COM Express®
SECO
SOM-COMe-CT6-WHL-U
SECO SOM-COMe-CT6-WHL-U - COM Express CPU-Modul mit Intel® Whiskey Lake COM Express® Rel. 3.0 Compact Type 6 Computer on Module (CoM) with 8th Gen Intel® Core™ and Celeron™ U-series (Codename: Whiskey Lake-U) Processors.
(LARISSA - C55)
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SECO SOM-COMe-CT6-WHL-U - COM Express CPU-Modul mit Intel® Whiskey LakeCOM Express® Rel. 3.0 Compact Type 6 Computer on Module (CoM) with 8th Gen Intel® Core™ and Celeron™ U-series (Codename: Whiskey Lake-U) Processors.
(LARISSA - C55)
Datenblatt
Handbuch
System Integration
ÜbersichtKey FeaturesCPU8th Gen Intel Core and Celeron 4000 series processors (formerly Whiskey Lake) with 15W TDPIntel UHD Graphics 620/6104 x USB 3.1, 8 x USB 2.0, up to 8 x PCI-e x 1Two DDR4 SO-DIMM Slots supporting DDR4-2400 Memory, up to 64GB
CPU Produktfamilie: Intel® Whiskey Lake
Intel® Core™ i7-8665UE (8M Cache, bis zu 4.40 GHz)Intel® Core™ i5-8365UE (6M Cache, bis zu 4.10 GHz)Intel® Core™ i3-8145UE (4M Cache, bis zu 3.90 GHz)Intel® Celeron® 4305UE (2M Cache, 2.00 GHz)CPU-Varianten
CPU
Intel® Core™ i7-8665UE
Intel® Core™ i5-8365UE
Intel® Core™ i3-8145UE
Intel® Celeron® 4305UE
Processor Number
i7-8665UE
i5-8365UE
i3-8145UE
4305UE
Cache
8 MB Intel® Smart Cache
6 MB Intel® Smart Cache
4 MB Intel® Smart Cache
2 MB Intel® Smart Cache
Total Cores
4
4
2
2
Total Threads
8
8
4
2
PCI Express Revision
3.0
3.0
3.0
3.0
Max Turbo Frequency
4.40 GHz
4.10 GHz
3.90 GHz
Spezifikation
Description
Low power multi-core Intel® architecture for mobile applications
Cpu
Intel® Core™ i7-8665UE, Quad Core @ 1.7GHz (Turbo Boost 4.4GHz) with HT, 8MB Cache, 15W TDP (12.5W..25W cTDP)
Intel® Core™ i5-8365UE, Quad Core @ 1.6GHz (Turbo Boost 4.1GHz) with HT, 6MB Cache, 15W TDP (12.5W..25W cTDP)
Intel® Core™ i3-8145UE, Dual Core @ 2.2GHz (Turbo Boost 3.9GHz) with HT, 4MB Cache, 15W TDP (12.5W..25W cTDP)
Intel® Celeron® 4305UE, Dual Core @ 2.0GHz, 2MB Cache, 15W TDP
Max Cores
4
Memory
Two DDR4 SO-DIMM Slots supporting DDR4-2400 Memory, up to 64GB
Graphics
Intel® UHD Graphics 620 (Core™ processors), 610 (Celeron™ processor)
Up to 3 independent display supported
DirectX 12, OpenGL 4.5, and OpenCL 2.1 support
HW accelerated video decode MPEG2, VC1/WMV9, AVC/H.264,
VP8, JPEG/MJPEG, HEVC/H.265 (8 and 10 bits), VP9
HW accelerated video encode MPEG2, AVC/H.264, VP8, JPEG,
HEVC/H.265, VP9
Video Interfaces
Up to 2 x Digital Display Interfaces (DDIs), supporting DP 1.2, eDP 1.4, HDMI 1.4 and DVI
eDP or Single/Dual-Channel 18-/24- bit LVDS interface
Optional VGA interface (excludes DDI port #2)
Video Resolution
eDP, DP: up to 4096 x 2304 @60Hz
HDMI: up to 4096 x 2160 @30Hz
LVDS: up to 1920 x 1200 @ 60Hz
VGA: up to 2048 x 1536 @ 50Hz (reduced blanking)
Mass Storage
Up to 3 x S-ATA Gen3 Channels
Optional eMMC 5.1 drive on-board
microSD Card slot on-board
Networking
Gigabit Ethernet interface
Intel® I219-LM GbE Controller
Usb
4 x USB 3.1 Host ports
8 x USB 2.0 Host ports
Pci
Up to 8 x PCI-e x 1 lanes
Optional PCI-express Graphics (PEG) x2 or x4
Possible configurations (factory alternative):
• 8 ports PCI-e x1
• 6 ports PCI-e x 1 + PEG x2
• 5 ports PCI-e x 1 + PEG x4
• 4 ports PCI-e x 1 + PEG x4 + 3rd SATA
Audio
HD Audio Interface
Serial Ports
2 x UARTs
Other Interfaces
SPI, I2C, SM Bus, LPC bus, FAN management
Optional TPM 2.0 module on-board
LID#/SLEEP#/PWRBTN#, Watchdog
4x GPI, 4 x GPO
Power Supply
+12VDC ± 10% and + 5VSB (optional)
Operating System
Microsoft Windows 10 Enterprise / IoT
Linux
Yocto
Operating Temperature
0°C ÷ +60 °C (Commercial version)
*Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensions
95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout)
Produktvarianten / ZubehörMC55-3001-6120-C0-VCOMe-C55 w/Intel Whiskey Lake U i7-8665UE Quad Core @ 1.8GHz, 8MB Cache, 15W TDP, 8 PCIE + 0 PEG + 2 SATA, EDP, DP su DDI2, TPMSLB 9670, 3wire FAN, Comm.Temp.MC55-4003-2010-C0-VCOM Express Type 6 - COMe-C55 w/ Intel® Whiskey Lake U Celeron 4305UE Dual Core, 5 PCIE + 4 PEG + 2 SATA, LVDS, 4wire Fan, CommTempMC55-4003-7020-C0-VCOM Express Type 6 - COMe-C55 w/ Intel® Whiskey Lake U 4305UE Dual Core @ 2.2GHz, 5 PCIE + 4 PEG + 2 SATA, LVDS + VGA, 3wire FAN, Comm Temp.Bitte stellen Sie sicher, dass Sie stets die aktuellsten Version der Produktspezifikationen des Herstellers verwenden. Hersteller-Produktseite: SOM-COMe-CT6-WHL-UMCTX Mobile & Embedded Computers GmbH IST UM DIE RICHTIGKEIT UND AKTUALITÄT DER DATEN AUF DIESER WEBSEITE BEMÜHT, ÜBERNIMMT JEDOCH KEINERLEI ZUSICHERUNG BEZÜGLICH DES INHALTS. EINE HAFTUNG ODER GARANTIE FÜR DIE AKTUALITÄT, RICHTIGKEIT UND VOLLSTÄNDIGKEIT DER ZUR VERFÜGUNG GESTELLTEN INFORMATIONEN IST FOLGLICH AUSGESCHLOSSEN.Technische Unterstützung & System Integration Services
Alle Dokumente auf dieser Seite werden ohne Benachrichtigung aktualisiert.DatenblattHandbuch
Preis auf Anfrage
SECO
SOM-COMe-CT6-V2000
SECO SOM-COMe-CT6-V2000 - COM Express CPU-Modul COM Express® 3.0 Type 6 Compact Computer on Module (CoM) with AMD Ryzen™ Embedded V2000 SoCs.
