COM-HPC®
congatec conga-HPC/uATX-Server - COM-HPC CPU-Modul Application Carrier Board for COM-HPC Server Type Modules (Size D)
.product-menu-page {
font-family: 'Ubuntu', sans-serif;
color: #3f4c58;
}
.text_bold {
font-weight: bolder;
}
.product-menu-page {
display: none;
}
.product-menu-page:target {
display: block;
}
.head_sec {
background-color: #e9e9f0;
color: #4B70B2;}
.col_a {
background-color: #798490;
}
.head_subsec {color: CornflowerBlue;
padding-top: 10px;padding-left: 10px;
padding-right: 25px;
vertical-align: bottom;
}
.chead {
border: 1px solid Lavender;
font-size: 90%;
font-weight: bolder;}
.ckey {
width: 25%;white-space: nowrap;text-align: left;font-size: 90%;
font-weight: bolder;
border: 1px solid Lavender;word-break: break-word;
}
.copt {
width: 25%;text-align: left;font-size: 90%;
font-weight: bolder;
border: 1px solid Lavender;word-break: break-word;
}
.cval {
width: auto;text-align: left;
border: 1px solid Lavender;
word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;}
.rowspecsim {
font-size: 110%;
white-space: nowrap;text-align: left;
}
.column_1 {
width: 250px;white-space: nowrap;text-align: left;
}
.column_2 {
width: 250px;white-space: nowrap;text-align: left;
}
table {
margin-top: 10px;
width: 100%;
border-collapse: collapse;
table-layout: fixed;
}
th, td {
border: 1px solid White;text-align: left;
word-break: break-word;
font-size: 100%;
line-height: 1.5;
padding-top: 5px;
padding-left: 10px;
padding-bottom: 5px;
}
th {
font-size: 90%;
padding-left: 25px;
}
td {
word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;
}
#prod_kf {
font-size: 100%;width: 100%;}
#prod_spec {
font-size: 100%;word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;
}
#prod_spec_embed {
word-break: break-word;
font-size: 90%;
padding-top: 10px;width: 100%;}
#prod_disc {
font-size: 90%;
width: 100%;}
#prod_cpo {font-size: 90%;
width: 100%;
word-break: break-word;
}
#prod_var {
word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;
}
congatec conga-HPC/uATX-Server - COM-HPC CPU-ModulApplication Carrier Board for COM-HPC Server Type Modules (Size D)
Beispiel Menü
/* CSS-Variable für die Breite der schwarzen Buttons */
:root {
--black-button-width: 120px;
}
/* Menüleiste: Flexbox für gleichmäßig verteilte Menüeinträge */
ul.menu {
list-style-type: none;
margin: 0;
padding: 0;
background-color: white;
overflow: hidden;
font-family: 'Ubuntu', sans-serif;
display: flex; /* Flexbox */
width: 100%;
}
/* Menüeinträge */
li.menu-item {
padding: 0;
text-align: center;
border-right: 5px solid white;
display: block;
text-align: center;
text-decoration: none;
border-radius: 3px;
transition: background-color 0.3s, color 0.3s; /* Smooth transition for hover effect */
}
li.menu-item a {
display: block;
color: white;
text-align: center;
text-decoration: none;
padding: 10px 20px;
font-size: 16px;
font-weight: 500;
border-radius: 3px;
transition: background-color 0.3s, color 0.3s; /* Smooth transition for hover effect */
}
/* Stretch-Element */
.stretch {
flex-grow: 1;
height: 30px;
}
li.menu-item a:hover {
color: black !important; /* Ensures text color change on hover */
background-color: #f7c13d !important; /* Ensures background color change on hover */
}
/* Aktiver Menüeintrag: Hintergrundfarbe und Schriftgewicht bei Aktivierung */
li.menu-item a:active {
color: #2b3136; /* Textfarbe beim aktiven Zustand */
font-weight: bolder; /* Fettere Schrift */
background-color: CornflowerBlue; /* Hintergrundfarbe beim aktiven Zustand */
}
Datenblatt
Handbuch
System Integration
Unverbindliche Beratung: +49(0)7665 9390 185
ÜbersichtKey FeaturesQuick start for COM-HPC Server and Edge ComputingUnparalleled feature densityIndustrial temperature supportScalable µATX carrier boardZubehör065520conga-HPC/uATX-ServerCOM-HPC Server µATX carrier board065521conga-HPC/i-uATX-ServerIndustrial temperature COM-HPC Server µATX carrier board065529conga-HPC/uATX-Server I/O ShieldI/O shield accessory for COM-HPC Server µATX carrier boardBitte stellen Sie sicher, dass Sie stets die aktuellsten Version der Produktspezifikationen des Herstellers verwenden. Hersteller-Produktseite: conga-HPC/uATX-ServerMCTX Mobile & Embedded Computers GmbH IST UM DIE RICHTIGKEIT UND AKTUALITÄT DER DATEN AUF DIESER WEBSEITE BEMÜHT, ÜBERNIMMT JEDOCH KEINERLEI ZUSICHERUNG BEZÜGLICH DES INHALTS. EINE HAFTUNG ODER GARANTIE FÜR DIE AKTUALITÄT, RICHTIGKEIT UND VOLLSTÄNDIGKEIT DER ZUR VERFÜGUNG GESTELLTEN INFORMATIONEN IST FOLGLICH AUSGESCHLOSSEN.Technische Unterstützung & System Integration Services
Alle Dokumente auf dieser Seite werden ohne Benachrichtigung aktualisiert.DatenblattHandbuch
Preis auf Anfrage
congatec conga-HPC/uATX-Client - COM-HPC CPU-Modul Application Carrier Board for COM-HPC Client Type Modules (Sizes A, B, C)
.product-menu-page {
font-family: 'Ubuntu', sans-serif;
color: #3f4c58;
}
.text_bold {
font-weight: bolder;
}
.product-menu-page {
display: none;
}
.product-menu-page:target {
display: block;
}
.head_sec {
background-color: #e9e9f0;
color: #4B70B2;}
.col_a {
background-color: #798490;
}
.head_subsec {color: CornflowerBlue;
padding-top: 10px;padding-left: 10px;
padding-right: 25px;
vertical-align: bottom;
}
.chead {
border: 1px solid Lavender;
font-size: 90%;
font-weight: bolder;}
.ckey {
width: 25%;white-space: nowrap;text-align: left;font-size: 90%;
font-weight: bolder;
border: 1px solid Lavender;word-break: break-word;
}
.copt {
width: 25%;text-align: left;font-size: 90%;
font-weight: bolder;
border: 1px solid Lavender;word-break: break-word;
}
.cval {
width: auto;text-align: left;
border: 1px solid Lavender;
word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;}
.rowspecsim {
font-size: 110%;
white-space: nowrap;text-align: left;
}
.column_1 {
width: 250px;white-space: nowrap;text-align: left;
}
.column_2 {
width: 250px;white-space: nowrap;text-align: left;
}
table {
margin-top: 10px;
width: 100%;
border-collapse: collapse;
table-layout: fixed;
}
th, td {
border: 1px solid White;text-align: left;
word-break: break-word;
font-size: 100%;
line-height: 1.5;
padding-top: 5px;
padding-left: 10px;
padding-bottom: 5px;
}
th {
font-size: 90%;
padding-left: 25px;
}
td {
word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;
}
#prod_kf {
font-size: 100%;width: 100%;}
#prod_spec {
font-size: 100%;word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;
}
#prod_spec_embed {
word-break: break-word;
font-size: 90%;
padding-top: 10px;width: 100%;}
#prod_disc {
font-size: 90%;
width: 100%;}
#prod_cpo {font-size: 90%;
width: 100%;
word-break: break-word;
}
#prod_var {
word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;
}
congatec conga-HPC/uATX-Client - COM-HPC CPU-ModulApplication Carrier Board for COM-HPC Client Type Modules (Sizes A, B, C)
Beispiel Menü
/* CSS-Variable für die Breite der schwarzen Buttons */
:root {
--black-button-width: 120px;
}
/* Menüleiste: Flexbox für gleichmäßig verteilte Menüeinträge */
ul.menu {
list-style-type: none;
margin: 0;
padding: 0;
background-color: white;
overflow: hidden;
font-family: 'Ubuntu', sans-serif;
display: flex; /* Flexbox */
width: 100%;
}
/* Menüeinträge */
li.menu-item {
padding: 0;
text-align: center;
border-right: 5px solid white;
display: block;
text-align: center;
text-decoration: none;
border-radius: 3px;
transition: background-color 0.3s, color 0.3s; /* Smooth transition for hover effect */
}
li.menu-item a {
display: block;
color: white;
text-align: center;
text-decoration: none;
padding: 10px 20px;
font-size: 16px;
font-weight: 500;
border-radius: 3px;
transition: background-color 0.3s, color 0.3s; /* Smooth transition for hover effect */
}
/* Stretch-Element */
.stretch {
flex-grow: 1;
height: 30px;
}
li.menu-item a:hover {
color: black !important; /* Ensures text color change on hover */
background-color: #f7c13d !important; /* Ensures background color change on hover */
}
/* Aktiver Menüeintrag: Hintergrundfarbe und Schriftgewicht bei Aktivierung */
li.menu-item a:active {
color: #2b3136; /* Textfarbe beim aktiven Zustand */
font-weight: bolder; /* Fettere Schrift */
background-color: CornflowerBlue; /* Hintergrundfarbe beim aktiven Zustand */
}
Datenblatt
Handbuch
System Integration
Unverbindliche Beratung: +49(0)7665 9390 185
ÜbersichtKey FeaturesApplication carrier board for COM-HPCScalable µATX motherboardLongevity by module conceptQuick start to the COM-HPC worldZubehör065620conga-HPC/uATX-ClientCOM-HPC Client µATX Application Carrier Board suitable for congatec COM-HPC modules with Size A,B and C.Bitte stellen Sie sicher, dass Sie stets die aktuellsten Version der Produktspezifikationen des Herstellers verwenden. Hersteller-Produktseite: conga-HPC/uATX-ClientMCTX Mobile & Embedded Computers GmbH IST UM DIE RICHTIGKEIT UND AKTUALITÄT DER DATEN AUF DIESER WEBSEITE BEMÜHT, ÜBERNIMMT JEDOCH KEINERLEI ZUSICHERUNG BEZÜGLICH DES INHALTS. EINE HAFTUNG ODER GARANTIE FÜR DIE AKTUALITÄT, RICHTIGKEIT UND VOLLSTÄNDIGKEIT DER ZUR VERFÜGUNG GESTELLTEN INFORMATIONEN IST FOLGLICH AUSGESCHLOSSEN.Technische Unterstützung & System Integration Services
Alle Dokumente auf dieser Seite werden ohne Benachrichtigung aktualisiert.DatenblattHandbuch
