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,
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Computer-On-Module
SECO
SOM-uQ7-MX8M-Mini-Nano
SECO SOM-uQ7-MX8M-Mini-Nano - Qseven CPU-Modul μQseven® Computer on Module (CoM) with NXP i.MX 8M Mini & NXP i.MX 8M Nano Processors.
(ELECTRA - C72)
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SECO SOM-uQ7-MX8M-Mini-Nano - Qseven CPU-ModulμQseven® Computer on Module (CoM) with NXP i.MX 8M Mini & NXP i.MX 8M Nano Processors.
(ELECTRA - C72)
Datenblatt
Handbuch
System Integration
ÜbersichtKey FeaturesNXP i.MX 8M Mini Family / i.MX 8M Nano FamilyGC320 2D accelerator + GCNanoUltra 3D acceleratorGigabit Ethernet, opt. Wi-Fi +BT 5.0, 2 x UART, opt. CAN, 5x USB 2.0, 1 PCI-e x1Soldered on-board DDR4-2400 MemorySpezifikation
Description
μQseven® Computer on Module (CoM) with NXP i.MX 8M Mini & NXP i.MX 8M Nano Processors
Cpu
NXP i.MX 8M Mini Family based on ARM® Cortex®-A53 cores + general purpose Cortex®-M4 400MHz processor:
i.MX 8M Mini Quad – Full featured, 4x Cortex®-A53 cores up to 1.8GHz
i.MX 8M Mini Dual – Full featured, 2x Cortex®-A53 cores up to 1.8GHz
i.MX 8M Mini Solo – Full featured, 1x Cortex®-A53 cores up to 1.8GHz
i.MX 8M Mini Quad Lite – 4x Cortex®-A53 cores up to 1.8GHz, no VPU
i.MX 8M Mini Dual Lite – 2x Cortex®-A53 cores up to 1.8GHz, no VPU
i.MX 8M Mini Solo Lite – 1x Cortex®-A53 cores up to 1.8GHz, no VPU
NXP i.MX 8M Nano Family based on ARM® Cortex®-A53 cores + general purpose Cortex®-M7 750MHz processor:
i.MX 8M Nano Quad – Full featured, 4x Cortex®-A53 cores up to 1.5GHz
i.MX 8M Nano Dual – Full featured, 2x Cortex®-A53 cores up to 1.5GHz
i.MX 8M Nano Solo – Full featured, 1x Cortex®-A53 cores up to 1.5GHz
i.MX 8M Nano Quad Lite – 4x Cortex®-A53 cores up to 1.5GHz, no VPU
i.MX 8M Nano Dual Lite – 2x Cortex®-A53 cores up to 1.5GHz, no VPU
i.MX 8M Nano Solo Lite – 1x Cortex®-A53 cores up to 1.8GHz, no VPU
Max Cores
4+1
Memory
Soldered Down onboard DDR4 memory:
Up to 4GB of DDR4-2400, 32-bit bus memory (i.MX8M Mini)
Up to 2GB of DDR4-2400, 16-bit bus memory (i.MX8M Nano)
Graphics
i.MX 8M Mini Family of processors:
Vivante GC320 2D accelerator + GCNanoUltra 3D accelerator
OpenGL ES 2.0, OpenVG 1.1 support
i.MX 8M Nano Family of processors:
Vivante GC7000UL 2D/3D GPU
OpenGL ES 3.1, OpenCL1.2, Vulkan support
Only for i.MX 8M Mini Family, not for Lite processors, embedded VPU able to offer:
VP9, HEVC/H.265, AVC/H.264, VP8 HW Decoding
AVC/H.264, VP8 HW encoding
Video Interfaces
Single/Dual Channel 18/24 bit LVDS interface or eDP interface
Video Resolution
Up to 1920 x 1080p
Mass Storage
eMMC 5.1 drive on-board, up to 64GB
SD / MMC / SDIO interface
Optional QSPI Flash for booting
Networking
Gigabit Ethernet interface
Optional WiFi 802.11 a/b/g/n/ac +BT 5.0 NGFF module soldered on-board
Usb
5x USB 2.0 Host ports (i.MX 8M Mini)
4x USB 2.0 Host ports (i.MX 8M Nano)
Pci
1 x PCI Express x 1 lane (only with i.MX 8M Mini)
Audio
I2S Audio Interface
Serial Ports
1x 4-wire UART + 1 x Debug UART
Optional CAN interface
Other Interfaces
SPI interface
Watchdog
8x GPIO
SM Bus
I2C interface
Power Supply
+5VDC and +5VSB (optional)
Operating System
Linux (Yocto)
Operating Temperature
0°C ÷ +60 °C (commercial temp.)*
-30°C ÷ +85°C (Extended temp.)*
*Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensions
40x70 mm (1.57” x 2.76”)
Produktvarianten / ZubehörQC72-1130-1101-C2μQ7-C72 w/NXP i.MX8M Mini Quad, 4GB DDR4 (2x16Gb), 16GB eMMC, LVDS, CAN, QSPI, Comm.TempQC72-1130-1101-I2μQ7-C72 w/NXP i.MX8M Mini Quad, 4GB DDR4 (2x16Gb), 16GB eMMC, LVDS, CAN, QSPI, Ind.TempQC72-1140-1111-C2_μQ7-C72 w/NXP i.MX8M Mini Quad, 4GB DDR4 (2x16Gb), 32GB eMMC, LVDS, CAN, WiFi/BLE, QSPI, Comm.TempQC72-3220-1101-C2μQ7-C72 w/NXP i.MX8M Mini Dual, 2GB DDR4 (2x8Gb), 8GB eMMC, LVDS, CAN, QSPI, Comm.TempQC72-3220-1101-I2μQ7-C72 w/NXP i.MX8M Mini Dual, 2GB DDR4 (2x8Gb), 8GB eMMC, LVDS, CAN, QSPI, Ind.TempQC72-5520-1101-I2μQ7-C72 w/NXP i.MX8M Mini Solo, 1GB DDR4 (1x8Gb), 8GB eMMC, LVDS, CAN, QSPI - Ind.TempQC72-A520-1101-C2μQ7-C72 w/NXP i.MX8M Nano DualLite, 1GB DDR4 (1x8Gb), 8GB eMMC, LVDS, CAN, QSPI - Comm.TempC72QC72-C510-1000-C2μQ7-C72 w/NXP i.MX8M Nano SoloLite, 1GB DDR4 (1x8Gb), 4GB eMMC, LVDS - Comm.TempBitte stellen Sie sicher, dass Sie stets die aktuellsten Version der Produktspezifikationen des Herstellers verwenden. Hersteller-Produktseite: SOM-uQ7-MX8M-Mini-NanoMCTX Mobile & Embedded Computers GmbH IST UM DIE RICHTIGKEIT UND AKTUALITÄT DER DATEN AUF DIESER WEBSEITE BEMÜHT, ÜBERNIMMT JEDOCH KEINERLEI ZUSICHERUNG BEZÜGLICH DES INHALTS. EINE HAFTUNG ODER GARANTIE FÜR DIE AKTUALITÄT, RICHTIGKEIT UND VOLLSTÄNDIGKEIT DER ZUR VERFÜGUNG GESTELLTEN INFORMATIONEN IST FOLGLICH AUSGESCHLOSSEN.Technische Unterstützung & System Integration Services
Alle Dokumente auf dieser Seite werden ohne Benachrichtigung aktualisiert.DatenblattHandbuch
