COM-HPC Server – Grenzenlose Freiheit für Edge-Server
COM-HPC Server definiert zwei verschiedene Formfaktoren für das Ultra-High-End-Embedded-Computing mit bis zu 100 Gbit/s Ethernet und bis zu 48 PCIe-Lanes, 8x 2,5 Gbit/s Ethernet und 4 DRAM-Slots mit bis zu 512 GB Gesamt-RAM.
COM-HPC Server definiert zwei verschiedene Formfaktoren für das Ultra-High-End-Embedded-Computing mit bis zu 100 Gbit/s Ethernet und bis zu 48 PCIe-Lanes, 8x 2,5 Gbit/s Ethernet und 4 DRAM-Slots mit bis zu 512 GB Gesamt-RAM.
COM-HPC Server Module decken die Anforderungen von Edge- und Fog-Servern in rauen Umgebungen ab, die von industriellen Workload-Konsolidierungsservern für Automatisierung, Robotik und medizinische Backend-Bildverarbeitung bis hin zu Outdoor-Servern für Versorgungsunternehmen und kritische Infrastrukturen sowie autonomen Fahrzeugen und Video-Infrastrukturen für Sicherheit und Schutz reichen.
COM-HPC® Server
congatec conga-HPC/sILL - COM-HPC Server CPU-Modul mit Intel® Ice Lake COM-HPC Server Size D module based on Intel® Xeon® D processor series (code name "Ice Lake")
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congatec conga-HPC/sILL - COM-HPC Server CPU-Modul mit Intel® Ice LakeCOM-HPC Server Size D module based on Intel® Xeon® D processor series (code name "Ice Lake")
Beispiel Menü
/* CSS-Variable für die Breite der schwarzen Buttons */
:root {
--black-button-width: 120px;
}
/* Menüleiste: Flexbox für gleichmäßig verteilte Menüeinträge */
ul.menu {
list-style-type: none;
margin: 0;
padding: 0;
background-color: white;
overflow: hidden;
font-family: 'Ubuntu', sans-serif;
display: flex; /* Flexbox */
width: 100%;
}
/* Menüeinträge */
li.menu-item {
padding: 0;
text-align: center;
border-right: 5px solid white;
display: block;
text-align: center;
text-decoration: none;
border-radius: 3px;
transition: background-color 0.3s, color 0.3s; /* Smooth transition for hover effect */
}
li.menu-item a {
display: block;
color: white;
text-align: center;
text-decoration: none;
padding: 10px 20px;
font-size: 16px;
font-weight: 500;
border-radius: 3px;
transition: background-color 0.3s, color 0.3s; /* Smooth transition for hover effect */
}
/* Stretch-Element */
.stretch {
flex-grow: 1;
height: 30px;
}
li.menu-item a:hover {
color: black !important; /* Ensures text color change on hover */
background-color: #f7c13d !important; /* Ensures background color change on hover */
}
/* Aktiver Menüeintrag: Hintergrundfarbe und Schriftgewicht bei Aktivierung */
li.menu-item a:active {
color: #2b3136; /* Textfarbe beim aktiven Zustand */
font-weight: bolder; /* Fettere Schrift */
background-color: CornflowerBlue; /* Hintergrundfarbe beim aktiven Zustand */
}
Datenblatt
Handbuch
System Integration
Unverbindliche Beratung: +49(0)7665 9390 185
ÜbersichtKey FeaturesCPUIndustrial Use Condition with extended Temperature options32 PCIe Express lanesAI Capabilities with Intel® DL boostReal Time Capable PlatformSupporting up to 256 GB DDR4 2933MT/s Memory