(OPHELIA - D21)
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SECO SOM-COMe-CT6-V2000 - COM Express CPU-ModulCOM Express® 3.0 Type 6 Compact Computer on Module (CoM) with AMD Ryzen™ Embedded V2000 SoCs.
(OPHELIA - D21)
Datenblatt
System Integration
ÜbersichtKey FeaturesCPUEmbedded Ryzen V-Series V2000 FP6 Platform with Zen2 CPU and Radeon GPU CoresIntegrated AMD Radeon GPU with up to 7 Compute Units1x GbE, 1x SuperSpeed USB 10Gbps, 3x SuperSpeed USB 5Gbps, 8x USB 2.0, 8x PCI-e x1 Gen3, PEG x8 Gen3Two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC and non-ECC Memory, up to 64GBAMD Ryzen™ Embedded V2748 with AMD Radeon™ Graphics with 7CU, Eight Core Dual Thread @ 2.9GHz (4.15 Boost), TDP 35-54W AMD Ryzen™ Embedded V2718 with AMD Radeon™ Graphics with 7CU, Eight Core Dual Thread @ 1.7GHz (4.15 Boost), TDP 10-25W AMD Ryzen™ Embedded V2546 with AMD Radeon™ Graphics with 6 CU, Six Core Dual Thread @ 3GHz (3.95 Boost), TDP 35-54W AMD Ryzen™ Embedded V2516 with AMD Radeon™ Graphics with 6 CU, Six Core Dual Thread @ 2.1GHz (3.95 Boost), TDP 10-25W Spezifikation
Description
COM Express® 3.0 Type 6 Compact Computer on Module (CoM) with AMD Ryzen™ Embedded V2000 SoCs
Cpu
AMD Ryzen™ Embedded V2748 with AMD Radeon™ Graphics with 7CU, Eight Core Dual Thread @ 2.9GHz (4.15 Boost), TDP 35-54W
AMD Ryzen™ Embedded V2718 with AMD Radeon™ Graphics with 7CU, Eight Core Dual Thread @ 1.7GHz (4.15 Boost), TDP 10-25W
AMD Ryzen™ Embedded V2546 with AMD Radeon™ Graphics with 6 CU, Six Core Dual Thread @ 3GHz (3.95 Boost), TDP 35-54W
AMD Ryzen™ Embedded V2516 with AMD Radeon™ Graphics with 6 CU, Six Core Dual Thread @ 2.1GHz (3.95 Boost), TDP 10-25W
Max Cores
8
Memory
Two DDR4 SO-DIMM Slots supporting DDR4-3200, ECC and non- ECC modules
Memory, up to 64GB
Graphics
AMD Radeon™ Graphics GPU with up to 7 Compute Units
Up to 4 independent displays supported
Support DirectX 12, OpenGL 4.6, OpenCL 2.1 and Vulkan
HW accelerated Video Decode VP9 (8 and 10 bits), H.264/AVC (8bits), H.265/HEVC (8 and 10
bits), JPEG
HW accelerated Video Encode H.264/AVC (8bits), H.265/HEVC (8 and 10 bits), JPEG
Video Interfaces
Up to 3 x Digital Display Interfaces (DDIs), supporting DVI, DP 1.4, HDMI 2.1
1 x eDP 1.3 or Single/Dual-Channel 18-/24-bit LVDS interface
Video Resolution
eDP, DP up to 4096x2160 @60Hz 10b with DSC 1.2 (HBR3)
HDMI up to 4096x2160 @ 60Hz
LVDS up to 1920x1200 @ 60Hz
Mass Storage
2 x S-ATA Gen3 Channels
Networking
Gigabit Ethernet interface with Intel® I21x GbE Controller
Optional M.2 1216 WiFi 802.11ac and BTLE 5.0 on-board
Usb
1 x SuperSpeed USB 10Gbps Host ports
3 x SuperSpeed USB 5Gbps Host ports
8 x 2.0 Host ports
Pci
8 x PCI-e x1 Gen3 lanes
PCI-express Graphics (PEG) x8 Gen3
Audio
HD Audio interface
Serial Ports
2 x UARTs
Other Interfaces
SPI, I2C, SM Bus, Thermal Management, FAN management
LPC bus
Optional TPM 2.0 on-board
LID#/SLEEP#/PWRBTN#, Watchdog
4 x GPI, 4 x GPO
Power Supply
+12VDC ± 10%, +5VSB (optional), +3VRTC (optional)
Operating System
Microsoft® Windows 10
Linux
Operating Temperature
0°C ÷ +60°C (Commercial version)*
* Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will depend on the application, enclosure, and/or environment. Each customer must consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensions
95 x 95 mm (COM Express® Compact Form factor, Type 6 pinout)
Produktvarianten / ZubehörBitte stellen Sie sicher, dass Sie stets die aktuellsten Version der Produktspezifikationen des Herstellers verwenden. Hersteller-Produktseite: SOM-COMe-CT6-V2000MCTX Mobile & Embedded Computers GmbH IST UM DIE RICHTIGKEIT UND AKTUALITÄT DER DATEN AUF DIESER WEBSEITE BEMÜHT, ÜBERNIMMT JEDOCH KEINERLEI ZUSICHERUNG BEZÜGLICH DES INHALTS. EINE HAFTUNG ODER GARANTIE FÜR DIE AKTUALITÄT, RICHTIGKEIT UND VOLLSTÄNDIGKEIT DER ZUR VERFÜGUNG GESTELLTEN INFORMATIONEN IST FOLGLICH AUSGESCHLOSSEN.Technische Unterstützung & System Integration Services
Alle Dokumente auf dieser Seite werden ohne Benachrichtigung aktualisiert.Datenblatt
Preis auf Anfrage
SECO
SOM-COMe-CT6-V1000
SECO SOM-COMe-CT6-V1000 - COM Express CPU-Modul SOM-COMe-CT6-V1000 is a COM Express® Compact Type 6 Computer on Module (CoM) with the AMD Ryzen™ Embedded V1000 processors designed by SECO mounting up to 4 Zen x86 CPU cores with the latest Radeon graphics and I/O controller on a single chip. It comes
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SECO SOM-COMe-CT6-V1000 - COM Express CPU-ModulSOM-COMe-CT6-V1000 is a COM Express® Compact Type 6 Computer on Module (CoM) with the AMD Ryzen™ Embedded V1000 processors designed by SECO mounting up to 4 Zen x86 CPU cores with the latest Radeon graphics and I/O controller on a single chip. It comes