Preis auf Anfrage
congatec conga-HPC/sILL - COM-HPC Server CPU-Modul mit Intel® Ice Lake COM-HPC Server Size D module based on Intel® Xeon® D processor series (code name "Ice Lake")
.product-menu-page {
font-family: 'Ubuntu', sans-serif;
color: #3f4c58;
}
.text_bold {
font-weight: bolder;
}
.product-menu-page {
display: none;
}
.product-menu-page:target {
display: block;
}
.head_sec {
background-color: #e9e9f0;
color: #4B70B2;}
.col_a {
background-color: #798490;
}
.head_subsec {color: CornflowerBlue;
padding-top: 10px;padding-left: 10px;
padding-right: 25px;
vertical-align: bottom;
}
.chead {
border: 1px solid Lavender;
font-size: 90%;
font-weight: bolder;}
.ckey {
width: 25%;white-space: nowrap;text-align: left;font-size: 90%;
font-weight: bolder;
border: 1px solid Lavender;word-break: break-word;
}
.copt {
width: 25%;text-align: left;font-size: 90%;
font-weight: bolder;
border: 1px solid Lavender;word-break: break-word;
}
.cval {
width: auto;text-align: left;
border: 1px solid Lavender;
word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;}
.rowspecsim {
font-size: 110%;
white-space: nowrap;text-align: left;
}
.column_1 {
width: 250px;white-space: nowrap;text-align: left;
}
.column_2 {
width: 250px;white-space: nowrap;text-align: left;
}
table {
margin-top: 10px;
width: 100%;
border-collapse: collapse;
table-layout: fixed;
}
th, td {
border: 1px solid White;text-align: left;
word-break: break-word;
font-size: 100%;
line-height: 1.5;
padding-top: 5px;
padding-left: 10px;
padding-bottom: 5px;
}
th {
font-size: 90%;
padding-left: 25px;
}
td {
word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;
}
#prod_kf {
font-size: 100%;width: 100%;}
#prod_spec {
font-size: 100%;word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;
}
#prod_spec_embed {
word-break: break-word;
font-size: 90%;
padding-top: 10px;width: 100%;}
#prod_disc {
font-size: 90%;
width: 100%;}
#prod_cpo {font-size: 90%;
width: 100%;
word-break: break-word;
}
#prod_var {
word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;
}
congatec conga-HPC/sILL - COM-HPC Server CPU-Modul mit Intel® Ice LakeCOM-HPC Server Size D module based on Intel® Xeon® D processor series (code name "Ice Lake")
Beispiel Menü
/* CSS-Variable für die Breite der schwarzen Buttons */
:root {
--black-button-width: 120px;
}
/* Menüleiste: Flexbox für gleichmäßig verteilte Menüeinträge */
ul.menu {
list-style-type: none;
margin: 0;
padding: 0;
background-color: white;
overflow: hidden;
font-family: 'Ubuntu', sans-serif;
display: flex; /* Flexbox */
width: 100%;
}
/* Menüeinträge */
li.menu-item {
padding: 0;
text-align: center;
border-right: 5px solid white;
display: block;
text-align: center;
text-decoration: none;
border-radius: 3px;
transition: background-color 0.3s, color 0.3s; /* Smooth transition for hover effect */
}
li.menu-item a {
display: block;
color: white;
text-align: center;
text-decoration: none;
padding: 10px 20px;
font-size: 16px;
font-weight: 500;
border-radius: 3px;
transition: background-color 0.3s, color 0.3s; /* Smooth transition for hover effect */
}
/* Stretch-Element */
.stretch {
flex-grow: 1;
height: 30px;
}
li.menu-item a:hover {
color: black !important; /* Ensures text color change on hover */
background-color: #f7c13d !important; /* Ensures background color change on hover */
}
/* Aktiver Menüeintrag: Hintergrundfarbe und Schriftgewicht bei Aktivierung */
li.menu-item a:active {
color: #2b3136; /* Textfarbe beim aktiven Zustand */
font-weight: bolder; /* Fettere Schrift */
background-color: CornflowerBlue; /* Hintergrundfarbe beim aktiven Zustand */
}
Datenblatt
Handbuch
System Integration
Unverbindliche Beratung: +49(0)7665 9390 185
ÜbersichtKey FeaturesCPUIndustrial Use Condition with extended Temperature options32 PCIe Express lanesAI Capabilities with Intel® DL boostReal Time Capable PlatformSupporting up to 256 GB DDR4 2933MT/s Memory
CPU Produktfamilie: Intel® Ice Lake
Intel® Xeon® D-1746TER (15M Cache, bis zu 3.10 GHz)Intel® Xeon® D-1735TR (15M Cache, bis zu 3.40 GHz)Intel® Xeon® D-1732TE (15M Cache, bis zu 3.00 GHz)Intel® Xeon® D-1715TER (10M Cache, bis zu 3.50 GHz)Intel® Xeon® D-1712TR (10M Cache, bis zu 3.10 GHz)CPU-Varianten
CPU
Processor Number
Cache
Max Turbo Frequency
Total Cores
Total Threads
PCI Express Revision
Intel® Xeon® D-1746TER
D-1746TER
15 MB
3.10 GHz
10
20
4.0
Intel® Xeon® D-1735TR
D-1735TR
15 MB
3.40 GHz
8
16
4.0
Intel® Xeon® D-1732TE
D-1732TE
15 MB
3.00 GHz
8
16
4.0
Intel® Xeon® D-1715TER
D-1715TER
10 MB
3.50 GHz
4
8
4.0
Intel® Xeon® D-1712TR
D-1712TR
10 MB
3.10 GHz
4
8
4.0
SpezifikationFormfactorCOM-HPCCPUIntel® Xeon® D-1848TER(10 x 2.0 GHz, 15 MB cache, 100G Eth, 57W)Intel® Xeon® D-1712TR(4 x 2.0 GHz, 10 MB cache, 50G Eth, 39W)Intel® Xeon® D-1735TR(8 x 2.2 GHz, 15 MB cache, 50G Eth, 59W)Intel® Xeon® D-1715TER(4 x 2.4 GHz, 10 MB cache, 50G Eth, 50W)Intel® Xeon® D-1732TE(8 x 1.9 GHz, 15 MB cache, 50G Eth, 52W)Intel® Xeon® D-1746TER(10 x 2.0 GHz, 15 MB cache, 100G Eth, 67W)DRAM4x DIMM sockets for DDR4 memory modules | Max. capacity = 256GBEthernet1 x 2.5GbE TSN Ethernet2x 40G / 4x 25G / 8x 10G/2.5G/1G/100M lanes | Maximum total bandwidth 100Gb (depending on CPU)I/O Interfaces16 x PCIe Gen416 x PCIe Gen34 x USB 3.04 x USB 2.02 x SATA III (6Gb/s)2 x UART12 x GPIOs2 x SM-Bus2 x I²C buscongatec Board ControllerMulti Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirectionembedded BIOS FeaturesAMI Aptio UEFI64Mbyte serial SPI with congatec Embedded BIOS featureOEM LogoOEM CMOS DefaultsFlash UpdateSecurityTrusted Platform Module (TPM 2.0)Power ManagementACPI 5.0 with battery supportOperating SystemsMicrosoft® Windows® 10Microsoft® Windows 10 IoT EnterpriseMicrosoft® Windows IoT 10 CoreLinuxAndroidYoctoHypervisorRTS Real-Time HypervisorTemperatureCommercial: Operating Temperature: 0 to +60°C | Storage Temperature: -20 to +85°CIndustrial: Operating Temperature: -40 to +85°C | Storage Temperature: -40 to +85°C (depending on CPU)HumidityOperating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.Size160 x 160 mmProduktvarianten / Zubehör050412conga-HPC/sILL-D1848TERCOM-HPC Size D module based on Intel® Xeon® D-1848TER 10-core processor with 2.0 GHz, 15MB cache and dual channel DDR4 2666 MT/s memory interface (formerly Ice Lake-D Refresh LCC). Industrial temperature range from -40°C to 85°C.050400conga-HPC/sILL-D1746TERCOM-HPC Size D module based on Intel® Xeon® D1746TER 10-core processor with 2.0 GHz, 15MB cache and dual channel DDR4 up to 2667 MT/s memory interface (formerly Ice Lake-D LCC). Industrial temperature range from -40°C to 85°C.050401conga-HPC/sILL-D1732TECOM-HPC Size D module based on Intel® Xeon® D1732TE 8-core processor with 1.9 GHz, 15MB cache and dual channel DDR4 up to 2667 MT/s memory interface (formerly Ice Lake-D LCC). Industrial temperature range from -40°C to 85°C.050402conga-HPC/sILL-D1715TERCOM-HPC Size D module based on Intel® Xeon® D1715TER 4-core processor with 2.4 GHz, 10MB cache and dual channel DDR4 up to 2667 MT/s memory interface (formerly Ice Lake-D LCC). Extended temperature range from -40°C to 80°C.050410conga-HPC/sILL-D1735TRCOM-HPC Size D module based on Intel® Xeon® D1735TR 8-core processor with 2.2 GHz, 15MB cache and dual channel DDR4 up to 2933 MT/s memory interface (formerly Ice Lake-D LCC). Commercial temperature range from 0°C to 60°C.050411conga-HPC/sILL-D1712TRCOM-HPC Size D module based on Intel® Xeon® D1712TR 4-core processor with 2.0 GHz, 10MB cache and dual channel DDR4 up to 2400 MT/s memory interface (formerly Ice Lake-D LCC). Commercial temperature range from 0°C to 60°C.Zubehör050450conga-HPC/sILL-CSA-HPStandard active cooling solution for COM-HPC Server modules conga-HPC/sILL with integrated heat pipes, 35.2mm overall cooling height and integrated 12V fan.050451conga-HPC/sILL-CSP-HPStandard passive cooling solution for COM-HPC Server modules conga-HPC/sILL with integrated heat pipes, 18.2mm overall cooling height.050452conga-HPC/sILL-HSP-HP-BStandard heatspreader for COM-HPC Server modules conga-HPC/sILL with integrated heat pipes and 11mm overall cooling height. Through hole mounting with bore hole standoffs Ø2.7mm.050453conga-HPC/sILL-HSP-HP-TStandard heatspreader for COM-HPC Server modules conga-HPC/sILL with integrated heat pipes and 11mm overall cooling height. Threaded mounting with threaded standoffs M2.5.050454conga-HPC/sILL-HPAHeat pipe Adapter for COM-HPC Server modules conga-HPC/sILL. Suitable for standard 8 mm heat pipes to optimize heat distribution.050455conga-HPC/sILL-Retention FrameRetention frame for conga-HPC/sILL065500conga-HPC/EVAL-Serverconga-HPC/EVAL-Server069000DDR4-UDIMM-3200 (16GB)DDR4 UDIMM memory module with 3200 MT/s and 16GB RAM069003DDR4-UDIMM-3200 ECC (16GB)DDR4 ECC UDIMM memory module with 3200 MT/s and 16GB RAM069002DDR4-UDIMM-3200 (16GB) / i-tempIndustrial DDR4 UDIMM memory module with 3200 MT/s and 16GB RAM069004DDR4-UDIMM-3200 ECC (16GB) / i-tempIndustrial DDR4 ECC UDIMM memory module with 3200 MT/s and 16GB RAM069001DDR4-UDIMM-3200 (32GB)DDR4 UDIMM memory module with 3200 MT/s and 32GB RAM069006DDR4-UDIMM-3200 ECC (32GB)DDR4 ECC UDIMM memory module with 