COM-HPC®
SECO
SOM-COM-HPC-A-TGL-UP3
SECO SOM-COM-HPC-A-TGL-UP3 - COM-HPC CPU Module with Intel® Tiger Lake COM-HPC® Client Computer on Module (CoM) Size A with 11th Gen Intel® Core™ and Celeron® (Codename: Tiger Lake-UP3) Processors.
(CARINA - C77)
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SECO SOM-COM-HPC-A-TGL-UP3 - COM-HPC CPU Module with Intel® Tiger LakeCOM-HPC® Client Computer on Module (CoM) Size A with 11th Gen Intel® Core™ and Celeron® (Codename: Tiger Lake-UP3) Processors.
(CARINA - C77)
Datasheet
System Integration
OverviewKey FeaturesSupported CPUs11th Gen Intel Core processors and Intel Celeron processorsIntel Iris Xe Graphics Core Gen12 GPU with up to 96 EU, up to 4 independent displays4x USB 4.0 / USB 3.2, 4x USB 2.0, 8x PCI-e x1 Gen3 , 1x PCI-e x4 Gen4, up to 2x 2.5GbETwo DDR4 SO-DIMM Slots supporting DDR4-3200 ECC Memory
CPU-Product Family: Intel® Tiger Lake
Intel® Core™ i7-1185GRE (12M Cache, up to 4.40 GHz)Intel® Core™ i7-1185G7E (12M Cache, up to 4.40 GHz)Intel® Core™ i5-1145GRE (8M Cache, up to 4.10 GHz)Intel® Core™ i5-1145G7E (8M Cache, up to 4.10 GHz)Intel® Core™ i3-1115GRE (6M Cache, up to 3.90 GHz)Intel® Core™ i3-1115G4E (6M Cache, up to 3.90 GHz)Intel® Celeron® 6305E (4M Cache, 1.80 GHz)CPU-Variants
CPU
Processor Number
Cache
Total Cores
Total Threads
Max Turbo Frequency
Intel® Core™ i7-1185GRE
i7-1185GRE
12 MB Intel® Smart Cache
4
8
4.40 GHz
Intel® Core™ i7-1185G7E
i7-1185G7E
12 MB Intel® Smart Cache
4
8
4.40 GHz
Intel® Core™ i5-1145GRE
i5-1145GRE
8 MB Intel® Smart Cache
4
8
4.10 GHz
Intel® Core™ i5-1145G7E
i5-1145G7E
8 MB Intel® Smart Cache
4
8
4.10 GHz
Intel® Core™ i3-1115GRE
i3-1115GRE
6 MB Intel® Smart Cache
2
4
3.90 GHz
Intel® Core™ i3-1115G4E
i3-1115G4E
6 MB Intel® Smart Cache
2
4
3.90 GHz
Intel® Celeron® 6305E
6305E
4 MB Intel® Smart Cache
2
2
Specification
Description
COM-HPC® Client Computer on Module (CoM) Size A with 11th Gen Intel® Core™ and Celeron® (formerly Tiger Lake-UP3) Processors
Cpu
11th Generation Intel® Core™ and Celeron® Processors, also available in industrial temperature range
• Intel® Core™ i7-1185G7E, Quad Core @ 2.8GHz (4.4GHz in Turbo Boost) with HT, 12MB Cache, 28/15/12W cTDP
• Intel® Core™ i5-1145G7E, Quad Core @ 2.6GHz (4.1GHz in Turbo Boost) with HT, 8MB Cache, 28/15/12W cTDP
• Intel® Core™ i3-1115G4E, Dual Core @ 3.0GHz (3.9GHz in Turbo Boost) with HT, 6MB Cache, 28/15/12W cTDP
• Intel® Celeron® 6305E, Dual Core @1.8GHz, 4MB Cache, 15W TDP
• Intel® Core™ i7-1185GRE, Quad Core @ 2.8GHz (4.4GHz in Turbo Boost) with HT, 12MB Cache, with IBECC and Functional Safety Essential Design package, 28/15/12W cTDP – Industrial (w/ Turbo OFF)
• Intel® Core™ i5-1145GRE, Quad Core @ 2.6GHz (4.1GHz in Turbo Boost) with HT, 8MB Cache, with IBECC and Functional Safety Essential Design package, 28/15/12W cTDP - Industrial (w/ Turbo OFF)
•Intel® Core i3-1115GRE, Dual Core @ 3.0GHz (3.9GHz in Turbo Boost) with HT, 6MB Cache, 28/15/12W cTDP - Industrial (w/ Turbo OFF)
Max Cores
4
Memory
2x DDR4-3200 SODIMM Slots with IBECC (In-Band Error Correction Code), up to 64GB supported
Graphics
Integrated Iris Xe Graphics Core Gen12 architecture, with up to 96 Execution Units
MPEG2, WMV9, AVC/H.264, JPEG/MJPEG, HEVC/H.265, VP9, AV1 HW decoding, up to 8k @60.