Datenblatt
Handbuch
System Integration
ÜbersichtKey FeaturesCPUAMD Ryzen Embedded V1000 processorsAMD Radeon Vega GPU with up to 11 Compute Units DirectX 12 supported4x USB 3.0, 8x USB 2.0, 4x PCI-e x1 Gen 3, PEG x8 Gen3Up to two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC MemoryAMD Ryzen™ Embedded V1807B with AMD Radeon™ Vega 11 Graphics, Quad Core Dual Thread @ 3.35GHz (3.8 Boost), TDP 35-54W AMD Ryzen™ Embedded V1756B with AMD Radeon™ Vega 8 Graphics, Quad Core Dual Thread @ 3.25GHz (3.6 Boost), TDP 35-54W AMD Ryzen™ Embedded V1605B with AMD Radeon™ Vega 8 Graphics, Quad Core Dual Thread @ 2.0GHz (3.6 Boost), TDP 12-25W AMD Ryzen™ Embedded V1202B with AMD Radeon™ Vega 3 Graphics, Dual Core Dual Thread @ 2.3GHz (3.2 Boost), TDP 12-25W AMD Ryzen™ Embedded V1404I with AMD Radeon™ Vega 8 Graphics, Quad Core / Single Thread, TDP 15W ,Industrial Temperature range Spezifikation
Description
SOM-COMe-CT6-V1000 is a COM Express® Compact Type 6 Computer on Module (CoM) with the AMD Ryzen™ Embedded V1000 processors designed by SECO mounting up to 4 Zen x86 CPU cores with the latest Radeon graphics and I/O controller on a single chip. It comes with up to two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC Memory, a wide range of expansion ports, PCI-Express, Serial Ports, networking and video interfaces, all of which makes it an ideal solution for medical devices, digital signage, and gaming.
Cpu
AMD Ryzen™ Embedded V1807B with AMD Radeon™ Vega 11 Graphics, Quad Core Dual Thread @ 3.35GHz (3.8 Boost), TDP 35-54W
AMD Ryzen™ Embedded V1756B with AMD Radeon™ Vega 8 Graphics, Quad Core Dual Thread @ 3.25GHz (3.6 Boost), TDP 35-54W
AMD Ryzen™ Embedded V1605B with AMD Radeon™ Vega 8 Graphics, Quad Core Dual Thread @ 2.0GHz (3.6 Boost), TDP 12-25W
AMD Ryzen™ Embedded V1202B with AMD Radeon™ Vega 3 Graphics, Dual Core Dual Thread @ 2.3GHz (3.2 Boost), TDP 12-25W
AMD Ryzen™ Embedded V1404I with AMD Radeon™ Vega 8 Graphics, Quad Core / Single Thread, TDP 15W ,Industrial Temperature range
Max Cores
4
Memory
Up to two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC and non- ECC Memory modules (DDR4-2400 with V1605B, V1202B and V1404I)
Up to 16GB @ 3200Mhz, up to 32GB @ 2400MHz supported
Graphics
AMD Radeon™ Vega GPU with up to 11 Compute Units
DirectX® 12 supported
H.265 (10-bit) decode and 8-bit video encode
VP9 decode
4 independent displays supported
Video Interfaces
3 x Digital Display Interfaces (DDIs), supporting DP 1.3, DVI and HDMI 1.4/2.0
eDP or Single/Dual-Channel 18-/24- bit LVDS interface
Video Resolution
DDIs, eDP: up to 4K
LVDS: up to 1920 x 1200
Mass Storage
2 x S-ATA Gen3 Channels
Networking
Gigabit Ethernet interface
Intel® I21x family GbE Controller
Usb
4 x USB 3.0 Host ports
8 x USB 2.0 Host ports
Pci
Up to 4x PCI-e x1 Gen3 lanes + 2 x PCI-e x1 Gen2 ports
PCI-express Graphics (PEG) x 8 Gen3
Audio
HD Audio Interface
Serial Ports
2 x UARTs
Other Interfaces
SPI, I2C bus, SM Bus, LPC bus, FAN management
LID#/SLEEP#/PWRBTN#, Watchdog
4x GPI, 4 x GPO
Optional TPM 1.2 module on-board
Power Supply
+12VDC ± 10% and + 5VSB (optional)
Operating System
Microsoft® Windows 10
Linux
Operating Temperature
0°C ÷ +60 °C (Commercial version)
-40°C ÷ +85°C (Industrial version)
*Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensions
95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout)
Produktvarianten / ZubehörMB75-4001-2111-C1-VCOMe-B75-CT6 w/AMD Ryzen Embedded V1605B @ 2.0GHz - Ethernet Contr. I211 - EDP Port - HUB - Packet Switch - Comm. TempMB75-6001-2111-C1-VCOMe-B75-CT6 w/AMD Ryzen Embedded V1807B @ 3.35GHz - Ethernet Contr. I211 - EDP Port - HUB - Packet Switch - Comm. TempMB75-9001-1211-I1-VCOMe-B75-CT6 w/AMD Ryzen Embedded V1404I @ 2GHz - Packet Switch - Ethernet Contr. I210 - EDP Port - HUB - TPM - Ind. TempBitte stellen Sie sicher, dass Sie stets die aktuellsten Version der Produktspezifikationen des Herstellers verwenden. Hersteller-Produktseite: SOM-COMe-CT6-V1000MCTX Mobile & Embedded Computers GmbH IST UM DIE RICHTIGKEIT UND AKTUALITÄT DER DATEN AUF DIESER WEBSEITE BEMÜHT, ÜBERNIMMT JEDOCH KEINERLEI ZUSICHERUNG BEZÜGLICH DES INHALTS. EINE HAFTUNG ODER GARANTIE FÜR DIE AKTUALITÄT, RICHTIGKEIT UND VOLLSTÄNDIGKEIT DER ZUR VERFÜGUNG GESTELLTEN INFORMATIONEN IST FOLGLICH AUSGESCHLOSSEN.Technische Unterstützung & System Integration Services
Alle Dokumente auf dieser Seite werden ohne Benachrichtigung aktualisiert.DatenblattHandbuch
Preis auf Anfrage
SECO
SOM-COMe-CT6-TGL-U
SECO SOM-COMe-CT6-TGL-U - COM Express CPU-Modul mit Intel® Tiger Lake COM Express® Rel. 3.0 Compact Type 6 Computer on Module (CoM) with 11th Gen Intel® Core™ (Codename: Tiger Lake UP3) Processors.