3200 MT/s and 32GB RAM069005DDR4-UDIMM-3200 (32GB) / i-tempIndustrial DDR4 UDIMM memory module with 3200 MT/s and 32GB RAM069007DDR4-UDIMM-3200 ECC (32GB) / i-tempIndustrial DDR4 ECC UDIMM memory module with 3200 MT/s and 32GB RAM069200DDR4-RDIMM-3200 ECC (16GB)DDR4 ECC RDIMM memory module with 3200 MT/s and 16GB RAM069210DDR4-RDIMM-3200 ECC (16GB) / i-tempIndustrial DDR4 ECC RDIMM memory module with 3200 MT/s and 16GB RAM069220DDR4-RDIMM-3200 ECC (32GB)DDR4 ECC RDIMM memory module with 3200 MT/s and 32GB RAM069230DDR4-RDIMM-3200 ECC (32GB) / i-tempIndustrial DDR4 ECC RDIMM memory module with 3200 MT/s and 32GB RAM069240DDR4-RDIMM-3200 ECC (64GB)DDR4 ECC RDIMM memory module with up to 3200 MT/s and 64GB RAM069250DDR4-RDIMM-3200 ECC (64GB) / i-tempIndustrial DDR4 ECC RDIMM memory module with 3200 MT/s and 64GB RAM069600VLP DDR4-RDIMM-3200 ECC (16GB)DDR4 ECC VLP RDIMM memory module with up to 3200 MT/s and 16GB RAM069610VLP DDR4-RDIMM-3200 ECC (16GB) / i-tempIndustrial DDR4 ECC VLP RDIMM memory module with up to 3200 MT/s and 16GB RAM069620VLP DDR4-RDIMM-3200 ECC (32GB)DDR4 ECC VLP RDIMM memory module with up to 3200 MT/s and 32GB RAM27000001Design-In TrainingDesign-Training to develop carrier boards for Computer on ModulesBitte stellen Sie sicher, dass Sie stets die aktuellsten Version der Produktspezifikationen des Herstellers verwenden. Hersteller-Produktseite: conga-HPC/sILLMCTX Mobile & Embedded Computers GmbH IST UM DIE RICHTIGKEIT UND AKTUALITÄT DER DATEN AUF DIESER WEBSEITE BEMÜHT, ÜBERNIMMT JEDOCH KEINERLEI ZUSICHERUNG BEZÜGLICH DES INHALTS. EINE HAFTUNG ODER GARANTIE FÜR DIE AKTUALITÄT, RICHTIGKEIT UND VOLLSTÄNDIGKEIT DER ZUR VERFÜGUNG GESTELLTEN INFORMATIONEN IST FOLGLICH AUSGESCHLOSSEN.Technische Unterstützung & System Integration Services
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congatec conga-HPC/sILH - COM-HPC Server CPU-Modul mit Intel® Ice Lake COM-HPC Server Size D module based on Intel® Xeon® D processor series (code name "Ice Lake")
.product-menu-page {
font-family: 'Ubuntu', sans-serif;
color: #3f4c58;
}
.text_bold {
font-weight: bolder;
}
.product-menu-page {
display: none;
}
.product-menu-page:target {
display: block;
}
.head_sec {
background-color: #e9e9f0;
color: #4B70B2;}
.col_a {
background-color: #798490;
}
.head_subsec {color: CornflowerBlue;
padding-top: 10px;padding-left: 10px;
padding-right: 25px;
vertical-align: bottom;
}
.chead {
border: 1px solid Lavender;
font-size: 90%;
font-weight: bolder;}
.ckey {
width: 25%;white-space: nowrap;text-align: left;font-size: 90%;
font-weight: bolder;
border: 1px solid Lavender;word-break: break-word;
}
.copt {
width: 25%;text-align: left;font-size: 90%;
font-weight: bolder;
border: 1px solid Lavender;word-break: break-word;
}
.cval {
width: auto;text-align: left;
border: 1px solid Lavender;
word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;}
.rowspecsim {
font-size: 110%;
white-space: nowrap;text-align: left;
}
.column_1 {
width: 250px;white-space: nowrap;text-align: left;
}
.column_2 {
width: 250px;white-space: nowrap;text-align: left;
}
table {
margin-top: 10px;
width: 100%;
border-collapse: collapse;
table-layout: fixed;
}
th, td {
border: 1px solid White;text-align: left;
word-break: break-word;
font-size: 100%;
line-height: 1.5;
padding-top: 5px;
padding-left: 10px;
padding-bottom: 5px;
}
th {
font-size: 90%;
padding-left: 25px;
}
td {
word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;
}
#prod_kf {
font-size: 100%;width: 100%;}
#prod_spec {
font-size: 100%;word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;
}
#prod_spec_embed {
word-break: break-word;
font-size: 90%;
padding-top: 10px;width: 100%;}
#prod_disc {
font-size: 90%;
width: 100%;}
#prod_cpo {font-size: 90%;
width: 100%;
word-break: break-word;
}
#prod_var {
word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;
}
congatec conga-HPC/sILH - COM-HPC Server CPU-Modul mit Intel® Ice LakeCOM-HPC Server Size D module based on Intel® Xeon® D processor series (code name "Ice Lake")
Beispiel Menü
/* CSS-Variable für die Breite der schwarzen Buttons */
:root {
--black-button-width: 120px;
}
/* Menüleiste: Flexbox für gleichmäßig verteilte Menüeinträge */
ul.menu {
list-style-type: none;
margin: 0;
padding: 0;
background-color: white;
overflow: hidden;
font-family: 'Ubuntu', sans-serif;
display: flex; /* Flexbox */
width: 100%;
}
/* Menüeinträge */
li.menu-item {
padding: 0;
text-align: center;
border-right: 5px solid white;
display: block;
text-align: center;
text-decoration: none;
border-radius: 3px;
transition: background-color 0.3s, color 0.3s; /* Smooth transition for hover effect */
}
li.menu-item a {
display: block;
color: white;
text-align: center;
text-decoration: none;
padding: 10px 20px;
font-size: 16px;
font-weight: 500;
border-radius: 3px;
transition: background-color 0.3s, color 0.3s; /* Smooth transition for hover effect */
}
/* Stretch-Element */
.stretch {
flex-grow: 1;
height: 30px;
}
li.menu-item a:hover {
color: black !important; /* Ensures text color change on hover */
background-color: #f7c13d !important; /* Ensures background color change on hover */
}
/* Aktiver Menüeintrag: Hintergrundfarbe und Schriftgewicht bei Aktivierung */
li.menu-item a:active {
color: #2b3136; /* Textfarbe beim aktiven Zustand */
font-weight: bolder; /* Fettere Schrift */
background-color: CornflowerBlue; /* Hintergrundfarbe beim aktiven Zustand */
}
Datenblatt
Handbuch
System Integration
Unverbindliche Beratung: +49(0)7665 9390 185
ÜbersichtKey FeaturesCPUIndustrial Use Condition with extended Temperature options48 PCIe Express lanesAI Capabilities with Intel® DL boostReal Time Capable Platform
CPU Produktfamilie: Intel® Ice Lake
Intel® Xeon® D-2796TE (30M Cache, bis zu 3.10 GHz)Intel® Xeon® D-2775TE (25M Cache, bis zu 3.10 GHz)Intel® Xeon® D-2752TER (20M Cache, bis zu 2.80 GHz)Intel® Xeon® D-2733NT (15M Cache, bis zu 3.20 GHz)Intel® Xeon® D-2712T (15M Cache, bis zu 3.00 GHz)CPU-Varianten
CPU
Processor Number
Cache
Max Turbo Frequency
Total Cores
Total Threads
PCI Express Revision
Intel® Xeon® D-2796TE
D-2796TE
30 MB
3.10 GHz
20
40
4.0
Intel® Xeon® D-2775TE
D-2775TE
25 MB
3.10 GHz
16
32
4.0
Intel® Xeon® D-2752TER
D-2752TER
20 MB
2.80 GHz
12
24
4.0
Intel® Xeon® D-2733NT
D-2733NT
15 MB
3.20 GHz
8
16
4.0
Intel® Xeon® D-2712T
D-2712T
15 MB
3.00 GHz
4
8
4.0
SpezifikationFormfactorCOM-HPCCPUIntel® Xeon® D-2899NT(22 x 2.2 GHz, 30 MB cache, 100G Eth, 135W)Intel® Xeon® D-2712T(4 x 1.9 GHz, 15 MB cache, 50G Eth, 65W)Intel® Xeon® D-2733NT(8 x 2.1 GHz, 15 MB cache, 50G Eth, 80W)Intel® Xeon® D-2752TER(12 x 1.8 GHz, 20 MB cache, 50G Eth, 77W)Intel® Xeon® D-2775TE(16 x 2.0 GHz, 25 MB cache, 100G Eth, 100W)Intel® Xeon® D-2796TE(20 x 2.0 GHz, 30 MB cache, 100G Eth, 118W)DRAM4x DIMM sockets for DDR4 memory modules | Max. capacity = 512GB**Optional 8 sockets on Size E, up to 1TBEthernet1 x 2.5GbE TSN Ethernet2x 40G / 4x 25G / 8x 10G/2.5G/1G/100M lanes | Maximum total bandwidth 100Gb (depending on CPU)I/O Interfaces32 x PCIe Gen416 x PCIe Gen34 x USB 3.04 x USB 2.02 x SATA III (6Gb/s)2 x UART12 x GPIOs2 x SM-Bus2 x I²C buscongatec Board ControllerMulti Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirectionembedded BIOS FeaturesAMI Aptio UEFI64Mbyte serial SPI with congatec Embedded BIOS featureOEM LogoOEM CMOS DefaultsFlash UpdateSecurityTrusted Platform Module (TPM 2.0)Power ManagementACPI 5.0 with battery supportOperating SystemsMicrosoft® Windows® 10Microsoft® Windows 10 IoT EnterpriseMicrosoft® Windows IoT 10 CoreLinuxAndroidYoctoHypervisorRTS Real-Time HypervisorTemperatureCommercial: Operating Temperature: 0 to +60°C | Storage Temperature: -20 to +80°CIndustrial:
Operating Temperature: -40 to +80°C | Storage Temperature: -40 to +80°CHumidityOperating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.Size160 x 160 mmOptional available on Size E, 200 x 160mmProduktvarianten / Zubehör050912conga-HPC/sILH-D2899NTCOM-HPC Size D module based on Intel® Xeon® D-2899NT 22-core processor with 2.2 GHz, 30MB cache and quad channel DDR4 3200 MT/s memory interface (formerly Ice Lake-D HCC Refresh). Commercial temperature range.050900conga-HPC/sILH-D2796TECOM-HPC Size D module based on Intel® Xeon® D-2796TE 20-core processor with 2.0 GHz, 30MB cache and quad channel DDR4 2933 MT/s memory interface (formerly Ice Lake-D HCC). Industrial temperature range.050901conga-HPC/sILH-D2775TECOM-HPC Size D module based on Intel® Xeon® D-2775TE 16-core processor with 2.0 GHz, 25MB cache and quad channel DDR4 2933 MT/s memory interface (formerly Ice Lake-D HCC). Industrial temperature range.050902conga-HPC/sILH-D2752TERCOM-HPC Size D module based on Intel® Xeon® D-2752TER 12-core processor with 1.8 GHz, 20MB cache and quad channel DDR4 2666 MT/s memory interface (formerly Ice Lake-D HCC). Industrial temperature range.050910conga-HPC/sILH-D2733NTCOM-HPC Size D module based on Intel® Xeon® D-2733NT 8-core processor with 2.1 GHz, 15MB cache and quad channel DDR4 2666 MT/s memory interface (formerly Ice Lake-D HCC). Commercial temperature range.050911conga-HPC/sILH-D2712TCOM-HPC Size D module based on Intel® Xeon® D-2712T 4-core