000conga-TS370/i7-8850HCOM Express Type 6 Basic module with Coffeelake-H Intel® Core™ i7-8850H hexa core processor with 2.6GHz, 9MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface. Chipset QM370. TPM 2.0.049001conga-TS370/i5-8400HCOM Express Type 6 Basic module with Coffeelake-H Intel® Core™ i5-8400H quad core processor with 2.5GHz, 8MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface. Chipset QM370. TPM 2.0.049003conga-TS370/i3-8100HCOM Express Type 6 Basic module with Coffeelake-H Intel® Core™ i3-8100H quad core processor with 3.0GHz, 6MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface. Chipset HM370. TPM 2.0.049002conga-TS370/E-2176MCOM Express Type 6 Basic module with Coffeelake-H Intel® Xeon® Processor E-2176M, hexa core processor with 2.7GHz, 12MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface with ECC support. Chipset CM246. TPM 2.0.Zubehör045930conga-TS170/CSA-HP-BStandard active cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.045931conga-TS170/CSA-HP-TStandard active cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.045932conga-TS170/CSP-HP-BStandard passive cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All standoffs are with 2.7mm bore hole.045933conga-TS170/CSP-HP-TStandard passive cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All standoffs are M2.5mm thread.045934conga-TS170/HSP-HP-BStandard heatspreader for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes. All standoffs are with 2.7mm bore hole.045935conga-TS170/HSP-HP-TStandard heatspreader for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes. All standoffs are M2.5mm thread.067780DDR4-SODIMM-2666 (4GB)DDR4 SODIMM memory module with 2666 MT/s and 4GB RAM067781DDR4-SODIMM-2666 (8GB)DDR4 SODIMM memory module with 2666 MT/s and 8GB RAM067782DDR4-SODIMM-2666 (16GB)DDR4 SODIMM memory module with 2666 MT/s and 16GB RAM068806DDR4-SODIMM-2666 (32GB)DDR4 SODIMM memory module with 2666 MT/s and 32GB RAM067783DDR4-SODIMM-2666 ECC (4GB)DDR4 ECC SODIMM memory module with 2666 MT/s and 4GB RAM067784DDR4-SODIMM-2666 ECC (8GB)DDR4 ECC SODIMM memory module with 2666 MT/s and 8GB RAM067785DDR4-SODIMM-2666 ECC (16GB)DDR4 ECC SODIMM memory module with 2666 MT/s and 16GB RAM068805DDR4-SODIMM-2666 ECC (32GB)DDR4 ECC SODIMM memory module with 2666 MT/s and 32GB RAM065800conga-TEVALEvaluation Carrier Board for COM Express Type 6 Modules.27000001Design-In TrainingDesign-Training to develop carrier boards for Computer on ModulesBitte stellen Sie sicher, dass Sie stets die aktuellsten Version der Produktspezifikationen des Herstellers verwenden. Hersteller-Produktseite: conga-TS370MCTX Mobile & Embedded Computers GmbH IST UM DIE RICHTIGKEIT UND AKTUALITÄT DER DATEN AUF DIESER WEBSEITE BEMÜHT, ÜBERNIMMT JEDOCH KEINERLEI ZUSICHERUNG BEZÜGLICH DES INHALTS. EINE HAFTUNG ODER GARANTIE FÜR DIE AKTUALITÄT, RICHTIGKEIT UND VOLLSTÄNDIGKEIT DER ZUR VERFÜGUNG GESTELLTEN INFORMATIONEN IST FOLGLICH AUSGESCHLOSSEN.Technische Unterstützung & System Integration Services
Alle Dokumente auf dieser Seite werden ohne Benachrichtigung aktualisiert.DatenblattHandbuch
Preis auf Anfrage
congatec conga-TS175 - COM Express Basic Type 6 CPU-Modul mit Intel® Kaby Lake COM Express Type 6 Basic module based on 7th Generation Intel® Core™ processor family
.product-menu-page {
font-family: 'Ubuntu', sans-serif;
color: #3f4c58;
}
.text_bold {
font-weight: bolder;
}
.product-menu-page {
display: none;
}
.product-menu-page:target {
display: block;
}
.head_sec {
background-color: #e9e9f0;
color: #4B70B2;}
.col_a {
background-color: #798490;
}
.head_subsec {color: CornflowerBlue;
padding-top: 10px;padding-left: 10px;
padding-right: 25px;
vertical-align: bottom;
}
.chead {
border: 1px solid Lavender;
font-size: 90%;
font-weight: bolder;}
.ckey {
width: 25%;white-space: nowrap;text-align: left;font-size: 90%;
font-weight: bolder;
border: 1px solid Lavender;word-break: break-word;
}
.copt {
width: 25%;text-align: left;font-size: 90%;
font-weight: bolder;
border: 1px solid Lavender;word-break: break-word;
}
.cval {
width: auto;text-align: left;
border: 1px solid Lavender;
word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;}
.rowspecsim {
font-size: 110%;
white-space: nowrap;text-align: left;
}
.column_1 {
width: 250px;white-space: nowrap;text-align: left;
}
.column_2 {
width: 250px;white-space: nowrap;text-align: left;
}
table {
margin-top: 10px;
width: 100%;
border-collapse: collapse;
table-layout: fixed;
}
th, td {
border: 1px solid White;text-align: left;
word-break: break-word;
font-size: 100%;
line-height: 1.5;
padding-top: 5px;
padding-left: 10px;
padding-bottom: 5px;
}
th {
font-size: 90%;
padding-left: 25px;
}
td {
word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;
}
#prod_kf {
font-size: 100%;width: 100%;}
#prod_spec {
font-size: 100%;word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;
}
#prod_spec_embed {
word-break: break-word;
font-size: 90%;
padding-top: 10px;width: 100%;}
#prod_disc {
font-size: 90%;
width: 100%;}
#prod_cpo {font-size: 90%;
width: 100%;
word-break: break-word;
}
#prod_var {
word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;
}
congatec conga-TS175 - COM Express Basic Type 6 CPU-Modul mit Intel® Kaby LakeCOM Express Type 6 Basic module based on 7th Generation Intel® Core™ processor family