Preis auf Anfrage
SECO
SOM-uQ7-MX6-2
SECO SOM-uQ7-MX6-2 - Qseven CPU-Modul The extremely low power and low cost μQseven Rev. 2.0 Compliant Computer on Module (CoM) with the NXP i.MX 6 Processor features all the processor and integrated native I/O capabilities of the SoC, in compliance with the Qseven standard, at the competitive cost of a proprietary module. This board is supplied with a complete and fully-featured BSP, for easy migration from, and to, the entire i.MX 6 product family, along with dedicated hardware and software development support.
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SECO SOM-uQ7-MX6-2 - Qseven CPU-ModulThe extremely low power and low cost μQseven Rev. 2.0 Compliant Computer on Module (CoM) with the NXP i.MX 6 Processor features all the processor and integrated native I/O capabilities of the SoC, in compliance with the Qseven standard, at the competitive cost of a proprietary module. This board is supplied with a complete and fully-featured BSP, for easy migration from, and to, the entire i.MX 6 product family, along with dedicated hardware and software development support.
Datenblatt
Handbuch
System Integration
ÜbersichtKey FeaturesSingle and Dual Core Lite (ARM CortexA9 Cores)2D/3D dedicated graphics processorsFastEthernet, GPI/Osup to 1GB DDR3L on-boardSpezifikation
Description
The extremely low power and low cost μQseven Rev. 2.0 Compliant Computer on Module (CoM) with the NXP i.MX 6 Processor features all the processor and integrated native I/O capabilities of the SoC, in compliance with the Qseven standard, at the competitive cost of a proprietary module. This board is supplied with a complete and fully-featured BSP, for easy migration from, and to, the entire i.MX 6 product family, along with dedicated hardware and software development support.
Cpu
NXP i.MX 6 Family, based on ARM® CORTEX-A9 processors
- i.MX6S Solo - Single core up to 1GHz
- i.MX6DL Dual Lite - Dual core up to 1GHz per core
Max Cores
2
Memory
Up to 1GB DDR3L on-board (up to 512MB with i.MX6S Solo) 32-bit I/F
Graphics
Dedicated 2D Hardware accelerator
Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D
Supports 2 independent displays
Video Interfaces
1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
HDMI Interface
Video Resolution
LVDS, resolution up to 1920x1200
HDMI, resolution up to 1080p
Mass Storage
On-board eMMC drive, up to 8 GB
SD / MMC / SDIO interface
Internal SPI Flash for booting
Networking
Fast Ethernet (10/100) interface
Usb
1 x USB OTG interface
1 x USB 2.0 Host interface
Pci
1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)
Audio
I2S / AC’97 Audio Interface
Other Interfaces
On the card edge connector, many pins can be used as General Purpose I / Os or to implement some(*) of the following extra functionalities:
- Additional SD interface
- Up to 4 UARTs
- CAN interface
- Watchdog(s)
- I2C interfaces
- PWM outputs
- SPI interface
- Additional Audio interface
(*) not all the combinations are allowed simultaneously Power Management Signals
Power Supply
+5VDC ± 5%
Optional Low Power RTC
Operating System
Linux
Yocto
Operating Temperature
0°C ÷ +60 °C (commercial temp.)*
-40°C ÷ +85°C (Industrial temp.)*
*Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensions
40x70 mm (1.57” x 2.76”)
Produktvarianten / ZubehörQA75-1140-1000-C0-VµQ7-A75-J w/i.MX6 Solo - RAM DDR3L 256MB single chip - eMMC 4GB - RTC Low Power - Comm.TempQA75-1140-1000-I0-VµQ7-A75-J w/i.MX6 Solo - RAM DDR3L 256MB single chip - eMMC 4GB - RTC Low Power - Ind.TempQA75-1340-1000-I0-VµQ7 - µQ7-A75-J w/i.MX6 Solo - RAM DDR3L 256MB single chip - eMMC 4GB - RTC Low Power - Comm.TempQA75-2330-1000-C0-VµQ7 - µQ7-A75-J w/i.MX6 DualLite - RAM DDR3L 512MB dual chip - eMMC 4GB - RTC Low Power - Comm.TempQA75-2410-1000-C0-VµQ7-A75-J w/i.MX6 DualLite - RAM DDR3L 1GB dual chip - eMMC 4GB - RTC Low Power - Comm.TempQA75-2440-1000-I0-VµQ7-A75-J w/i.MX6 DualLite - RAM DDR3L 1GB dual chip - eMMC 4GB - RTC Low Power - Ind.TempBitte stellen Sie sicher, dass Sie stets die aktuellsten Version der Produktspezifikationen des Herstellers verwenden. Hersteller-Produktseite: SOM-uQ7-MX6-2MCTX Mobile & Embedded Computers GmbH IST UM DIE RICHTIGKEIT UND AKTUALITÄT DER DATEN AUF DIESER WEBSEITE BEMÜHT, ÜBERNIMMT JEDOCH KEINERLEI ZUSICHERUNG BEZÜGLICH DES INHALTS. EINE HAFTUNG ODER GARANTIE FÜR DIE AKTUALITÄT, RICHTIGKEIT UND VOLLSTÄNDIGKEIT DER ZUR VERFÜGUNG GESTELLTEN INFORMATIONEN IST FOLGLICH AUSGESCHLOSSEN.Technische Unterstützung & System Integration Services
Alle Dokumente auf dieser Seite werden ohne Benachrichtigung aktualisiert.DatenblattHandbuch
Preis auf Anfrage
SECO
SOM-uQ7-MX6
SECO SOM-uQ7-MX6 - Qseven CPU-Modul SOM-uQ7-MX6 is a Qseven® Rel. 2.0 Compliant Computer on Module (CoM) designed by SECO that offers top computational and graphical performances given by low-power consuming ARM architecture.
