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SOM-COM-HPC-A-TGL-UP3

SECO

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Product number: SOM-COM-HPC-A-TGL-UP3

Product information "SOM-COM-HPC-A-TGL-UP3"

SECO SOM-COM-HPC-A-TGL-UP3 - COM-HPC CPU Module with Intel® Tiger Lake COM-HPC® Client Computer on Module (CoM) Size A with 11th Gen Intel® Core™ and Celeron® (Codename: Tiger Lake-UP3) Processors. (CARINA - C77)

SECO SOM-COM-HPC-A-TGL-UP3 - COM-HPC CPU Module with Intel® Tiger Lake
COM-HPC® Client Computer on Module (CoM) Size A with 11th Gen Intel® Core™ and Celeron® (Codename: Tiger Lake-UP3) Processors. (CARINA - C77)

Overview

Key Features	Supported CPUs
11th Gen Intel Core processors and Intel Celeron processors Intel Iris Xe Graphics Core Gen12 GPU with up to 96 EU, up to 4 independent displays 4x USB 4.0 / USB 3.2, 4x USB 2.0, 8x PCI-e x1 Gen3 , 1x PCI-e x4 Gen4, up to 2x 2.5GbE Two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC Memory	CPU-Product Family: Intel® Tiger Lake Intel® Core™ i7-1185GRE (12M Cache, up to 4.40 GHz) Intel® Core™ i7-1185G7E (12M Cache, up to 4.40 GHz) Intel® Core™ i5-1145GRE (8M Cache, up to 4.10 GHz) Intel® Core™ i5-1145G7E (8M Cache, up to 4.10 GHz) Intel® Core™ i3-1115GRE (6M Cache, up to 3.90 GHz) Intel® Core™ i3-1115G4E (6M Cache, up to 3.90 GHz) Intel® Celeron® 6305E (4M Cache, 1.80 GHz)

Key Features

Supported CPUs

11th Gen Intel Core processors and Intel Celeron processors
Intel Iris Xe Graphics Core Gen12 GPU with up to 96 EU, up to 4 independent displays
4x USB 4.0 / USB 3.2, 4x USB 2.0, 8x PCI-e x1 Gen3 , 1x PCI-e x4 Gen4, up to 2x 2.5GbE
Two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC Memory

CPU-Product Family: Intel® Tiger Lake

CPU-Variants

CPU	Processor Number	Cache	Total Cores	Total Threads	Max Turbo Frequency
Intel® Core™ i7-1185GRE	i7-1185GRE	12 MB Intel® Smart Cache	4	8	4.40 GHz
Intel® Core™ i7-1185G7E	i7-1185G7E	12 MB Intel® Smart Cache	4	8	4.40 GHz
Intel® Core™ i5-1145GRE	i5-1145GRE	8 MB Intel® Smart Cache	4	8	4.10 GHz
Intel® Core™ i5-1145G7E	i5-1145G7E	8 MB Intel® Smart Cache	4	8	4.10 GHz
Intel® Core™ i3-1115GRE	i3-1115GRE	6 MB Intel® Smart Cache	2	4	3.90 GHz
Intel® Core™ i3-1115G4E	i3-1115G4E	6 MB Intel® Smart Cache	2	4	3.90 GHz
Intel® Celeron® 6305E	6305E	4 MB Intel® Smart Cache	2	2