Beispiel Menü
/* CSS-Variable für die Breite der schwarzen Buttons */
:root {
--black-button-width: 120px;
}
/* Menüleiste: Flexbox für gleichmäßig verteilte Menüeinträge */
ul.menu {
list-style-type: none;
margin: 0;
padding: 0;
background-color: white;
overflow: hidden;
font-family: 'Ubuntu', sans-serif;
display: flex; /* Flexbox */
width: 100%;
}
/* Menüeinträge */
li.menu-item {
padding: 0;
text-align: center;
border-right: 5px solid white;
display: block;
text-align: center;
text-decoration: none;
border-radius: 3px;
transition: background-color 0.3s, color 0.3s; /* Smooth transition for hover effect */
}
li.menu-item a {
display: block;
color: white;
text-align: center;
text-decoration: none;
padding: 10px 20px;
font-size: 16px;
font-weight: 500;
border-radius: 3px;
transition: background-color 0.3s, color 0.3s; /* Smooth transition for hover effect */
}
/* Stretch-Element */
.stretch {
flex-grow: 1;
height: 30px;
}
li.menu-item a:hover {
color: black !important; /* Ensures text color change on hover */
background-color: #f7c13d !important; /* Ensures background color change on hover */
}
/* Aktiver Menüeintrag: Hintergrundfarbe und Schriftgewicht bei Aktivierung */
li.menu-item a:active {
color: #2b3136; /* Textfarbe beim aktiven Zustand */
font-weight: bolder; /* Fettere Schrift */
background-color: CornflowerBlue; /* Hintergrundfarbe beim aktiven Zustand */
}
Datenblatt
Handbuch
System Integration
Unverbindliche Beratung: +49(0)7665 9390 185
ÜbersichtKey FeaturesCPU7th Generation Intel® Core™ processorIntel® Xeon® processors for data center applicationsIntel® Optane™ memory can be connected via PCI Express Gen 3.0ECC memory supportUp to 32 GByte dual channel DDR4 memory
CPU Produktfamilie: Intel® Kaby Lake
Intel® Core™ i7-7820EQ (8M Cache, bis zu 3.70 GHz)Intel® Core™ i5-7442EQ (6M Cache, bis zu 2.90 GHz)Intel® Core™ i5-7440EQ (6M Cache, bis zu 3.60 GHz)Intel® Core™ i3-7102E (3M Cache, 2.10 GHz)Intel® Core™ i3-7100E (3M Cache, 2.90 GHz)CPU-Varianten
CPU
Processor Number
Cache
Total Cores
Total Threads
PCI Express Revision
Max Turbo Frequency
Intel® Core™ i7-7820EQ
i7-7820EQ
8 MB
4
8
3.0
3.70 GHz
Intel® Core™ i5-7442EQ
i5-7442EQ
6 MB
4
4
3.0
2.90 GHz
Intel® Core™ i5-7440EQ
i5-7440EQ
6 MB
4
4
3.0
3.60 GHz
Intel® Core™ i3-7102E
i3-7102E
3 MB
2
4
3.0
Intel® Core™ i3-7100E
i3-7100E
3 MB
2
4
3.0
SpezifikationFormfactorCOM Express BasicCPUIntel® Xeon® E3-1505M V6(4 x 3.0 GHz, 8MB cache, 45W)Intel® Xeon® E3-1505L V6(4 x 2.2 GHz, 8MB cache, 25W)Intel® Core™ i7-7820EQ(4 x 3.0 GHz, 8MB cache, 45W)Intel® Core™ i5-7440EQ(4 x 2.9 GHz, 6MB cache, 45W)Intel® Core™ i5-7442EQ(4 x 2.1 GHz, 6MB cache, 25W)Intel® Core™ i3-7100E(2 x 2.9 GHz, 3MB cache, 35W)Intel® Core™ i3-7102E(2 x 2.1 GHz, 3MB cache, 25W)DRAM2 Sockets, SO-DIMM DDR4 up to 2400 MT/s and 32GByte dual channel, optionally with ECC supportEthernetIntel® i219-LM GbE LAN Controller with AMT 11.6 supportI/O Interfaces8 x PCI Express GEN 3.0 lanes4 x Serial ATA Gen 34 x USB 3.08 x USB 2.0 (XHCI)1 x PEG x16 Gen 3LPC busI²C bus (fast mode, 400 kHz, multi-master)2 x UARTGraphicsIntel® Gen9 HD Graphics EngineOpenCL 2.0/2.1, OpenGL 4.4/4.5 and DirectX12 (for Windows 10) support | up to three independent displays: DDI / DisplayPort 1.2 / eDP 1.3 | High performance hardware MPEG-2 decoding | WMV9 (VC-1) and H.265 (HEVC) support Blu-ray support @ 40 MBit/s | HEVC, VP9 and VDENC encodingcongatec Board ControllerMulti Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | LVDS backlight control I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Controlembedded BIOS FeaturesAMI AptioV® UEFI 2.x firmware8/16 MByte serial SPI firmware flashSecurityThe conga-TS175 can be optionally equipped with a discrete ”Trusted Platform Module” (TPM 1.2 / 2.0)Power ManagementACPI 4.0 with battery supportOperating SystemsMicrosoft® Windows 10 (64bit only)Microsoft® Windows 10 IoT Enterprise (64bit only)LinuxFedora 24UbuntuSuSeRed Hat EnterpriseYocto Project v2.2Chromium 2Wind River VxWorksTemperatureOperating: 0 to +60°C Storage: -20 to +70°CHumidityOperating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.Video Interfaces3x DDI / DisplayPort 1.2 with support for Multi-Stream Transport (MST) | resolutions up to 4kDual channel LVDS transmitter, Supports flat panels 2x24 Bit interface | VESA and openLDI colour mappings | resolutions up to 1920x1200 Automatic Panel Detection via EDID/EPI1 x VGA (optional)Size95 x 125 mm (3.74" x 4.92")Produktvarianten / Zubehör045950conga-TS175/i7-7820EQCOM Express Type 6 Basic module with Intel® Core™ i7-7820EQ quad core processor with 3GHz up to 3.7GHz, 8MB Intel® Smart Cache, GT2 graphics and 2400MT/s dual channel DDR4 memory interface (Intel Kaby Lake-H). Chipset QM175 with support for Intel® Optane™ memory045951conga-TS175/i5-7440EQCOM Express Type 6 Basic modul Intel® Core™ i5-7440EQ quad core processor with 2.9GHz up to 3.6GHz, 6MB Intel® Smart Cache, GT2 graphics and 2400MT/s dual channel DDR4 memory interface (Intel Kaby Lake-H). Chipset QM175 with support for Intel® Optane™ memory045952conga-TS175/i5-7442EQCOM Express Type 6 Basic module with Intel® Core™ i5-7442EQ quad core processor with 2.1GHz up to 2.9GHz, 6MB Intel® Smart Cache, GT2 graphics and 2400MT/s dual channel DDR4 memory interface (Intel Kaby Lake-H). Chipset QM175 with support for Intel® Optane™ memory045953conga-TS175/i3-7100ECOM Express Type 6 Basic module with Intel® Core™ i3-7100E dual core processor with 2.9GHz, 3MB Intel® Smart Cache, GT2 graphics and 2400MT/s dual channel DDR4 memory interface (Intel Kaby Lake-H). Chipset HM175 with support for Intel® Optane™ memory045954conga-TS175/i3-7102ECOM Express Type 6 Basic module with Intel® Core™ i3-7102E dual core processor with 2.1GHz, 3MB Intel® Smart Cache, GT2 graphics and 2400MT/s dual channel DDR4 memory interface (Intel Kaby Lake-H). Chipset HM175 with support for Intel® Optane™ memory045955conga-TS175/E3-1505MV6COM Express Type 6 Basic module with Intel® Xeon® E3-1505M V6 quad core processor with 3GHz up to 4GHz, 8MB Intel® Smart Cache, GT2 graphics and 2400MT/s dual channel DDR4 memory interface (Intel Kaby Lake-H). Chipset CM238 with ECC memory support045956conga-TS175/E3-1505LV6COM Express Type 6 Basic module with Intel® Xeon® E3-1505L V6 quad core processor with 2.2GHz up to 3GHz, 8MB Intel® Smart Cache, GT2 graphics and 2400MT/s dual channel DDR4 memory interface (Intel Kaby Lake-H). Chipset CM238 with ECC memory supportZubehör045934conga-TS170/HSP-HP-BStandard heatspreader for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes. All standoffs are with 2.7mm bore hole.045935conga-TS170/HSP-HP-TStandard heatspreader for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes. All standoffs are M2.5mm thread.045932conga-TS170/CSP-HP-BStandard passive cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All standoffs are with 2.7mm bore hole.045933conga-TS170/CSP-HP-TStandard passive cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All standoffs are M2.5mm thread.045930conga-TS170/CSA-HP-BStandard active cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.045931conga-TS170/CSA-HP-TStandard active cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.068790DDR4-SODIMM-2400 (4GB)DDR4 SODIMM memory module with 2400 MT/s and 4GB RAM068791DDR4-SODIMM-2400 (8GB)DDR4 SODIMM memory module with 2400 MT/s and 8GB RAM068792DDR4-SODIMM-2400 (16GB)DDR4 SODIMM memory module with 2400 MT/s and 16GB RAM068795DDR4-SODIMM-2400 ECC (4GB)4 GByte ECC DDR4 SODIMM memory module | 2400 MT/s (PC4-2400) | 260 pin | supply voltage 1,2V068796DDR4-SODIMM-2400 ECC (8GB)8 GByte ECC DDR4 SODIMM memory module | 2400 MT/s (PC4-2400) | 260 pin | supply voltage 1,2V068797DDR4-SODIMM-2400 ECC (16GB)16 GByte ECC DDR4 SODIMM memory module | 2400 MT/s (PC4-2400) | 260 pin | supply voltage 1,2V065810conga-TEVAL2Evaluation carrier board for COM Express Type6 Rev. 3.0 modules.27000001Design-In TrainingDesign-Training to develop carrier boards for Computer on ModulesBitte stellen Sie sicher, dass Sie stets die aktuellsten Version der Produktspezifikationen des Herstellers verwenden. Hersteller-Produktseite: conga-TS175MCTX Mobile & Embedded Computers GmbH IST UM DIE RICHTIGKEIT UND AKTUALITÄT DER DATEN AUF DIESER WEBSEITE BEMÜHT, ÜBERNIMMT JEDOCH KEINERLEI ZUSICHERUNG BEZÜGLICH DES INHALTS. EINE HAFTUNG ODER GARANTIE FÜR DIE AKTUALITÄT, RICHTIGKEIT UND VOLLSTÄNDIGKEIT DER ZUR VERFÜGUNG GESTELLTEN INFORMATIONEN IST FOLGLICH AUSGESCHLOSSEN.Technische Unterstützung & System Integration Services
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congatec conga-TS170 - COM Express Basic Type 6 CPU-Modul mit Intel® Skylake COM Express Type 6 Basic module based on 6th Generation Intel® Core™ processor family
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congatec conga-TS170 - COM Express Basic Type 6 CPU-Modul mit Intel® SkylakeCOM Express Type 6 Basic module based on 6th Generation Intel® Core™ processor family
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Datenblatt
Handbuch
System Integration
Unverbindliche Beratung: +49(0)7665 9390 185
ÜbersichtKey FeaturesCPU6th Generation Intel® Core™ processorIntel® Gen9 HD Graphics with HEVC (H.265) supportECC memory support for Xeon and i3 versionUp to 32GByte dual channel DDR4 memoryXEON processors for data center applicationsProduct Video
CPU Produktfamilie: Intel® Skylake
Intel® Xeon® E3-1558L v5 (8M Cache, 1.90 GHz)Intel® Celeron® G3902E (2M Cache, 1.60 GHz)Intel® Celeron® G3900E (2M Cache, 2.40 GHz)Intel® Xeon® E3-1515M v5 (8M Cache, 2.80 GHz)Intel® Core™ i7-6822EQ (8M Cache, bis zu 2.80 GHz)Intel® Core™ i7-6820EQ (8M Cache, bis zu 3.50 GHz)Intel® Core™ i5-6442EQ (6M Cache, bis zu 2.70 GHz)Intel® Core™ i5-6440EQ (6M Cache, bis zu 3.40 GHz)Intel® Core™ i3-6102E (3M Cache, 1.90 GHz)Intel® Core™ i3-6100E (3M Cache, 2.70 GHz)CPU-Varianten
CPU
Processor Number
Cache
Total Cores
Total Threads
PCI Express Revision
Max Turbo Frequency
Intel® Core™ i7-6822EQ
i7-6822EQ
8 MB Intel® Smart Cache
4
8
3.0
2.80 GHz
Intel® Core™ i7-6820EQ
i7-6820EQ
8 MB Intel® Smart Cache
4
8
3.0
3.50 GHz
Intel® Core™ i5-6442EQ
i5-6442EQ
6 MB Intel® Smart Cache
4
4
3.0
2.70 GHz
Intel® Core™ i5-6440EQ
i5-6440EQ
6 MB Intel® Smart Cache
4
4
3.0
3.40 GHz
Intel® Core™ i3-6102E
i3-6102E
3 MB Intel® Smart Cache
2
4
3.0
Intel® Core™ i3-6100E
i3-6100E
3 MB Intel® Smart Cache
2
4
3.0
Intel® Celeron® G3902E
G3902E
2 MB Intel® Smart Cache
2
2
3.0
Intel® Celeron® G3900E
G3900E
2 MB Intel® Smart Cache
2
2
3.0
Intel® Xeon® E3-1558L v5
E3-1558LV5
8 MB
4
8
3.0
3.30 GHz