(CALYPSO - D40)
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SECO SOM-COMe-CT6-TGL-U - COM Express CPU-Modul mit Intel® Tiger LakeCOM Express® Rel. 3.0 Compact Type 6 Computer on Module (CoM) with 11th Gen Intel® Core™ (Codename: Tiger Lake UP3) Processors.
(CALYPSO - D40)
Datenblatt
Handbuch
System Integration
ÜbersichtKey FeaturesCPUIntel Core Series (formerly Tiger Lake UP3) ProcessorsIntegrated Intel Iris Xe Graphics, up to 96 Execution Units1x GbE, 4x SuperSpeed USB 5Gbps, 8x USB 2.0, 8x PCI-e x1 Gen3, PEG x4 Gen4Two DDR4 SO-DIMM Slots supporting DDR4-3200 IBECC memory, up to 64GB
CPU Produktfamilie: Intel® Tiger Lake
Intel® Core™ i7-1185GRE (12M Cache, bis zu 4.40 GHz)Intel® Core™ i7-1185G7E (12M Cache, bis zu 4.40 GHz)Intel® Core™ i5-1145GRE (8M Cache, bis zu 4.10 GHz)Intel® Core™ i5-1145G7E (8M Cache, bis zu 4.10 GHz)Intel® Core™ i3-1115GRE (6M Cache, bis zu 3.90 GHz)Intel® Core™ i3-1115G4E (6M Cache, bis zu 3.90 GHz)CPU-Varianten
CPU
Processor Number
Cache
Max Turbo Frequency
Total Cores
Total Threads
Intel® Core™ i7-1185GRE
i7-1185GRE
12 MB Intel® Smart Cache
4.40 GHz
4
8
Intel® Core™ i7-1185G7E
i7-1185G7E
12 MB Intel® Smart Cache
4.40 GHz
4
8
Intel® Core™ i5-1145GRE
i5-1145GRE
8 MB Intel® Smart Cache
4.10 GHz
4
8
Intel® Core™ i5-1145G7E
i5-1145G7E
8 MB Intel® Smart Cache
4.10 GHz
4
8
Intel® Core™ i3-1115GRE
i3-1115GRE
6 MB Intel® Smart Cache
3.90 GHz
2
4
Intel® Core™ i3-1115G4E
i3-1115G4E
6 MB Intel® Smart Cache
3.90 GHz
2
4
Spezifikation
Description
COM Express® Rel. 3.0 Compact Type 6 Computer on Module (CoM) with 11th Gen Intel® Core™ (formerly Tiger Lake UP3) Processors
Cpu
Intel® Core™ i7-1185G7E, Quad Core @2.8GHz (4.4GHz Turbo Boost), 12MB Cache, 28W TDP (12W cTDP), with Hyperthreading
Intel® Core™ i5-1145G7E, Quad Core @2.6GHz (4.1GHz Turbo Boost), 8MB Cache, 28W TDP (12W cTDP), with Hyperthreading
Intel® Core™ i3-1115G4E, Dual Core @3.0GHz (3.9GHz Turbo Boost), 6MB Cache, 28W TDP (12W cTDP), with Hyperthreading
Intel® Core™ i7-1185GRE, Quad Core @2.8GHz (4.4GHz Turbo Boost), 12MB Cache, with IBECC, 28W TDP (12W cTDP), with Hyperthreading - Industrial
Intel® Core™ i5-1145GRE, Quad Core @2.6GHz (4.1GHz Turbo Boost), 8MB Cache, with IBECC, 28W TDP (12W cTDP), with Hyperthreading - Industrial
Intel® Core™ i3-1115GRE, Dual Core @3.0GHz (3.9GHz Turbo Boost), 6MB Cache, with IBECC, 28W TDP (12W cTDP), with Hyperthreading - Industrial
Memory
Two DDR4 SO-DIMM slots supporting DDR4-3200 memory, up to 64GB
IBECC DDR4 memory modules supported only with Intel® Core™ Industrial SoCs
Graphics
Intel® Iris® Xe Graphics, up to 96 Execution Units Up to 4 independent displays supported
Support DirectX 12, OpenGL 4.6, OpenCL 3.0 and Vulkan 1.2 HW accelerated video decode AVC/H.264, HEVC/H.265, VP81, VP9, AV1
HW accelerated video encode AVC/H.264, HEVC/H.265, VP81, VP9
Video Interfaces
Up to 3x Digital Display Interfaces (DDIs), supporting DP 1.2, eDP 1.4, HDMI 1.4, DVI
1 x eDP 1.4 or Single/Dual-Channel 18-/24-bit LVDS interface 1 x VGA interface
Video Resolution
eDP, DP: up to 5120x3200 @60Hz 24bpp / 7680x4320 @60Hz 30bpp with DSC
HDMI: up to 4096x2160 @24Hz, 24bpp
LVDS: up to 1920x1200 @60Hz
VGA: up to 2048 x 1536 @50Hz
Mass Storage
2x SATA Gen3 channels
2x PCI-e x4 ports available for M.2 NVMe drives
Networking
Gigabit Ethernet interface
Intel® I225 GbE controller
Usb
4x SuperSpeed USB 5Gbps host ports
8x USB 2.0 Host ports
Pci
8x PCI-e x1 Gen3 lanes
PCI-express Graphics (PEG) x4 Gen4
Audio
HD audio interface
Serial Ports
2x UARTs
Other Interfaces
SPI, I2C, SM bus, thermal management, FAN management
LPC bus
Optional TPM 2.0 on-board
LID#/SLEEP#/PWRBTN#, Watchdog
4x GPI, 4x GPO
Power Supply
+12VDC ± 10%, +5VSB (optional), +3VRTC (optional)
Operating System
Microsoft® Windows 10
Microsoft® Windows 10 IoT Core
Linux
Operating Temperature
0°C ÷ +60°C (Commercial)
-40°C ÷ +85°C (Industrial)
Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider applicationspecific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensions
95 x 95 mm (COM Express® Compact Form factor, Type 6
pinout)
Produktvarianten / ZubehörBitte stellen Sie sicher, dass Sie stets die aktuellsten Version der Produktspezifikationen des Herstellers verwenden. Hersteller-Produktseite: SOM-COMe-CT6-TGL-UMCTX Mobile & Embedded Computers GmbH IST UM DIE RICHTIGKEIT UND AKTUALITÄT DER DATEN AUF DIESER WEBSEITE BEMÜHT, ÜBERNIMMT JEDOCH KEINERLEI ZUSICHERUNG BEZÜGLICH DES INHALTS. EINE HAFTUNG ODER GARANTIE FÜR DIE AKTUALITÄT, RICHTIGKEIT UND VOLLSTÄNDIGKEIT DER ZUR VERFÜGUNG GESTELLTEN INFORMATIONEN IST FOLGLICH AUSGESCHLOSSEN.Technische Unterstützung & System Integration Services
Alle Dokumente auf dieser Seite werden ohne Benachrichtigung aktualisiert.DatenblattHandbuch
Preis auf Anfrage
SECO
SOM-COMe-CT6-R1000
SECO SOM-COMe-CT6-R1000 - COM Express CPU-Modul COM Express® Rel. 3.0 Compact Type 6 Computer on Module (CoM) with AMD Ryzen™ Embedded R1000 family of SoCs.