Specification

Description	COM-HPC® Client Computer on Module (CoM) Size A with 11th Gen Intel® Core™ and Celeron® (formerly Tiger Lake-UP3) Processors
Cpu	11th Generation Intel® Core™ and Celeron® Processors, also available in industrial temperature range • Intel® Core™ i7-1185G7E, Quad Core @ 2.8GHz (4.4GHz in Turbo Boost) with HT, 12MB Cache, 28/15/12W cTDP • Intel® Core™ i5-1145G7E, Quad Core @ 2.6GHz (4.1GHz in Turbo Boost) with HT, 8MB Cache, 28/15/12W cTDP • Intel® Core™ i3-1115G4E, Dual Core @ 3.0GHz (3.9GHz in Turbo Boost) with HT, 6MB Cache, 28/15/12W cTDP • Intel® Celeron® 6305E, Dual Core @1.8GHz, 4MB Cache, 15W TDP • Intel® Core™ i7-1185GRE, Quad Core @ 2.8GHz (4.4GHz in Turbo Boost) with HT, 12MB Cache, with IBECC and Functional Safety Essential Design package, 28/15/12W cTDP – Industrial (w/ Turbo OFF) • Intel® Core™ i5-1145GRE, Quad Core @ 2.6GHz (4.1GHz in Turbo Boost) with HT, 8MB Cache, with IBECC and Functional Safety Essential Design package, 28/15/12W cTDP - Industrial (w/ Turbo OFF) •Intel® Core i3-1115GRE, Dual Core @ 3.0GHz (3.9GHz in Turbo Boost) with HT, 6MB Cache, 28/15/12W cTDP - Industrial (w/ Turbo OFF)
Max Cores	4
Memory	2x DDR4-3200 SODIMM Slots with IBECC (In-Band Error Correction Code), up to 64GB supported
Graphics	Integrated Iris Xe Graphics Core Gen12 architecture, with up to 96 Execution Units MPEG2, WMV9, AVC/H.264, JPEG/MJPEG, HEVC/H.265, VP9, AV1 HW decoding, up to 8k @60. AVC/H.264, HEVC/H.265, JPEG, VP9 HW encoding Support up to 4 independent displays.
Video Interfaces	1x eDP 1.4b or MIPI_DSI 1.3 Up to 3x DP++ interface, supporting Display Port 1.4a and HDMI 2.0b Up to 4x Display Port over Type-C (Alternate mode)
Video Resolution	DP, eDP: Up to 5120x3200 @60Hz 24bpp / 7680x4320@60Hz 30bpp with DSC MIPI-DSI: Up to 3200x2000 @60Hz 24 bpp, 5120x3200 @60Hz 24bpp with DSC HDMI 1.4: Up to 4Kx2K 24-30Hz 24bpp HDMI 2.0b: Up to 4Kx2K 48-60Hz 24bpp / 4Kx2K 48-60Hz 12bpc (need dedicated redriver on carrier board)
Mass Storage	2 x S-ATA Gen3 Channels PCI-e x4 port can be used to connect, on the carrier board, M.2 NVMe drives
Networking	Up to 2x NBase-T Ethernet interfaces, supporting 2.5Gb Ethernet connection, managed by as many Intel® i225 2.5GbE Controllers M.2 1216 SD Module supporting WiFi 802.11abgn+ac R2 MIMO 2x2 + MU-MIMO and Bluetooth 5.0
Usb	Up to 4 x USB 4.0 / USB 3.2 Host ports 4 x USB 2.0 Host port
Pci	1x PCI-e x4 Gen 4 port Up to 8x PCI-e Gen 3 lanes, groupable to support up to 4 root ports (5 root ports without the second 2.5GbE controller)
Audio	SoundWire and I2S Audio Interface
Serial Ports	2 x UARTs
Other Interfaces	2x 4-lane CSI-2 interfaces, optional SPI, SM Bus, 2x I2C, Watchdog timer, Carrier board FAN Control Management signals, ACPI signals, Safety Status signals Deep Sleep / Battery support Optional TPM 2.0 module on-board 12x GPIOs
Power Supply	+8VDC .. +20VDC Main power supply +5V stand-by
Operating System	Windows 10 IoT Enterprise LTSC Linux Kernel LTS Yocto VxWorks 7.0 Android
Operating Temperature	0°C ÷ +60°C (Commercial version) -40°C ÷ +85°C (Industrial version) *Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider applicationspecific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensions	120 x 95 mm (Com HPC Size A Form factor, Client pinout)