The board integrates i.MX 6 Multimedia Applications platform from
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margin: 0;
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}
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}
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display: block;
color: #2b3136;
text-align: center;
text-decoration: none;
background-color: CornflowerBlue;}
li.menu-item a {display: block;
color: white;text-align: center;
text-decoration: none;
}
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color: white;
background-color: #f7c13d;}
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font-weight: bolder;
background-color: CornflowerBlue;}
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font-size: 100%;
line-height: 1.5;
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SECO SOM-uQ7-MX6 - Qseven CPU-ModulSOM-uQ7-MX6 is a Qseven® Rel. 2.0 Compliant Computer on Module (CoM) designed by SECO that offers top computational and graphical performances given by low-power consuming ARM architecture.
The board integrates i.MX 6 Multimedia Applications platform from
Datenblatt
Handbuch
System Integration
ÜbersichtKey FeaturesSingle-, Dual- and Quad- Core (ARM Cortex -A9 Cores)2D/3D dedicated graphics processors4x USB 2.0, 2x Serial ports, CAN Busup to 2GB DDR3L on-boardSpezifikation
Description
SOM-uQ7-MX6 is a Qseven® Rel. 2.0 Compliant Computer on Module (CoM) designed by SECO that offers top computational and graphical performances given by low-power consuming ARM architecture.
The board integrates i.MX 6 Multimedia Applications platform from NXP, a multimedia processor integrating a multicore Cortex® A9 ARM Core (up to Quad Core processors), ideal for applications requiring multimedia capabilities and/or high levels of parallel computing.
All this comes in the μQseven form factor, just 40x70mm, introduced with the Qseven® specifications Rel. 2.0.
Cpu
NXP i.MX 6 Family, based on ARM® CORTEX® -A9 processors
- i.MX6S Solo - Single core up to 1GHz
- i.MX6DL Dual Lite - Dual core up to 1GHz per core
- i.MX6D Dual - Dual core up to 1GHz per core
- i.MX6Q Quad - Quad core up to 1GHz per core
Max Cores
4
Memory
up to 2GB DDR3L on-board (up to 1GB with i.MX6S)
Graphics
Dedicated 2D Hardware accelerator
Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D
Dedicated Vector Graphics accelerator supports OpenVG™ (only i.MX6D and i.MX6Q)
Supports up to 3 independent displays with i.MX6D and i.MX6Q
Supports 2 independent displays with i.MX6DL and i.MX6S
Video Interfaces
1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface
HDMI Interface 1.4
Video Resolution
HDMI, up to 1080p
LVDS, up to 1920x1200
Mass Storage
Up to 8 GB eMMC drive soldered onboard
SD / MMC / SDIO interface
1 x External SATA Channel (only available with i.MX6D and i.MX6Q)
Networking
Gigabit Ethernet interface
Usb
1 x USB OTG interface
4 x USB 2.0 Host interfaces
Pci
1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)
Audio
I2S / AC’97 Audio Interface
Serial Ports
2 x Serial ports (TTL interface)
CAN port interface
Other Interfaces
I2C Bus
SM Bus
Power Management Signals
Power Supply
+5VDC ± 5%
Operating System
Linux
Yocto
Operating Temperature
0°C ÷ +60°C (commercial version)
-40°C ÷ +85°C (industrial version)
*Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensions
40x70 mm (μQseven, 1.57” x 2.76”)
Produktvarianten / ZubehörQ962-AA60-0000-I1-VµQ7 - µQ7-962 w/ i.MX6 Solo @800MHz - DDR3L 512MB - eMMC 4GB - RTC low power - Ind. Temp.Q962-C150-0000-I1-VµQ7-962 w/ i.MX6 DualLite @800MHz - DDR3L 1GB - eMMC 8GB - RTC low power - Ind. Temp.Q962-GA20-0000-I1-VµQ7 - µQ7-962 w/ i.MX6 Quad @800MHz - DDR3L 512MB - eMMC 4GB - RTC low power - Ind. Temp.Q962-H160-0000-C1-VµQ7-962 w/ i.MX6 Quad @1GHz - DDR3L 1GB - eMMC 4GB - RTC low power - Comm. Temp.Q962-H230-0000-C1-VµQ7 - µQ7-962 w/ i.MX6 Quad @1GHz - DDR3L 2GB - eMMC 8GB - RTC low power - Comm. Temp.Bitte stellen Sie sicher, dass Sie stets die aktuellsten Version der Produktspezifikationen des Herstellers verwenden. Hersteller-Produktseite: SOM-uQ7-MX6MCTX Mobile & Embedded Computers GmbH IST UM DIE RICHTIGKEIT UND AKTUALITÄT DER DATEN AUF DIESER WEBSEITE BEMÜHT, ÜBERNIMMT JEDOCH KEINERLEI ZUSICHERUNG BEZÜGLICH DES INHALTS. EINE HAFTUNG ODER GARANTIE FÜR DIE AKTUALITÄT, RICHTIGKEIT UND VOLLSTÄNDIGKEIT DER ZUR VERFÜGUNG GESTELLTEN INFORMATIONEN IST FOLGLICH AUSGESCHLOSSEN.Technische Unterstützung & System Integration Services
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SECO
SOM-Trizeps-VIII-MX8M-Plus
SECO SOM-Trizeps-VIII-MX8M-Plus - Trizeps SODIMM SOM CPU-Modul The new SOM-Trizeps-VIII-MX8M-Plus CPU Computer on Module (CoM) uses the new i.MX 8M Plus processor from the NXP i.MX8 series. The i.MX 8M Plus SoC (System on Chip) has various processor units that can handle a wide range of computing operations.