AVC/H.264, HEVC/H.265, JPEG, VP9 HW encoding
Support up to 4 independent displays.
Video Interfaces
1x eDP 1.4b or MIPI_DSI 1.3
Up to 3x DP++ interface, supporting Display Port 1.4a and HDMI 2.0b
Up to 4x Display Port over Type-C (Alternate mode)
Video Resolution
DP, eDP: Up to 5120x3200 @60Hz 24bpp / 7680x4320@60Hz 30bpp with DSC
MIPI-DSI: Up to 3200x2000 @60Hz 24 bpp, 5120x3200 @60Hz 24bpp with DSC
HDMI 1.4: Up to 4Kx2K 24-30Hz 24bpp
HDMI 2.0b: Up to 4Kx2K 48-60Hz 24bpp / 4Kx2K 48-60Hz 12bpc (need dedicated redriver on carrier board)
Mass Storage
2 x S-ATA Gen3 Channels
PCI-e x4 port can be used to connect, on the carrier board,
M.2 NVMe drives
Networking
Up to 2x NBase-T Ethernet interfaces, supporting 2.5Gb Ethernet connection, managed by as many Intel® i225 2.5GbE Controllers
M.2 1216 SD Module supporting WiFi 802.11abgn+ac R2
MIMO 2x2 + MU-MIMO and Bluetooth 5.0
Usb
Up to 4 x USB 4.0 / USB 3.2 Host ports
4 x USB 2.0 Host port
Pci
1x PCI-e x4 Gen 4 port
Up to 8x PCI-e Gen 3 lanes, groupable to support up to 4 root ports (5 root ports without the second 2.5GbE controller)
Audio
SoundWire and I2S Audio Interface
Serial Ports
2 x UARTs
Other Interfaces
2x 4-lane CSI-2 interfaces, optional
SPI, SM Bus, 2x I2C, Watchdog timer, Carrier board FAN Control
Management signals, ACPI signals, Safety Status signals
Deep Sleep / Battery support
Optional TPM 2.0 module on-board
12x GPIOs
Power Supply
+8VDC .. +20VDC Main power supply
+5V stand-by
Operating System
Windows 10 IoT Enterprise LTSC
Linux Kernel LTS
Yocto
VxWorks 7.0
Android
Operating Temperature
0°C ÷ +60°C (Commercial version)
-40°C ÷ +85°C (Industrial version)
*Measured at any point of SECO standard heatspreader for this product, during
any and all times (including start-up). Actual temperature will widely depend on
application, enclosure and/or environment. Upon customer to consider applicationspecific
cooling solutions for the final system to keep the heatspreader temperature
in the range indicated.