processor with 1.9 GHz, 15MB cache and quad channel DDR4 2666 MT/s memory interface (formerly Ice Lake-D HCC). Commercial temperature range.050995conga-HPC/sILH-D2796TE DPLLCOM-HPC Size D module based on Intel® Xeon® D-2796TE 20-core processor with 2.0 GHz, 30MB cache and quad channel DDR4 2933 MT/s memory interface (formerly Ice Lake-D HCC). Industrial temperature range. With DPLL option for ITU-T Synchronous Ethernet (SyncE) and IEEE1588 PTP support.050996conga-HPC/sILH-D2775TE DPLLCOM-HPC Size D modulebasedon Intel® Xeon® D-2775TE 16-core processorwith2.0 GHz, 25MB cacheand quadchannelDDR4 2933 MT/s memoryinterface (formerlyIce Lake-D HCC). Industrial temperaturerange. WithDPLL optionforITU-T SynchronousEthernet (SyncE) and IEEE1588 PTP support.Zubehör050950conga-HPC/sILH-CSA-HP-BStandard active cooling solution for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes, 32.9mm overall cooling height and integrated 12V fan. Through hole mounting with bore hole standoffs Ø2.7mm.050951conga-HPC/sILH-CSA-HP-TStandard active cooling solution for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes, 32.9mm overall cooling height and integrated 12V fan. Threaded mounting with threaded standoffs M2.5.050952conga-HPC/sILH-HSP-HP-BStandard heatspreader for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes and 11mm overall cooling height. Through hole mounting with bore hole standoffs Ø2.7mm.050953conga-HPC/sILH-HSP-HP-TStandard heatspreader for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes and 11mm overall cooling height. Threaded mounting with threaded standoffs M2.5.050954conga-HPC/sILH-HPA-BHeat pipe Adapter for COM-HPC Server modules conga-HPC/sILH. Suitable for standard 8 mm heat pipes to optimize heat distribution. Through hole mounting with bore hole standoffs Ø2.7mm.050955conga-HPC/sILH-HPA-THeat pipe Adapter for COM-HPC Server modules conga-HPC/sILH. Suitable for standard 8 mm heat pipes to optimize heat distribution. Threaded mounting with threaded standoffs M2.5.050956conga-HPC/sILH-Retention FrameRetention frame for conga-HPC/sILH065500conga-HPC/EVAL-Serverconga-HPC/EVAL-Server069420DDR4-LRDIMM-3200 ECC (128GB)DDR4 ECC LRDIMM memory module with 3200 MT/s and 128GB RAM069430DDR4-LRDIMM-3200 ECC (128GB)Industrial DDR4 ECC LRDIMM memory module with 3200 MT/s and 128GB RAM069000DDR4-UDIMM-3200 (16GB)DDR4 UDIMM memory module with 3200 MT/s and 16GB RAM069003DDR4-UDIMM-3200 ECC (16GB)DDR4 ECC UDIMM memory module with 3200 MT/s and 16GB RAM069002DDR4-UDIMM-3200 (16GB) / i-tempIndustrial DDR4 UDIMM memory module with 3200 MT/s and 16GB RAM069004DDR4-UDIMM-3200 ECC (16GB) / i-tempIndustrial DDR4 ECC UDIMM memory module with 3200 MT/s and 16GB RAM069001DDR4-UDIMM-3200 (32GB)DDR4 UDIMM memory module with 3200 MT/s and 32GB RAM069006DDR4-UDIMM-3200 ECC (32GB)DDR4 ECC UDIMM memory module with 3200 MT/s and 32GB RAM069005DDR4-UDIMM-3200 (32GB) / i-tempIndustrial DDR4 UDIMM memory module with 3200 MT/s and 32GB RAM069007DDR4-UDIMM-3200 ECC (32GB) / i-tempIndustrial DDR4 ECC UDIMM memory module with 3200 MT/s and 32GB RAM069200DDR4-RDIMM-3200 ECC (16GB)DDR4 ECC RDIMM memory module with 3200 MT/s and 16GB RAM069210DDR4-RDIMM-3200 ECC (16GB) / i-tempIndustrial DDR4 ECC RDIMM memory module with 3200 MT/s and 16GB RAM069220DDR4-RDIMM-3200 ECC (32GB)DDR4 ECC RDIMM memory module with 3200 MT/s and 32GB RAM069230DDR4-RDIMM-3200 ECC (32GB) / i-tempIndustrial DDR4 ECC RDIMM memory module with 3200 MT/s and 32GB RAM069240DDR4-RDIMM-3200 ECC (64GB)DDR4 ECC RDIMM memory module with up to 3200 MT/s and 64GB RAM069610VLP DDR4-RDIMM-3200 ECC (16GB) / i-tempIndustrial DDR4 ECC VLP RDIMM memory module with up to 3200 MT/s and 16GB RAM069600VLP DDR4-RDIMM-3200 ECC (16GB)DDR4 ECC VLP RDIMM memory module with up to 3200 MT/s and 16GB RAM069620VLP DDR4-RDIMM-3200 ECC (32GB)DDR4 ECC VLP RDIMM memory module with up to 3200 MT/s and 32GB RAM065505conga-HPC/LEK-C827-IM 4SFP28COM-HPC Mezzanine card with Intel C827-IM, 4xSFP28065506conga-HPC/LEK-XL827-AM 8SFP+COM-HPC Mezzanine card with 2x Intel XL827-AM, 8xSFP+065508conga-HPC/LEK-C827-IM 2QSFP28COM-HPC Mezzanine card with Intel C827-IM, 2x QSFP28Bitte stellen Sie sicher, dass Sie stets die aktuellsten Version der Produktspezifikationen des Herstellers verwenden. Hersteller-Produktseite: conga-HPC/sILHMCTX Mobile & Embedded Computers GmbH IST UM DIE RICHTIGKEIT UND AKTUALITÄT DER DATEN AUF DIESER WEBSEITE BEMÜHT, ÜBERNIMMT JEDOCH KEINERLEI ZUSICHERUNG BEZÜGLICH DES INHALTS. EINE HAFTUNG ODER GARANTIE FÜR DIE AKTUALITÄT, RICHTIGKEIT UND VOLLSTÄNDIGKEIT DER ZUR VERFÜGUNG GESTELLTEN INFORMATIONEN IST FOLGLICH AUSGESCHLOSSEN.Technische Unterstützung & System Integration Services
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congatec conga-HPC/LEK - COM-HPC CPU-Modul Mezzanine Cards for up to 100Gb Ethernet
.product-menu-page {
font-family: 'Ubuntu', sans-serif;
color: #3f4c58;
}
.text_bold {
font-weight: bolder;
}
.product-menu-page {
display: none;
}
.product-menu-page:target {
display: block;
}
.head_sec {
background-color: #e9e9f0;
color: #4B70B2;}
.col_a {
background-color: #798490;
}
.head_subsec {color: CornflowerBlue;
padding-top: 10px;padding-left: 10px;
padding-right: 25px;
vertical-align: bottom;
}
.chead {
border: 1px solid Lavender;
font-size: 90%;
font-weight: bolder;}
.ckey {
width: 25%;white-space: nowrap;text-align: left;font-size: 90%;
font-weight: bolder;
border: 1px solid Lavender;word-break: break-word;
}
.copt {
width: 25%;text-align: left;font-size: 90%;
font-weight: bolder;
border: 1px solid Lavender;word-break: break-word;
}
.cval {
width: auto;text-align: left;
border: 1px solid Lavender;
word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;}
.rowspecsim {
font-size: 110%;
white-space: nowrap;text-align: left;
}
.column_1 {
width: 250px;white-space: nowrap;text-align: left;
}
.column_2 {
width: 250px;white-space: nowrap;text-align: left;
}
table {
margin-top: 10px;
width: 100%;
border-collapse: collapse;
table-layout: fixed;
}
th, td {
border: 1px solid White;text-align: left;
word-break: break-word;
font-size: 100%;
line-height: 1.5;
padding-top: 5px;
padding-left: 10px;
padding-bottom: 5px;
}
th {
font-size: 90%;
padding-left: 25px;
}
td {
word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;
}
#prod_kf {
font-size: 100%;width: 100%;}
#prod_spec {
font-size: 100%;word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;
}
#prod_spec_embed {
word-break: break-word;
font-size: 90%;
padding-top: 10px;width: 100%;}
#prod_disc {
font-size: 90%;
width: 100%;}
#prod_cpo {font-size: 90%;
width: 100%;
word-break: break-word;
}
#prod_var {
word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;
}
congatec conga-HPC/LEK - COM-HPC CPU-ModulMezzanine Cards for up to 100Gb Ethernet
Beispiel Menü
/* CSS-Variable für die Breite der schwarzen Buttons */
:root {
--black-button-width: 120px;
}
/* Menüleiste: Flexbox für gleichmäßig verteilte Menüeinträge */
ul.menu {
list-style-type: none;
margin: 0;
padding: 0;
background-color: white;
overflow: hidden;
font-family: 'Ubuntu', sans-serif;
display: flex; /* Flexbox */
width: 100%;
}
/* Menüeinträge */
li.menu-item {
padding: 0;
text-align: center;
border-right: 5px solid white;
display: block;
text-align: center;
text-decoration: none;
border-radius: 3px;
transition: background-color 0.3s, color 0.3s; /* Smooth transition for hover effect */
}
li.menu-item a {
display: block;
color: white;
text-align: center;
text-decoration: none;
padding: 10px 20px;
font-size: 16px;
font-weight: 500;
border-radius: 3px;
transition: background-color 0.3s, color 0.3s; /* Smooth transition for hover effect */
}
/* Stretch-Element */
.stretch {
flex-grow: 1;
height: 30px;
}
li.menu-item a:hover {
color: black !important; /* Ensures text color change on hover */
background-color: #f7c13d !important; /* Ensures background color change on hover */
}
/* Aktiver Menüeintrag: Hintergrundfarbe und Schriftgewicht bei Aktivierung */
li.menu-item a:active {
color: #2b3136; /* Textfarbe beim aktiven Zustand */
font-weight: bolder; /* Fettere Schrift */
background-color: CornflowerBlue; /* Hintergrundfarbe beim aktiven Zustand */
}
Datenblatt
Handbuch
System Integration
Unverbindliche Beratung: +49(0)7665 9390 185
ÜbersichtKey FeaturesLan Enabling Kits (LEK)Add-on cards for usage with conga-HPC/EVAL-ServerConfiguration options for up to 100GbEPart of the congatec COM-HPC EcosystemZubehör065505conga-HPC/LEK-C827-IM 4SFP28COM-HPC Mezzanine card with Intel C827-IM, 4xSFP28065506conga-HPC/LEK-XL827-AM 8SFP+COM-HPC Mezzanine card with 2x Intel XL827-AM, 8xSFP+065507conga-HPC/LEK-QSFPCOM-HPC Mezzanine card with direct connection: 4x SFP28 and 1x QSFP adapter065508conga-HPC/LEK-C827-IM 2QSFP28COM-HPC Mezzanine card with Intel C827-IM, 2x QSFP28Bitte stellen Sie sicher, dass Sie stets die aktuellsten Version der Produktspezifikationen des Herstellers verwenden. Hersteller-Produktseite: conga-HPC/LEKMCTX Mobile & Embedded Computers GmbH IST UM DIE RICHTIGKEIT UND AKTUALITÄT DER DATEN AUF DIESER WEBSEITE BEMÜHT, ÜBERNIMMT JEDOCH KEINERLEI ZUSICHERUNG BEZÜGLICH DES INHALTS. EINE HAFTUNG ODER GARANTIE FÜR DIE AKTUALITÄT, RICHTIGKEIT UND VOLLSTÄNDIGKEIT DER ZUR VERFÜGUNG GESTELLTEN INFORMATIONEN IST FOLGLICH AUSGESCHLOSSEN.Technische Unterstützung & System Integration Services