CPU Produktfamilie: Intel® Ice Lake
Intel® Xeon® D-1746TER (15M Cache, bis zu 3.10 GHz)Intel® Xeon® D-1735TR (15M Cache, bis zu 3.40 GHz)Intel® Xeon® D-1732TE (15M Cache, bis zu 3.00 GHz)Intel® Xeon® D-1715TER (10M Cache, bis zu 3.50 GHz)Intel® Xeon® D-1712TR (10M Cache, bis zu 3.10 GHz)CPU-Varianten
CPU
Processor Number
Cache
Max Turbo Frequency
Total Cores
Total Threads
PCI Express Revision
Intel® Xeon® D-1746TER
D-1746TER
15 MB
3.10 GHz
10
20
4.0
Intel® Xeon® D-1735TR
D-1735TR
15 MB
3.40 GHz
8
16
4.0
Intel® Xeon® D-1732TE
D-1732TE
15 MB
3.00 GHz
8
16
4.0
Intel® Xeon® D-1715TER
D-1715TER
10 MB
3.50 GHz
4
8
4.0
Intel® Xeon® D-1712TR
D-1712TR
10 MB
3.10 GHz
4
8
4.0
SpezifikationFormfactorCOM-HPCCPUIntel® Xeon® D-1848TER(10 x 2.0 GHz, 15 MB cache, 100G Eth, 57W)Intel® Xeon® D-1712TR(4 x 2.0 GHz, 10 MB cache, 50G Eth, 39W)Intel® Xeon® D-1735TR(8 x 2.2 GHz, 15 MB cache, 50G Eth, 59W)Intel® Xeon® D-1715TER(4 x 2.4 GHz, 10 MB cache, 50G Eth, 50W)Intel® Xeon® D-1732TE(8 x 1.9 GHz, 15 MB cache, 50G Eth, 52W)Intel® Xeon® D-1746TER(10 x 2.0 GHz, 15 MB cache, 100G Eth, 67W)DRAM4x DIMM sockets for DDR4 memory modules | Max. capacity = 256GBEthernet1 x 2.5GbE TSN Ethernet2x 40G / 4x 25G / 8x 10G/2.5G/1G/100M lanes | Maximum total bandwidth 100Gb (depending on CPU)I/O Interfaces16 x PCIe Gen416 x PCIe Gen34 x USB 3.04 x USB 2.02 x SATA III (6Gb/s)2 x UART12 x GPIOs2 x SM-Bus2 x I²C buscongatec Board ControllerMulti Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirectionembedded BIOS FeaturesAMI Aptio UEFI64Mbyte serial SPI with congatec Embedded BIOS featureOEM LogoOEM CMOS DefaultsFlash UpdateSecurityTrusted Platform Module (TPM 2.0)Power ManagementACPI 5.0 with battery supportOperating SystemsMicrosoft® Windows® 10Microsoft® Windows 10 IoT EnterpriseMicrosoft® Windows IoT 10 CoreLinuxAndroidYoctoHypervisorRTS Real-Time HypervisorTemperatureCommercial: Operating Temperature: 0 to +60°C | Storage Temperature: -20 to +85°CIndustrial: Operating Temperature: -40 to +85°C | Storage Temperature: -40 to +85°C (depending on CPU)HumidityOperating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.Size160 x 160 mmProduktvarianten / Zubehör050412conga-HPC/sILL-D1848TERCOM-HPC Size D module based on Intel® Xeon® D-1848TER 10-core processor with 2.0 GHz, 15MB cache and dual channel DDR4 2666 MT/s memory interface (formerly Ice Lake-D Refresh LCC). Industrial temperature range from -40°C to 85°C.050400conga-HPC/sILL-D1746TERCOM-HPC Size D module based on Intel® Xeon® D1746TER 10-core processor with 2.0 GHz, 15MB cache and dual channel DDR4 up to 2667 MT/s memory interface (formerly Ice Lake-D LCC). Industrial temperature range from -40°C to 85°C.050401conga-HPC/sILL-D1732TECOM-HPC Size D module based on Intel® Xeon® D1732TE 8-core processor with 1.9 GHz, 15MB cache and dual channel DDR4 up to 2667 MT/s memory interface (formerly Ice Lake-D LCC). Industrial temperature range from -40°C to 85°C.050402conga-HPC/sILL-D1715TERCOM-HPC Size D module based on Intel® Xeon® D1715TER 4-core