Dimensions
120 x 95 mm (Com HPC Size A Form factor, Client pinout)
Product Variants / AccessoriesHC77-1000-1120-C2COM-HPC - CARINA w/Intel® Core™ i5-1145G7E, Quad Core @ 2.6GHz (4.1GHz in Turbo Boost), 8MB Cache, 28/15/12W cTDP, TPM 2.0, 8xPCI-e Gen 3, 1x eDP, 1x DP++, 4x USB 4.0, Comm. Temp.HC77-2000-1120-I2COM-HPC - CARINA w/Intel® Core™ i7-1185GRE, Quad Core @ 2.8GHz (4.4GHz in Turbo Boost) 12MB Cache, with IBECC and FuSa, 28/15/12W cTDP, TPM 2.0, 8x PCI-e Gen 3, 1x eDP, 1x DP++, 4x USB 4.0, Ind. Temp.HC77-3000-1120-C2HPC - CARINA w/Intel® Core™ i7-1185G7E, Quad Core @ 2.8GHz (4.4GHz in Turbo Boost), 12MB Cache, 28/15/12W cTDP, TPM 2.0, 8x PCI-e Gen 3, 1x eDP, 1x DP++, 4x USB 4.0, Comm. Temp.HC77-3000-2101-C2COM-HPC - CARINA w/Intel® Core™ i7-1185G7E, Quad Core @ 2.8GHz (4.4GHz in Turbo Boost), 12MB Cache, 28/15/12W cTDP, 8x PCI-e Gen 3, 1x eDP, 3x DP++, 2x USB 4.0, Comm. Temp.HC77-4000-1120-C2HPC - CARINA w/Intel® Celeron® 6305E, Dual Core @1.8GHz, 4MB Cache, 15W TDP, TPM 2.0, 8x PCI-e Gen 3, 1x eDP, 1x DP++, 4x USB 4.0, Comm. Temp.HC77-5000-1120-I2COM-HPC - CARINA w/ Intel® Core™ i5-1145GRE, Quad Core @ 2.6GHz (4.1GHz in Turbo Boost), 8MB Cache, with IBECC and FuSa, 28/15/12W cTDP, TPM 2.0, 8x PCI-e Gen 3, 1x eDP, 1x DP++, 4x USB 4.0, Ind. Temp.HC77-6000-1120-C2HPC - CARINA w/ Intel® Core™ i3-1115G4E, Dual Core @ 3.0GHz (3.9GHz in Turbo Boost), 6MB Cache, 28/15/12W cTDP, TPM 2.0, 8x PCI-e Gen 3, 1x eDP, 1x DP++, 4x USB 4.0, Comm. Temp.HC77-7000-1120-I2COM-HPC - CARINA w/Intel® Core i3-1115GRE, Dual Core @ 3.0GHz (3.9GHz in Turbo Boost), 6MB Cache, 28/15/12W cTDP, TPM 2.0, 8x PCI-e Gen 3, 1x eDP, 1x DP++, 4x USB 4.0, Ind. Temp.All data is for information purposes only. The specification is subject to change without notice in advance. Any configuration other than original product specification is not guaranteed. Although all the information contained within this website is carefully checked, no guarantee of correctness is implied or expressed.Please always double-check the latest version of the product specification of the product manufacturer. Manufacturer Product Website: SOM-COM-HPC-A-TGL-UP3Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with MCTX Mobile & Embedded Computers GmbH.OEM System Integration Support
All documents found on this page are subject to change without notification. Always ensure that you work with the latest version.Datasheet
Price on request
SECO
SOM-COM-HPC-A-TGL-H
SECO SOM-COM-HPC-A-TGL-H - COM-HPC CPU Module with Intel® Tiger Lake COM-HPC® Client Computer on Module (CoM) Size A with 11th Gen Intel® Xeon® W-11000E Series, Core™ vPro® and Celeron® (Codename: Tiger Lake-H) Processors for FuSa applications.
(LAGOON - D57)
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SECO SOM-COM-HPC-A-TGL-H - COM-HPC CPU Module with Intel® Tiger LakeCOM-HPC® Client Computer on Module (CoM) Size A with 11th Gen Intel® Xeon® W-11000E Series, Core™ vPro® and Celeron® (Codename: Tiger Lake-H) Processors for FuSa applications.