(METIS - C89)
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SECO SOM-COMe-CT6-R1000 - COM Express CPU-ModulCOM Express® Rel. 3.0 Compact Type 6 Computer on Module (CoM) with AMD Ryzen™ Embedded R1000 family of SoCs.
(METIS - C89)
Datenblatt
Handbuch
System Integration
ÜbersichtKey FeaturesCPUAMD Ryzen Embedded R1000 processorsAMD Radeon Vega GPU with 3 Compute Units4x USB 3.0, 8x USB 2.0, Up to 5x PCI-e x1, PEG x4 Gen3Two DDR4 SO-DIMM Slots supporting DDR4-2400 ECC MemoryAMD Ryzen™ Embedded R1606G with GPU AMD Radeon™ Vega 3, Dual Core Four Thread @ 2.6GHz (3.5 Boost), TDP 12-25W AMD Ryzen™ Embedded R1505G with GPU AMD Radeon™ Vega 3, Dual Core Four Thread @ 2.4GHz (3.3 Boost), TDP 12-25W AMD Ryzen™ Embedded R1305G with GPU AMD Radeon™ Vega 3, Dual Core Four Thread @ 1.5GHz (2.8 Boost), TDP 8-10W Spezifikation
Description
Low-end AMD Ryzen® on COM Express® Type 6 Compact Computer on Module (CoM)
Cpu
AMD Ryzen™ Embedded R1606G with GPU AMD Radeon™ Vega 3, Dual Core Four Thread @ 2.6GHz (3.5 Boost), TDP 12-25W
AMD Ryzen™ Embedded R1505G with GPU AMD Radeon™ Vega 3, Dual Core Four Thread @ 2.4GHz (3.3 Boost), TDP 12-25W
AMD Ryzen™ Embedded R1305G with GPU AMD Radeon™ Vega 3, Dual Core Four Thread @ 1.5GHz (2.8 Boost), TDP 8-10W
Max Cores
2
Memory
Two DDR4 SO-DIMM Slots supporting DDR4-2400 Memory, up to 32GB
Graphics
AMD Radeon™ Vega 3 GPU with 3 Compute Units
DirectX® 12 supported
H.265 (10-bit) decode and 8-bit video encode
VP9 decode
3 independent displays supported
Video Interfaces
Up to 3 x Digital Display Interfaces (DDIs), supporting DP 1.3, DVI and HDMI 1.4/2.0I
eDP or Single/Dual-Channel 18-/24- bit LVDS interface (factory alternatives to third DDI port)
Video Resolution
DDIs, eDP: up to 4K
LVDS: up to 1920 x 1200 @ 60Hz
Mass Storage
2 x S-ATA Gen3 Channels
Networking
Gigabit Ethernet interface
Intel® I21x family GbE Controller
Usb
Up to 4 x USB 3.0 Host ports
8 x USB 2.0 Host ports
Pci
2 x PCI-e x1 Gen3 lanes
Additional 3rd PCI-e x1 Gen3 lane or 3x PCI-e x1 Gen2 lanes (factory alternatives)
PCI-express Graphics (PEG) x4
Audio
HD Audio Interface
Serial Ports
2 x UARTs
Other Interfaces
SPI, I2C, SM Bus, LPC bus, FAN management
Optional TPM 2.0 module on-board
4x GPI, 4 x GPO
Power Supply
+12VDC ± 10% and +5VSB (optional)
Operating System
Windows 10 64-bit
Linux
Operating Temperature
0°C ÷ +60 °C (Commercial version)
-40°C ÷ +85°C (Industrial version)
*Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensions
95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout)
Produktvarianten / ZubehörMC89-1002-2211-C0-VCOMe-C89-CT6 w/AMD Ryzen Embedded R1606G @2.6GHz 15W, GbE I211, 2x DDI & LVDS, TPM1.2, 4xUSB3.0, 2x PCIe Gen3 & 3x PCIe Gen2 - Comm. TempMC89-2002-2211-C0-VCOMe-C89-CT6 w/AMD Ryzen Embedded R1505G @ 2.4GHz 15W, GbE I211, 2x DDI & LVDS, TPM1.2, 4xUSB3.0, 2x PCIe Gen3 & 3x PCIe Gen2 -Comm. TempMC89-3002-2222-C0-VCOMe-C89-CT6 w/AMD Ryzen Embedded R1305G @ 1.5GHz 8W, GbE I211, 2x DDI & LVDS, TPM1.2, 2xUSB3.0, 3x PCIe Gen3 - Comm. TempBitte stellen Sie sicher, dass Sie stets die aktuellsten Version der Produktspezifikationen des Herstellers verwenden. Hersteller-Produktseite: SOM-COMe-CT6-R1000MCTX Mobile & Embedded Computers GmbH IST UM DIE RICHTIGKEIT UND AKTUALITÄT DER DATEN AUF DIESER WEBSEITE BEMÜHT, ÜBERNIMMT JEDOCH KEINERLEI ZUSICHERUNG BEZÜGLICH DES INHALTS. EINE HAFTUNG ODER GARANTIE FÜR DIE AKTUALITÄT, RICHTIGKEIT UND VOLLSTÄNDIGKEIT DER ZUR VERFÜGUNG GESTELLTEN INFORMATIONEN IST FOLGLICH AUSGESCHLOSSEN.Technische Unterstützung & System Integration Services
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Preis auf Anfrage
SECO
SOM-COMe-CT6-MBPF
SECO SOM-COMe-CT6-MBPF - COM Express CPU-Modul SOM-COMe-CT6-MBPF is a COM Express® Compact Type 6 Computer on Module (CoM) with the AMD Embedded 3rd generation R-Series SoC (formerly Merlin Falcon), G-Series SoC-I (formerly Brown Falcon) or G-Series SoC-J (formerly Prairie Falcon) designed by SECO th
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SECO SOM-COMe-CT6-MBPF - COM Express CPU-ModulSOM-COMe-CT6-MBPF is a COM Express® Compact Type 6 Computer on Module (CoM) with the AMD Embedded 3rd generation R-Series SoC (formerly Merlin Falcon), G-Series SoC-I (formerly Brown Falcon) or G-Series SoC-J (formerly Prairie Falcon) designed by SECO th
Datenblatt
Handbuch
System Integration
ÜbersichtKey FeaturesCPUAMD Embedded 3rd generation R-Series SOC, G-Series SOC-I or G-Series SoC-JAMD Radeon 3rd -Generation Graphics Core Next (GCN)4x USB 3.0, 8x USB 2.0, 3x PCI-e x1 Gen3Two SO-DIMM slots supporting DDR4 ECC and non-ECC modulesAMD RX-421BD, Quad Core @ 2.1 GHz (3.4 GHz Max), TDP 35W AMD RX-418GD, Quad Core @ 1.8 GHz (3.2 GHz Max), TDP 35W AMD RX-216GD, Dual Core @ 1.6GHz (3.0 GHz Max), TDP 15W AMD RX-416GD, Quad Core @ 1.6 GHz (2.4GHz Max), TDP 15W, Industrial Temperature range AMD GX-217GI, Dual Core @1.7GHz (2.0GHz Max), TDP 15W AMD GX-224IJ, Dual Core @ 2.4GHz (2.8GHz Max), cTDP 10-15W AMD GX-215IJ, Dual Core @1.5GHz (2.0GHz Max), cTDP 6-10W Spezifikation