Of parti
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SECO SOM-Trizeps-VIII-MX8M-Plus - Trizeps SODIMM SOM CPU-ModulThe new SOM-Trizeps-VIII-MX8M-Plus CPU Computer on Module (CoM) uses the new i.MX 8M Plus processor from the NXP i.MX8 series. The i.MX 8M Plus SoC (System on Chip) has various processor units that can handle a wide range of computing operations.
Of parti
Datenblatt
System Integration
ÜbersichtKey FeaturesNXP i.MX8M Plus Applications ProcessorsIntegrated GPU with multi display support , GC520L 2D accelerator + GC7000UL 3D accelerator2x Gigabit Ethernet, 2x USB 3.0, 2x CAN-FD, PCIe, LVDS, 2x MIPI-CSI, WiFi/BluetoothUp to 8 GB LPDDR4-4000 memorySpezifikation
Description
The new SOM-Trizeps-VIII-MX8M-Plus CPU Computer on Module (CoM) uses the new i.MX 8M Plus processor from the NXP i.MX8 series. The i.MX 8M Plus SoC (System on Chip) has various processor units that can handle a wide range of computing operations.
Of particular note is the NPU (Neural Processing Unit), which can handle computational processes in the field of AI (Artificial Intelligence) typically with learned neural networks. These can be used for pattern, speech and object recognition. and object recognition. This opens up new areas of application for the SOM-Trizeps-VIII-MX8M-Plus (System On Module).
Equally important is the wide range of applications for the classic embedded functions. This is where the Dual Gigabit Ethernet and Dual CAN FD interfaces, which are used e.g. in industrial automation, are convincing. ""Low power"" applications or real-time applications can be provided by the integrated 800 MHz clocked Arm Cortex-M7 co-processor. USB 3.0 and PCIe are available as high-speed interfaces.
The SOM-Trizeps-VIII-MX8M-Plus can also be used for a wide range of multimedia applications. Fast image processing is enabled by high-performance video decoders and encoders as well as two image signal processors (Dual-ISP - Dual Image Signal Processor). Also, powerful audio and voice functions are available. Displays can be connected via HDMI, (dual-)LVDS or MIPI-DISI interfaces.
Besides, the Trizeps VIII Plus extends the functionality of the i.MX 8M Plus SoC with the configurable FPGA, the programmable Kinetis Cortex M0+ MCU, the HiFi Audio Codec and the WLAN/Bluetooth module.
Cpu
NXP i.MX 8M Plus family SoCs: Dual or Quad ARM Cortex®-A53 Cores + general purpose Cortex® M7 800MHz processor
• NXP i.MX 8M Plus Quad, 4x ARM Cortex®-A53 Cores up to 1.8GHz
• NXP i.MX 8M Plus Dual, 2x ARM Cortex®-A53 Cores up to 1.8GH
NPU: 2.3 TOPS Neural Network performance (not for Quad Lite)
Optional: NXP™ Kinetis V Arm® Cortex-M0+ up to 75 MHz / 8x 16 Bit ADC, UART, SPI, GPIO, I2C
Optional: Programmable FPGA, up to 4300 LUTs
Memory
Soldered down LPDDR4-4000 memory, 32-bit interface, up to 8GB
Graphics
Integrated Graphics Processing Unit GC7000UL, supports 3 independent displays.
