SMARC®
SECO
SOM-SMARC-ZU
SECO SOM-SMARC-ZU - SMARC CPU-Modul mit Xilinx® Zynq The SOM-SMARC-ZU is a SMARC Rel. 2.0 compliant Computer on Module (CoM) with the Zynq® Ultrascale+™ MPSoC. Delivering flexibile ARM + FPGA Heterogeneous processing in a standard form factor, this solution is able to merge wide scalability, from cost effec
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SECO SOM-SMARC-ZU - SMARC CPU-Modul mit Xilinx® ZynqThe SOM-SMARC-ZU is a SMARC Rel. 2.0 compliant Computer on Module (CoM) with the Zynq® Ultrascale+™ MPSoC. Delivering flexibile ARM + FPGA Heterogeneous processing in a standard form factor, this solution is able to merge wide scalability, from cost effec
Datenblatt
Handbuch
System Integration
ÜbersichtKey FeaturesCPUZynq Ultrascale+ CG/EG/EV MPSoCs in C784 packageIntegrated ARM Mali-400 MP2 GPUPCI-e x4, 2x GbE, 2x CAN Bus, 2x SPI, 12x GPI/OsUp to 8GB + 2GB DDR4 soldered downXilinx® Zynq® Ultrascale+™ ZU2CG, ZU3CG, ZU4CG or ZU5CG MPSoCs: Dual-core ARM® Cortex®-A53 MPCore Application Processing Unit +Dual-core ARM® Cortex®-R5 Real-Time Processing Unit Xilinx® Zynq® Ultrascale+™ ZU2EG, ZU3EG, ZU4EG, ZU5EG, ZU4EV or ZU5EV MPSoCs: Quad-core ARM® Cortex®-A53 MPCore Application Processing Unit +Dual-core ARM® Cortex®-R5 Real-Time Processing Unit Spezifikation
Description
The SOM-SMARC-ZU is a SMARC Rel. 2.0 compliant Computer on Module (CoM) with the Zynq® Ultrascale+™ MPSoC. Delivering flexibile ARM + FPGA Heterogeneous processing in a standard form factor, this solution is able to merge wide scalability, from cost effective Dual-Core to high performance Quad-Core ARM® Cortex®-A53 MPSoCs with GPU/VCU, and extreme flexibility (up to 256k FPGA logic cells). It also features dedicated Real-Time ARM® Cortex®-R5 processors, along with LVDS and DP video interfaces up to 4K resolution and high-speed interfaces.
Cpu
Zynq® Ultrascale+™ ZU2CG, ZU3CG, ZU4CG or ZU5CG MPSoCs:
Dual-core ARM® Cortex®-A53 MPCore Application Processing Unit +Dual-core ARM® Cortex®-R5 Real-Time Processing Unit
Zynq® Ultrascale+™ ZU2EG, ZU3EG, ZU4EG, ZU5EG, ZU4EV or ZU5EV MPSoCs:
Quad-core ARM® Cortex®-A53 MPCore Application Processing Unit +Dual-core ARM® Cortex®-R5 Real-Time Processing Unit
Memory
Soldered Down DDR4-2400 memory
Up to 8GB for Processing System Unit + up to 2GB for Programmable Logic
Graphics
Only on EG and EV MPSOcs:
Integrated ARM Mali-400 MP2 Graphics Processing Unit
Multicore 2D/3D acceleration at 667MHz
OpenGL ES 1.1 / 2.0, OpenVG 1.0 / 1.1
On EV MPSoCs only, H.264/H.265 integrated video codec
Video Interfaces
18- / 24-bit Dual Channel LVDS interface
DP interface
2 x CSI interfaces
Video Resolution
DP Up to 4096 x 2160
LVDS Dependent on the IP implemented in the programmable logic
Mass Storage
1 x external S-ATA Gen3 Channel
SD interface
QSPI Flash soldered-onboard
Optional eMMC 4.51 drive soldered on-board
Networking
Up to 2 x Gigabit Ethernet interfaces
Usb
1x USB 2.0 OTG
2x USB 2.0 Host
2x USB 3.0 Host
Pci
PCI-e x4 interface
Audio
Dependent on the IP implemented in the programmable logic
Serial Ports
2 x UART Tx/Rx/RTS/CTS
2 x UART Tx/Rx
2 x CAN Bus
Other Interfaces
2 x I2C Bus
2 x SPI interfaces
12 x GPI/Os
Boot select signals
Power Management Signals
Power Supply
+3÷+5.25VDC
+3.3V_RTC
Operating System
Linux
Android
Operating Temperature
0°C ÷ +60°C (Commercial version)
-40°C ÷ +85°C (Industrial version)
*Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensions
50 x 82 mm (1.97” x 3.23”)
Produktvarianten / ZubehörRB71-7522-1300-C0-VSMARC with CPU ZU4EV Quad Core+GPU+VCU 1,30GHz Zynq Ultrascale+, PS DRAM 2 GB, PL DRAM 512M, eMMC 8 GB, SecondGigabit Ethernet SGMII, Clock Generator Si510 148.5 MHz - Comm. Temp.RB71-C504-0000-I0-VSMARC con CPU ZU4EG Quad Core+GPU 1,30GHz Xilinx Zynq Ultrascale+, PS DRAM 2 GB, eMMC 4 GB - Ind.Temp.Bitte stellen Sie sicher, dass Sie stets die aktuellsten Version der Produktspezifikationen des Herstellers verwenden. Hersteller-Produktseite: SOM-SMARC-ZUMCTX Mobile & Embedded Computers GmbH IST UM DIE RICHTIGKEIT UND AKTUALITÄT DER DATEN AUF DIESER WEBSEITE BEMÜHT, ÜBERNIMMT JEDOCH KEINERLEI ZUSICHERUNG BEZÜGLICH DES INHALTS. EINE HAFTUNG ODER GARANTIE FÜR DIE AKTUALITÄT, RICHTIGKEIT UND VOLLSTÄNDIGKEIT DER ZUR VERFÜGUNG GESTELLTEN INFORMATIONEN IST FOLGLICH AUSGESCHLOSSEN.Technische Unterstützung & System Integration Services
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SECO
SOM-SMARC-MX93
SECO SOM-SMARC-MX93 - SMARC CPU-Modul SMARC® Rel. 2.1.1 Computer on Module (CoM) with NXP i.MX 9 Applications Processors.