(LAGOON - D57)
Datasheet
System Integration
OverviewKey FeaturesSupported CPUs11th Gen Intel Xeon, Core and Celeron processorsIntel Iris Xe Graphics Core Gen12 GPU with up to 32, EU, up to 4 independent displays2x USB 4, 2x USB 3.2 Gen 2x2, 8x USB 2.0, 20x PCI-e, Gen3 lanes, 20x PCI-e Gen4 lanes, up to 2x 2.5GbETwo DDR4 SO-DIMM Slots supporting DDR4-3200, ECC Memory
CPU-Product Family: Intel® Tiger Lake
Intel® Xeon® W-11865MRE (24M Cache, up to 4.70 GHz)Intel® Xeon® W-11865MLE (24M Cache, up to 4.50 GHz)Intel® Xeon® W-11555MRE (12M Cache, up to 4.50 GHz)Intel® Xeon® W-11555MLE (12M Cache, up to 4.40 GHz)Intel® Xeon® W-11155MRE (8M Cache, up to 4.40 GHz)Intel® Xeon® W-11155MLE (8M Cache, up to 3.10 GHz)Intel® Core™ i7-11850HE (24M Cache, up to 4.70 GHz)Intel® Core™ i5-11500HE (12M Cache, up to 4.50 GHz)Intel® Core™ i3-11100HE (8M Cache, up to 4.40 GHz)Intel® Celeron® 6600HE (8M Cache, up to 2.60 GHz)CPU-Variants
CPU
Processor Number
Cache
Total Cores
Total Threads
Max Turbo Frequency
Intel® Core™ i7-11850HE
i7-11850HE
24 MB Intel® Smart Cache
8
16
4.70 GHz
Intel® Core™ i5-11500HE
i5-11500HE
12 MB Intel® Smart Cache
6
12
4.50 GHz
Intel® Core™ i3-11100HE
i3-11100HE
8 MB Intel® Smart Cache
4
8
4.40 GHz
Intel® Xeon® W-11865MRE
W-11865MRE
24 MB Intel® Smart Cache
8
16
4.70 GHz
Intel® Xeon® W-11865MLE
W-11865MLE
24 MB Intel® Smart Cache
8
16
4.50 GHz
Intel® Xeon® W-11555MRE
W-11555MRE
12 MB Intel® Smart Cache
6
12
4.50 GHz
Intel® Xeon® W-11555MLE
W-11555MLE
12 MB Intel® Smart Cache
6
12
4.40 GHz
Intel® Xeon® W-11155MRE
W-11155MRE
8 MB Intel® Smart Cache
4
8
4.40 GHz
Intel® Xeon® W-11155MLE
W-11155MLE
8 MB Intel® Smart Cache
4
8
3.10 GHz
Intel® Celeron® 6600HE
6600HE
8 MB Intel® Smart Cache
2
2
Specification
Description
COM-HPC® Client Computer on Module (CoM) Size A with 11th Gen Intel® Xeon® W-11000E Series, Core™ vPro® and Celeron® (formerly Tiger Lake-H) Processors for FuSa applications
Cpu
11th Generation Intel® Xeon®, Core™ and Celeron® Processors, also available in industrial temperature range.
• Intel® Core™ vPRO® i7-11850HE, Eight Core @ 2.6GHz (up to 4.7GHz in Turbo Boost) with HT, 24MB Cache L3, 45/35W cTDP
• Intel® Core™ vPRO® i5-11500HE, Six Core @ 2.6GHz (up to 4.5GHz in Turbo Boost) with HT, 12MB L3 Cache, 45/35W cTDP
• Intel® Core™ i3-11100HE, Quad Core @ 2.4GHz (up to 4.4GHz in Turbo Boost) with HT, 8MB L3 Cache, 45/35W cTDP
• Intel® Celeron® 6600HE, Dual Core @2.6GHz, 8MB L3 Cache, 35W TDP
• Intel® Xeon® vPRO® W-11865MRE, Eight Core @ 2.6GHz (up to 4.7GHz in Turbo Boost) with HT, 24MB L3 Cache, with ECC, TCC/TSN and Functional Safety Essential Design package, 45/35W cTDP – Industrial (w/ Turbo OFF)
• Intel® Xeon® vPRO® W-11555MRE, Six Core @ 2.6GHz (up to 4.5GHz in Turbo Boost) with HT, 12MB L3 Cache, with ECC, TCC/TSN and Functional Safety Essential Design package, 45/35W cTDP – Industrial (w/ Turbo OFF)
• Intel® Xeon® W-11155MRE, Quad Core @ 2.4GHz (up to 4.4GHz in Turbo Boost) with HT, 8MB L3 Cache, with ECC and TCC/TSN, 45/35W cTDP – Industrial (w/ Turbo OFF)
• Intel® Xeon® vPRO® W-11865MLE, Eight Core @ 1.5GHz (up to 4.5GHz in Turbo Boost) with HT, 24MB L3 Cache, with ECC and TCC/TSN, 25W TDP
• Intel® Xeon® vPRO® W-11555MLE, Six Core @ 1.9GHz (up to 4.4GHz in Turbo Boost) with HT, 24MB L3 Cache, with ECC and TCC/TSN, 25W TDP
• Intel® Xeon® W-11155MLE, Quad Core @ 1.8GHz (up to 3.1GHz in Turbo Boost) with HT, 24MB L3 Cache, with ECC and TCC/TSN, 25W TDP B Cache, 28/15/12W cTDP - Industrial (w/ Turbo OFF)
Max Cores
8
Memory
2x DDR4-3200 SODIMM Slots with ECC (In-Band Error
Correction Code), up to 64GB supported
Graphics
Integrated Iris Xe Graphics Core Gen12 architecture, with up to
32 Execution Units and up to 2 VDbox
MPEG2, WMV9, AVC/H.264, JPEG/MJPEG, HEVC/H.265, VP9,
AV1 HW decoding, up to 8k60.