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congatec conga-HPC/cTLU - COM-HPC Client CPU-Modul mit Intel® Tiger Lake COM-HPC Client Size A high performance module based on 11th Gen Intel® Core™ processor series (code name "Tiger Lake")
.product-menu-page {
font-family: 'Ubuntu', sans-serif;
color: #3f4c58;
}
.text_bold {
font-weight: bolder;
}
.product-menu-page {
display: none;
}
.product-menu-page:target {
display: block;
}
.head_sec {
background-color: #e9e9f0;
color: #4B70B2;}
.col_a {
background-color: #798490;
}
.head_subsec {color: CornflowerBlue;
padding-top: 10px;padding-left: 10px;
padding-right: 25px;
vertical-align: bottom;
}
.chead {
border: 1px solid Lavender;
font-size: 90%;
font-weight: bolder;}
.ckey {
width: 25%;white-space: nowrap;text-align: left;font-size: 90%;
font-weight: bolder;
border: 1px solid Lavender;word-break: break-word;
}
.copt {
width: 25%;text-align: left;font-size: 90%;
font-weight: bolder;
border: 1px solid Lavender;word-break: break-word;
}
.cval {
width: auto;text-align: left;
border: 1px solid Lavender;
word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;}
.rowspecsim {
font-size: 110%;
white-space: nowrap;text-align: left;
}
.column_1 {
width: 250px;white-space: nowrap;text-align: left;
}
.column_2 {
width: 250px;white-space: nowrap;text-align: left;
}
table {
margin-top: 10px;
width: 100%;
border-collapse: collapse;
table-layout: fixed;
}
th, td {
border: 1px solid White;text-align: left;
word-break: break-word;
font-size: 100%;
line-height: 1.5;
padding-top: 5px;
padding-left: 10px;
padding-bottom: 5px;
}
th {
font-size: 90%;
padding-left: 25px;
}
td {
word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;
}
#prod_kf {
font-size: 100%;width: 100%;}
#prod_spec {
font-size: 100%;word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;
}
#prod_spec_embed {
word-break: break-word;
font-size: 90%;
padding-top: 10px;width: 100%;}
#prod_disc {
font-size: 90%;
width: 100%;}
#prod_cpo {font-size: 90%;
width: 100%;
word-break: break-word;
}
#prod_var {
word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;
}
congatec conga-HPC/cTLU - COM-HPC Client CPU-Modul mit Intel® Tiger LakeCOM-HPC Client Size A high performance module based on 11th Gen Intel® Core™ processor series (code name "Tiger Lake")
Beispiel Menü
/* CSS-Variable für die Breite der schwarzen Buttons */
:root {
--black-button-width: 120px;
}
/* Menüleiste: Flexbox für gleichmäßig verteilte Menüeinträge */
ul.menu {
list-style-type: none;
margin: 0;
padding: 0;
background-color: white;
overflow: hidden;
font-family: 'Ubuntu', sans-serif;
display: flex; /* Flexbox */
width: 100%;
}
/* Menüeinträge */
li.menu-item {
padding: 0;
text-align: center;
border-right: 5px solid white;
display: block;
text-align: center;
text-decoration: none;
border-radius: 3px;
transition: background-color 0.3s, color 0.3s; /* Smooth transition for hover effect */
}
li.menu-item a {
display: block;
color: white;
text-align: center;
text-decoration: none;
padding: 10px 20px;
font-size: 16px;
font-weight: 500;
border-radius: 3px;
transition: background-color 0.3s, color 0.3s; /* Smooth transition for hover effect */
}
/* Stretch-Element */
.stretch {
flex-grow: 1;
height: 30px;
}
li.menu-item a:hover {
color: black !important; /* Ensures text color change on hover */
background-color: #f7c13d !important; /* Ensures background color change on hover */
}
/* Aktiver Menüeintrag: Hintergrundfarbe und Schriftgewicht bei Aktivierung */
li.menu-item a:active {
color: #2b3136; /* Textfarbe beim aktiven Zustand */
font-weight: bolder; /* Fettere Schrift */
background-color: CornflowerBlue; /* Hintergrundfarbe beim aktiven Zustand */
}
Datenblatt
Handbuch
System Integration
Unverbindliche Beratung: +49(0)7665 9390 185
ÜbersichtKey FeaturesCPUCOM HPC Client Size APCI Express Gen 4 Embedded/Industrial use conditionExtended temperature options availableIntegrated high performance Xe (Gen 12) graphics with 96 EUAI/DL Instruction Sets including VNNI
CPU Produktfamilie: Intel® Tiger Lake
Intel® Core™ i7-1185GRE (12M Cache, bis zu 4.40 GHz)Intel® Core™ i7-1185G7E (12M Cache, bis zu 4.40 GHz)Intel® Core™ i5-1145GRE (8M Cache, bis zu 4.10 GHz)Intel® Core™ i5-1145G7E (8M Cache, bis zu 4.10 GHz)Intel® Core™ i3-1115GRE (6M Cache, bis zu 3.90 GHz)Intel® Core™ i3-1115G4E (6M Cache, bis zu 3.90 GHz)Intel® Celeron® 6305E (4M Cache, 1.80 GHz)CPU-Varianten
CPU
Processor Number
Cache
Total Cores
Total Threads
Max Turbo Frequency
Intel® Core™ i7-1185GRE
i7-1185GRE
12 MB Intel® Smart Cache
4
8
4.40 GHz
Intel® Core™ i7-1185G7E
i7-1185G7E
12 MB Intel® Smart Cache
4
8
4.40 GHz
Intel® Core™ i5-1145GRE
i5-1145GRE
8 MB Intel® Smart Cache
4
8
4.10 GHz
Intel® Core™ i5-1145G7E
i5-1145G7E
8 MB Intel® Smart Cache
4
8
4.10 GHz
Intel® Core™ i3-1115GRE
i3-1115GRE
6 MB Intel® Smart Cache
2
4
3.90 GHz
Intel® Core™ i3-1115G4E
i3-1115G4E
6 MB Intel® Smart Cache
2
4
3.90 GHz
Intel® Celeron® 6305E
6305E
4 MB Intel® Smart Cache
2
2
SpezifikationFormfactorCOM-HPCCPUIntel® Core™ i7-1185G7E(4 x 1.8 GHz, 12 MB cache, 15W)Intel® Core™ i5-1145G7E(4 x 1.5 GHz, 8 MB cache, 15W)Intel® Core™ i3-1115G4E(2 x 2.2 GHz, 6 MB cache, 15W)Intel® Celeron® 6305E(2 x 1.8 GHz, 4MB cache, 15W)Intel® Core™ i7-1185GRE(4 x 1.8 GHz, 12 MB cache, 15W)Intel® Core™ i5-1145GRE(4 x 1.5 GHz, 8 MB cache, 15W)Intel® Core™ i3-1115GRE(2 x 2.2 GHz, 6 MB cache, 15W)DRAMUp to 2 SO-DIMM sockets for DDR4 memory modules up to 32 GByte each (64 GByte total) with 3200 MT/sEthernet2 x 2.5 GbE with TSN support via Intel® i226 Ethernet controller seriesI/O Interfaces4 x PCIe Gen48 x PCIe Gen32 x USB 4.02 x USB 3.26 x SATA III (6Gb/s)2 x UART12 x GPIOs8 x MIPI-CSI8 x USB 2.0SPIGraphicsIntegrated Xe (Gen 12) graphics engine with up to 96 EU (Execution Units) | Supporting 4 independent display units (4x 4k/2x 8K) | Enhanced media (AV1/12b) with up to 2 Vdbox | Next Gen IPU6 with DPHY2.1 | DP 1.4congatec Board ControllerMulti Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirectionembedded BIOS FeaturesAMI Aptio® UEFI firmware32 Mbyte serial SPI with congatec Embedded BIOS featureOEM LogoOEM CMOS DefaultsLCD ControlDisplay Auto DetectionBacklight ControlFlash UpdateSecurityTrusted Platform Module (TPM 2.0)Power ManagementACPI 5.0 with battery supportOperating SystemsMicrosoft® Windows 11 IoT EnterpriseMicrosoft® Windows® 10Microsoft® Windows 10 IoT EnterpriseMicrosoft® Windows IoT 10 CoreLinuxAndroidYoctoHypervisorRTS Real-Time HypervisorTemperatureCommercial: Operating: 0 to +60°C | Storage: -20 to +80°CIndustrial: Operating: -40 to +85°C | Storage: -40 to +85°CHumidityOperating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.Video Interfaces3x DDI/DP++ | 1x eDPSize95 x 120 mmProduktvarianten / Zubehör050600conga-HPC/cTLU-i7-1185G7ECOM-HPC Size A module based on Intel® Core™i7-1185G7E 4-core processor with 1.8GHz up to 4.4GHz turbo boost, 12MB cache, Intel® Iris® Xe Graphics with 96EU and dual channel DDR4 3200 MT/s memory interface (Intel Tiger Lake-UP3). Embedded temperature range 0°C to 60°C.050601conga-HPC/cTLU-i5-1145G7ECOM-HPC Size A module based on Intel® Core™i5-1145G7E 4-core processor with 1.5GHz up to 4.1GHz turbo boost, 8MB cache, Intel® Iris® Xe Graphics with 80EU and dual channel DDR4 3200 MT/s memory interface (Intel Tiger Lake-UP3). Embedded temperature range 0°C to 60°C.050602conga-HPC/cTLU-i3-1115G4ECOM-HPC Size A module based on Intel® Core™i3-1115G4E 2-core processor with 2.2GHz up to 3.9GHz turbo boost, 6MB cache, Intel® Graphics with 48EU and dual channel DDR4 3200 MT/s memory interface (Intel Tiger Lake-UP3). Embedded temperature range 0°C to 60°C.050603conga-HPC/cTLU-6305ECOM-HPC Size A module based on Intel® Celeron® 6305E2-core processor with 1.8GHz, 4MB cache, Intel® Graphics with 48EU and dual channel DDR4 3200 MT/s memory interface (Intel Tiger Lake-UP3). Embedded temperature range 0°C to 60°C.050610conga-HPC/cTLU-i7-1185GRECOM-HPC Size A module based on Intel® Core™i7-1185GRE 4-core processor with 1.8GHz up to 4.4GHz turbo boost, 12MB cache, Intel® Iris® Xe Graphics with 96EU and dual channel DDR4 3200 MT/s memory interface (Intel Tiger Lake-UP3). Industrial temperature range -40°C to 85°C.050611conga-HPC/cTLU-i5-1145GRECOM-HPC Size A module based on Intel® Core™i5-1145GRE 4-core processor with 1.5GHz up to 4.1GHz turbo boost, 8MB cache, Intel® Iris® Xe Graphics with 80EU and dual channel DDR4 3200 MT/s memory interface (Intel Tiger Lake-UP3). Industrial temperature range -40°C to 85°C.050612conga-HPC/cTLU-i3-1115GRECOM-HPC Size A module based on Intel® Core™i3-1115GRE 2-core processor with 2.2GHz up to 3.9GHz turbo boost, 6MB cache, Intel® Graphics with 48EU and dual channel DDR4 3200 MT/s memory interface (Intel Tiger Lake-UP3). Industrial temperature range -40°C to 85°C.Zubehör050663conga-HPC/cTLU-HSP-HP-TStandard heatspreader for high performance COM-HPC module conga-HPC/cTLU with integrated heatpipe, 13mm height. All standoffs are with M2.5mm