(MAURY)
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SECO SOM-SMARC-MX93 - SMARC CPU-ModulSMARC® Rel. 2.1.1 Computer on Module (CoM) with NXP i.MX 9 Applications Processors.
(MAURY)
Datenblatt
System Integration
ÜbersichtKey FeaturesNXP i.MX 933/935 processor, On request also available with NXP i.MX 91 with reduced functionalitiesDisplay up to FHD2x GB Ethernet, 1x USB 2.0 OTG, up to 4x USB 2.0, 2x CAN, 4 x UART, opt Wi-Fi +BT 5.0, MIPI-CSI, 1x I2SSoldered-down LPDDR4X/LPDDR4-3200 memory, up to 2GB total, 16-bit interfaceSpezifikation
Description
SMARC® Rel. 2.1.1 Computer on Module (CoM) with NXP i.MX 9 Applications Processors
Cpu
1-2x Arm® Cortex®-A55 @ 1.7 GHz
Arm Cortex-M33 @ 250Mhz
Arm® Ethos™ U-65 microNPU
Memory
Soldered-down LPDDR4X/LPDDR4-3200 memory, up to 2GB total, 16-bit interface
Graphics
LVDS Single Channel
MIPI_DSI or eDP interface (factory alternatives)
Video Interfaces
LVDS Single Channel
MIPI_DSI or eDP interface (factory alternatives)
Video Resolution
MIPI-DSI: up to 1080p60
LVDS: up to 720p60
Mass Storage
eMMC 5.1 Drive soldered on-board, up to 64GB (boot device)
SD 4-bit interface (boot device)
Networking
2x Gigabit Ethernet interfaces, opt. Wi-Fi + BT5.0
Usb
1x USB 2.0 OTG port
up to 4x USB 2.0 using optional internal 2.0 HUB
Audio
1x I2S port
Serial Ports
2x UART (4-wires)
2x UART (2-wires)
Other Interfaces
12 x GPIOs
1x MIPI-CSI 2 Lanes Camera interface
1x General Purpose I2C Bus
2 x PWM ports
Security
TPM
Embedded Controller Functionalities
Power management
Watchdog
Boot select signals
GP I/O
Power Supply
+5VDC ± 5% and +3.3V_RTC
Operating System
Linux
Yocto
Operating Temperature
0 to +60°C (Commercial Range)
-40 to +85°C (Industrial Range)
*Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensions
82 x 50 mm
Produktvarianten / ZubehörBitte stellen Sie sicher, dass Sie stets die aktuellsten Version der Produktspezifikationen des Herstellers verwenden. Hersteller-Produktseite: SOM-SMARC-MX93MCTX Mobile & Embedded Computers GmbH IST UM DIE RICHTIGKEIT UND AKTUALITÄT DER DATEN AUF DIESER WEBSEITE BEMÜHT, ÜBERNIMMT JEDOCH KEINERLEI ZUSICHERUNG BEZÜGLICH DES INHALTS. EINE HAFTUNG ODER GARANTIE FÜR DIE AKTUALITÄT, RICHTIGKEIT UND VOLLSTÄNDIGKEIT DER ZUR VERFÜGUNG GESTELLTEN INFORMATIONEN IST FOLGLICH AUSGESCHLOSSEN.Technische Unterstützung & System Integration Services
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SECO
SOM-SMARC-MX8X
SECO SOM-SMARC-MX8X - SMARC CPU-Modul SMARC® Rel. 2.1.1 Computer on Module (CoM) with NXP i.MX 8X Applications Processors.
(SWAN - D16)
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SECO SOM-SMARC-MX8X - SMARC CPU-ModulSMARC® Rel. 2.1.1 Computer on Module (CoM) with NXP i.MX 8X Applications Processors.
(SWAN - D16)
Datenblatt
Handbuch
System Integration
ÜbersichtKey FeaturesNXP i.MX 8X Applications ProcessorsIntegrated GPU, supports 2 independent displays2x Gigabit Ethernet, opt. Wi-Fi +BT 5.0, CSI camera, 2x USB 3.0, 3x USB2.0, 1x PCI-e x1, 2x CAN Bus, 4xUART, 14x GPI/Os, QuadSPI interfaceup to 4GB soldered down LPDDR4-2400 memorySpezifikation
Description
SMARC® Rel. 2.1.1 Computer on Module (CoM) with NXP i.MX 8X Applications Processors
Cpu
NXP i.MX 8X family SoCs: Dual or Quad ARM Cortex®-A35 Cores + 1x Cortex® M4F core for real-time processing
NXP i.MX8 QuadXplus, 4x ARM Cortex®-A35 Cores + 1x Cortex® M4F core for real-time processing
NXP i.MX8 DualXplus, 2x ARM Cortex®-A35 Cores + 1x Cortex® M4F core for real-time processing
NXP i.MX8 DualX, 2x ARM Cortex®-A35 Cores
Max Cores
4+1
Memory
Soldered down LPDDR4 memory @ 1200MHz, 32-bit interface, up to 4GB
Graphics
Embedded GC7000Lite GPU
Supports OpenGL 3.0, 2.1, OpenGL ES 3.1, OpenCL 1.2 Full Profile and 1.1, OpenVG 1.1, and Vulkan
Embedded VPU, supports HW decoding of HEVC/H.265, AVC/H.264, MPEG-2, VC-1, RV10, VP8, H.263 and MPEG4.2t, HW encoding of AVC/H.264
2 independent displays supported
Video Interfaces
Factory alternatives:
· 2x LVDS / Mipi-DSI Single Channel or 1xLVDS / Mipi-DSI Dual Channel 18-/24-bit interface
· LVDS / Mipi-DSI Single Channel 18-/24-bit interface + HMDI interface
· eDP 4-lane interface + LVDS / Mipi-DSI single Channel 18-/24-bit interface
· eDP 4-lane interface + HMDI interface
Video Resolution
MIPI-DSI, LVDS, eDP, HDMI: Up to 1920 x 1080 @ 60Hz
Mass Storage
Optional Soldered onboard eMMC 5.1 Drive, up to 64GB
SD 4-bit interface
QSPI NOR Flash soldered on-board
Networking
Up to 2 x Gigabit Ethernet interfaces
On-board WiFi 802.11 a/b/g/n + BT LE 5.0 module, optional
Usb
Up to 3 x USB 2.0 Host Ports
2 x USB 3.0 Host Ports
Pci
1x PCI-e 3.0 x1 port
Audio
Up to 2x I2S Audio interfaces
Serial Ports
2x 2-wires UART
2x 4-wires UART
Other Interfaces
1x 4-lanes CSI camera interface
2x PWM
Up to 14x GPIOs
I2C bus
SM bus
SPI interface
QuadSPI interface
Watchdog
Boot select signals
Power Management Signals
Power Supply
+5VDC and +3.3V_RTC
Operating System
Linux
Android
Operating Temperature
0°C ÷ +60°C ** (Commercial version)
-40°C ÷ +85°C (Industrial version)