AVC/H.264, HEVC/H.265, JPEG, VP9 HW encoding, up to 8k30
Support up to 4 independent displays.
Video Interfaces
1x eDP 1.4b or MIPI_DSI 1.3
Up to 3x DP++ interface, supporting Display Port 1.4a and
HDMI 2.0b
Up to 2x Display Port over Type-C (Alternate mode)
Video Resolution
DP, eDP:
Up to 5120x3200 @60Hz 24bpp /
7680x4320@60Hz 30bpp with DSC
MIPI-DSI:
Up to 3200x2000 @60Hz 24bpp, 5120x3200
@60Hz 24bpp with DSC
HDMI 1.4:
Up to 4Kx2K 24-30Hz 24bpp
HDMI 2.0b:
Up to 4Kx2K 48-60Hz 24bpp / 4Kx2K 48-
60Hz 12bpc (need dedicated redriver on
carrier board)
Mass Storage
2 x S-ATA Gen3 Channels
PCI-e x4 port can be used to connect, on the carrier board,
M.2 NVMe drives
Networking
Up to 2x NBase-T Ethernet interfaces, supporting 2.5Gb
Ethernet connection, managed by as many Intel® i225 2.5GbE
Controllers with TSN
Usb
2x USB4 ports
2x USB 3.2 Gen 2x2 ports
8 x USB 2.0 Host ports
Pci
1x PCI-e x4 Gen 4 port for NVME
16x PCI-e Gen4 lanes, can be used to support 1x PCI-e x16,
2x PCI-e x8 or (1x PCI-e x8 +2x PCI-e x4) root ports
20x PCI-e Gen 3 lanes, groupable to support up to 12 root
ports, max allowed grouping PCI-e x4
Audio
SoundWire and I2S Audio Interface
Serial Ports
2x legacy UARTs, managed by the Embedded Controller
Other Interfaces
2x 4-lane CSI-2 interfaces, optional
SPI, eSPI, SM Bus, 2x I2C, Watchdog timer, Carrier board
FAN Control
Management signals, ACPI signals, Safety Status signals
Deep Sleep / Battery support
Optional TPM 2.0 module on-board
12x GPIOs
Power Supply
+8VDC .. +20VDC Main power supply
+5V stand-by
Operating System
Windows 10 IoT Enterprise LTSC
Linux Kernel LTS
Yocto Project 3.0
WindRiver VxWorks 7.0
Android
Operating Temperature
0°C ÷ +60°C (Commercial version)
-40°C ÷ +85°C (Industrial Range)
Dimensions
120 x 95 mm (COM-HPC® Size A Form factor, Client pinout)
Product Variants / AccessoriesAll data is for information purposes only. The specification is subject to change without notice in advance. Any configuration other than original product specification is not guaranteed. Although all the information contained within this website is carefully checked, no guarantee of correctness is implied or expressed.Please always double-check the latest version of the product specification of the product manufacturer. Manufacturer Product Website: SOM-COM-HPC-A-TGL-HProduct names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with MCTX Mobile & Embedded Computers GmbH.OEM System Integration Support
All documents found on this page are subject to change without notification. Always ensure that you work with the latest version.Datasheet
Price on request
SECO
SOM-COM-HPC-A-ADL-P
SECO SOM-COM-HPC-A-ADL-P - COM-HPC CPU Module COM-HPC® Client Computer on Module (CoM) Size A with 12th Gen Intel® Core™ (Codename: Alder Lake - P series) Processors.