processor with 2.4 GHz, 10MB cache and dual channel DDR4 up to 2667 MT/s memory interface (formerly Ice Lake-D LCC). Extended temperature range from -40°C to 80°C.050410conga-HPC/sILL-D1735TRCOM-HPC Size D module based on Intel® Xeon® D1735TR 8-core processor with 2.2 GHz, 15MB cache and dual channel DDR4 up to 2933 MT/s memory interface (formerly Ice Lake-D LCC). Commercial temperature range from 0°C to 60°C.050411conga-HPC/sILL-D1712TRCOM-HPC Size D module based on Intel® Xeon® D1712TR 4-core processor with 2.0 GHz, 10MB cache and dual channel DDR4 up to 2400 MT/s memory interface (formerly Ice Lake-D LCC). Commercial temperature range from 0°C to 60°C.Zubehör050450conga-HPC/sILL-CSA-HPStandard active cooling solution for COM-HPC Server modules conga-HPC/sILL with integrated heat pipes, 35.2mm overall cooling height and integrated 12V fan.050451conga-HPC/sILL-CSP-HPStandard passive cooling solution for COM-HPC Server modules conga-HPC/sILL with integrated heat pipes, 18.2mm overall cooling height.050452conga-HPC/sILL-HSP-HP-BStandard heatspreader for COM-HPC Server modules conga-HPC/sILL with integrated heat pipes and 11mm overall cooling height. Through hole mounting with bore hole standoffs Ø2.7mm.050453conga-HPC/sILL-HSP-HP-TStandard heatspreader for COM-HPC Server modules conga-HPC/sILL with integrated heat pipes and 11mm overall cooling height. Threaded mounting with threaded standoffs M2.5.050454conga-HPC/sILL-HPAHeat pipe Adapter for COM-HPC Server modules conga-HPC/sILL. Suitable for standard 8 mm heat pipes to optimize heat distribution.050455conga-HPC/sILL-Retention FrameRetention frame for conga-HPC/sILL065500conga-HPC/EVAL-Serverconga-HPC/EVAL-Server069000DDR4-UDIMM-3200 (16GB)DDR4 UDIMM memory module with 3200 MT/s and 16GB RAM069003DDR4-UDIMM-3200 ECC (16GB)DDR4 ECC UDIMM memory module with 3200 MT/s and 16GB RAM069002DDR4-UDIMM-3200 (16GB) / i-tempIndustrial DDR4 UDIMM memory module with 3200 MT/s and 16GB RAM069004DDR4-UDIMM-3200 ECC (16GB) / i-tempIndustrial DDR4 ECC UDIMM memory module with 3200 MT/s and 16GB RAM069001DDR4-UDIMM-3200 (32GB)DDR4 UDIMM memory module with 3200 MT/s and 32GB RAM069006DDR4-UDIMM-3200 ECC (32GB)DDR4 ECC UDIMM memory module with 3200 MT/s and 32GB RAM069005DDR4-UDIMM-3200 (32GB) / i-tempIndustrial DDR4 UDIMM memory module with 3200 MT/s and 32GB RAM069007DDR4-UDIMM-3200 ECC (32GB) / i-tempIndustrial DDR4 ECC UDIMM memory module with 3200 MT/s and 32GB RAM069200DDR4-RDIMM-3200 ECC (16GB)DDR4 ECC RDIMM memory module with 3200 MT/s and 16GB RAM069210DDR4-RDIMM-3200 ECC (16GB) / i-tempIndustrial DDR4 ECC RDIMM memory module with 3200 MT/s and 16GB RAM069220DDR4-RDIMM-3200 ECC (32GB)DDR4 ECC RDIMM memory module with 3200 MT/s and 32GB RAM069230DDR4-RDIMM-3200 ECC (32GB) / i-tempIndustrial DDR4 ECC RDIMM memory module with 3200 MT/s and 32GB RAM069240DDR4-RDIMM-3200 ECC (64GB)DDR4 ECC RDIMM memory module with up to 3200 MT/s and 64GB RAM069250DDR4-RDIMM-3200 ECC (64GB) / i-tempIndustrial DDR4 ECC RDIMM