Intel® Xeon® E3-1515M v5
E3-1515MV5
8 MB Intel® Smart Cache
4
8
3.0
3.70 GHz
SpezifikationFormfactorCOM Express BasicCPUIntel® Xeon™ E3-1505M V5(4 x 2.8 GHz, 8MB cache, 45W)Intel® Xeon™ E3-1505L V5(4 x 2.0 GHz, 8MB cache, 25W)Intel® Xeon® E3-1578L V5(4 x 2.0 GHz, 8MB cache, 45W)Intel® Xeon® E3-1558LV5(4 x 1.9 GHz, 8MB cache, 45W)Intel® Xeon® E3-1515MV5(4 x 2.8 GHz, 8MB cache, 45W)Intel® Core™ i7-6820EQ(4 x 2.8 GHz, 8MB cache, 45W)Intel® Core™ i7-6822EQ(4 x 2.0 GHz, 8MB cache, 25W)Intel® Core™ i5-6440EQ(4 x 2.7 GHz, 6MB cache, 45W)Intel® Core™ i5-6442EQ(4 x 1.9 GHz, 6MB cache, 25W)Intel® Core™ i3-6100E(2 x 2.7 GHz, 3MB cache, 35W)Intel® Core™ i3-6102E(2 x 1.9 GHz, 3MB cache, 25W)Intel® Celeron® G3900E(2 x 2.4 GHz, 2MB cache, 35W)Intel® Celeron® G3902E(2 x 1.6 GHz, 2MB cache, 25W)DRAM2 Sockets, SO-DIMM DDR4 up to 2133 MT/s and 32GByte dual channelEthernetIntel® i219-LM GbE LAN Controller with AMT 11 supportI/O Interfaces8 x PCI Express GEN 3.0 lanes4 x SATA III (6Gb/s)4 x USB 3.08 x USB 2.01 x PEG x16 Gen 3LPC busI²C bus2 x UARTGraphicsIntel® Gen9 HD Graphics Enginewith OpenCL 2.0, OpenGL 4.3 and DirectX12 (Windows 10) support | up to three independent displays: DisplayPort 1.2 | eDP 1.3 | VGA (optional)congatec Board ControllerMulti Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | LVDS backlight control I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Controlembedded BIOS Features8/16 MByte serial SPI firmware flashAMI AptioV® UEFI 2.x firmwareSecurityThe conga-TS170 can be optionally equipped with a discrete ”Trusted Platform Module” (TPM 1.2 / 2.0)Power ManagementACPI 4.0 with battery supportOperating SystemsMicrosoft® Windows® 10Microsoft® Windows® 8.1Microsoft® Windows® 7LinuxMicrosoft® Windows® embedded StandardTemperatureStandardOperating: 0 to +60°C
Storage: -20 to +80°CHumidityOperating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.Size95 x 125 mm (3.74" x 4.92")Produktvarianten / Zubehör045913conga-TS170/E3-1578LV5COM Express Type 6 Basic module with Skylake-H Intel® Xeon® E3-1578L V5 quad core processor with 2.0GHz up to 3.4GHz, 8MB L2 cache, GT4 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset CM236 with ECC memory support045914conga-TS170/E3-1558LV5COM Express Type 6 Basic module with Skylake-H Intel Xeon® E3-1558L V5 quad core processor with 1.9GHz up to 3.3GHz, 8MB L2 cache, GT3e graphics and 2133MT/s dual channel DDR4 memory interface, Chipset CM236 with ECC memory support045912conga-TS170/E3-1515MV5COM Express Type 6 Basic module with Skylake-H Intel® Xeon® E3-1515M V5 quad core processor with 2.8GHz up to 3.7GHz, 8MB L2 cache, GT4 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset CM236 with ECC memory support045906conga-TS170/E3-1505MV5COM Express Type 6 Basic module with Intel® Xeon® E3-1505M V5 quad core processor with 2.8GHz up to 3.7GHz, 8MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset CM236 with ECC memory support045907conga-TS170/E3-1505LV5COM Express Type 6 Basic module with Intel® Xeon® E3-1505L V5 quad core processor with 2.0GHz up to 2.8GHz, 8MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset CM236 with ECC memory support045900conga-TS170/i7-6820EQCOM Express Type 6 Basic module with Intel® Core™ i7-6820EQ quad core processor with 2.8GHz up to 3.5GHz, 8MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset QM170045901conga-TS170/i7-6822EQCOM Express Type 6 Basic module with Intel® Core™ i7-6822EQ quad core processor with 2.0GHz up to 2.8GHz, 8MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset QM170045902conga-TS170/i5-6440EQCOM Express Type 6 Basic module with Intel® Core™ i5-6440EQ quad core processor with 2.7GHz up to 3.4GHz, 6MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset QM170045903conga-TS170/i5-6442EQCOM Express Type 6 Basic module with Intel® Core™ i5-6442EQ quad core processor with 1.9GHz up to 2.7GHz, 6MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset QM170045908conga-TS170/i3-6100E ECCCOM Express Type 6 Basic module with Intel® Core™ i3-6100E dual core processor with 2.7GHz, 3MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset CM236 with ECC memory support045909conga-TS170/i3-6102E ECCCOM Express Type 6 Basic module with Intel® Core™ i3-6102EQ dual core processor with 1.9GHz, 3MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset CM236 with ECC memory support045904conga-TS170/i3-6100ECOM Express Type 6 Basic module with Intel® Core™ i3-6100E dual core processor with 2.7GHz, 3MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset HM170045905conga-TS170/i3-6102ECOM Express Type 6 Basic module with Intel® Core™ i3-6102EQ dual core processor with 1.9GHz, 3MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset HM170045910conga-TS170/G3900ECOM Express Type 6 Basic module with Skylake-H Intel® Celeron® G3900E dual core processor with 2.4GHz, 2MB L2 cache, GT1 graphics and 2133MT/s dual channel DDR4 memory interface. Chipset HM170.045911conga-TS170/G3902ECOM Express Type 6 Basic module with Skylake-H Intel® Celeron® G3902E dual core processor with 1.6GHz, 2MB L2 cache, GT1 graphics and 2133MT/s dual channel DDR4 memory interface. Chipset HM170.Zubehör045934conga-TS170/HSP-HP-BStandard heatspreader for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes. All standoffs