(ORION - D80)
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font-weight: bolder;
}
.product-menu-page {
display: none;
}
.product-menu-page:target {
display: block;
}
.head_sec {
background-color: #e9e9f0;
}
.col_a {
background-color: #798490;
}
.head_subsec {color: CornflowerBlue;
padding-top: 10px;padding-right: 25px;
vertical-align: bottom;
}
.chead {
border: 1px solid Lavender;
font-size: 90%;
font-weight: bolder;}
.ckey {
width: 25%;white-space: nowrap;text-align: left;font-size: 90%;
font-weight: bolder;
border: 1px solid Lavender;}
.copt {
width: 25%;text-align: left;font-size: 90%;
font-weight: bolder;
border: 1px solid Lavender;}
.cval {
width: auto;text-align: left;
border: 1px solid Lavender;
word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;}
.rowspecsim {
font-size: 110%;
white-space: nowrap;text-align: left;
}
.column_1 {
width: 250px;white-space: nowrap;text-align: left;
}
.column_2 {
width: 250px;white-space: nowrap;text-align: left;
}
ul.menu {
list-style-type: none;
margin: 0;
padding: 0;background-color: #798490;overflow: hidden;font-family: 'Ubuntu', sans-serif;
}
li.menu-item {float: left;padding: 0px 16px;
}
ul.menu li.selected a {
display: block;
color: #2b3136;
text-align: center;
text-decoration: none;
background-color: CornflowerBlue;}
li.menu-item a {display: block;
color: white;text-align: center;
text-decoration: none;
}
li.menu-item a:hover {
color: white;
background-color: #f7c13d;}
.li.menu-item a:active {color: #2b3136;
font-weight: bolder;
background-color: CornflowerBlue;}
table {
margin-top: 10px;
width: 100%;
border-collapse: collapse;
table-layout: fixed;
}
th, td {
border: 1px solid White;text-align: left;
word-break: break-word;
font-size: 100%;
line-height: 1.5;
padding-top: 5px;
padding-left: 10px;
padding-bottom: 5px;
}
th {
font-size: 90%;
padding-left: 25px;
}
td {
word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;
}
#prod_kf {
font-size: 100%;width: 100%;}
#prod_spec {
font-size: 100%;word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;
}
#prod_disc {
font-size: 90%;
width: 100%;}
#prod_cpo {font-size: 90%;
width: 100%;
}
#prod_var {
word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;
}
SECO SOM-COM-HPC-A-ADL-P - COM-HPC CPU ModuleCOM-HPC® Client Computer on Module (CoM) Size A with 12th Gen Intel® Core™ (Codename: Alder Lake - P series) Processors.
(ORION - D80)
Datasheet
System Integration
OverviewKey Features12th Gen Intel Core processors (Codename: Alder Lake P series)Intel Iris Xe Architecture with up to 96 EUs, up to 4 independent displays2x 2.5GbE, 4x USB4 Gen 2x2, 4x USB2.0, 8x PCIe x1 Gen3, 1x PCIe x8 or 2x PCIe x4 Gen4, Optional on-board WiFi 6E + BT 5.2Two DDR5 SO-DIMM Slots supporting DDR5-4800 MemorySpecification
Description
COM-HPC® Client Computer on Module (CoM) Size A with 12th Gen Intel® Core™ (formerly Alder Lake - P series) Processors
Cpu
12th Gen Intel® Core™ processors, up to 14 cores & up to 20 threads, up to 24MB cache, 45W TDP (35W cTDP)
Max Cores
14
Memory
2x DDR5-4800 SODIMM Slots, up to 64GB
Graphics
Integrated Iris® Xe Architecture, up to 96 Execution Units
Up to two video decode boxes (VDBoxes) for enhanced video stream capabilities
Support for up to 48 simultaneous 1080p streams ingestion
Support for up to four independent displays at up to 4K60 HDR resolution or one display at 8K resolution
Video Interfaces
3x DDI ports supporting DP 1.4, HDMI 2.0b (HDMI 2.1 via LSPCON)
1x eDP 1.4b interface
4x DP interface on USB Type-C connector (Alternate mode)
Video Resolution
DP:Up to 5120x3200 @60Hz 24bpp / 7680x4320@60Hz 30bpp with DSC
eDP: Up to 5120x3200 @60Hz 24bpp / 5120x3200@120Hz 30bpp with DSC
HDMI 1.4: Up to 4Kx2K 24-30Hz 24bpp
HDMI 2.1:Up to 4Kx2K 48-60Hz 24bpp / 4Kx2K 48-60Hz 12bpc (need dedicated redriver on carrier board)
Mass Storage
2x external SATA Gen3 Channels