Embedded VPU, supports HW decoding of HEVC/H.265, AVC/H.264, MPEG-4, MPEG-2, MVC, VC-1, RV, VP6, VP7, VP8, VP9, JPEG, HW encoding of HEVC/H.265, AVC/H.264
Supports OpenVG 1.1, OpenGL ES 3.1, OpenCL 1.2 Full Profile and Vulkan
Video Interfaces
HDMI, MIPI display (4 channel) / Single- or Dual-LVDS, LCD 24 Bit RGB
Video Resolution
HDMI, LVDS, eDP: Up to 1920 x 1080p @60
Video-Decoder: 1080p60, h.265/4, VP9, VP8 / Video Encoder: 1080p60, h.265/4
Mass Storage
Onboard 4 Bit wide μSD Card Socket or onboard 8 Bit wide eMMC
Networking
2x Gigabit Ethernet (1x RGMII PHY and 1x RGMII interface)
Optional: WiFi 802.11 a/b/g/n/ac 2x2 MU-MIMO / Bluetooth 4.2/5.0
Usb
2x USB 3.0 OTG
Pci
Up to 1x PCI-e x1 Gen3 port
Audio
Digital: 18x I2S TDM, DSD512, S/PDIF Tx + Rx, 8 channel PDM Microphone input
Analog: Stereo Headphone output, Mono Speaker output, Stereo Line-In, Microphone input
Serial Ports
4x UART
Other Interfaces
3x 4 Bit wide SDIO 3.0
SPDIF In/Out
I2S
Multichannel Serial-Audio-Interface
2x I2C
SPI
QSPI
GPIOs
PWMs
2x CAN
Power Supply
3.3 VDC
Operating System
Linux Yocto, Debian / Android / Windows 10 IoT
Operating Temperature
-40 ÷ 85°C (industrial) / -25 ÷ 85°C (Extended Consumer) / 0 ÷ 70°C (Consumer)
Dimensions
67.6 x 36.7 x 6.4 mm
Produktvarianten / ZubehörBitte stellen Sie sicher, dass Sie stets die aktuellsten Version der Produktspezifikationen des Herstellers verwenden. Hersteller-Produktseite: SOM-Trizeps-VIII-MX8M-PlusMCTX Mobile & Embedded Computers GmbH IST UM DIE RICHTIGKEIT UND AKTUALITÄT DER DATEN AUF DIESER WEBSEITE BEMÜHT, ÜBERNIMMT JEDOCH KEINERLEI ZUSICHERUNG BEZÜGLICH DES INHALTS. EINE HAFTUNG ODER GARANTIE FÜR DIE AKTUALITÄT, RICHTIGKEIT UND VOLLSTÄNDIGKEIT DER ZUR VERFÜGUNG GESTELLTEN INFORMATIONEN IST FOLGLICH AUSGESCHLOSSEN.Technische Unterstützung & System Integration Services
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SECO
SOM-Trizeps-VIII-MX8M-Mini
SECO SOM-Trizeps-VIII-MX8M-Mini - Trizeps SODIMM SOM CPU-Modul "The new SOM-Trizeps-VIII-MX8M-Mini CPU Computer on Module (CoM) from the NXP i.MX8 series uses the i.MX 8M Mini processor, which provides the high performance demands of current video, voice and audio processing, including video resolutions up to 1080p.
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SECO SOM-Trizeps-VIII-MX8M-Mini - Trizeps SODIMM SOM CPU-Modul"The new SOM-Trizeps-VIII-MX8M-Mini CPU Computer on Module (CoM) from the NXP i.MX8 series uses the i.MX 8M Mini processor, which provides the high performance demands of current video, voice and audio processing, including video resolutions up to 1080p.
Datenblatt
System Integration
ÜbersichtKey FeaturesNXP i.MX 8M Mini Applications ProcessorsGC320 2D accelerator + GCNanoUltra 3D accelerator1x Gigabit Ethernet, WiFi/Bluetooth, USB 2.0, LVDSUp to 8 GB LPDDR4-3200 RAM memory, 32 BitSpezifikation
Description
"The new SOM-Trizeps-VIII-MX8M-Mini CPU Computer on Module (CoM) from the NXP i.MX8 series uses the i.MX 8M Mini processor, which provides the high performance demands of current video, voice and audio processing, including video resolutions up to 1080p. The NXP iMX8M Mini CPU is produced in the 14nm LPC FinFET technology, which enables high operating frequencies in combination with a low power consumption.
The SOM-Trizeps-VIII-MX8M-Mini adds further features with the confi gurable FPGA, the programmable NXP Kinetis Cortex M0+ MCU, the LVDS transceiver, the Hi-Fi Audio Codec and the onboard WiFi/Bluetooth module. This integrates e.g. CAN, ADC, SPI, I2C interfaces as well as RBG and LVDS displays in addition to the iMX8M Mini CPU functionality."
Cpu
NXP i.MX 8M Mini Family based on ARM® Cortex®-A53 cores
+ general purpose Cortex®-M4 400MHz processor:
• i.MX 8M Mini Quad - Full featured, 4x Cortex®-A53 cores
up to 1.8GHz
• i.MX 8M Mini Dual - Full featured, 2x Cortex®-A53 cores
up to 1.8GHz
• i.MX 8M Mini Solo - Full featured, 1x Cortex®-A53 cores
up to 1.8GHz
• i.MX 8M Mini Quad Lite - 4x Cortex®-A53 cores up to 1.8GHz, no VPU
• i.MX 8M Mini Dual Lite - 2x Cortex®-A53 cores up to 1.8GHz, no VPU
• i.MX 8M Mini Solo Lite - 1x Cortex®-A53 cores up to 1.8GHz, no VPU
Optional: Programmable FPGA with up to 4300 LUTs to convert parallel display/camera/data-streams to MIPI DSI/CSI
Memory
Soldered down LPDDR4-3200 memory up to 8GB, 32-bit interface
Graphics
i.MX 8M Mini Family of processors:
Vivante GC320 2D accelerator + GCNanoUltra 3D
accelerator
OpenGL ES 2.0, OpenVG 1.1 support
Video Interfaces
MIPI display (4 channel) / Single- or Dual-LVDS, LCD 24 Bit RGB
Video Resolution
LVDS, MIPI: Up to 1920 x 1080p @60
Mass Storage
Onboard 4 Bit wide μSD Card Socket or onboard 8 Bit wide eMMC
Networking
1x GB Ethernet RGMII PHY and SIOP interface
Optional: WiFi 802.11 a/b/g/n/ac 2x2 MU-MIMO / Bluetooth 4.2/5.0
Usb
2x USB 2.0 OTG
Pci
PCIe
Audio
Audio Codec: Stereo Headphone output, Mono Speaker output, Stereo Line-In, Microphone input
Serial Ports
4x UART
Other Interfaces
4 Bit wide SDIO
SPDIF In/Out
I2S
Multichannel Serial-Audio-Interface
2x I2C
SPI
QSPI
GPIOs
PWM
MIPI CSI (4 channel)
Power Supply
3.3 VDC
Operating System
Linux Yocto, Debian / Android / Windows 10 IoT
Operating Temperature
-40 ÷ 85°C (industrial) / -25 ÷ 85°C (Extended Consumer) / 0 ÷ 70°C (Consumer)
Dimensions
67.6 x 36.7 x 6.4 mm
Produktvarianten / ZubehörBitte stellen Sie sicher, dass Sie stets die aktuellsten Version der Produktspezifikationen des Herstellers verwenden. Hersteller-Produktseite: SOM-Trizeps-VIII-MX8M-MiniMCTX Mobile & Embedded Computers GmbH IST UM DIE RICHTIGKEIT UND AKTUALITÄT DER DATEN AUF DIESER WEBSEITE BEMÜHT, ÜBERNIMMT JEDOCH KEINERLEI ZUSICHERUNG BEZÜGLICH DES INHALTS. EINE HAFTUNG ODER GARANTIE FÜR DIE AKTUALITÄT, RICHTIGKEIT UND VOLLSTÄNDIGKEIT DER ZUR VERFÜGUNG GESTELLTEN INFORMATIONEN IST FOLGLICH AUSGESCHLOSSEN.Technische Unterstützung & System Integration Services
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SECO
SOM-Trizeps-VIII-MX8M
SECO SOM-Trizeps-VIII-MX8M - Trizeps SODIMM SOM CPU-Modul The new SOM-Trizeps-VIII-MX8M uses the i.MX 8M processor from the NXP i.MX8 series. The CPU Computer on Module (CoM) provides the high performance demands of current video, voice, and audio processing, either for industrial or home automation, streaming audio applications, or for modern imaging devices.