are with 2.7mm bore hole.045935conga-TS170/HSP-HP-TStandard heatspreader for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes. All standoffs are M2.5mm thread.045932conga-TS170/CSP-HP-BStandard passive cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All standoffs are with 2.7mm bore hole.045933conga-TS170/CSP-HP-TStandard passive cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All standoffs are M2.5mm thread.045930conga-TS170/CSA-HP-BStandard active cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.045931conga-TS170/CSA-HP-TStandard active cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.068790DDR4-SODIMM-2400 (4GB)DDR4 SODIMM memory module with 2400 MT/s and 4GB RAM068791DDR4-SODIMM-2400 (8GB)DDR4 SODIMM memory module with 2400 MT/s and 8GB RAM068792DDR4-SODIMM-2400 (16GB)DDR4 SODIMM memory module with 2400 MT/s and 16GB RAM068795DDR4-SODIMM-2400 ECC (4GB)4 GByte ECC DDR4 SODIMM memory module | 2400 MT/s (PC4-2400) | 260 pin | supply voltage 1,2V068796DDR4-SODIMM-2400 ECC (8GB)8 GByte ECC DDR4 SODIMM memory module | 2400 MT/s (PC4-2400) | 260 pin | supply voltage 1,2V068797DDR4-SODIMM-2400 ECC (16GB)16 GByte ECC DDR4 SODIMM memory module | 2400 MT/s (PC4-2400) | 260 pin | supply voltage 1,2V065800conga-TEVALEvaluation Carrier Board for COM Express Type 6 Modules.27000001Design-In TrainingDesign-Training to develop carrier boards for Computer on ModulesBitte stellen Sie sicher, dass Sie stets die aktuellsten Version der Produktspezifikationen des Herstellers verwenden. Hersteller-Produktseite: conga-TS170MCTX Mobile & Embedded Computers GmbH IST UM DIE RICHTIGKEIT UND AKTUALITÄT DER DATEN AUF DIESER WEBSEITE BEMÜHT, ÜBERNIMMT JEDOCH KEINERLEI ZUSICHERUNG BEZÜGLICH DES INHALTS. EINE HAFTUNG ODER GARANTIE FÜR DIE AKTUALITÄT, RICHTIGKEIT UND VOLLSTÄNDIGKEIT DER ZUR VERFÜGUNG GESTELLTEN INFORMATIONEN IST FOLGLICH AUSGESCHLOSSEN.Technische Unterstützung & System Integration Services
Alle Dokumente auf dieser Seite werden ohne Benachrichtigung aktualisiert.DatenblattHandbuch
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congatec conga-TR4 - COM Express Basic Type 6 CPU-Modul COM Express® Type 6 module based on AMD Ryzen Embedded V1000 Series SOC
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}
.column_2 {
width: 250px;white-space: nowrap;text-align: left;
}
table {
margin-top: 10px;
width: 100%;
border-collapse: collapse;
table-layout: fixed;
}
th, td {
border: 1px solid White;text-align: left;
word-break: break-word;
font-size: 100%;
line-height: 1.5;
padding-top: 5px;
padding-left: 10px;
padding-bottom: 5px;
}
th {
font-size: 90%;
padding-left: 25px;
}
td {
word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;
}
#prod_kf {
font-size: 100%;width: 100%;}
#prod_spec {
font-size: 100%;word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;
}
#prod_spec_embed {
word-break: break-word;
font-size: 90%;
padding-top: 10px;width: 100%;}
#prod_disc {
font-size: 90%;
width: 100%;}
#prod_cpo {font-size: 90%;
width: 100%;
word-break: break-word;
}
#prod_var {
word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;
}
congatec conga-TR4 - COM Express Basic Type 6 CPU-ModulCOM Express® Type 6 module based on AMD Ryzen Embedded V1000 Series SOC
Beispiel Menü
/* CSS-Variable für die Breite der schwarzen Buttons */
:root {
--black-button-width: 120px;
}
/* Menüleiste: Flexbox für gleichmäßig verteilte Menüeinträge */
ul.menu {
list-style-type: none;
margin: 0;
padding: 0;
background-color: white;
overflow: hidden;
font-family: 'Ubuntu', sans-serif;
display: flex; /* Flexbox */
width: 100%;
}
/* Menüeinträge */
li.menu-item {
padding: 0;
text-align: center;
border-right: 5px solid white;
display: block;
text-align: center;
text-decoration: none;
border-radius: 3px;
transition: background-color 0.3s, color 0.3s; /* Smooth transition for hover effect */
}
li.menu-item a {
display: block;
color: white;
text-align: center;
text-decoration: none;
padding: 10px 20px;
font-size: 16px;
font-weight: 500;
border-radius: 3px;
transition: background-color 0.3s, color 0.3s; /* Smooth transition for hover effect */
}
/* Stretch-Element */
.stretch {
flex-grow: 1;
height: 30px;
}
li.menu-item a:hover {
color: black !important; /* Ensures text color change on hover */
background-color: #f7c13d !important; /* Ensures background color change on hover */
}
/* Aktiver Menüeintrag: Hintergrundfarbe und Schriftgewicht bei Aktivierung */
li.menu-item a:active {
color: #2b3136; /* Textfarbe beim aktiven Zustand */
font-weight: bolder; /* Fettere Schrift */
background-color: CornflowerBlue; /* Hintergrundfarbe beim aktiven Zustand */
}
Datenblatt
Handbuch
System Integration
Unverbindliche Beratung: +49(0)7665 9390 185