PCI-e x4 ports can be used to connect, on the carrier board,
M.2 NVMe drives
Networking
2x NBase-T Ethernet interfaces, supporting 2.5Gb Ethernet connection, managed by as many Intel® i225 2.5GbE Controllers
Optional on-board M.2 1216 module, supporting WiFi 802.11ax (WiFi 6E) MIMO 2x2 + MU-MIMO and Bluetooth 5.2, external antennas*
*Certification upon request
Usb
Up to 4 x USB4 Gen 2x2 Host ports
4 x USB 2.0 Host port
Pci
Up to 8x PCIe x1 Gen3 lanes
1x PCIe x8 Gen4 port
2x PCIe x4 Gen4 ports
Audio
SoundWire and I2S Audio Interface
Serial Ports
2 x UARTs
Other Interfaces
2x 4-lane CSI-2 interfaces
SPI, SM Bus, 2x I2C, Watchdog timer, Carrier board FAN Control
Management signals, ACPI signals, Safety Status signals
Deep Sleep / Battery support
Optional TPM 2.0 module on-board
12x GPIOs
Power Supply
+8VDC .. +20VDC Main power supply
+5VDC stand-by
Operating System
Windows Server 2022
Wind River VxWorks 7.0
Linux Kernel LTS
Wind River Linux
Yocto
Android
Operating Temperature
0°C ÷ +60°C (Commercial version)
Dimensions
120 x 95 mm (COM-HPC® Size A Form factor, Client pinout)
Product Variants / AccessoriesAll data is for information purposes only. The specification is subject to change without notice in advance. Any configuration other than original product specification is not guaranteed. Although all the information contained within this website is carefully checked, no guarantee of correctness is implied or expressed.Please always double-check the latest version of the product specification of the product manufacturer. Manufacturer Product Website: SOM-COM-HPC-A-ADL-PProduct names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with MCTX Mobile & Embedded Computers GmbH.OEM System Integration Support
All documents found on this page are subject to change without notification. Always ensure that you work with the latest version.Datasheet
Price on request
SECO
DEV-KIT-COM-HPC-A
SECO DEV-KIT-COM-HPC-A - COM-HPC Development Kit Development Kit Contents:
- CCHPC-C78-C Carrier board
- GPIO Header adapter cable
- (Free wires on one extremity)
- 1x certified High Speed DP cable 1m
- DP-to-HDMI adapter
- 1x Serial Adapter Cables
- 1x SATA cable
- Front Panel module V995 with connecting cables
.product-menu-page {
font-family: 'Ubuntu', sans-serif;
color: #3f4c58;
}
.text_bold {
font-weight: bolder;
}
.product-menu-page {
display: none;
}
.product-menu-page:target {
display: block;
}
.head_sec {
background-color: #e9e9f0;
}
.col_a {
background-color: #798490;
}
.head_subsec {color: CornflowerBlue;
padding-top: 10px;padding-right: 25px;
vertical-align: bottom;
}
.chead {
border: 1px solid Lavender;
font-size: 90%;
font-weight: bolder;}
.ckey {
width: 25%;white-space: nowrap;text-align: left;font-size: 90%;
font-weight: bolder;
border: 1px solid Lavender;}
.copt {
width: 25%;text-align: left;font-size: 90%;
font-weight: bolder;
border: 1px solid Lavender;}
.cval {
width: auto;text-align: left;
border: 1px solid Lavender;
word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;}
.rowspecsim {
font-size: 110%;
white-space: nowrap;text-align: left;
}
.column_1 {
width: 250px;white-space: nowrap;text-align: left;
}
.column_2 {
width: 250px;white-space: nowrap;text-align: left;
}
ul.menu {
list-style-type: none;
margin: 0;
padding: 0;background-color: #798490;overflow: hidden;font-family: 'Ubuntu', sans-serif;
}
li.menu-item {float: left;padding: 0px 16px;
}
ul.menu li.selected a {
display: block;
color: #2b3136;
text-align: center;
text-decoration: none;
background-color: CornflowerBlue;}
li.menu-item a {display: block;
color: white;text-align: center;
text-decoration: none;
}
li.menu-item a:hover {
color: white;
background-color: #f7c13d;}
.li.menu-item a:active {color: #2b3136;
font-weight: bolder;
background-color: CornflowerBlue;}
table {
margin-top: 10px;
width: 100%;