**Measured at any point of the heatspreader/heatsink during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system.
Dimensions
50 x 82 mm (1.97” x 3.23”)
Produktvarianten / ZubehörRD16-2242-3100-C3SWAN- SMARC module with NXP Quad8XPlus w/DSP, 2GB RAM, 32GB eMMC, LVDS Single Channel, HDMI, 2xGbE, Comm. TempRD16-2243-3100-I3SWAN- SMARC module with NXP Quad8XPlus w/DSP, 2GB RAM, 32GB eMMC, LVDS Single Channel, eDP, 2xGbE, Ind. TempBitte stellen Sie sicher, dass Sie stets die aktuellsten Version der Produktspezifikationen des Herstellers verwenden. Hersteller-Produktseite: SOM-SMARC-MX8XMCTX Mobile & Embedded Computers GmbH IST UM DIE RICHTIGKEIT UND AKTUALITÄT DER DATEN AUF DIESER WEBSEITE BEMÜHT, ÜBERNIMMT JEDOCH KEINERLEI ZUSICHERUNG BEZÜGLICH DES INHALTS. EINE HAFTUNG ODER GARANTIE FÜR DIE AKTUALITÄT, RICHTIGKEIT UND VOLLSTÄNDIGKEIT DER ZUR VERFÜGUNG GESTELLTEN INFORMATIONEN IST FOLGLICH AUSGESCHLOSSEN.Technische Unterstützung & System Integration Services
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SECO
SOM-SMARC-MX8M-Plus
SECO SOM-SMARC-MX8M-Plus - SMARC CPU-Modul SMARC® Rel. 2.1.1 Computer on Module (CoM) with NXP i.MX 8M Plus Applications Processors.
(LEVY - D18)
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SECO SOM-SMARC-MX8M-Plus - SMARC CPU-ModulSMARC® Rel. 2.1.1 Computer on Module (CoM) with NXP i.MX 8M Plus Applications Processors.
(LEVY - D18)
Datenblatt
Handbuch
System Integration
ÜbersichtKey FeaturesNXP i.MX 8M Plus Applications ProcessorsIntegrated GPU, supports 3 independent displays2x Gigabit Ethernet, opt. Wi-Fi +BT 5.0, 2x CSI camera, 2x USB 3.0, 3x USB2.0, 1x PCI-e x1, 2x CAN Bus, 4xUART, 14x GPI/Os, QuadSPI interfaceup to 6GB soldered down LPDDR4-4000 memorySpezifikation
Description
SMARC® Rel. 2.1.1 Computer on Module (CoM) with NXP i.MX 8M Plus Applications Processors
Cpu
NXP i.MX 8M Plus family SoCs: Dual or Quad ARM Cortex®-A53 Cores + general purpose Cortex® M7 800MHz processor
• NXP i.MX 8M Plus Quad, 4x ARM Cortex®-A53 Cores up to 1.8GHz
• NXP i.MX 8M Plus Dual, 2x ARM Cortex®-A53 Cores up to 1.8GHz
• NXP i.MX 8M Plus Quad Lite, 4x ARM Cortex®-A53 Cores up to 1.8GHz, no VPU / NPU
NPU: 2.3 TOPS Neural Network performance (not for Quad Lite)
Max Cores
4+1
Memory
Soldered down LPDDR4-4000 memory, 32-bit interface, up to 6GB
Graphics
Integrated Graphics Processing Unit GC7000UL, supports 3 independent displays.
Embedded VPU, supports HW decoding of HEVC/H.265, AVC/H.264, MPEG-4, MPEG-2, MVC, VC-1, RV, VP6, VP7, VP8, VP9, JPEG, HW encoding of HEVC/H.265, AVC/H.264
Supports OpenVG 1.1, OpenGL ES 3.1, OpenCL 1.2 Full Profile and Vulkan
Video Interfaces
Up to 3 video display interfaces
HDMI 2.0a interface, supporting HDCP 2.2 and HDCP 1.4/1.3
2xLVDS Single Channel / 1xLVDS Dual Channel or eDP + 1xLVDS Single Channel (factory alternatives)
Video Resolution
HDMI: Up to 3840 x 2160 @30
LVDS/eDP: Up to 1920 x 1080 @60
Mass Storage
Soldered onboard eMMC 5.1 Drive, up to 64GB
SD 4-bit interface
Networking
Up to 2 x Gigabit Ethernet interfaces
Optional WiFi + BT LE module onboard
Usb
2 x USB 2.0 Host Ports
2 x USB 3.0 Host Ports
1 x USB 2.0 Host/Client port
Pci
Up to 1x PCI-e x1 Gen3 port
Audio
Up to 2x I2S Audio interfaces
Serial Ports
2x 2-wires UART
2x 4-wires UART
Other Interfaces
1x 4-lanes CSI camera interface
1x 2-lanes CSI camera interface
2x PWM
Up to 14x GPIOs
I2C bus
SM bus
SPI interface
QuadSPI interface
Watchdog
Boot select signals
Power Management Signals
Power Supply
+5VDC ± 5% and +3.3V_RTC
Operating System
Linux
Operating Temperature
0°C ÷ +60°C ** (Commercial version)
-40°C ÷ +85°C (Industrial version, without WiF+BT optional module)