ÜbersichtKey FeaturesAMD’s Next Gen V1000 processor Series“Zen” core architecture with up to 4 coresImproved graphic performance with “Vega” GPUUp to 32GByte dual channel DDR4 3200MT/s memoryTDP scalable down to 12Wup to 4 x 4K DP / eDPProduct videoWhitepaperSpezifikationFormfactorCOM Express BasicCPUAMD V1807B(4 x 3.35 GHz, 2MB L2 cache, 45W)AMD V1756B(4 x 3.25 GHz, 2MB L2 cache, 45W)AMD V1605B(4 x 2.0 GHz, 2MB L2 cache, 15W)AMD V1202B(2 x 2.5 GHz, 1MB L2 cache, 15W)AMD V1404I(4 x 2.0 GHz, 2MB L2 cache, 15W)AMD R1606G(2 x 2.6 GHz, 1MB L2 cache, 15W)AMD R1505G(2 x 2.4 GHz, 1MB L2 cache, 15W)DRAM2 Sockets, SO-DIMM DDR4 up to 32 GByte with ECCEthernetGigabit EthernetI/O Interfaces4 x PCI Express™ 3.0 lanesSM-BusSPILPC busI²C bus (fast mode, 400 kHz, multi-master)2 x SATA 6 Gb/s8 x USB 2.02 x USB 3.1 Gen12 x USB 3.1 Gen21 x PEG 3.0 x84 x PCI Express™ 2.0 lanes2 x UARTGraphicsIntegrated AMD Radeon™ Graphics supports DirectX 12 | OpenGL 4.6 and OpenCL™ 2.1 | up to 4 simultaneous Displays | Unified Video Decoder 6 (H.265, H.264, MVC, MPEG4, MPEG2, VC-1, WMV and MJPEG) Video Compression Engine 3.1 (dual, H.264, SVC)congatec Board ControllerMulti Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | LVDS backlight control I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Controlembedded BIOS FeaturesAMI Aptio® 2.X (UEFI) firmware8 MByte serial SPI firmware flashSecurityThe conga-TR4 offers a discrete TPM 2.0 (Infineon SLB9665).This TPM includes coprocessors to calculate efficient hash and RSA algorithms with key lengths up to 2048 bits as well as a real random number generator. Security sensitive applications like gaming and e-commerce will benefit also with improved authentication, integrity and confidence levels. The conga-TR4 also offers AMD Secure Processor™.Power ManagementACPI 5 .0 compliant, Smart Battery ManagementOperating SystemsMicrosoft® Windows® 10Microsoft® Windows 10 IoT Enterprise (64bit only)LinuxTemperatureCommercial : Operating: 0 to +60°C | Operating industrial: -40 .. +85°C | Storage: -20 to +80°CHumidityOperating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.Size95 x 125 mm (3.74" x 4.92")Produktvarianten / Zubehör041600conga-TR4/V1807BCOM Express Type 6 Basic module with AMD embedded V-Series V1807B (Great Horned Owl) quad core processor with 3.35 GHz up to 3.75 GHz core frequency, 2MB L2 cache and 3200MT/s DDR4 SODIMM memory interface for up to 32GB. Features AMD Radeon™ Vega integrated graphics core with 11 CU. TDP 35-54W.041601conga-TR4/V1756BCOM Express Type 6 Basic module with AMD embedded V-Series V1756B (Great Horned Owl) quad core processor with 3.25 GHz up to 3.6 GHz core frequency, 2MB L2 cache and 3200MT/s DDR4 SODIMM memory interface for up to 32GB. Features AMD Radeon™ Vega integrated graphics core with 8 CU. TDP 35-54W.041602conga-TR4/V1605BCOM Express Type 6 Basic module with AMD embedded V-Series V1605B (Great Horned Owl) quad core processor with 2.0 GHz up to 3.6 GHz core frequency, 2MB L2 cache and 2400MT/s DDR4 SODIMM memory interface for up to 32GB. Features AMD Radeon™ Vega integrated graphics core with 8 CU. TDP 12-25W.041603conga-TR4/V1202BCOM Express Type 6 Basic module with AMD embedded V-Series V1202B (Great Horned Owl) dual core processor with 2.5 GHz up to 3.4 GHz core frequency, 1MB L2 cache and 2400MT/s DDR4 SODIMM memory interface for up to 32GB. Features AMD Radeon™ Vega integrated graphics core with 3 CU. TDP 12-25W.041610conga-TR4/i-V1404ICOM Express Type 6 Basic module based on AMD embedded V-Series V1404B 4-core processor with 2.0 GHz up to 3.6 GHz turbo boost, 2MB L2 Cache and dual channel DDR4 2400MT/s memory interface (formerly Great HornedOwl). Features AMD Radeon™ Vega integrated graphics core with 8 CU. Industrial temperature range.041620conga-TR4/R1606GCOM Express Type 6 Basic module based on AMD embedded R-Series R1606G 2-core processor with 2.6 GHz up to 3.5 GHz turbo boost, 1MB L2 Cache and dual channel DDR4 2400MT/s memory interface (formerly Great Horned Owl). Features AMD Radeon™ Vega integrated graphics core with 3 CU.041621conga-TR4/R1505GCOM Express Type 6 Basic module based on AMD embedded R-Series R1505G 2-core processor with 2.4 GHz up to 3.3 GHz turbo boost, 1MB L2 Cache and dual channel DDR4 2400MT/s memory interface (formerly Great Horned Owl). Features AMD Radeon™ Vega integrated graphics core with 3 CU.Zubehör041651conga-TR4/HSP-HP-BStandard heatspreader for high performance COM Express module conga-TR4 with integrated heat pipes. All standoffs are with 2.7mm bore hole.041652conga-TR4/HSP-HP-TStandard heatspreader for high performance COM Express module conga-TR4 with integrated heat pipes. All standoffs are M2.5mm thread.041653conga-TR4/CSP-HP-BStandard passive cooling solution for high performance COM Express module conga-TR4 with integrated heat pipes, 15mm fins and 20mm overall heat sink height. All standoffs are with 2.7mm bore hole.041654conga-TR4/CSP-HP-TStandard passive cooling solution for high performance COM Express module conga-TR4 with integrated heat pipes, 15mm fins and 20mm overall heat sink height. All standoffs are M2.5mm thread.041655conga-TR4/CSA-HP-BStandard active cooling solution for high performance COM Express module conga-TR4 with integrated heat pipes, 15mm fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.041656conga-TR4/CSA-HP-TStandard active cooling solution for high performance COM Express module conga-TR4 with integrated heat pipes, 15mm fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.068736DDR4-SODIMM-3200 ECC (4GB)DDR4 ECC SODIMM memory module with 3200 MT/s and 4GB RAM068737DDR4-SODIMM-3200 ECC (8GB)DDR4 ECC SODIMM memory module with 3200 MT/s and 8GB RAM068738DDR4-SODIMM-3200 ECC (16GB)DDR4 ECC SODIMM memory module with 3200 MT/s and 16GB RAM068793DDR4-SODIMM-3200 (4GB)DDR4 SODIMM memory module with 3200 MT/s