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vertical-align: bottom;
}
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font-weight: bolder;}
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}
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color: #2b3136;
text-align: center;
text-decoration: none;
background-color: CornflowerBlue;}
li.menu-item a {display: block;
color: white;text-align: center;
text-decoration: none;
}
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background-color: #f7c13d;}
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background-color: CornflowerBlue;}
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#prod_var {
word-break: break-word;
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padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;
}
SECO SOM-Trizeps-VIII-MX8M - Trizeps SODIMM SOM CPU-ModulThe new SOM-Trizeps-VIII-MX8M uses the i.MX 8M processor from the NXP i.MX8 series. The CPU Computer on Module (CoM) provides the high performance demands of current video, voice, and audio processing, either for industrial or home automation, streaming audio applications, or for modern imaging devices.
Datenblatt
System Integration
ÜbersichtKey FeaturesNXP i.MX8M Applications ProcessorsIntegrated GPU with multi display support1x Gigabit Ethernet, WiFi/Bluetooth, 2x USB 3.0Up to 8 GB LPDDR4-3200 memorySpezifikation
Description
The new SOM-Trizeps-VIII-MX8M uses the i.MX 8M processor from the NXP i.MX8 series. The CPU Computer on Module (CoM) provides the high performance demands of current video, voice, and audio processing, either for industrial or home automation, streaming audio applications, or for modern imaging devices.
Cpu
NXP i.MX 8M Family based on ARM Cortex®-A53 cores + general purpose Cortex®-M4 processor:
• i.MX 8M Quad - 4x Cortex®-A53 cores up to 1.5GHz
• i.MX 8M Dual - 2x Cortex®-A53 cores up to 1.5GHz
• i.MX 8M QuadLite - 4x Cortex®-A53 cores up to 1.5GHz, no VPU
Optional: NXP™ Kinetis V Arm® Cortex-M0+ up to 75 MHz / 8x 16 Bit ADC, CAN, UART, SPI, GPIO
Optional: Programmable FPGA, up to 4300 LUTs to convert parallel display/camera/data-streams to MIPI DSI/CSI
Memory
Soldered down LPDDR4-3200 memory, 32-bit interface, up to 8GB
Graphics
Integrated Graphics Processing Unit, supports 2 independent displays.
Embedded VPU, supports HW decoding of HEVC,H.264, H.263, MPEG-4, MPEG-2, AVC, VC-1, RV, DivX, VP6, VP8, VP9, JPEG (not for i.MX8M QuadLite).
Supports OpenGL ES 3.1, Open CL 1.2, OpenGL 2.x, DirectX 11
Video Interfaces
HDMI v2.0a, MIPI display (4ch), Single-, Dual-LVDS or LCD 24 Bit RGB
Camera Interfaces: 8bit parallel, MIPI (4ch and additional 2ch)
Video Resolution
HDMI, MIPI: up to 4k resolution
Mass Storage
Onboard 4 Bit wide μSD Card Socket or onboard 8 Bit wide eMMC
Networking
1x GB Ethernet RGMII PHY and SIOP interface
Optional: WiFi 802.11 a/b/g/n/ac 2x2 MU-MIMO / Bluetooth 4.2/5.0
Usb
2x USB 3.0 OTG
Pci
1x PCIe
Audio
Audio Codec: Stereo Headphone output, Mono Speaker output, Stereo Line-In, Microphone input
Serial Ports
4x UART
Other Interfaces
SPDIF In/Out
I2S
Multichannel Serial-Audio-Interface
2x I2C
SPI
QSPI
GPIOs
PWM
Power Supply
3.3 VDC
Operating System
Linux Yocto, Debian / Android / Windows 10 IoT
Operating Temperature
-40 ÷ 85°C (industrial) / -25 ÷ 85°C (Extended Consumer) / 0 ÷ 70°C (Consumer)
Dimensions
67.6 x 36.7 x 6.4 mm
Produktvarianten / ZubehörBitte stellen Sie sicher, dass Sie stets die aktuellsten Version der Produktspezifikationen des Herstellers verwenden. Hersteller-Produktseite: SOM-Trizeps-VIII-MX8MMCTX Mobile & Embedded Computers GmbH IST UM DIE RICHTIGKEIT UND AKTUALITÄT DER DATEN AUF DIESER WEBSEITE BEMÜHT, ÜBERNIMMT JEDOCH KEINERLEI ZUSICHERUNG BEZÜGLICH DES INHALTS. EINE HAFTUNG ODER GARANTIE FÜR DIE AKTUALITÄT, RICHTIGKEIT UND VOLLSTÄNDIGKEIT DER ZUR VERFÜGUNG GESTELLTEN INFORMATIONEN IST FOLGLICH AUSGESCHLOSSEN.Technische Unterstützung & System Integration Services
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SECO
SOM-Trizeps-VII-MX6
SECO SOM-Trizeps-VII-MX6 - Trizeps SODIMM SOM CPU-Modul The SOM-Trizeps-VII-MX6 is one of the world‘s most powerful NXP i.MX6 CPU Computer on Modules (CoM) and is suitable for multimedia, multitouch and multidisplay applications as well as for demanding control tasks. It uses the full performance potential of the NXP i.MX6 processor with the compact form factor of the SODIMM 200 standard.