**Measured at any point of the heatspreader/heatsink during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system.
Dimensions
50 x 82 mm (1.97” x 3.23”)
Produktvarianten / ZubehörRD18-3331-3111-C1LEVY, SMARC module with NXP i.MX8M Plus Quad, 4GB RAM, 16GB eMMC, HDMI, LVDS dual ch, 2x GbE, PCIe, Secure Element, Comm. temp.RD18-3452-3111-C1LEVY, SMARC module with NXP i.MX 8M Plus Quad, 6GB RAM, 64GB eMMC, HDMI, eDP, LVDS single ch, 2x GbE, PCIe, Secure Element, Comm. tempBitte stellen Sie sicher, dass Sie stets die aktuellsten Version der Produktspezifikationen des Herstellers verwenden. Hersteller-Produktseite: SOM-SMARC-MX8M-PlusMCTX Mobile & Embedded Computers GmbH IST UM DIE RICHTIGKEIT UND AKTUALITÄT DER DATEN AUF DIESER WEBSEITE BEMÜHT, ÜBERNIMMT JEDOCH KEINERLEI ZUSICHERUNG BEZÜGLICH DES INHALTS. EINE HAFTUNG ODER GARANTIE FÜR DIE AKTUALITÄT, RICHTIGKEIT UND VOLLSTÄNDIGKEIT DER ZUR VERFÜGUNG GESTELLTEN INFORMATIONEN IST FOLGLICH AUSGESCHLOSSEN.Technische Unterstützung & System Integration Services
Alle Dokumente auf dieser Seite werden ohne Benachrichtigung aktualisiert.DatenblattHandbuch
Preis auf Anfrage
SECO
SOM-SMARC-MX8M
SECO SOM-SMARC-MX8M - SMARC CPU-Modul The SOM-SMARC-MX8M is a SMARC Rel. 2.1.1 compliant Computer on Module (CoM) with NXP i.MX 8M Applications Processors. Featuring multicore processing (Dual or Quad ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor) and 4Kp60 HEVC decoding with HDR, it is a scalable solution designed by SECO for home automation, transportation, digital signage and vending machines, and applicable to scenarios requiring advanced security, connectivity, multimedia and real-time response.
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SECO SOM-SMARC-MX8M - SMARC CPU-ModulThe SOM-SMARC-MX8M is a SMARC Rel. 2.1.1 compliant Computer on Module (CoM) with NXP i.MX 8M Applications Processors. Featuring multicore processing (Dual or Quad ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor) and 4Kp60 HEVC decoding with HDR, it is a scalable solution designed by SECO for home automation, transportation, digital signage and vending machines, and applicable to scenarios requiring advanced security, connectivity, multimedia and real-time response.
Datenblatt
Handbuch
System Integration
ÜbersichtKey FeaturesNXP i.MX 8M Applications ProcessorsIntegrated Graphics Processing Unit, supports 2 independent displaysWiFi + BT LE, CSI camera, QuadSPI interface, 14x GPI/OsUp to 4GB soldered down LPDDR4-3200 memory, 32-bit interface.Spezifikation
Description
The SOM-SMARC-MX8M is a SMARC Rel. 2.1.1 compliant Computer on Module (CoM) with NXP i.MX 8M Applications Processors. Featuring multicore processing (Dual or Quad ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor) and 4Kp60 HEVC decoding with HDR, it is a scalable solution designed by SECO for home automation, transportation, digital signage and vending machines, and applicable to scenarios requiring advanced security, connectivity, multimedia and real-time response.
Cpu
NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor:
• i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz
• i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz
• i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU
Memory
Soldered Down LPDDR4-3200 memory, 32-bit interface, up to 4GB
Graphics
Integrated Graphics Processing Unit, supports 2 independent displays
Embedded VPU, supports HW decoding of HEVC (H.265), H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG
Supports OpenGL ES 3.1, Open CL 1.2. OpenGL 2.X, Vulkan, DirectX, Open VG 1.1
Video Interfaces
HDMI 2.0a interface, supporting HDCP 2.2 and HDCP 1.4
18- / 24-bit Dual Channel LVDS interface (factory option)
Video Resolution
HDMI Up to 4096 x 2160 @ 60 (4K)
LVDS Up to 1920 x 1080 @ 60Hz
Mass Storage
Optional SD 4-bit interface
QSPI Flash soldered-onboard
eMMC 5.0 drive soldered on-board
Networking
1 x Gigabit Ethernet interface
Optional WiFi + BT LE module onboard
Usb
2 USB 3.0 Host ports
2 USB 2.0 Host ports
1 USB 2.0 OTG port
Pci
2x PCI-e x1 ports
Audio
I2S Audio Interface
Serial Ports
Up to 2x UART Tx/Rx/RTS/CTS
2x UART Tx/Rx
1x CAN Bus (TTL level)
Other Interfaces
1x 4-lanes + 1x 2-lanes CSI camera interfaces
I2C Bus
SM Bus
2x SPI interfaces
QuadSPI interface
14 x GPI/Os
Boot select signals
Power Management Signals
Power Supply
+5VDC
+3.3V_RTC
Operating System
Linux
Yocto
Android
Operating Temperature
0°C ÷ +60°C (Commercial version)
-40°C ÷ +85°C (Industrial version)
*Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensions
50 x 82 mm (1.97” x 3.23”)
Produktvarianten / ZubehörRC12-3320-2112-C2-VSM-C12 i.MX8M Quad Lite1.5 GHz (GPU, No VPU), LPDDR4 4 GB, eMMC 8 GB, LVDS + HDMI, uSD + UART4 , PCIe, NO CAN/ NO RTC, Comm. Temp.RC12-5520-2111-I2-VSM-C12 i.MX8M Quad 1.3 GHz (VPU decode + HDR10 + GPU), LPDDR4 2 GB, eMMC 8 GB, LVDS + HDMI, uSD + UART4, PCIe, CAN, Ind. TempRC12-5630-2111-I2-VSM-C12 i.MX8M Quad 1.3 GHz (VPU decode + HDR10 + GPU), LPDDR4 4 GB, eMMC 16 GB, LVDS + HDMI, uSD + UART4, PCIe, CAN, Ind. TempBitte stellen Sie sicher, dass Sie stets die aktuellsten Version der Produktspezifikationen des Herstellers verwenden. Hersteller-Produktseite: SOM-SMARC-MX8MMCTX Mobile & Embedded Computers GmbH IST UM DIE RICHTIGKEIT UND AKTUALITÄT DER DATEN AUF DIESER WEBSEITE BEMÜHT, ÜBERNIMMT JEDOCH KEINERLEI ZUSICHERUNG BEZÜGLICH DES INHALTS. EINE HAFTUNG ODER GARANTIE FÜR DIE AKTUALITÄT, RICHTIGKEIT UND VOLLSTÄNDIGKEIT DER ZUR VERFÜGUNG GESTELLTEN INFORMATIONEN IST FOLGLICH AUSGESCHLOSSEN.Technische Unterstützung & System Integration Services
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Preis auf Anfrage
SECO
SOM-SMARC-Genio700
SECO SOM-SMARC-Genio700 - SMARC CPU-Modul SMARC® Rel. 2.1.1 Computer on Module (CoM) with MediaTek Genio 700 Applications Processors .