Description
SOM-COMe-CT6-MBPF is a COM Express® Compact Type 6 Computer on Module (CoM) with the AMD Embedded 3rd generation R-Series SoC (formerly Merlin Falcon), G-Series SoC-I (formerly Brown Falcon) or G-Series SoC-J (formerly Prairie Falcon) designed by SECO that features up to 4 Excavator x86 CPU cores with the latest Radeon graphics and I / O Controller on a single Chip; each Processor can scale the TDP down to 15W. SOM-COMe-CT6-MBPF is ideal in applications where scalable graphics performance makes the difference.
Cpu
AMD RX-421BD, Quad Core @ 2.1 GHz (3.4 GHz Max), TDP 35W
AMD RX-418GD, Quad Core @ 1.8 GHz (3.2 GHz Max), TDP 35W
AMD RX-216GD, Dual Core @ 1.6GHz (3.0 GHz Max), TDP 15W
AMD RX-416GD, Quad Core @ 1.6 GHz (2.4GHz Max), TDP 15W, Industrial Temperature range
AMD GX-217GI, Dual Core @1.7GHz (2.0GHz Max), TDP 15W
AMD GX-224IJ, Dual Core @ 2.4GHz (2.8GHz Max), cTDP 10-15W
AMD GX-215IJ, Dual Core @1.5GHz (2.0GHz Max), cTDP 6-10W
Max Cores
4
Memory
R-Series: Two SO-DIMM slots supporting DDR4 ECC / nonECC modules up to 2133MHz
G-Series SoC-I: Two SO-DIMM slots supporting DDR4 ECC / non-ECC modules up to 1600MHz
G-Series SoC-J: One SO-DIMM slot supporting DDR4 nonECC modules up to 2133MHz
Graphics
AMD Radeon 3rd -Generation Graphics Core Next (GCN)
AMD RX-421BD - Radeon R7
AMD RX-418GD, RX-416GD - Radeon R6
AMD-RX-216GD - Radeon R5
AMD GX-217GI - Radeon R6E
AMD GX-224IJ - Radeon R4E
AMD GX-215IJ - Radeon R2E
Up to 3 independent displays supported (up to 2 with G-Series SoC-I and SoC-J)
DirectX® 12 supported
UVD 6 (4K H.265 and H.264 decode) and VCE 3.1 (4KH.264 encode) supported
Video Interfaces
Up to 3 x Digital Display Interfaces (DDIs), supporting eDP1.4, DP 1.2, DVI and HDMI 1.4b/2.0 (up to 2x DDIs with G-Series SoC-I and SoC-J)
Optional VGA interface (excludes one DDI Port)
Optional eDP or Single / Dual-Channel 18- / 24- bit LVDS interface (excludes one DDI Port)
Video Resolution
DDIs: up to 4K
LVDS, VGA: up to 1920 x 1200 @ 60Hz
Mass Storage
2 x SATA Gen3 Channels
SD interface shared with GPI/Os
Networking
Gigabit Ethernet interface
Intel® I210 / I211 GbE Controller
Usb
4 x USB 3.0 Host ports
8 x USB 2.0 Host ports
Pci
3 x PCI-e x 1 lanes
PCI-express Graphics (PEG) x8 (R-Series SoCs) or x4 (G-Series SOC-I and SoC-J)
Audio
HD Audio Interface
Serial Ports
2 x HS UARTs
Other Interfaces
SPI, I2C Bus, SM Bus, LPC Bus, 2 x Express Card, FAN management
LID# / SLEEP# / PWRBTN#, Watchdog
4 x GPI, 4 x GPO (multiplexed with SD interface)
Optional TPM 1.2 or 2.0 module onboard
Power Supply
+12VDC ± 10% and + 5VSB (optional)
Operating System
Microsoft® Windows 7
Microsoft® Windows 10
Microsoft® Windows 10 IoT
Linux
Operating Temperature
0°C ÷ +60 °C (Commercial version)
-40°C ÷ +85°C (Industrial version)
*Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensions
95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout)
Produktvarianten / ZubehörBitte stellen Sie sicher, dass Sie stets die aktuellsten Version der Produktspezifikationen des Herstellers verwenden. Hersteller-Produktseite: SOM-COMe-CT6-MBPFMCTX Mobile & Embedded Computers GmbH IST UM DIE RICHTIGKEIT UND AKTUALITÄT DER DATEN AUF DIESER WEBSEITE BEMÜHT, ÜBERNIMMT JEDOCH KEINERLEI ZUSICHERUNG BEZÜGLICH DES INHALTS. EINE HAFTUNG ODER GARANTIE FÜR DIE AKTUALITÄT, RICHTIGKEIT UND VOLLSTÄNDIGKEIT DER ZUR VERFÜGUNG GESTELLTEN INFORMATIONEN IST FOLGLICH AUSGESCHLOSSEN.Technische Unterstützung & System Integration Services
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SECO
SOM-COMe-BT7-E3000
SECO SOM-COMe-BT7-E3000 - COM Express CPU-Modul This innovative Computer on Module (CoM) provides scalable offerings with outstanding performance and more connectivity. Networking and connectivity are improved with the 4x 10GBASE-KR interfaces + 1x 1GbE port with NC-SI and the 4 USB 3.1; 24x PCI-e Gen3
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SECO SOM-COMe-BT7-E3000 - COM Express CPU-ModulThis innovative Computer on Module (CoM) provides scalable offerings with outstanding performance and more connectivity. Networking and connectivity are improved with the 4x 10GBASE-KR interfaces + 1x 1GbE port with NC-SI and the 4 USB 3.1; 24x PCI-e Gen3
Datenblatt
Handbuch
System Integration