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SECO SOM-Trizeps-VII-MX6 - Trizeps SODIMM SOM CPU-ModulThe SOM-Trizeps-VII-MX6 is one of the world‘s most powerful NXP i.MX6 CPU Computer on Modules (CoM) and is suitable for multimedia, multitouch and multidisplay applications as well as for demanding control tasks. It uses the full performance potential of the NXP i.MX6 processor with the compact form factor of the SODIMM 200 standard.
Datenblatt
System Integration
ÜbersichtKey FeaturesNXP i.MX6 Applications Processors, Solo up to QuadCoreVivante GC3500 2D accelerator + Vivante GC2000 3D accelerator1x 100/1000 Megabit Ethernet, WiFi/Bluetooth, USB 2.0, PCIe, HDMIUp to 2 GB LPDDR3-1066 RAM memory, 64 BitSpezifikation
Description
The SOM-Trizeps-VII-MX6 is one of the world‘s most powerful NXP i.MX6 CPU Computer on Modules (CoM) and is suitable for multimedia, multitouch and multidisplay applications as well as for demanding control tasks. It uses the full performance potential of the NXP i.MX6 processor with the compact form factor of the SODIMM 200 standard.
Cpu
NXP i.MX M6 Family based on ARM® Cortex®-A9 cores
• i.MX 6Solo - 1x Cortex®-A9 core up to 1.0GHz
• i.MX 6DualLite - 2x Cortex®-A9 cores up to 1.0GHz
• i.MX 6Dual - 2x Cortex®-A9 cores up to 1.0GHz
• i.MX 8Quad - 4x Cortex®-A9 cores up to 1.0GHz
Memory
Soldered down LPDDR3-1066 memory up to 2 GB, 64-bit interface
Graphics
Vivante GC3500 2D Hardware accelerator
Vivante GC2000 3D Hardware accelerator, supports OpenGL® ES 2.0 3D
Dedicated Vector Graphics accelerator, supports OpenVG™ (only i.MX 6Dual and i.MX 6Quad)
Supports up to 3 independent displays with i.MX 6Dual and i.MX 6Quad
Supports 2 independent displays with i.MX 6DualLite and i.MX 6Solo
Video Interfaces
HDMI v1.4, 2x LVDS, LCD 24 Bit RGB, MIPI
Video Resolution
LVDS, up to 1920x1200
HDMI, up to 1080p
Mass Storage
Onboard 4 Bit wide μSD Card Socket or onboard 8 Bit wide eMMC
Networking
1x 100 Mbit Ethernet RGMII PHY or 1000 Mbit Ethernet RGMII interface
Optional: WiFi 802.11 a/b/g/n/e/i/h/d/k/r/w, Bluetooth 3.0+ EDR
Usb
1x USB 2.0 OTG and 1x USB 2.0 Host
Pci
1x PCIe
Audio
AC‘97 Audio Codec with 4/5 wires res. Touch and 4x 12 Bit ADC (2x comparator inputs for battery monitoring); Stereo: Line-in, Mic-in, Speaker-out, Headphone out
Serial Ports
3x UART
Other Interfaces
2x FlexCAN
S-ATAII
2x 4 Bit wide SDIO
RTC
SPDIF
Adress-Data-Bus
2x I2C
2x SPI
GPIOs
2x PWM
Power Supply
3.3 VDC
Operating System
Linux / Android / Windows Embedded Compact 7, 2013, Windows 10 IoT Core
Operating Temperature
-40 ÷ 85°C (industrial) / -25 ÷ 85°C (Extended Consumer) / 0 ÷ 70°C (Consumer)
Dimensions
67.6 x 36.7 x 6.4 mm
Produktvarianten / ZubehörBitte stellen Sie sicher, dass Sie stets die aktuellsten Version der Produktspezifikationen des Herstellers verwenden. Hersteller-Produktseite: SOM-Trizeps-VII-MX6MCTX Mobile & Embedded Computers GmbH IST UM DIE RICHTIGKEIT UND AKTUALITÄT DER DATEN AUF DIESER WEBSEITE BEMÜHT, ÜBERNIMMT JEDOCH KEINERLEI ZUSICHERUNG BEZÜGLICH DES INHALTS. EINE HAFTUNG ODER GARANTIE FÜR DIE AKTUALITÄT, RICHTIGKEIT UND VOLLSTÄNDIGKEIT DER ZUR VERFÜGUNG GESTELLTEN INFORMATIONEN IST FOLGLICH AUSGESCHLOSSEN.Technische Unterstützung & System Integration Services
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SECO
SOM-SMARC-ZU
SECO SOM-SMARC-ZU - SMARC CPU-Modul mit Xilinx® Zynq The SOM-SMARC-ZU is a SMARC Rel. 2.0 compliant Computer on Module (CoM) with the Zynq® Ultrascale+™ MPSoC. Delivering flexibile ARM + FPGA Heterogeneous processing in a standard form factor, this solution is able to merge wide scalability, from cost effec
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SECO SOM-SMARC-ZU - SMARC CPU-Modul mit Xilinx® ZynqThe SOM-SMARC-ZU is a SMARC Rel. 2.0 compliant Computer on Module (CoM) with the Zynq® Ultrascale+™ MPSoC. Delivering flexibile ARM + FPGA Heterogeneous processing in a standard form factor, this solution is able to merge wide scalability, from cost effec