(WILK)
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SECO SOM-SMARC-Genio700 - SMARC CPU-ModulSMARC® Rel. 2.1.1 Computer on Module (CoM) with MediaTek Genio 700 Applications Processors .
(WILK)
Datenblatt
System Integration
ÜbersichtKey FeaturesMediaTek Genio 700Mali G57 MC3 GPUUp to 2x Gb Ethernet, 1x USB 3.1, 2x USB 2.0, 1x CAN, 4 x UART,, opt Wi-Fi +BT 5.0, MIPI-CSI, 1x I2SSoldered-down LPDDR4X-3733 memory, up to 8GB totalSpezifikation
Description
SMARC® Rel. 2.1.1 Computer on Module (CoM) with MediaTek Genio 700 Applications Processors
Cpu
2x Arm® Cortex®-A78 @ 2.2 GHz
6x Arm® Cortex®-A55 @ 2.0 GHz
Mali G57 MC3 GPU
AI Accelerator: Cadence Tensilica VP6 with Mediatek APU3.0
System Companion Chip: MDSP RV55
DSP: Candence Tensilica HiFi5
Image Signal Processor (ISP)
Memory
Soldered-down LPDDR4X-3733/LPDDR4-3200 memory, up to 8GB total
Video Interfaces
LVDS Dual Channel or eDP (factory alternatives)
HDMI
DP
Video Resolution
MIPI/eDP: up to 2560x1600p60
HDMI/DP: up to 4K60
Mass Storage
eMMC 5.1 Drive soldered on-board, up to 64GB (boot device)
SDIO Interface
Networking
1x Gigabit Ethernet (RGMII)
1x 100Mbit Ethernet (USB)
Optional Wifi 802.11 a/b/g/n/ac 2x2 and BT 5.3 utilising onboard module with M2.1216 standard form factor
Usb
1x USB3.1
1x USB2.0 Host/Slave
4x USB2.0 Host
Audio
2x I2S port
Serial Ports
2x UART (4-wires)
2x UART (2-wires)
Other Interfaces
GPIOs
MIPI-CSI camera interface
General Purpose I2C Bus
PWM ports
Security
TPM
Embedded Controller Functionalities
Power management
Watchdog
Boot select signals
GP I/O
Power Supply
+5VDC ± 5% and +3.3V_RTC
Operating System
Linux Yocto Kirkstone
Android T (13)
Operating Temperature
0 ÷ +60°C (Commercial Range)*
-20 ÷ +85°C (Extended Commercial Range)*
-40 ÷ +85°C (Industrial Range)*
*Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensions
82 x 50 mm
Produktvarianten / ZubehörBitte stellen Sie sicher, dass Sie stets die aktuellsten Version der Produktspezifikationen des Herstellers verwenden. Hersteller-Produktseite: SOM-SMARC-Genio700MCTX Mobile & Embedded Computers GmbH IST UM DIE RICHTIGKEIT UND AKTUALITÄT DER DATEN AUF DIESER WEBSEITE BEMÜHT, ÜBERNIMMT JEDOCH KEINERLEI ZUSICHERUNG BEZÜGLICH DES INHALTS. EINE HAFTUNG ODER GARANTIE FÜR DIE AKTUALITÄT, RICHTIGKEIT UND VOLLSTÄNDIGKEIT DER ZUR VERFÜGUNG GESTELLTEN INFORMATIONEN IST FOLGLICH AUSGESCHLOSSEN.Technische Unterstützung & System Integration Services
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Preis auf Anfrage
SECO
SOM-SMARC-EHL
SECO SOM-SMARC-EHL - SMARC CPU-Modul mit Intel® Elkhart Lake SMARC® Rel. 2.1.1 Computer on Module (CoM) with Intel® Atom® x6000E Series and Intel® Pentium® and Celeron® N and J Series (Codename: Elkhart Lake) Processors for FuSa applications.
(HALLEY - C93)
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SECO SOM-SMARC-EHL - SMARC CPU-Modul mit Intel® Elkhart LakeSMARC® Rel. 2.1.1 Computer on Module (CoM) with Intel® Atom® x6000E Series and Intel® Pentium® and Celeron® N and J Series (Codename: Elkhart Lake) Processors for FuSa applications.