and 4GB RAM068794DDR4-SODIMM-3200 (8GB)DDR4 SODIMM memory module with 3200 MT/s and 8GB RAM068798DDR4-SODIMM-3200 (16GB)DDR4 SODIMM memory module with 3200 MT/s and 16GB RAM068795DDR4-SODIMM-2400 ECC (4GB)4 GByte ECC DDR4 SODIMM memory module | 2400 MT/s (PC4-2400) | 260 pin | supply voltage 1,2V068796DDR4-SODIMM-2400 ECC (8GB)8 GByte ECC DDR4 SODIMM memory module | 2400 MT/s (PC4-2400) | 260 pin | supply voltage 1,2V068797DDR4-SODIMM-2400 ECC (16GB)16 GByte ECC DDR4 SODIMM memory module | 2400 MT/s (PC4-2400) | 260 pin | supply voltage 1,2V068790DDR4-SODIMM-2400 (4GB)DDR4 SODIMM memory module with 2400 MT/s and 4GB RAM068791DDR4-SODIMM-2400 (8GB)DDR4 SODIMM memory module with 2400 MT/s and 8GB RAM068792DDR4-SODIMM-2400 (16GB)DDR4 SODIMM memory module with 2400 MT/s and 16GB RAM065810conga-TEVAL2Evaluation carrier board for COM Express Type6 Rev. 3.0 modules.27000001Design-In TrainingDesign-Training to develop carrier boards for Computer on ModulesBitte stellen Sie sicher, dass Sie stets die aktuellsten Version der Produktspezifikationen des Herstellers verwenden. Hersteller-Produktseite: conga-TR4MCTX Mobile & Embedded Computers GmbH IST UM DIE RICHTIGKEIT UND AKTUALITÄT DER DATEN AUF DIESER WEBSEITE BEMÜHT, ÜBERNIMMT JEDOCH KEINERLEI ZUSICHERUNG BEZÜGLICH DES INHALTS. EINE HAFTUNG ODER GARANTIE FÜR DIE AKTUALITÄT, RICHTIGKEIT UND VOLLSTÄNDIGKEIT DER ZUR VERFÜGUNG GESTELLTEN INFORMATIONEN IST FOLGLICH AUSGESCHLOSSEN.Technische Unterstützung & System Integration Services
Alle Dokumente auf dieser Seite werden ohne Benachrichtigung aktualisiert.DatenblattHandbuch
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congatec conga-TEVAL3/COMe3.1 - Evaluation Board COM Express Type 6 Rev. 3.1 Evaluation Carrier Board
.product-menu-page {
font-family: 'Ubuntu', sans-serif;
color: #3f4c58;
}
.text_bold {
font-weight: bolder;
}
.product-menu-page {
display: none;
}
.product-menu-page:target {
display: block;
}
.head_sec {
background-color: #e9e9f0;
color: #4B70B2;}
.col_a {
background-color: #798490;
}
.head_subsec {color: CornflowerBlue;
padding-top: 10px;padding-left: 10px;
padding-right: 25px;
vertical-align: bottom;
}
.chead {
border: 1px solid Lavender;
font-size: 90%;
font-weight: bolder;}
.ckey {
width: 25%;white-space: nowrap;text-align: left;font-size: 90%;
font-weight: bolder;
border: 1px solid Lavender;word-break: break-word;
}
.copt {
width: 25%;text-align: left;font-size: 90%;
font-weight: bolder;
border: 1px solid Lavender;word-break: break-word;
}
.cval {
width: auto;text-align: left;
border: 1px solid Lavender;
word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;}
.rowspecsim {
font-size: 110%;
white-space: nowrap;text-align: left;
}
.column_1 {
width: 250px;white-space: nowrap;text-align: left;
}
.column_2 {
width: 250px;white-space: nowrap;text-align: left;
}
table {
margin-top: 10px;
width: 100%;
border-collapse: collapse;
table-layout: fixed;
}
th, td {
border: 1px solid White;text-align: left;
word-break: break-word;
font-size: 100%;
line-height: 1.5;
padding-top: 5px;
padding-left: 10px;
padding-bottom: 5px;
}
th {
font-size: 90%;
padding-left: 25px;
}
td {
word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;
}
#prod_kf {
font-size: 100%;width: 100%;}
#prod_spec {
font-size: 100%;word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;
}
#prod_spec_embed {
word-break: break-word;
font-size: 90%;
padding-top: 10px;width: 100%;}
#prod_disc {
font-size: 90%;
width: 100%;}
#prod_cpo {font-size: 90%;
width: 100%;
word-break: break-word;
}
#prod_var {
word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;
}
congatec conga-TEVAL3/COMe3.1 - Evaluation BoardCOM Express Type 6 Rev. 3.1 Evaluation Carrier Board
Beispiel Menü
/* CSS-Variable für die Breite der schwarzen Buttons */
:root {
--black-button-width: 120px;
}
/* Menüleiste: Flexbox für gleichmäßig verteilte Menüeinträge */
ul.menu {
list-style-type: none;
margin: 0;
padding: 0;
background-color: white;
overflow: hidden;
font-family: 'Ubuntu', sans-serif;
display: flex; /* Flexbox */
width: 100%;
}
/* Menüeinträge */
li.menu-item {
padding: 0;
text-align: center;
border-right: 5px solid white;
display: block;
text-align: center;
text-decoration: none;
border-radius: 3px;
transition: background-color 0.3s, color 0.3s; /* Smooth transition for hover effect */
}
li.menu-item a {
display: block;
color: white;
text-align: center;
text-decoration: none;
padding: 10px 20px;
font-size: 16px;
font-weight: 500;
border-radius: 3px;
transition: background-color 0.3s, color 0.3s; /* Smooth transition for hover effect */
}
/* Stretch-Element */
.stretch {
flex-grow: 1;
height: 30px;
}
li.menu-item a:hover {
color: black !important; /* Ensures text color change on hover */
background-color: #f7c13d !important; /* Ensures background color change on hover */
}
/* Aktiver Menüeintrag: Hintergrundfarbe und Schriftgewicht bei Aktivierung */
li.menu-item a:active {
color: #2b3136; /* Textfarbe beim aktiven Zustand */
font-weight: bolder; /* Fettere Schrift */
background-color: CornflowerBlue; /* Hintergrundfarbe beim aktiven Zustand */
}
Datenblatt
Handbuch
System Integration
Unverbindliche Beratung: +49(0)7665 9390 185