memory module with 3200 MT/s and 64GB RAM069600VLP DDR4-RDIMM-3200 ECC (16GB)DDR4 ECC VLP RDIMM memory module with up to 3200 MT/s and 16GB RAM069610VLP DDR4-RDIMM-3200 ECC (16GB) / i-tempIndustrial DDR4 ECC VLP RDIMM memory module with up to 3200 MT/s and 16GB RAM069620VLP DDR4-RDIMM-3200 ECC (32GB)DDR4 ECC VLP RDIMM memory module with up to 3200 MT/s and 32GB RAM27000001Design-In TrainingDesign-Training to develop carrier boards for Computer on ModulesBitte stellen Sie sicher, dass Sie stets die aktuellsten Version der Produktspezifikationen des Herstellers verwenden. Hersteller-Produktseite: conga-HPC/sILLMCTX Mobile & Embedded Computers GmbH IST UM DIE RICHTIGKEIT UND AKTUALITÄT DER DATEN AUF DIESER WEBSEITE BEMÜHT, ÜBERNIMMT JEDOCH KEINERLEI ZUSICHERUNG BEZÜGLICH DES INHALTS. EINE HAFTUNG ODER GARANTIE FÜR DIE AKTUALITÄT, RICHTIGKEIT UND VOLLSTÄNDIGKEIT DER ZUR VERFÜGUNG GESTELLTEN INFORMATIONEN IST FOLGLICH AUSGESCHLOSSEN.Technische Unterstützung & System Integration Services
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congatec conga-HPC/sILH - COM-HPC Server CPU-Modul mit Intel® Ice Lake COM-HPC Server Size D module based on Intel® Xeon® D processor series (code name "Ice Lake")
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display: block;
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background-color: #e9e9f0;
color: #4B70B2;}
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background-color: #798490;
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.head_subsec {color: CornflowerBlue;
padding-top: 10px;padding-left: 10px;
padding-right: 25px;
vertical-align: bottom;
}
.chead {
border: 1px solid Lavender;
font-size: 90%;
font-weight: bolder;}
.ckey {
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font-weight: bolder;
border: 1px solid Lavender;word-break: break-word;
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font-weight: bolder;
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congatec conga-HPC/sILH - COM-HPC Server CPU-Modul mit Intel® Ice LakeCOM-HPC Server Size D module based on Intel® Xeon® D processor series (code name "Ice Lake")
Beispiel Menü
/* CSS-Variable für die Breite der schwarzen Buttons */
:root {
--black-button-width: 120px;
}
/* Menüleiste: Flexbox für gleichmäßig verteilte Menüeinträge */
ul.menu {
list-style-type: none;
margin: 0;
padding: 0;
background-color: white;
overflow: hidden;
font-family: 'Ubuntu', sans-serif;
display: flex; /* Flexbox */
width: 100%;
}
/* Menüeinträge */
li.menu-item {
padding: 0;
text-align: center;
border-right: 5px solid white;
display: block;
text-align: center;
text-decoration: none;
border-radius: 3px;
transition: background-color 0.3s, color 0.3s; /* Smooth transition for hover effect */
}
li.menu-item a {
display: block;
color: white;
text-align: center;
text-decoration: none;
padding: 10px 20px;
font-size: 16px;
font-weight: 500;
border-radius: 3px;
transition: background-color 0.3s, color 0.3s; /* Smooth transition for hover effect */