(HALLEY - C93)
Datenblatt
Handbuch
System Integration
ÜbersichtKey FeaturesCPUIntel Atom x6000E Series and Intel Pentium and Celeron N and J Series processorsIntegrated Gen11 UHD Graphics controller supporting 3 independent displays2x GbE with precision time protocol IEEE 1588, optional SERDES for external 3rd Ethernet, 6x USB 2.0, 3x USB 3.1, up to 4x PCI-eQuad Channel LPDDR4x Soldered Down with IBECC
CPU Produktfamilie: Intel® Elkhart Lake
Intel® Pentium® N6415 (1.5M Cache, bis zu 3.00 GHz)Intel® Pentium® J6426 (1.5M Cache, bis zu 3.00 GHz)Intel® Celeron® N6211 (1.5M Cache, bis zu 3.00 GHz)Intel® Celeron® J6413 (1.5M Cache, bis zu 3.00 GHz)CPU-Varianten
CPU
Intel® Pentium® N6415
Intel® Celeron® N6211
Intel® Pentium® J6426
Intel® Celeron® J6413
Processor Number
N6415
N6211
J6426
J6413
Cache
1.5 MB L2 Cache
1.5 MB L2 Cache
1.5 MB L2 Cache
1.5 MB L2 Cache
Total Cores
4
2
4
4
Total Threads
4
2
4
4
PCI Express Revision
3.0
3.0
3.0
3.0
Spezifikation
Description
SMARC® Rel. 2.1.1 Computer on Module (CoM) with Intel® Atom® x6000E Series and Intel® Pentium® and Celeron® N and J Series (formerly Elkhart Lake) Processors for FuSa applications
Cpu
Intel® Atom™ x6000E, Pentium® and Celeron® N and J Series “Elkhart Lake” CPUs:
• Celeron® J6413 Quad Core @ 1.8GHz (3.0GHZ Turbo) 10W TDP - Comm. Temp. Range
• Celeron® N6211 Dual Core @1.2GHz (3.0GHZ Turbo) 6.5W TDP - Comm. Temp. Range
• Pentium® J6426 Quad Core @2GHz (3.0GHZ Turbo) 10W TDP - Comm. Temp. Range
• Pentium® N6415 Quad Core @1.2GHz (3.0GHZ Turbo) 6.5W TDP - Comm. Temp. Range
• Atom™ x6211E Dual Core @1.3GHz (3.0GHZ Turbo) 6W TDP w/ IBECC and IHS - Ind. Temp. Range
• Atom™ x6413E Quad Core @1.5GHz (3.0GHZ Turbo) 9W TDP w/ IBECC and IHS - Ind. Temp. Range
• Atom™ x6425E Quad Core @2GHz (3.0GHZ Turbo) 12W TDP w/ IBECC and IHS - Ind. Temp. Range
• Atom™ x6212RE Dual Core @1.2GHz (no Turbo) 6W TDP w/ IBECC, IHS and TCC - Ind. Temp. Range
• Atom™ x6414RE Quad Core @1.5GHz (no Turbo) 9W TDP w/ IBECC, IHS and TCC - Ind. Temp. Range
• Atom™ x6425RE Quad Core @1.9GHz (no Turbo) 12W TDP w/ IBECC, IHS and TCC - Ind. Temp. Range
• Atom™ x6427FE Quad Core @1.9GHz (no Turbo) 12W TDP w/ IBECC, IHS and TCC, FuSa Certified - Ind. Temp. Range
• Atom™ x6200FE Dual Core @1.0GHz (no Turbo) 4.5W TDP no Graphics w/ IBECC, IHS and TCC, FuSa Certified - Ind. Temp. Range
(*) IHS: Integrated Heatspreader; TCC: Time Coordinated Computing
(**) FuSa Certified: Atom™ SKUs compliant to IEC 61508 and ISO 13849 requirements for Functional Safety and Safety Integrity levels
Max Cores
4
Memory
32-bit LPDDR4x Soldered Down Memory
Up to 16GB Quad Channel with In-Band Error Correction Code (IBECC, Safety Related feature) supported
1GB or 2GB Single Channel, 4GB Dual Channel, 8GB or 16GB Quad Channel supported
Speed: 4267MT/s single rank (1GB / 2GB / 4GB / 8GB), 3733MT/s dual rank (16GB)
Graphics
Up to 3 independent displays
Integrated Gen11 UHD Graphics controller with up to 32 EU
4K HW decoding and encoding of HEVC (H.265), H.264, VP8/VP9, WMV9/VC1 (decoding only)
DirectX 12.1, OpenGL ES 3.1, OpenGL 4.5, OpenCL™ 1.2, Vulkan 1.0
Video Interfaces
eDP 1.3 or Dual Channel 18/24bit LVDS interface (factory options)
2 x DP++ 1.4 or 1x DP++ 1.4 and 1x HDMI 1.4 interfaces
Video Resolution
Up to 4096x2160 @60Hz
Mass Storage
1 x external S-ATA Gen3 Channel
SDIO interface
Optional eMMC 5.1 drive soldered on-board (Safety Related)
Networking
2x Gigabit Ethernet PHY with precision clock synchronization and synchronous Ethernet clock output for IEEE 1588 (Safety Related – Black channel)
Optional SERDES (SGMII) Interface for additional third Gigabit Ethernet (factory option, alternative to fourth PCI-e lane)
Usb
6 x USB 2.0 Host Ports
2 x USB 3.1 Gen2 Ports
Pci
Up to 4 x PCI-e Gen3 Lanes
Audio
HD Audio interface
Serial Ports
2 x HS-UARTs (Safety Related)
2 x UARTs
Other Interfaces
SM Bus
Power Management Signals
I2C Bus
1x SPI interface for boot
1x General Purpose SPI or eSPI (Factory Alternatives)
Power Supply
+5VDC and +3.3V_RTC
Operating System
Microsoft® Windows 10 Enterprise (64 bit)
Linux Yocto 64-bit
Operating Temperature