thread.050662conga-HPC/cTLU-HSP-HP-BStandard heatspreader for high performance COM-HPC module conga-HPC/cTLU with integrated heatpipe, 13mm height. All standoffs are with 2.7mm bore hole.050661conga-HPC/cTLU-CSP-HP-TStandard passive cooling solution for high performance COM-HPC module conga-HPC/cTLU with integrated heatpipe, 28mm height. All standoffs are with M2.5mm thread.050660conga-HPC/cTLU-CSP-HP-BStandard passive cooling solution for high performance COM-HPC module conga-HPC/cTLU with integrated heatpipe, 28mm height. All standoffs are with 2.7mm bore hole.050659conga-HPC/cTLU-CSA-HP-TStandard active cooling solution for high performance COM-HPC module conga-HPC/cTLU with integrated heatpipe, 29mm height and integrated 12V fan. All standoffs are M2.5mm thread.050658conga-HPC/cTLU-CSA-HP-BStandard active cooling solution for high performance COM-HPC module conga-HPC/cTLU with integrated heatpipe, 29mm height and integrated 12V fan. All standoffs are with 2.7mm bore hole.065600conga-HPC/EVAL-ClientEvaluation Carrier Board for COM-HPC Client type Modules.068793DDR4-SODIMM-3200 (4GB)DDR4 SODIMM memory module with 3200 MT/s and 4GB RAM068794DDR4-SODIMM-3200 (8GB)DDR4 SODIMM memory module with 3200 MT/s and 8GB RAM068798DDR4-SODIMM-3200 (16GB)DDR4 SODIMM memory module with 3200 MT/s and 16GB RAM068825DDR4-SODIMM-3200 (4GB) / i-tempDDR4 SODIMM memory module with up to 3200 MT/s and 4GB RAM, industrial temp -40°C to +85°C068826DDR4-SODIMM-3200 (8GB) / i-tempDDR4 SODIMM memory module with up to 3200 MT/s and 8GB RAM, industrial temp -40°C to +85°C068827DDR4-SODIMM-3200 (16GB) / i-tempDDR4 SODIMM memory module with up to 3200 MT/s and 16GB RAM, industrial temp -40°C to +85°C27000001Design-In TrainingDesign-Training to develop carrier boards for Computer on ModulesBitte stellen Sie sicher, dass Sie stets die aktuellsten Version der Produktspezifikationen des Herstellers verwenden. Hersteller-Produktseite: conga-HPC/cTLUMCTX Mobile & Embedded Computers GmbH IST UM DIE RICHTIGKEIT UND AKTUALITÄT DER DATEN AUF DIESER WEBSEITE BEMÜHT, ÜBERNIMMT JEDOCH KEINERLEI ZUSICHERUNG BEZÜGLICH DES INHALTS. EINE HAFTUNG ODER GARANTIE FÜR DIE AKTUALITÄT, RICHTIGKEIT UND VOLLSTÄNDIGKEIT DER ZUR VERFÜGUNG GESTELLTEN INFORMATIONEN IST FOLGLICH AUSGESCHLOSSEN.Technische Unterstützung & System Integration Services
Alle Dokumente auf dieser Seite werden ohne Benachrichtigung aktualisiert.DatenblattHandbuch
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congatec conga-HPC/cTLH - COM-HPC Client CPU-Modul mit Intel® Tiger Lake COM-HPC Client Size B high performance module based on 11th Gen Intel® Core™ processor series (code name "Tiger Lake-H")
.product-menu-page {
font-family: 'Ubuntu', sans-serif;
color: #3f4c58;
}
.text_bold {
font-weight: bolder;
}
.product-menu-page {
display: none;
}
.product-menu-page:target {
display: block;
}
.head_sec {
background-color: #e9e9f0;
color: #4B70B2;}
.col_a {
background-color: #798490;
}
.head_subsec {color: CornflowerBlue;
padding-top: 10px;padding-left: 10px;
padding-right: 25px;
vertical-align: bottom;
}
.chead {
border: 1px solid Lavender;
font-size: 90%;
font-weight: bolder;}
.ckey {
width: 25%;white-space: nowrap;text-align: left;font-size: 90%;
font-weight: bolder;
border: 1px solid Lavender;word-break: break-word;
}
.copt {
width: 25%;text-align: left;font-size: 90%;
font-weight: bolder;
border: 1px solid Lavender;word-break: break-word;
}
.cval {
width: auto;text-align: left;
border: 1px solid Lavender;
word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;}
.rowspecsim {
font-size: 110%;
white-space: nowrap;text-align: left;
}
.column_1 {
width: 250px;white-space: nowrap;text-align: left;
}
.column_2 {
width: 250px;white-space: nowrap;text-align: left;
}
table {
margin-top: 10px;
width: 100%;
border-collapse: collapse;
table-layout: fixed;
}
th, td {
border: 1px solid White;text-align: left;
word-break: break-word;
font-size: 100%;
line-height: 1.5;
padding-top: 5px;
padding-left: 10px;
padding-bottom: 5px;
}
th {
font-size: 90%;
padding-left: 25px;
}
td {
word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;
}
#prod_kf {
font-size: 100%;width: 100%;}
#prod_spec {
font-size: 100%;word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;
}
#prod_spec_embed {
word-break: break-word;
font-size: 90%;
padding-top: 10px;width: 100%;}
#prod_disc {
font-size: 90%;
width: 100%;}
#prod_cpo {font-size: 90%;
width: 100%;
word-break: break-word;
}
#prod_var {
word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;
}
congatec conga-HPC/cTLH - COM-HPC Client CPU-Modul mit Intel® Tiger LakeCOM-HPC Client Size B high performance module based on 11th Gen Intel® Core™ processor series (code name "Tiger Lake-H")
Beispiel Menü
/* CSS-Variable für die Breite der schwarzen Buttons */
:root {
--black-button-width: 120px;
}
/* Menüleiste: Flexbox für gleichmäßig verteilte Menüeinträge */
ul.menu {
list-style-type: none;
margin: 0;
padding: 0;
background-color: white;
overflow: hidden;
font-family: 'Ubuntu', sans-serif;
display: flex; /* Flexbox */
width: 100%;
}
/* Menüeinträge */
li.menu-item {
padding: 0;
text-align: center;
border-right: 5px solid white;
display: block;
text-align: center;
text-decoration: none;
border-radius: 3px;
transition: background-color 0.3s, color 0.3s; /* Smooth transition for hover effect */
}
li.menu-item a {
display: block;
color: white;
text-align: center;
text-decoration: none;
padding: 10px 20px;
font-size: 16px;
font-weight: 500;
border-radius: 3px;
transition: background-color 0.3s, color 0.3s; /* Smooth transition for hover effect */
}
/* Stretch-Element */
.stretch {
flex-grow: 1;
height: 30px;
}
li.menu-item a:hover {
color: black !important; /* Ensures text color change on hover */
background-color: #f7c13d !important; /* Ensures background color change on hover */
}
/* Aktiver Menüeintrag: Hintergrundfarbe und Schriftgewicht bei Aktivierung */
li.menu-item a:active {
color: #2b3136; /* Textfarbe beim aktiven Zustand */
font-weight: bolder; /* Fettere Schrift */
background-color: CornflowerBlue; /* Hintergrundfarbe beim aktiven Zustand */
}
Datenblatt
Handbuch
System Integration
Unverbindliche Beratung: +49(0)7665 9390 185
ÜbersichtKey FeaturesCPUEmbedded/Industrial use conditionExtended temperature options availablePCI Express Gen 4 | USB 4.0AI/DL Instruction Sets including VNNIUp to 128 Gbyte DDR4-3200 MT/sIntegrated Xe (Gen 12) graphics with 32 EU
CPU Produktfamilie: Intel® Tiger Lake
Intel® Xeon® W-11865MRE (24M Cache, bis zu 4.70 GHz)Intel® Xeon® W-11865MLE (24M Cache, bis zu 4.50 GHz)Intel® Xeon® W-11555MRE (12M Cache, bis zu 4.50 GHz)Intel® Xeon® W-11555MLE (12M Cache, bis zu 4.40 GHz)Intel® Xeon® W-11155MRE (8M Cache, bis zu 4.40 GHz)Intel® Xeon® W-11155MLE (8M Cache, bis zu 3.10 GHz)Intel® Core™ i7-11850HE (24M Cache, bis zu 4.70 GHz)Intel® Core™ i5-11500HE (12M Cache, bis zu 4.50 GHz)Intel® Core™ i3-11100HE (8M Cache, bis zu 4.40 GHz)Intel® Celeron® 6600HE (8M Cache, bis zu 2.60 GHz)CPU-Varianten
CPU
Processor Number
Cache
Total Cores
Total Threads
Max Turbo Frequency
Intel® Core™ i7-11850HE
i7-11850HE
24 MB Intel® Smart Cache
8
16
4.70 GHz
Intel® Core™ i5-11500HE
i5-11500HE
12 MB Intel® Smart Cache
6
12
4.50 GHz
Intel® Core™ i3-11100HE
i3-11100HE
8 MB Intel® Smart Cache
4
8
4.40 GHz
Intel® Xeon® W-11865MRE
W-11865MRE
24 MB Intel® Smart Cache
8
16
4.70 GHz
Intel® Xeon® W-11865MLE
W-11865MLE
24 MB Intel® Smart Cache
8
16
4.50 GHz
Intel® Xeon® W-11555MRE
W-11555MRE
12 MB Intel® Smart Cache
6
12
4.50 GHz
Intel® Xeon® W-11555MLE
W-11555MLE
12 MB Intel® Smart Cache
6
12
4.40 GHz
Intel® Xeon® W-11155MRE
W-11155MRE
8 MB Intel® Smart Cache
4
8
4.40 GHz
Intel® Xeon® W-11155MLE
W-11155MLE
8 MB Intel® Smart Cache
4
8
3.10 GHz
Intel® Celeron® 6600HE
6600HE
8 MB Intel® Smart Cache
2
2