Datenblatt
Handbuch
System Integration
ÜbersichtKey FeaturesCPUZynq Ultrascale+ CG/EG/EV MPSoCs in C784 packageIntegrated ARM Mali-400 MP2 GPUPCI-e x4, 2x GbE, 2x CAN Bus, 2x SPI, 12x GPI/OsUp to 8GB + 2GB DDR4 soldered downXilinx® Zynq® Ultrascale+™ ZU2CG, ZU3CG, ZU4CG or ZU5CG MPSoCs: Dual-core ARM® Cortex®-A53 MPCore Application Processing Unit +Dual-core ARM® Cortex®-R5 Real-Time Processing Unit Xilinx® Zynq® Ultrascale+™ ZU2EG, ZU3EG, ZU4EG, ZU5EG, ZU4EV or ZU5EV MPSoCs: Quad-core ARM® Cortex®-A53 MPCore Application Processing Unit +Dual-core ARM® Cortex®-R5 Real-Time Processing Unit Spezifikation
Description
The SOM-SMARC-ZU is a SMARC Rel. 2.0 compliant Computer on Module (CoM) with the Zynq® Ultrascale+™ MPSoC. Delivering flexibile ARM + FPGA Heterogeneous processing in a standard form factor, this solution is able to merge wide scalability, from cost effective Dual-Core to high performance Quad-Core ARM® Cortex®-A53 MPSoCs with GPU/VCU, and extreme flexibility (up to 256k FPGA logic cells). It also features dedicated Real-Time ARM® Cortex®-R5 processors, along with LVDS and DP video interfaces up to 4K resolution and high-speed interfaces.
Cpu
Zynq® Ultrascale+™ ZU2CG, ZU3CG, ZU4CG or ZU5CG MPSoCs:
Dual-core ARM® Cortex®-A53 MPCore Application Processing Unit +Dual-core ARM® Cortex®-R5 Real-Time Processing Unit
Zynq® Ultrascale+™ ZU2EG, ZU3EG, ZU4EG, ZU5EG, ZU4EV or ZU5EV MPSoCs:
Quad-core ARM® Cortex®-A53 MPCore Application Processing Unit +Dual-core ARM® Cortex®-R5 Real-Time Processing Unit
Memory
Soldered Down DDR4-2400 memory
Up to 8GB for Processing System Unit + up to 2GB for Programmable Logic
Graphics
Only on EG and EV MPSOcs:
Integrated ARM Mali-400 MP2 Graphics Processing Unit
Multicore 2D/3D acceleration at 667MHz
OpenGL ES 1.1 / 2.0, OpenVG 1.0 / 1.1
On EV MPSoCs only, H.264/H.265 integrated video codec
Video Interfaces
18- / 24-bit Dual Channel LVDS interface
DP interface
2 x CSI interfaces
Video Resolution
DP Up to 4096 x 2160
LVDS Dependent on the IP implemented in the programmable logic
Mass Storage
1 x external S-ATA Gen3 Channel
SD interface
QSPI Flash soldered-onboard
Optional eMMC 4.51 drive soldered on-board
Networking
Up to 2 x Gigabit Ethernet interfaces
Usb
1x USB 2.0 OTG
2x USB 2.0 Host
2x USB 3.0 Host
Pci
PCI-e x4 interface
Audio
Dependent on the IP implemented in the programmable logic
Serial Ports
2 x UART Tx/Rx/RTS/CTS
2 x UART Tx/Rx
2 x CAN Bus
Other Interfaces
2 x I2C Bus
2 x SPI interfaces
12 x GPI/Os
Boot select signals
Power Management Signals
Power Supply
+3÷+5.25VDC
+3.3V_RTC
Operating System
Linux
Android
Operating Temperature
0°C ÷ +60°C (Commercial version)
-40°C ÷ +85°C (Industrial version)
*Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensions
50 x 82 mm (1.97” x 3.23”)
Produktvarianten / ZubehörRB71-7522-1300-C0-VSMARC with CPU ZU4EV Quad Core+GPU+VCU 1,30GHz Zynq Ultrascale+, PS DRAM 2 GB, PL DRAM 512M, eMMC 8 GB, SecondGigabit Ethernet SGMII, Clock Generator Si510 148.5 MHz - Comm. Temp.RB71-C504-0000-I0-VSMARC con CPU ZU4EG Quad Core+GPU 1,30GHz Xilinx Zynq Ultrascale+, PS DRAM 2 GB, eMMC 4 GB - Ind.Temp.Bitte stellen Sie sicher, dass Sie stets die aktuellsten Version der Produktspezifikationen des Herstellers verwenden. Hersteller-Produktseite: SOM-SMARC-ZUMCTX Mobile & Embedded Computers GmbH IST UM DIE RICHTIGKEIT UND AKTUALITÄT DER DATEN AUF DIESER WEBSEITE BEMÜHT, ÜBERNIMMT JEDOCH KEINERLEI ZUSICHERUNG BEZÜGLICH DES INHALTS. EINE HAFTUNG ODER GARANTIE FÜR DIE AKTUALITÄT, RICHTIGKEIT UND VOLLSTÄNDIGKEIT DER ZUR VERFÜGUNG GESTELLTEN INFORMATIONEN IST FOLGLICH AUSGESCHLOSSEN.Technische Unterstützung & System Integration Services
Alle Dokumente auf dieser Seite werden ohne Benachrichtigung aktualisiert.DatenblattHandbuch
Preis auf Anfrage