ÜbersichtKey FeaturesCPUAMD EPYC Embedded 3000 family of SoCsN.A.4x USB 3.1, 24x PCI-e Gen3 lanesFour DDR4 SO-DIMM Slots supporting DDR4-2666 Memory with ECC, up to 128GBAMD EPYC™ Embedded 3000 family of SoCs: AMD EPYC™ Embedded 3451, Sixteen Core Dual Thread @ 2.14GHz (3.0 Boost), 32MB L3 shared Cache, TDP 80-100W AMD EPYC™ Embedded 3351, Twelve Core Dual Thread @ 1.9GHz (3.0 Boost), 32MB L3 shared Cache, TDP 60-80W AMD EPYC™ Embedded 3251, Eight Core Dual Thread @ 2.5GHz (3.1 Boost), 16MB L3 shared Cache, TDP 55W AMD EPYC™ Embedded 3201, Eight Core Single Thread @ 1.5GHz (3.1 Boost), 16MB L3 shared Cache, TDP 30W AMD EPYC™ Embedded 3151, Quad Core Dual Thread @ 2.7GHz (2.9 Boost), 16MB L3 shared Cache, TDP 45W AMD EPYC™ Embedded 3101, Quad Core Single Thread @ 2.1GHz (2.9 Boost), 8MB L3 shared Cache, TDP 35W AMD EPYC™ Embedded 3255, Eight Core Dual Thread @ 2.5GHz (3.1 Boost), 16MB L3 Shared Cache, TDP 55W, industrial grade Spezifikation
Description
This innovative Computer on Module (CoM) provides scalable offerings with outstanding performance and more connectivity. Networking and connectivity are improved with the 4x 10GBASE-KR interfaces + 1x 1GbE port with NC-SI and the 4 USB 3.1; 24x PCI-e Gen3 lanes. Moreover, the performance is enhanced by the four DDR4 SO-DIMM slots supporting DDR4-2666 memory with ECC, up to 128GB.
The AMD EPYC™ Embedded 3000 shows major improvements in power, optimization, and security. The main features of this new processor are I/O integration, flexibility, and security capabilities, scalable offering, harnessing the power of the new “Zen” CPU architecture. Performance-per-dollar is greatly improved, making it a great choice for development.
Cpu
AMD EPYC™ Embedded 3000 family of SoCs:
AMD EPYC™ Embedded 3451, Sixteen Core Dual Thread @ 2.14GHz (3.0 Boost), 32MB L3 shared Cache, TDP 80-100W
AMD EPYC™ Embedded 3351, Twelve Core Dual Thread @ 1.9GHz (3.0 Boost), 32MB L3 shared Cache, TDP 60-80W
AMD EPYC™ Embedded 3251, Eight Core Dual Thread @ 2.5GHz (3.1 Boost), 16MB L3 shared Cache, TDP 55W
AMD EPYC™ Embedded 3201, Eight Core Single Thread @ 1.5GHz (3.1 Boost), 16MB L3 shared Cache, TDP 30W
AMD EPYC™ Embedded 3151, Quad Core Dual Thread @ 2.7GHz (2.9 Boost), 16MB L3 shared Cache, TDP 45W
AMD EPYC™ Embedded 3101, Quad Core Single Thread @ 2.1GHz (2.9 Boost), 8MB L3 shared Cache, TDP 35W
AMD EPYC™ Embedded 3255, Eight Core Dual Thread @ 2.5GHz (3.1 Boost), 16MB L3 Shared Cache, TDP 55W, industrial grade
Memory
Up to 4x DDR4 SO-DIMM Slots supporting DDR4-2666 Memory (both ECC and not-ECC supported), up to 128GB
Mass Storage
2x S-ATA Gen3 Channels
Networking
1x Gigabit Ethernet LAN port with NC-SI (Network Controller Sideband Interface) functionality, managed by an Intel® I210 Gigabit Ethernet Controller
4x 10Gigabit Ethernet interfaces (10GBASE-KR), directly managed by the EPYC™ SoCs
Usb
4 x USB 3.1 Host ports (SS + USB 2.0 interfaces)
Pci
24x PCI-e Gen3 lanes
Serial Ports
2x legacy UARTs, 16C550 compatible
Other Interfaces
SPI, SM Bus, LPC bus
Security
Optional TPM 2.0 module on-board
AMD Secure Processor for Crypto Co-processing
Hardware Validated Boot capabilities
Secure Memory Encryption
Secure Encrypted Virtualization
Power Supply
+12VDC ± 10% and + 5VSB (optional)
Operating System
Microsoft® Windows 10
Microsoft® Windows Server 2016
Linux OS 64-bit
Operating Temperature
0°C ÷ +60 °C (Commercial version)
-40°÷+85°C (Industrial Range, when available)
*Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensions
125 x 95 mm (Com Express™ Basic Form factor, Type 7 pinout)
Produktvarianten / ZubehörMC42-2002-1110-C1-VCOMe-C42-BT7 w/AMD EPYC™ Embedded 3201, Eight Core Single Thread @ 1.5GHz (3.1 Boost), 16MB L3 Shared Cache, TDP 30W, 4x SO-DIMM DDR4 slots, TPM 2.0, I210 GbE ctrl, 4-wire fan - Comm. TempMC42-4002-1110-C1-VCOM Express® Rel.3.0 Basic Type 7 module with the AMD EPYC™ Embedded 3000 Series of SoCsCOMe-C42-BT7 w/AMD EPYC™ Embedded 3101, Quad Core Single Thread @ 2.1GHz (2.9 Boost), 8MB L3 Shared Cache, TDP 35W, 4x SO-DIMM DDR4 slots, TPM 2.0, I210 GbE ctrl, 4-wire fan - Comm. TempMC42-7002-1110-I1-VCOMe-C42-BT7 w/AMD EPYC™ Embedded 3255, Eight Core Dual Thread @ 2.5GHz (3.1 Boost), 16MB L3 Shared Cache, TDP 55W, 4x SO-DIMM DDR4 slots, TPM 2.0, I210 GbE ctrl, 4-wire fan - Ind. TempBitte stellen Sie sicher, dass Sie stets die aktuellsten Version der Produktspezifikationen des Herstellers verwenden. Hersteller-Produktseite: SOM-COMe-BT7-E3000MCTX Mobile & Embedded Computers GmbH IST UM DIE RICHTIGKEIT UND AKTUALITÄT DER DATEN AUF DIESER WEBSEITE BEMÜHT, ÜBERNIMMT JEDOCH KEINERLEI ZUSICHERUNG BEZÜGLICH DES INHALTS. EINE HAFTUNG ODER GARANTIE FÜR DIE AKTUALITÄT, RICHTIGKEIT UND VOLLSTÄNDIGKEIT DER ZUR VERFÜGUNG GESTELLTEN INFORMATIONEN IST FOLGLICH AUSGESCHLOSSEN.Technische Unterstützung & System Integration Services
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SECO
SOM-COMe-BT6-RPL-P
SECO SOM-COMe-BT6-RPL-P - COM Express CPU-Modul mit Intel® Raptor Lake COM Express® 3.1 Type 6 Basic Computer on Module (CoM) with 13th Gen Intel® Core™ processors (Codename: Raptor Lake-P).