SpezifikationFormfactorCOM-HPCCPUIntel® Xeon® W-11155MLE(4 x 1.8 GHz, 8 MB cache, 25W)Intel® Xeon® W-11555MLE(6 x 1.9 GHz, 12 MB cache, 25W)Intel® Xeon® W-11865MLE(8 x 1.5 GHz, 24 MB cache, 25W)Intel® Xeon® W-11155MRE(4 x 2.4 GHz, 8 MB cache, 45W)Intel® Xeon® W-11555MRE(6 x 2.6 GHz, 12 MB cache, 45W)Intel® Xeon® W-11865MRE(8 x 2.6 GHz, 24 MB cache, 45W)Intel® Celeron® 6600HE(2 x 2.6 GHz, 8 MB cache, 35W)Intel® Core™ i3-11100HE(4 x 2.4 GHz, 8 MB cache, 45W)Intel® Core™ i5-11500HE(6 x 2.6 GHz, 12 MB cache, 45W)Intel® Core™ i7-11850HE(8 x 2.6 GHz, 24 MB cache, 45W)DRAMUp to 4 SO-DIMM sockets for DDR4 ECC memory modules up to 32 GByte each (128 GByte total) with 3200 MT/sEthernet2 x 2.5 GbE with TSN support via Intel® i226 Ethernet controller seriesI/O Interfaces4 x PCIe Gen4I²C bus12 x GPIOs2 x UARTeSPI2 x SATA III (6Gb/s)8 x USB 2.02 x USB 3.22 x USB 4.020 x PCIe Gen3PEG support x16 (PCIe Gen4)4 x MIPI-CSIGraphicsIntegrated Xe (Gen 12) graphics engine with up to 32 EU (Execution Units) | Supporting 4 independent display units (4x 4k/2x 8K) | Enhanced media (AV1/12b) with up to 2 Vdbox | Next Gen IPU6 with DPHY2.1 | DP 1.4congatec Board ControllerMulti Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirectionembedded BIOS FeaturesAMI Aptio UEFI32 MByte serial SPI firmware flashOEM LogoOEM CMOS DefaultsLCD ControlDisplay Auto DetectionBacklight ControlFlash UpdateSecurityTrusted Platform Module (TPM 2.0)Power ManagementACPI 6.0 with battery supportOperating SystemsMicrosoft® Windows® 10Microsoft® Windows 10 IoT EnterpriseLinuxYoctoHypervisorRTS Real-Time HypervisorTemperatureIndustrial: Operating: -40 to +85°C | Storage: -40 to +85°CCommercial: Operating: 0 to +60°C | Storage: -40 to +85°CHumidityOperating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.Video Interfaces3x DP/DP++ | 1x eDP /LVDSSize120 x 120 mm²Produktvarianten / Zubehör050800conga-HPC/cTLH-i7-11850HECOM HPC Size B module based on Intel® Core™ i7-11850HE 8-core processor with 2.6GHz up to 4.7GHz turbo boost, 24MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset QM580E | Intel® Tiger Lake-H | Commercial temperature range050801conga-HPC/cTLH-i5-11500HECOM HPC Size B module based on Intel® Core™ i5-11500HE 6-core processor with 2.6GHz up to 4.5GHz turbo boost, 12MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset QM580E | Intel® Tiger Lake-H | Commercial temperature range050802conga-HPC/cTLH-i3-11100HECOM HPC Size B module based on Intel® Core™ i3-11100HE 4-core processor with 2.4GHz up to 4.4GHz turbo boost, 8MB Intel® Smart Cache, Intel® UHD Graphics with 16EU and dual channel DDR4 3200 MT/s memory interface. | Chipset HM570E | Intel® Tiger Lake-H | Commercial temperature range050803conga-HPC/cTLH-6600HECOM HPC Size B module based on Intel® Celeron 6600HE 2-core processor with 2.6GHz base frequency, 8MB Intel® Smart Cache, Intel® UHD Graphics with 16EU and dual channel DDR4 3200 MT/s memory interface. | Chipset HM570E | Intel® Tiger Lake-H | Commercial temperature range050810conga-HPC/cTLH-W-11865MRECOM HPC Size B module based on Intel® Xeon® W-11865MRE 8-core processor with 2.6GHz up to 4.7GHz turbo boost, 24MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Industrial temperature range050811conga-HPC/cTLH-W-11555MRECOM HPC Size B module based on Intel® Xeon® W-11555MRE 6-core processor with 2.6GHz up to 4.5GHz turbo boost, 12MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Industrial temperature range050812conga-HPC/cTLH-W-11155MRECOM HPC Size B module based on Intel® Xeon® W-11155MRE 4-core processor with 2.4GHz up to 4.4GHz turbo boost, 8MB Intel® Smart Cache, Intel® UHD Graphics with 16EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Industrial temperature range050813conga-HPC/cTLH-W-11865MLECOM HPC Size B module based on Intel® Xeon® W-11865MLE 8-core processor with 1.5GHz up to 4.5GHz turbo boost, 24MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Commercial temperature range050814conga-HPC/cTLH-W-11555MLECOM HPC Size B module based on Intel® Xeon® W-11555MLE 6-core processor with 1.9GHz up to 4.4GHz turbo boost, 12MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Commercial temperature range050815conga-HPC/cTLH-W-11155MLECOM HPC Size B module based on Intel® Xeon® W-11155MRE 4-core processor with 1.8GHz up to 3.1GHz turbo boost, 8MB Intel® Smart Cache, Intel® UHD Graphics with 16EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Commercial temperature rangeZubehör050850conga-HPC/cTLH-CSA-HP-BStandard active cooling solution for high performance COM-HPC module conga-HPC/cTLH with integrated heatpipe, 29mm height and integrated 12V fan. All standoffs are with 2.7mm bore hole.050851conga-HPC/cTLH-CSA-HP-TStandard active cooling solution for high performance COM-HPC module conga-HPC/cTLH with integrated heatpipe, 29mm height and integrated 12V fan. All standoffs are M2.5mm thread.050852conga-HPC/cTLH-CSP-HP-BStandard passive cooling solution for high performance COM-HPC module conga-HPC/cTLH with integrated heatpipe, 29mm height. All standoffs are with 2.7mm bore hole.050853conga-HPC/cTLH-CSP-HP-TStandard passive cooling solution for high performance COM-HPC module conga-HPC/cTLH with integrated heatpipe, 29mm height. All standoffs are with M2.5mm thread.050854conga-HPC/cTLH-HSP-HP-BStandard heatspreader for high performance COM-HPC module conga-HPC/cTLH with integrated heatpipe, 13mm height. All standoffs are with 2.7mm bore hole.050855conga-HPC/cTLH-HSP-HP-TStandard heatspreader solution for high performance COM-HPC module conga-HPC/cTLH with integrated heatpipe, 13mm height. All standoffs are with M2.5mm thread.065600conga-HPC/EVAL-ClientEvaluation Carrier Board for COM-HPC Client type Modules.27000001Design-In TrainingDesign-Training to develop carrier boards for Computer on Modules068793DDR4-SODIMM-3200 (4GB)DDR4 SODIMM memory module with 3200 MT/s and 4GB RAM068794DDR4-SODIMM-3200 (8GB)DDR4 SODIMM memory module with 3200 MT/s and 8GB RAM068798DDR4-SODIMM-3200 (16GB)DDR4 SODIMM memory module with 3200 MT/s and 16GB RAM068825DDR4-SODIMM-3200 (4GB) / i-tempDDR4 SODIMM memory module with up to 3200 MT/s and 4GB RAM, industrial temp -40°C to +85°C068826DDR4-SODIMM-3200 (8GB) / i-tempDDR4 SODIMM memory module with up to 3200 MT/s and 8GB RAM, industrial temp -40°C to +85°C068827DDR4-SODIMM-3200 (16GB) / i-tempDDR4 SODIMM memory module with up to 3200 MT/s and 16GB RAM, industrial temp -40°C to +85°C068837DDR4-SODIMM-3200 (32GB) / i-tempDDR4 SODIMM memory module with up to 3200 MT/s and 32GB RAM, industrial temp -40°C to +85°CBitte stellen Sie sicher, dass Sie stets die aktuellsten Version der Produktspezifikationen des Herstellers verwenden. Hersteller-Produktseite: conga-HPC/cTLHMCTX Mobile & Embedded Computers GmbH IST UM DIE RICHTIGKEIT UND AKTUALITÄT DER DATEN AUF DIESER WEBSEITE BEMÜHT, ÜBERNIMMT JEDOCH KEINERLEI ZUSICHERUNG BEZÜGLICH DES INHALTS. EINE HAFTUNG ODER GARANTIE FÜR DIE AKTUALITÄT, RICHTIGKEIT UND VOLLSTÄNDIGKEIT DER ZUR VERFÜGUNG GESTELLTEN INFORMATIONEN IST FOLGLICH AUSGESCHLOSSEN.Technische Unterstützung & System Integration Services
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congatec conga-HPC/cRLS - COM-HPC Client CPU-Modul mit Intel® Raptor Lake COM-HPC Client Size C high performance module based on 13th and 14th Gen Intel® Core™ processor series (code name "Raptor Lake-S")
.product-menu-page {
font-family: 'Ubuntu', sans-serif;
color: #3f4c58;
}
.text_bold {
font-weight: bolder;
}
.product-menu-page {
display: none;
}
.product-menu-page:target {
display: block;
}
.head_sec {
background-color: #e9e9f0;
color: #4B70B2;}
.col_a {
background-color: #798490;
}
.head_subsec {color: CornflowerBlue;
padding-top: 10px;padding-left: 10px;
padding-right: 25px;
vertical-align: bottom;
}
.chead {
border: 1px solid Lavender;
font-size: 90%;
font-weight: bolder;}
.ckey {
width: 25%;white-space: nowrap;text-align: left;font-size: 90%;
font-weight: bolder;
border: 1px solid Lavender;word-break: break-word;
}
.copt {
width: 25%;text-align: left;font-size: 90%;
font-weight: bolder;
border: 1px solid Lavender;word-break: break-word;
}
.cval {
width: auto;text-align: left;
border: 1px solid Lavender;
word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;}
.rowspecsim {
font-size: 110%;
white-space: nowrap;text-align: left;
}
.column_1 {
width: 250px;white-space: nowrap;text-align: left;
}
.column_2 {
width: 250px;white-space: nowrap;text-align: left;
}
table {
margin-top: 10px;
width: 100%;
border-collapse: collapse;
table-layout: fixed;
}
th, td {
border: 1px solid White;text-align: left;
word-break: break-word;
font-size: 100%;
line-height: 1.5;
padding-top: 5px;
padding-left: 10px;
padding-bottom: 5px;
}
th {
font-size: 90%;
padding-left: 25px;
}
td {
word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;
}
#prod_kf {
font-size: 100%;width: 100%;}
#prod_spec {
font-size: 100%;word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;
}
#prod_spec_embed {
word-break: break-word;
font-size: 90%;
padding-top: 10px;width: 100%;}
#prod_disc {
font-size: 90%;
width: 100%;}
#prod_cpo {font-size: 90%;
width: 100%;
word-break: break-word;
}
#prod_var {
word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;
}
congatec conga-HPC/cRLS - COM-HPC Client CPU-Modul mit Intel® Raptor LakeCOM-HPC Client Size C high performance module based on 13th and 14th Gen Intel® Core™ processor series (code name "Raptor Lake-S")
Beispiel Menü
/* CSS-Variable für die Breite der schwarzen Buttons */
:root {
--black-button-width: 120px;
}
/* Menüleiste: Flexbox für gleichmäßig verteilte Menüeinträge */
ul.menu {
list-style-type: none;
margin: 0;
padding: 0;
background-color: white;
overflow: hidden;
font-family: 'Ubuntu', sans-serif;
display: flex; /* Flexbox */
width: 100%;
}
/* Menüeinträge */
li.menu-item {
padding: 0;
text-align: center;
border-right: 5px solid white;
display: block;
text-align: center;
text-decoration: none;
border-radius: 3px;
transition: background-color 0.3s, color 0.3s; /* Smooth transition for hover effect */
}
li.menu-item a {
display: block;
color: white;
text-align: center;
text-decoration: none;
padding: 10px 20px;
font-size: 16px;
font-weight: 500;
border-radius: 3px;
transition: background-color 0.3s, color 0.3s; /* Smooth transition for hover effect */
}
/* Stretch-Element */
.stretch {
flex-grow: 1;
height: 30px;
}
li.menu-item a:hover {
color: black !important; /* Ensures text color change on hover */