-40°C ÷ +85°C (Industrial version)*
*Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider applicationspecific
cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensions
50 x 82 mm
Produktvarianten / ZubehörRC93-M441-4021-C3_HALLEY (SM-C93) w/Intel® Pentium® J6426 (SKU2, QC up to 3.00 GHz, TDP 10W), 8GB RAM, 64GB eMMC, #4 PCIe x1 or #1 PCIe x4, LVDS, HDMI, DP++, TPM 2.0, GenPurp SPI, Comm.Temp.RC93-Q361-4021-I3SMARC 2.1 Elkhart Lake Atom SKU5 x6211E (1.5M Cache, up to 3.00 GHz), DC - TDP 6.0W, 4GB RAM, 32GB eMMC, 4x PCIe, LVDS + HDMI + DP++, TPM 2.0, GP SPI, Comm TempRC93-Q571-4021-I3SMARC® Rel. 2.1.1 Computer on Module (CoM) with Intel® Atom® x6000E Series and Intel® Pentium® and Celeron® N and J Series (formerly Elkhart Lake) Processors for FuSa applicationsRC93-R322-1021-I3HALLEY (SM-C93) w/ Intel Atom® x6413E (SKU6 ,QC @ 3.0GHz, TDP 9W), w/ IBECC 4GB RAM, 16GB eMMC, SERDES, eDP/DP++/DP++, TPM 2.0, GP SPI, Ind TempRC93-R471-3021-I3HALLEY (SM-C93) w/Intel® Atom® x6413E (SKU6, QC up to 3.00 GHz, TDP 9W), 8GB RAM, 64GB eMMC, #4 PCIe x1 or #1 PCIe x4, eDP, HDMI, DP++, TPM 2.0, GenPurp SPI, Ind.Temp.RC93-S471-4021-I3HALLEY (SM-C93) w/Intel Atom® x6425E (SKU7, QC up to 3.00 GHz, TDP 12W) w/IBECC 8GB RAM, 64GB eMMC, #4 PCIe x1 or #1 PCIe x4, LVDS, HDMI, DP++, TPM 2.0, GenPurp SPI, Ind. Temp.RC93-T361-2021-I3HALLEY (SM-C93) w/Intel Atom® x6212RE (SKU8, DC@1.20 GHz, TDP 6.0W), w/TCC and IBECC 4GB RAM, 32GB eMMC, #4 PCIe x1 or #1 PCIe x4, LVDS, 2x DP++, TPM 2.0, GenPurp SPI, Ind. Temp.RC93-V471-2021-I3HALLEY (SM-C93) w/Intel Atom® x6425RE (SKU10, QC@1.90 GHz, TDP 12W) w/TCC and IBECC 8GB RAM, 64GB eMMC, #4 PCIe x1 or #1 PCIe x4, LVDS, 2x DP++, TPM 2.0, GenPurp SPI, Ind. Temp.RC93-V471-4021-I3HALLEY (SM-C93) w/Intel Atom® x6425RE (SKU10, QC@1.90 GHz, TDP 12W) w/TCC and IBECC 8GB RAM, 64GB eMMC, #4 PCIe x1 or #1 PCIe x4, LVDS, HDMI, DP++, TPM 2.0, GenPurp SPI, Ind. Temp.RC93-V571-1021-I3HALLEY (SM-C93) w/Intel Atom® x6425RE (SKU10, QC@1.90 GHz, TDP 12W) w/TCC and IBECC 16GB RAM, 64GB eMMC, Opt #4 PCIE (w/ 1 x4),eDP, 2x DP++, TPM 2.0, GenPurp SPI, Ind. Temp.RC93-W471-4021-I3HALLEY (SM-C93) w/Intel Atom® x6427FE (SKU11, QC@1.90 GHz, TDP 12W) FuSa Certified, w/TCC and IBECC 8GB RAM, 64GB eMMC, LVDS, HDMI, DP++, #4 PCIe x1 or #1 PCIe x4, TPM 2.0, GenPurp SPI, Ind. Temp.RC93-W472-1022-I3HALLEY (SM-C93) w/Intel Atom® x6427FE (SKU11, QC@1.90 GHz, TDP 12W) FuSa Certified, w/TCC and IBECC 8GB RAM, 64GB eMMC, #3 PCIex1 and SERDES or #4 PCIe x1, TPM 2.0, eSPI, Ind. Temp.RC93-W571-4021-I3HALLEY (SM-C93) w/Intel Atom® x6427FE (SKU11, QC@1.90 GHz, TDP 12W) FuSa Certified, w/TCC and IBECC 16GB RAM, 64GB eMMC, LVDS, HDMI, DP++, #4 PCIe x1 or #1 PCIe x4, TPM 2.0, GenPurp SPI, Ind. Temp.RC93-Y361-0021-I3HALLEY (SM-C93) w/Intel Atom® x6200FE (SKU12, DC@1.00 GHz, TDP 4.5W),w/o Graphics, FuSa Certified, w/TCC and IBECC 4GB RAM, 32GB eMMC, headless, #4 PCIe x1 or #1 PCIe x4, TPM 2.0, GenPurp SPI, Ind. Temp.Bitte stellen Sie sicher, dass Sie stets die aktuellsten Version der Produktspezifikationen des Herstellers verwenden. Hersteller-Produktseite: SOM-SMARC-EHLMCTX Mobile & Embedded Computers GmbH IST UM DIE RICHTIGKEIT UND AKTUALITÄT DER DATEN AUF DIESER WEBSEITE BEMÜHT, ÜBERNIMMT JEDOCH KEINERLEI ZUSICHERUNG BEZÜGLICH DES INHALTS. EINE HAFTUNG ODER GARANTIE FÜR DIE AKTUALITÄT, RICHTIGKEIT UND VOLLSTÄNDIGKEIT DER ZUR VERFÜGUNG GESTELLTEN INFORMATIONEN IST FOLGLICH AUSGESCHLOSSEN.Technische Unterstützung & System Integration Services
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SECO
SOM-SMARC-ADL-N
SECO SOM-SMARC-ADL-N - SMARC CPU-Modul mit Intel® Alder Lake-N SMARC® Rel. 2.1 compliant Computer on Module (CoM) with Intel® Atom® processors x7000E Series, Intel® Core™ i3 processor, Intel® Processors N Series (Codename: Alder Lake N).
(FINLAY - E08)
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SECO SOM-SMARC-ADL-N - SMARC CPU-Modul mit Intel® Alder Lake-NSMARC® Rel. 2.1 compliant Computer on Module (CoM) with Intel® Atom® processors x7000E Series, Intel® Core™ i3 processor, Intel® Processors N Series (Codename: Alder Lake N).