}
/* Stretch-Element */
.stretch {
flex-grow: 1;
height: 30px;
}
li.menu-item a:hover {
color: black !important; /* Ensures text color change on hover */
background-color: #f7c13d !important; /* Ensures background color change on hover */
}
/* Aktiver Menüeintrag: Hintergrundfarbe und Schriftgewicht bei Aktivierung */
li.menu-item a:active {
color: #2b3136; /* Textfarbe beim aktiven Zustand */
font-weight: bolder; /* Fettere Schrift */
background-color: CornflowerBlue; /* Hintergrundfarbe beim aktiven Zustand */
}
Datenblatt
Handbuch
System Integration
Unverbindliche Beratung: +49(0)7665 9390 185
ÜbersichtKey FeaturesCPUIndustrial Use Condition with extended Temperature options48 PCIe Express lanesAI Capabilities with Intel® DL boostReal Time Capable Platform
CPU Produktfamilie: Intel® Ice Lake
Intel® Xeon® D-2796TE (30M Cache, bis zu 3.10 GHz)Intel® Xeon® D-2775TE (25M Cache, bis zu 3.10 GHz)Intel® Xeon® D-2752TER (20M Cache, bis zu 2.80 GHz)Intel® Xeon® D-2733NT (15M Cache, bis zu 3.20 GHz)Intel® Xeon® D-2712T (15M Cache, bis zu 3.00 GHz)CPU-Varianten
CPU
Processor Number
Cache
Max Turbo Frequency
Total Cores
Total Threads
PCI Express Revision
Intel® Xeon® D-2796TE
D-2796TE
30 MB
3.10 GHz
20
40
4.0
Intel® Xeon® D-2775TE
D-2775TE
25 MB
3.10 GHz
16
32
4.0
Intel® Xeon® D-2752TER
D-2752TER
20 MB
2.80 GHz
12
24
4.0
Intel® Xeon® D-2733NT
D-2733NT
15 MB
3.20 GHz
8
16
4.0
Intel® Xeon® D-2712T
D-2712T
15 MB
3.00 GHz
4
8
4.0
SpezifikationFormfactorCOM-HPCCPUIntel® Xeon® D-2899NT(22 x 2.2 GHz, 30 MB cache, 100G Eth, 135W)Intel® Xeon® D-2712T(4 x 1.9 GHz, 15 MB cache, 50G Eth, 65W)Intel® Xeon® D-2733NT(8 x 2.1 GHz, 15 MB cache, 50G Eth, 80W)Intel® Xeon® D-2752TER(12 x 1.8 GHz, 20 MB cache, 50G Eth, 77W)Intel® Xeon® D-2775TE(16 x 2.0 GHz, 25 MB cache, 100G Eth, 100W)Intel® Xeon® D-2796TE(20 x 2.0 GHz, 30 MB cache, 100G Eth, 118W)DRAM4x DIMM sockets for DDR4 memory modules | Max. capacity = 512GB**Optional 8 sockets on Size E, up to 1TBEthernet1 x 2.5GbE TSN Ethernet2x 40G / 4x 25G / 8x 10G/2.5G/1G/100M lanes | Maximum total bandwidth 100Gb (depending on CPU)I/O Interfaces32 x PCIe Gen416 x PCIe Gen34 x USB 3.04 x USB 2.02 x SATA III (6Gb/s)2 x UART12 x GPIOs2 x SM-Bus2 x I²C buscongatec Board ControllerMulti Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirectionembedded BIOS FeaturesAMI Aptio UEFI64Mbyte serial SPI with congatec Embedded BIOS featureOEM LogoOEM CMOS DefaultsFlash UpdateSecurityTrusted Platform Module (TPM 2.0)Power ManagementACPI 5.0 with battery supportOperating SystemsMicrosoft® Windows® 10Microsoft® Windows 10 IoT EnterpriseMicrosoft® Windows IoT 10 CoreLinuxAndroidYoctoHypervisorRTS Real-Time HypervisorTemperatureCommercial: Operating Temperature: 0 to +60°C | Storage Temperature: -20 to +80°CIndustrial:
Operating Temperature: -40 to +80°C | Storage Temperature: -40 to +80°CHumidityOperating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.Size160 x 160 mmOptional available on Size E, 200 x 160mmProduktvarianten / Zubehör050912conga-HPC/sILH-D2899NTCOM-HPC Size D module based on Intel® Xeon® D-2899NT 22-core processor with 2.2 GHz, 30MB cache and quad channel DDR4 3200 MT/s memory interface (formerly Ice Lake-D HCC Refresh). Commercial temperature range.050900conga-HPC/sILH-D2796TECOM-HPC Size D module based on Intel® Xeon® D-2796TE 20-core processor with 2.0 GHz, 30MB cache and quad channel DDR4 2933 MT/s memory interface (formerly Ice Lake-D HCC). Industrial temperature range.050901conga-HPC/sILH-D2775TECOM-HPC Size D module based on Intel® Xeon® D-2775TE 16-core processor with 2.0 GHz, 25MB cache and quad channel DDR4 2933 MT/s memory interface (formerly Ice Lake-D HCC). Industrial temperature range.050902conga-HPC/sILH-D2752TERCOM-HPC Size D module based on Intel® Xeon® D-2752TER 12-core processor with 1.8 GHz, 20MB cache and quad channel DDR4 2666 MT/s memory interface (formerly Ice Lake-D HCC). Industrial temperature range.050910conga-HPC/sILH-D2733NTCOM-HPC Size D module based on Intel® Xeon® D-2733NT 8-core processor with 2.1 GHz, 15MB cache and quad channel DDR4 2666 MT/s memory interface (formerly Ice Lake-D HCC). Commercial temperature range.050911conga-HPC/sILH-D2712TCOM-HPC Size D module based on Intel® Xeon® D-2712T 4-core processor with 1.9 GHz, 15MB cache and quad channel DDR4 2666 MT/s memory interface (formerly Ice Lake-D HCC). Commercial temperature range.050995conga-HPC/sILH-D2796TE DPLLCOM-HPC Size D module based on Intel® Xeon® D-2796TE 20-core processor with 2.0 GHz, 30MB cache and quad channel DDR4 2933 MT/s memory interface (formerly Ice Lake-D HCC). Industrial temperature range. With DPLL option for ITU-T Synchronous Ethernet (SyncE) and IEEE1588 PTP support.050996conga-HPC/sILH-D2775TE DPLLCOM-HPC Size D modulebasedon Intel® Xeon® D-2775TE 16-core processorwith2.0 GHz, 25MB cacheand quadchannelDDR4 2933 MT/s memoryinterface (formerlyIce Lake-D HCC). Industrial temperaturerange. WithDPLL optionforITU-T SynchronousEthernet (SyncE) and IEEE1588 PTP support.Zubehör050950conga-HPC/sILH-CSA-HP-BStandard active cooling solution for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes, 32.9mm overall cooling height and integrated 12V fan. Through hole mounting with bore hole standoffs Ø2.7mm.050951conga-HPC/sILH-CSA-HP-TStandard active cooling solution for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes, 32.9mm overall cooling height and integrated 12V fan. Threaded mounting with threaded standoffs M2.5.050952conga-HPC/sILH-HSP-HP-BStandard heatspreader for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes and 11mm overall cooling height. Through hole mounting with bore hole standoffs Ø2.7mm.050953conga-HPC/sILH-HSP-HP-TStandard heatspreader for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes and 11mm overall cooling height. Threaded mounting with threaded standoffs M2.5.050954conga-HPC/sILH-HPA-BHeat pipe Adapter for COM-HPC Server modules conga-HPC/sILH. Suitable for standard 8 mm heat pipes to optimize heat