background-color: #f7c13d !important; /* Ensures background color change on hover */
}
/* Aktiver Menüeintrag: Hintergrundfarbe und Schriftgewicht bei Aktivierung */
li.menu-item a:active {
color: #2b3136; /* Textfarbe beim aktiven Zustand */
font-weight: bolder; /* Fettere Schrift */
background-color: CornflowerBlue; /* Hintergrundfarbe beim aktiven Zustand */
}
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Handbuch
System Integration
Unverbindliche Beratung: +49(0)7665 9390 185
ÜbersichtKey FeaturesCPUIntel® hybrid design combines Performance-cores with Efficient–coresUp to Intel® UHD Graphics 770 driven by Xe ArchitecturePCI Express Gen 4 and 5 | USB 3.2 Gen 2x2AI Acceleration based on Intel® Deep Learning Boost (VNNI)
CPU Produktfamilie: Intel® Raptor Lake
Intel® Core™ i9-13900E (36M Cache, bis zu 5.20 GHz)Intel® Core™ i7-13700E (30M Cache, bis zu 5.10 GHz)Intel® Core™ i5-13400E (20M Cache, bis zu 4.60 GHz)Intel® Core™ i3-13100E (12 MB Cache, bis zu 4,40 GHz)Intel® Core™ i9 processor 14900 (36M Cache, bis zu 5.80 GHz)Intel® Core™ i7 processor 14700 (33M Cache, bis zu 5.40 GHz)Intel® Core™ i5 processor 14400 (20M Cache, bis zu 4.70 GHz)Intel® Core™ i3 processor 14100 (12M Cache, bis zu 4.70 GHz)CPU-Varianten
CPU
Processor Number
Cache
Total L2 Cache
Max Turbo Frequency
Total Cores
Total Threads
PCI Express Revision
Processor Base Power
Intel® Core™ i9 processor 14900
i9-14900
36 MB Intel® Smart Cache
32 MB
5.8 GHz
24
32
5.0 and 4.0
65 W
Intel® Core™ i9-13900E
i9-13900E
36 MB Intel® Smart Cache
32 MB
5.20 GHz
24
32
5.0 and 4.0
65 W
Intel® Core™ i7 processor 14700
i7-14700
33 MB Intel® Smart Cache
28 MB
5.4 GHz
20
28
5.0 and 4.0
65 W
Intel® Core™ i7-13700E
i7-13700E
30 MB Intel® Smart Cache
24 MB
5.10 GHz
16
24
5.0 and 4.0
65 W
Intel® Core™ i5 processor 14400
i5-14400
20 MB Intel® Smart Cache
9.5 MB
4.7 GHz
10
16
5.0 and 4.0
65 W
Intel® Core™ i5-13400E
i5-13400E
20 MB Intel® Smart Cache
9.5 MB
4.60 GHz
10
16
5.0 and 4.0
65 W
Intel® Core™ i3 processor 14100
i3-14100
12 MB Intel® Smart Cache
5 MB
4.7 GHz
4
8
5.0 and 4.0
60 W
SpezifikationFormfactorCOM-HPCCPUIntel® Core™ i9-14900(8 P-cores 2.0GHz up to 5.4GHz, 16 E-cores 1.5GHz up to 4.3GHz, 36MB cache, )Intel® Core™ i7-14700(8 P-cores 2.1GHz up to 5.3GHz, 12 E-cores 1.5GHz up to 4.2GHz, 33MB cache, )Intel® Core™ i5-14400(6 P-cores 2.5GHz up to 4.7GHz, 4 E-cores 1.8GHz up to 3.5GHz, 20MB cache)Intel® Core™ i3-14100(4 P-cores 3.5GHz up to 4.7GHz, 12MB cache, )Intel® Core™ i3-13100E(4 P-cores 3.3GHz up to 4.4GHz, 12MB cache, 65W)Intel® Core™ i5-13400E(6 P-cores 2.4GHz up to 4.6GHz, 4 E-cores 1.5GHz up to 3.3GHz, 20MB cache, 65W)Intel® Core™ i7-13700E(8 P-cores 1.9GHz up to 5.1GHz, 8 E-cores 1.3GHz up to 3.9GHz, 30MB cache, 65W)Intel® Core™ i9-13900E(8 P-cores 1.8GHz up to 5.2GHz, 16 E-cores 1.3GHz up to 4.0GHz, 36MB cache, 65W)DRAM4 SO-DIMM sockets for DDR5 memory modules up to 32 GByte each | max. 128 GByte RAM system capacity |up to 4.000 MT/s | ECC Support (not supported on product variants 049803, 049812 and 049813)Ethernet2 x 2.5 GbE with TSN support via Intel® i226 Ethernet controller seriesI/O Interfaces1x16 PCIe Gen 5 (PEG port)3x4 PCIe Gen 4up to 3x4 PCIe Gen 31x2 PCIe Gen34 x USB 3.2 Gen2x28 x USB 2.02 x SATA2 x UART12 x GPIOsGraphicsIntel® UHD Graphics 730/770 driven by Xe Architecture | up to 32 EUcongatec Board ControllerMulti Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirectionembedded BIOS FeaturesAMI Aptio UEFI32 Mbyte serial SPI with congatec Embedded BIOS featureOEM LogoOEM CMOS DefaultsLCD ControlDisplay Auto DetectionBacklight ControlFlash UpdateSecurityTrusted Platform Module (TPM 2.0)Power ManagementACPI 5.0a with battery supportOperating SystemsMicrosoft® Windows 11Microsoft® Windows 11 IoT EnterpriseMicrosoft® Windows® 10Microsoft® Windows 10 IoT EnterpriseLinuxYoctoHypervisorRTS Real-Time HypervisorTemperatureOperating: 0°C to 60°CStorage: -20°C to 80°CHumidityOperating: 10 to 85% r. H. non cond. / Storage 5 to 85% r. H. non cond.Video Interfaces3x DDI | eDPSize120 x 160 mmProduktvarianten / Zubehör049810conga-HPC/cRLS-i9-14900COM-HPC Client module based on Intel® Core™ i9-14900 LGA 1700 processor with 8 P-cores 2.0GHz up to 5.4GHz Turbo and 16 E-cores 1.5GHz up to 4.3GHz Turbo |36MB Intel® Smart Cache | Intel® UHD Graphics 770 with 32EUs | Dual channel DDR5 memory interface | Chipset R680E | Intel® code name: Raptor Lake-S Refresh049812conga-HPC/cRLS-i5-14400COM-HPC Client module based on Intel® Core™ i5-14400 LGA 1700 processor with 6 P-cores 2.5GHz up to 4.7GHz Turbo and 4 E-cores 1.8GHz up to 3.5GHz Turbo | 20MB Intel® Smart Cache | Intel® UHD Graphics 730 with 24EUs | Dual channel DDR5 memory interface | Chipset R680E | Intel® code name: Raptor Lake-S Refresh049811conga-HPC/cRLS-i7-14700COM-HPC Client module based on Intel® Core™ i7-14700 LGA 1700 processor with 8 P-cores 2.1GHz up to 5.3GHz Turbo and 12 E-cores 1.5GHz up to 4.2GHz Turbo | 33MB Intel® Smart Cache | Intel® UHD Graphics 770 with 32EUs | Dual channel DDR5 memory interface | Chipset R680E | Intel® code name: Raptor Lake-S Refresh049813conga-HPC/cRLS-i3-14100COM-HPC Client module based on Intel® Core™ i3-14100 LGA 1700 processor with 4 P-cores 3.5GHz up to 4.7GHz Turbo | 12MB Intel® Smart Cache | Intel® UHD Graphics 730 with 24EUs | Dual channel DDR5 memory interface | Chipset Q670E | Intel® code name: Raptor Lake-S Refresh049800conga-HPC/cRLS-i9-13900ECOM-HPC Client module based on Intel® Core™ i9-13900E LGA 1700 processor with 8 P-cores 1.8GHz up to 5.2GHz Turbo and 16 E-cores 1.3GHz up to 4.0GHz Turbo | 36MB Intel® Smart Cache | Intel® UHD Graphics 770 with 32EUs | Dual channel DDR5 memory interface | Chipset R680E | Intel® code name: Raptor Lake-S049801conga-HPC/cRLS-i7-13700ECOM-HPC Client module based on Intel® Core™ i7-13700E LGA 1700 processor with 8 P-cores 1.9GHz up to 5.1GHz Turbo and 8 E-cores 1.3GHz up to 3.9GHz Turbo | 30MB Intel® Smart Cache | Intel® UHD Graphics 770 with 32EUs | Dual channel DDR5 memory interface | Chipset R680E | Intel® code name: Raptor Lake-S049802conga-HPC/cRLS-i5-13400ECOM-HPC Client module based on Intel® Core™ i5-13400E LGA 1700 processor with 6 P-cores 2.4GHz up to 4.6GHz Turbo and 4 E-cores 1.5GHz up to 3.3GHz Turbo | 20MB Intel® Smart Cache | Intel® UHD Graphics 730 with 24EUs | Dual channel DDR5 memory interface | Chipset R680E | Intel® code name: Raptor Lake-S049803conga-HPC/cRLS-i3-13100ECOM-HPC Client module based on Intel® Core™ i3-13100E LGA 1700 processor with 4 P-cores 3.3GHz up to 4.4GHz Turbo | 12MB Intel® Smart Cache | Intel® UHD Graphics 730 with 24EUs | Dual channel DDR5 memory interface | Chipset Q670E | Intel® code name: Raptor Lake-SZubehör049650conga-HPC/cRLS-CSA-HP-BStandard active cooling solution for COM-HPC module conga-HPC/cRLS with integrated heat pipes, 30mm overall height and two integrated 12V fans. All standoffs are with 2.7mm bore hole.049651conga-HPC/cRLS-CSA-HP-TStandard active cooling solution for COM-HPC module conga-HPC/cRLS with integrated heat pipes, 30mm height and two integrated 12V fans. All standoffs are M2.5mm threaded.049652conga-HPC/cRLS-HSP-HP-BStandard heatspreader for COM-HPC module conga-HPC/cRLS with integrated heat pipes, 13mm height. All standoffs are with 2.7mm bore hole.049653conga-HPC/cRLS-HSP-HP-TStandard heatspreader for COM-HPC module conga-HPC/cRLS with integrated heat pipes, 13mm height. All standoffs are M2.5mm threaded.049654conga-HPC/cRLS-HPAStandard heatpipe adapter for COM-HPC module conga-HPC/cRLS.065620conga-HPC/uATX-ClientCOM-HPC Client µATX Application Carrier Board suitable for congatec COM-HPC modules with Size A,B and C.065600conga-HPC/EVAL-ClientEvaluation Carrier Board for COM-HPC Client type Modules.068901DDR5 SODIMM 4800 (8GB)DDR5 SODIMM memory module with up to 4800 MT/s and 8GB RAM, commercial temp 0°C to +60°C068902DDR5-SODIMM 4800 (16GB)DDR5 SODIMM memory module with up to 4800 MT/s and 16GB RAM, commercial temp 0°C to +60°C068903DDR5-SODIMM-4800 (32GB)DDR5 SODIMM memory module with up to 4800 MT/s and 32GB RAM, commercial temp 0°C to +60°C068911DDR5-SODIMM-4800 ECC (8GB)DDR5 SODIMM memory module with up to 4800 MT/s and 8GB RAM with ECC, commercial temp 0°C to +60°C068912DDR5-SODIMM-4800 ECC (16GB)DDR5 SODIMM memory module with up to 4800 MT/s and 16GB RAM with ECC, commercial temp 0°C to +60°C068913DDR5-SODIMM-4800 ECC (32GB)DDR5 SODIMM memory module with up to 4800 MT/s and 32GB RAM with ECC, commercial temp 0°C to +60°C27000001Design-In TrainingDesign-Training to develop carrier boards for Computer on ModulesBitte stellen Sie sicher, dass Sie stets die aktuellsten Version der Produktspezifikationen des Herstellers verwenden. Hersteller-Produktseite: conga-HPC/cRLSMCTX Mobile & Embedded Computers GmbH IST UM DIE RICHTIGKEIT UND AKTUALITÄT DER DATEN AUF DIESER WEBSEITE BEMÜHT, ÜBERNIMMT JEDOCH KEINERLEI ZUSICHERUNG BEZÜGLICH DES INHALTS. EINE HAFTUNG ODER GARANTIE FÜR DIE AKTUALITÄT, RICHTIGKEIT UND VOLLSTÄNDIGKEIT DER ZUR VERFÜGUNG GESTELLTEN INFORMATIONEN IST FOLGLICH AUSGESCHLOSSEN.Technische Unterstützung & System Integration Services
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Preis auf Anfrage