ÜbersichtKey FeaturesEvaluation Carrier for COMe Type 6 modulesSupports COMe Compact and Basic modules using connector Pinout Type 6Compliant to latest COMe Spec Rev. 3.1Zubehör065820conga-TEVAL3/COMe3.1congatec COM Express Type 6 evaluation carrier compliant to COM Express 3.1 specification. Industrial temperature range. From -40°C to 85°CBitte stellen Sie sicher, dass Sie stets die aktuellsten Version der Produktspezifikationen des Herstellers verwenden. Hersteller-Produktseite: conga-TEVAL3/COMe3.1MCTX Mobile & Embedded Computers GmbH IST UM DIE RICHTIGKEIT UND AKTUALITÄT DER DATEN AUF DIESER WEBSEITE BEMÜHT, ÜBERNIMMT JEDOCH KEINERLEI ZUSICHERUNG BEZÜGLICH DES INHALTS. EINE HAFTUNG ODER GARANTIE FÜR DIE AKTUALITÄT, RICHTIGKEIT UND VOLLSTÄNDIGKEIT DER ZUR VERFÜGUNG GESTELLTEN INFORMATIONEN IST FOLGLICH AUSGESCHLOSSEN.Technische Unterstützung & System Integration Services
Alle Dokumente auf dieser Seite werden ohne Benachrichtigung aktualisiert.Datenblatt
Preis auf Anfrage
congatec conga-TEVAL/COMe 3.0 - Evaluation Board Evaluation Carrier Board for COM Express® Type 6 Modules Rev. 3.0
.product-menu-page {
font-family: 'Ubuntu', sans-serif;
color: #3f4c58;
}
.text_bold {
font-weight: bolder;
}
.product-menu-page {
display: none;
}
.product-menu-page:target {
display: block;
}
.head_sec {
background-color: #e9e9f0;
color: #4B70B2;}
.col_a {
background-color: #798490;
}
.head_subsec {color: CornflowerBlue;
padding-top: 10px;padding-left: 10px;
padding-right: 25px;
vertical-align: bottom;
}
.chead {
border: 1px solid Lavender;
font-size: 90%;
font-weight: bolder;}
.ckey {
width: 25%;white-space: nowrap;text-align: left;font-size: 90%;
font-weight: bolder;
border: 1px solid Lavender;word-break: break-word;
}
.copt {
width: 25%;text-align: left;font-size: 90%;
font-weight: bolder;
border: 1px solid Lavender;word-break: break-word;
}
.cval {
width: auto;text-align: left;
border: 1px solid Lavender;
word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;}
.rowspecsim {
font-size: 110%;
white-space: nowrap;text-align: left;
}
.column_1 {
width: 250px;white-space: nowrap;text-align: left;
}
.column_2 {
width: 250px;white-space: nowrap;text-align: left;
}
table {
margin-top: 10px;
width: 100%;
border-collapse: collapse;
table-layout: fixed;
}
th, td {
border: 1px solid White;text-align: left;
word-break: break-word;
font-size: 100%;
line-height: 1.5;
padding-top: 5px;
padding-left: 10px;
padding-bottom: 5px;
}
th {
font-size: 90%;
padding-left: 25px;
}
td {
word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;
}
#prod_kf {
font-size: 100%;width: 100%;}
#prod_spec {
font-size: 100%;word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;
}
#prod_spec_embed {
word-break: break-word;
font-size: 90%;
padding-top: 10px;width: 100%;}
#prod_disc {
font-size: 90%;
width: 100%;}
#prod_cpo {font-size: 90%;
width: 100%;
word-break: break-word;
}
#prod_var {
word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;
}
congatec conga-TEVAL/COMe 3.0 - Evaluation BoardEvaluation Carrier Board for COM Express® Type 6 Modules Rev. 3.0
Beispiel Menü
/* CSS-Variable für die Breite der schwarzen Buttons */
:root {
--black-button-width: 120px;
}
/* Menüleiste: Flexbox für gleichmäßig verteilte Menüeinträge */
ul.menu {
list-style-type: none;
margin: 0;
padding: 0;
background-color: white;
overflow: hidden;
font-family: 'Ubuntu', sans-serif;
display: flex; /* Flexbox */
width: 100%;
}
/* Menüeinträge */
li.menu-item {
padding: 0;
text-align: center;
border-right: 5px solid white;
display: block;
text-align: center;
text-decoration: none;
border-radius: 3px;
transition: background-color 0.3s, color 0.3s; /* Smooth transition for hover effect */
}
li.menu-item a {
display: block;
color: white;
text-align: center;
text-decoration: none;
padding: 10px 20px;
font-size: 16px;
font-weight: 500;
border-radius: 3px;
transition: background-color 0.3s, color 0.3s; /* Smooth transition for hover effect */
}
/* Stretch-Element */
.stretch {
flex-grow: 1;
height: 30px;
}
li.menu-item a:hover {
color: black !important; /* Ensures text color change on hover */
background-color: #f7c13d !important; /* Ensures background color change on hover */
}
/* Aktiver Menüeintrag: Hintergrundfarbe und Schriftgewicht bei Aktivierung */
li.menu-item a:active {
color: #2b3136; /* Textfarbe beim aktiven Zustand */
font-weight: bolder; /* Fettere Schrift */
background-color: CornflowerBlue; /* Hintergrundfarbe beim aktiven Zustand */
}
Datenblatt
Handbuch
System Integration
Unverbindliche Beratung: +49(0)7665 9390 185
ÜbersichtKey FeaturesCOM Express Type 6 Rev. 3.0 Evaluation Carrier BoardReference Carrier BoardZubehör065810conga-TEVAL2Evaluation carrier board for COM Express Type6 Rev. 3.0 modules.Bitte stellen Sie sicher, dass Sie stets die aktuellsten Version der Produktspezifikationen des Herstellers verwenden. Hersteller-Produktseite: conga-TEVAL/COMe 3.0MCTX Mobile & Embedded Computers GmbH IST UM DIE RICHTIGKEIT UND AKTUALITÄT DER DATEN AUF DIESER WEBSEITE BEMÜHT, ÜBERNIMMT JEDOCH KEINERLEI ZUSICHERUNG BEZÜGLICH DES INHALTS. EINE HAFTUNG ODER GARANTIE FÜR DIE AKTUALITÄT, RICHTIGKEIT UND VOLLSTÄNDIGKEIT DER ZUR VERFÜGUNG GESTELLTEN INFORMATIONEN IST FOLGLICH AUSGESCHLOSSEN.Technische Unterstützung & System Integration Services
Alle Dokumente auf dieser Seite werden ohne Benachrichtigung aktualisiert.DatenblattHandbuch
Preis auf Anfrage