(FINLAY - E08)
Datenblatt
System Integration
ÜbersichtKey FeaturesCPUIntel Atom processors x7000E Series, Intel Core i3 processor, Intel Processors N Series (Codename: Alder Lake N) targeted for IoT and multimedia applicationsIntegrated Intel UHD Graphics driven by Intel Xe architecture, supporting 3 independent displays each up to 4K resolution2 x NBase-T (2.5GbE supported), 2x USB 3.2 Gen 2, 6x USB 2.0, 4x PCI-e Gen3 lanes with optional SERDESQuad Channel LPDDR5 soldered down with IBECC
CPU Produktfamilie: Intel® Alder Lake-N
Intel® N97 (6M Cache, bis zu 3.60 GHz)Intel® N50 (6M Cache, bis zu 3.40 GHz)Intel® N200 (6M Cache, bis zu 3.70 GHz)Intel® Core™ i3-N305 (6M Cache, bis zu 3.80 GHz)CPU-Varianten
CPU
Intel® Core™ i3-N305
Intel® N97
Intel® N50
Intel® N200
Processor Number
i3-N305
N97
N50
N200
Cache
6 MB Intel® Smart Cache
6 MB Intel® Smart Cache
6 MB
6 MB Intel® Smart Cache
Max Turbo Frequency
3.80 GHz
3.60 GHz
3.40 GHz
3.70 GHz
Total Cores
8
4
2
4
Total Threads
8
4
Spezifikation
Description
SMARC® Rel. 2.1 compliant Computer on Module (CoM) with Intel® Atom® processors x7000E Series, Intel® Core™ i3 processor, Intel® Processors N Series (Codename: Alder Lake N)
Cpu
Intel® Atom® processors x7000E Series, Intel® Core™ i3 processor and Intel® Processors N Series (Codename: Alder Lake N):
· Intel® Atom® x7213E, 2 Cores @1.7 GHz (3.2 GHz Turbo), 10W TDP, with TSN and TCC*
· Intel® Atom® x7425E, 4 Cores @1.5 GHz (3.4 GHz Turbo), 12W TDP, with TSN and TCC*
· Intel® Atom® x7211E, 2 Cores @1.0 GHz (3.2 GHz Turbo), 6W TDP, with TSN and TCC*
· Intel® Core™ i3-N305, 8 Cores @1.8 GHz (3.8 GHz Turbo), 15W TDP
· Intel® Processor N200, 4 Cores @1.0 GHz (3.7 GHz Turbo), 6W TDP
· Intel® Processor N97, 4 Cores @2.0 GHz (3.6 GHz Turbo), 12W TDP
· Intel® Processor N50, 2 Cores @1 GHz (3.4 GHz Turbo), 6W TDP
* Time Sensitive Network and Time Coordinate Computing
Memory
Up to 16GB LPDDR5-4800 soldered down memory with IBECC (in-band error correction code)
Graphics
Integrated Intel® UHD Graphics driven by Intel® Xe architecture:
Intel® Atom® x7213E processors with 16 Execution Units
Intel® Atom® x7425E processors with 24 Execution Units
Intel® Atom® x7211E processors with 16 Execution Units
Intel® Core™ i3-N305 processors with 32 Execution Units
Intel® Processor N200 with 32 Execution Units
Intel® Processor N97 with 24 Execution Units
Intel® Processor N50 with 16 Execution Units
AVX256 & VNNI support for faster AI inference and media transcoding
Support with up to 3 independent 4K60 SDR displays
Video Interfaces
Integrated Intel® UHD Graphics driven by Intel® Xe architecture, supporting 3 independent displays each up to 4K resolution
Video Resolution
Up to 4096x2160 @60Hz
Mass Storage
1x external S-ATA Gen3.2 channel
Optional eMMC 5.1 drive soldered on-board
Networking
2x NBase-T Ethernet ports (2.5GbE supported) with Time-Sensitive Networking functionality, implemented using as many Intel® i225 Gigabit Ethernet controllers, managed by two integrated PCH PCI-e ports
Optional SERDES (SGMII) interface for additional third Gigabit Ethernet (factory option, alternative to fourth PCI-e lane)
Usb
6x USB 2.0 host ports
2x USB 3.2 Gen2 ports
Pci
4x PCIe Gen3 lanes
Possible channel aggregations:
4 ports x1 lanes (4x1)
1 port x2 lanes + 2 ports x1 lane (1x2 + 2x1) or SERDES in place of fourth PCIe lane
Audio
HD Audio and Soundwire/i2S Audio interfaces
Serial Ports
2x UARTs
2x HS-UARTs
Other Interfaces
Up to 14x GPIOs
SM bus
I2C bus
1x SPI interface for boot
1x General Purpose SPI or eSPI (factory alternatives)
Power management signals, watchdog
Power Supply
+5VDC and +3VDC for RTC
Operating System
Microsoft® Windows 10
Linux Kernel LTS
Operating Temperature
0°C to +60°C (Commercial version) *
*Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature depends on the application, enclosure, and/or environment. It is the customer’s responsibility to implement an application-specific cooling solution for the customer’s system that keeps the heat spreader temperature in the range indicated.
Dimensions
50 x 82 mm
Produktvarianten / ZubehörBitte stellen Sie sicher, dass Sie stets die aktuellsten Version der Produktspezifikationen des Herstellers verwenden. Hersteller-Produktseite: SOM-SMARC-ADL-NMCTX Mobile & Embedded Computers GmbH IST UM DIE RICHTIGKEIT UND AKTUALITÄT DER DATEN AUF DIESER WEBSEITE BEMÜHT, ÜBERNIMMT JEDOCH KEINERLEI ZUSICHERUNG BEZÜGLICH DES INHALTS. EINE HAFTUNG ODER GARANTIE FÜR DIE AKTUALITÄT, RICHTIGKEIT UND VOLLSTÄNDIGKEIT DER ZUR VERFÜGUNG GESTELLTEN INFORMATIONEN IST FOLGLICH AUSGESCHLOSSEN.Technische Unterstützung & System Integration Services
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Preis auf Anfrage