distribution. Through hole mounting with bore hole standoffs Ø2.7mm.050955conga-HPC/sILH-HPA-THeat pipe Adapter for COM-HPC Server modules conga-HPC/sILH. Suitable for standard 8 mm heat pipes to optimize heat distribution. Threaded mounting with threaded standoffs M2.5.050956conga-HPC/sILH-Retention FrameRetention frame for conga-HPC/sILH065500conga-HPC/EVAL-Serverconga-HPC/EVAL-Server069420DDR4-LRDIMM-3200 ECC (128GB)DDR4 ECC LRDIMM memory module with 3200 MT/s and 128GB RAM069430DDR4-LRDIMM-3200 ECC (128GB)Industrial DDR4 ECC LRDIMM memory module with 3200 MT/s and 128GB RAM069000DDR4-UDIMM-3200 (16GB)DDR4 UDIMM memory module with 3200 MT/s and 16GB RAM069003DDR4-UDIMM-3200 ECC (16GB)DDR4 ECC UDIMM memory module with 3200 MT/s and 16GB RAM069002DDR4-UDIMM-3200 (16GB) / i-tempIndustrial DDR4 UDIMM memory module with 3200 MT/s and 16GB RAM069004DDR4-UDIMM-3200 ECC (16GB) / i-tempIndustrial DDR4 ECC UDIMM memory module with 3200 MT/s and 16GB RAM069001DDR4-UDIMM-3200 (32GB)DDR4 UDIMM memory module with 3200 MT/s and 32GB RAM069006DDR4-UDIMM-3200 ECC (32GB)DDR4 ECC UDIMM memory module with 3200 MT/s and 32GB RAM069005DDR4-UDIMM-3200 (32GB) / i-tempIndustrial DDR4 UDIMM memory module with 3200 MT/s and 32GB RAM069007DDR4-UDIMM-3200 ECC (32GB) / i-tempIndustrial DDR4 ECC UDIMM memory module with 3200 MT/s and 32GB RAM069200DDR4-RDIMM-3200 ECC (16GB)DDR4 ECC RDIMM memory module with 3200 MT/s and 16GB RAM069210DDR4-RDIMM-3200 ECC (16GB) / i-tempIndustrial DDR4 ECC RDIMM memory module with 3200 MT/s and 16GB RAM069220DDR4-RDIMM-3200 ECC (32GB)DDR4 ECC RDIMM memory module with 3200 MT/s and 32GB RAM069230DDR4-RDIMM-3200 ECC (32GB) / i-tempIndustrial DDR4 ECC RDIMM memory module with 3200 MT/s and 32GB RAM069240DDR4-RDIMM-3200 ECC (64GB)DDR4 ECC RDIMM memory module with up to 3200 MT/s and 64GB RAM069610VLP DDR4-RDIMM-3200 ECC (16GB) / i-tempIndustrial DDR4 ECC VLP RDIMM memory module with up to 3200 MT/s and 16GB RAM069600VLP DDR4-RDIMM-3200 ECC (16GB)DDR4 ECC VLP RDIMM memory module with up to 3200 MT/s and 16GB RAM069620VLP DDR4-RDIMM-3200 ECC (32GB)DDR4 ECC VLP RDIMM memory module with up to 3200 MT/s and 32GB RAM065505conga-HPC/LEK-C827-IM 4SFP28COM-HPC Mezzanine card with Intel C827-IM, 4xSFP28065506conga-HPC/LEK-XL827-AM 8SFP+COM-HPC Mezzanine card with 2x Intel XL827-AM, 8xSFP+065508conga-HPC/LEK-C827-IM 2QSFP28COM-HPC Mezzanine card with Intel C827-IM, 2x QSFP28Bitte stellen Sie sicher, dass Sie stets die aktuellsten Version der Produktspezifikationen des Herstellers verwenden. Hersteller-Produktseite: conga-HPC/sILHMCTX Mobile & Embedded Computers GmbH IST UM DIE RICHTIGKEIT UND AKTUALITÄT DER DATEN AUF DIESER WEBSEITE BEMÜHT, ÜBERNIMMT JEDOCH KEINERLEI ZUSICHERUNG BEZÜGLICH DES INHALTS. EINE HAFTUNG ODER GARANTIE FÜR DIE AKTUALITÄT, RICHTIGKEIT UND VOLLSTÄNDIGKEIT DER ZUR VERFÜGUNG GESTELLTEN INFORMATIONEN IST FOLGLICH AUSGESCHLOSSEN.Technische Unterstützung & System Integration Services
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