(CALLISTO - E03)
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SECO SOM-COMe-BT6-RPL-P - COM Express CPU-Modul mit Intel® Raptor LakeCOM Express® 3.1 Type 6 Basic Computer on Module (CoM) with 13th Gen Intel® Core™ processors (Codename: Raptor Lake-P).
(CALLISTO - E03)
Datenblatt
System Integration
ÜbersichtKey FeaturesCPU13th Gen Intel Core processors targeted for IoT Applicationsembedded Intel Iris Xe graphics with up to 96 execution units1x NBase-T 2.5GbE, 2x USB4.0 Gen2, 4x USB3.2 Gen 2, 8x USB 2.0, 8x PCI-e x1 Gen3, PEG x8 Gen4 and 2x PEG x4 Gen4.Two DDR5 SO-DIMM Slots supporting DDR5-4800 IBECC Memory, up to 64GB
CPU Produktfamilie: Intel® Raptor Lake
Intel® U300E (8M Cache, bis zu 4.30 GHz)CPU-Varianten
CPU
Intel® U300E
Processor Number
U300E
Cache
8 MB Intel® Smart Cache
Max Turbo Frequency
4.30 GHz
Total Cores
5
Total Threads
6
Processor Base Power
15 W
Spezifikation
Description
COM Express® 3.1 Type 6 Basic Computer on Module (CoM) with 13th Gen Intel® Core™ processors (formerly codenamed Raptor Lake-P)
Cpu
13th Gen Intel® Core™ processors (Raptor Lake U/P/H series) and Intel® Processor U300E:
U series, up to 10C (2P+8E), up to 12M cache, 15W TDP
P series, up to 14C (6P+8E), up to 24M cache, 28W TDP
H series, up to 14C (6P+8E), up to 24M cache, 45W TDP
Memory
Two DDR5 SO-DIMM slots supporting DDR5-4800, IBECC modules memory, up to 64GB
Graphics
Intel® UHD Graphics/Intel® Iris® Xe Graphics architecture, up to 96 EU
Improved image (IPU6EP) and video processing (AV1/GNA 3.0)
Support up to 4 independent displays @ 4K
Video Interfaces
Up to 3x Digital Display Interfaces (DDIs), supporting DVI, DP 1.4, HDMI 2.1
1x VGA (factory option)
1x eDP 1.3 or single/dual-channel 18-/24-bit LVDS interface (factory alternatives)
Video Resolution
HDMI and DP up to 8K @ 60Hz via TCSS with Hayden Bridge
eDP 1.4b up to 5K @ 120Hz (HBR3 with VDSC1.1)
LVDS up to 1920x1200 @ 60Hz
Mass Storage
2x SATA Gen3 channels
Up to 128 GB on-board NVMe SSD (factory alternative to one PCI-express Graphics (PEG) x4 Gen4)
Networking
1x NBase-T Ethernet interface with Intel® I225 GbE controller, with TSN and 2.5GbE supported.
Usb
Up to 2x USB 4 Gen2 host ports (depending on carrier board retimer implementation)
4x USB 3.2 Gen2 (10Gbps) host ports (depending on carrier board retimer implementation)
8x USB 2.0 host ports
Pci
Up to 8x PCI-e x1 Gen3 lanes
1x PCI-express Graphics (PEG) x8 Gen4
Up to 2x PCI-express Graphics (PEG) x4 Gen4
Audio
HD audio and Soundwire/i2S audio interfaces
Serial Ports
2x UARTs
Other Interfaces
SPI, I2C, SM Bus, Thermal Management, FAN management
Optional eSPI or LPC bus (factory alternatives)
Optional TPM 2.0 on-board
LID#/SLEEP#/PWRBTN#, Watchdog
4 x GPI, 4 x GPO
Power Supply
+12VDC ± 10%, +5VSB (optional), +3VRTC (optional)
Operating System
Microsoft® Windows 10
Linux Ubuntu
Operating Temperature
0°C to +60°C (commercial version)*
-40°C to +85°C (industrial version)*
*Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensions
125 x 95 mm (COM Express® Basic Form factor, Type 6 pinout)
Produktvarianten / ZubehörBitte stellen Sie sicher, dass Sie stets die aktuellsten Version der Produktspezifikationen des Herstellers verwenden. Hersteller-Produktseite: SOM-COMe-BT6-RPL-PMCTX Mobile & Embedded Computers GmbH IST UM DIE RICHTIGKEIT UND AKTUALITÄT DER DATEN AUF DIESER WEBSEITE BEMÜHT, ÜBERNIMMT JEDOCH KEINERLEI ZUSICHERUNG BEZÜGLICH DES INHALTS. EINE HAFTUNG ODER GARANTIE FÜR DIE AKTUALITÄT, RICHTIGKEIT UND VOLLSTÄNDIGKEIT DER ZUR VERFÜGUNG GESTELLTEN INFORMATIONEN IST FOLGLICH AUSGESCHLOSSEN.Technische Unterstützung & System Integration Services
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Preis auf Anfrage