border-collapse: collapse;
table-layout: fixed;
}
th, td {
border: 1px solid White;text-align: left;
word-break: break-word;
font-size: 100%;
line-height: 1.5;
padding-top: 5px;
padding-left: 10px;
padding-bottom: 5px;
}
th {
font-size: 90%;
padding-left: 25px;
}
td {
word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;
}
#prod_kf {
font-size: 100%;width: 100%;}
#prod_spec {
font-size: 100%;word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;
}
#prod_disc {
font-size: 90%;
width: 100%;}
#prod_cpo {font-size: 90%;
width: 100%;
}
#prod_var {
word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;
}
SECO DEV-KIT-COM-HPC-A - COM-HPC Development KitDevelopment Kit Contents:
- CCHPC-C78-C Carrier board
- GPIO Header adapter cable
- (Free wires on one extremity)
- 1x certified High Speed DP cable 1m
- DP-to-HDMI adapter
- 1x Serial Adapter Cables
- 1x SATA cable
- Front Panel module V995 with connecting cables
Datasheet
User Manual
System Integration
Specification
Description
Development Kit Contents:
- CCHPC-C78-C Carrier board
- GPIO Header adapter cable
- (Free wires on one extremity)
- 1x certified High Speed DP cable 1m
- DP-to-HDMI adapter
- 1x Serial Adapter Cables
- 1x SATA cable
- Front Panel module V995 with connecting cables
Video Interfaces
1x 40-poles eDP/DSI connector
3x DP++ connectors
2x CSI Camera Input Connectors
Mass Storage
2x S-ATA 7p M connectors
2x M.2 Socket 3 Key M slots for M.2 NVMe Drives
Networking
2x NBase-T Ethernet RJ-45 connectors
2x 10Gbase-KR interfaces on OCP Type-C connector
Usb
4x USB 4.0 / USB 3.2 Gen2x2 ports on Standard Type-C
sockets with PD functionality
4x USB 2.0 Host ports on standard Quad Type-A Socket
USB Overcurrent pin header
Pci
2x PCI-e x4 Slots
2x PCI-e x4 interfaces on M.2 Socket 3 Key M Slots
2x PCI-e x16 Slot
Audio
I2S Audio Codec
Line In, Line Out, Mic in Triple Audio jack
Mic In + Line Out internal pin header
I2S/Soundwire shared interface + Soundwire only interface on
internal pin header
Serial Ports
2 x RS-232/RS-422/RS-485 ports on dedicated pin header
(from module)
2 x RS-232/RS-422/RS-485 ports on dedicated pin header
(from eSPI Dual UART controller)
Other Interfaces
BMC connector with SM Bus, I2C, eSPI, 1x USB 2.0, 1x
PCI-e x1, 1 x UART, 2x GPIO
12 GPIO pin header
Boot SPI Internal Header
Button / LEDs front panel header
4-pin tachometric FAN connector
Feature Pin header with 2xI2C, SM Bus, GP SPI,
Management signals
I2C Flash Socket
SM Bus Smart Battery Connector
2x 7-segment LCD displays for POST codes
eSPI internal header
Functional Safety (FuSa) internal pin header
Power Supply
ATX 24 poles connector for carrier board working only
Auxiliary 12V PCI-e 6-pin power connector
Dedicated EPS CPU Power in connector (voltage range 8..20V)
for COM HPC Client module’s working
Cabled Coin-cell connector for RTC
Operating Temperature
-40°C ÷ +85°C (Industrial Temperature range)
Dimensions
305x244mm (ATX form factor, 12” x 9.6”)
Product Variants / AccessoriesKTDV-COM-HPC-C78.00Cross Platform Development Kit compatible with both x86 and ARM COM-HPC Client modulesAll data is for information purposes only. The specification is subject to change without notice in advance. Any configuration other than original product specification is not guaranteed. Although all the information contained within this website is carefully checked, no guarantee of correctness is implied or expressed.Please always double-check the latest version of the product specification of the product manufacturer. Manufacturer Product Website: DEV-KIT-COM-HPC-AProduct names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with MCTX Mobile & Embedded Computers GmbH.OEM System Integration Support
All documents found on this page are subject to change without notification. Always ensure that you work with the latest version.DatasheetUser Manual
Price on request