Product Variants / Accessories

HC77-1000-1120-C2	COM-HPC - CARINA w/Intel® Core™ i5-1145G7E, Quad Core @ 2.6GHz (4.1GHz in Turbo Boost), 8MB Cache, 28/15/12W cTDP, TPM 2.0, 8xPCI-e Gen 3, 1x eDP, 1x DP++, 4x USB 4.0, Comm. Temp.
HC77-2000-1120-I2	COM-HPC - CARINA w/Intel® Core™ i7-1185GRE, Quad Core @ 2.8GHz (4.4GHz in Turbo Boost) 12MB Cache, with IBECC and FuSa, 28/15/12W cTDP, TPM 2.0, 8x PCI-e Gen 3, 1x eDP, 1x DP++, 4x USB 4.0, Ind. Temp.
HC77-3000-1120-C2	HPC - CARINA w/Intel® Core™ i7-1185G7E, Quad Core @ 2.8GHz (4.4GHz in Turbo Boost), 12MB Cache, 28/15/12W cTDP, TPM 2.0, 8x PCI-e Gen 3, 1x eDP, 1x DP++, 4x USB 4.0, Comm. Temp.
HC77-3000-2101-C2	COM-HPC - CARINA w/Intel® Core™ i7-1185G7E, Quad Core @ 2.8GHz (4.4GHz in Turbo Boost), 12MB Cache, 28/15/12W cTDP, 8x PCI-e Gen 3, 1x eDP, 3x DP++, 2x USB 4.0, Comm. Temp.
HC77-4000-1120-C2	HPC - CARINA w/Intel® Celeron® 6305E, Dual Core @1.8GHz, 4MB Cache, 15W TDP, TPM 2.0, 8x PCI-e Gen 3, 1x eDP, 1x DP++, 4x USB 4.0, Comm. Temp.
HC77-5000-1120-I2	COM-HPC - CARINA w/ Intel® Core™ i5-1145GRE, Quad Core @ 2.6GHz (4.1GHz in Turbo Boost), 8MB Cache, with IBECC and FuSa, 28/15/12W cTDP, TPM 2.0, 8x PCI-e Gen 3, 1x eDP, 1x DP++, 4x USB 4.0, Ind. Temp.
HC77-6000-1120-C2	HPC - CARINA w/ Intel® Core™ i3-1115G4E, Dual Core @ 3.0GHz (3.9GHz in Turbo Boost), 6MB Cache, 28/15/12W cTDP, TPM 2.0, 8x PCI-e Gen 3, 1x eDP, 1x DP++, 4x USB 4.0, Comm. Temp.
HC77-7000-1120-I2	COM-HPC - CARINA w/Intel® Core i3-1115GRE, Dual Core @ 3.0GHz (3.9GHz in Turbo Boost), 6MB Cache, 28/15/12W cTDP, TPM 2.0, 8x PCI-e Gen 3, 1x eDP, 1x DP++, 4x USB 4.0, Ind. Temp.

All data is for information purposes only. The specification is subject to change without notice in advance. Any configuration other than original product specification is not guaranteed. Although all the information contained within this website is carefully checked, no guarantee of correctness is implied or expressed.
Please always double-check the latest version of the product specification of the product manufacturer. Manufacturer Product Website: SOM-COM-HPC-A-TGL-UP3
Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with MCTX Mobile & Embedded Computers GmbH.

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MCTX Mobile & Embedded Computers GmbH was founded in 2010 and focuses on the development and marketing of compact, high-performance, energy-efficient, and scalable computer systems and system components for mobile and stationary professional use in both indoor and outdoor environments.

We consider ourselves a reliable and experienced partner for companies and organizations that integrate these technologies into their processes or products. Our goal is to offer our customers SOLUTIONS that fully meet the requirements of their tasks.

Our company headquarters is located in southwestern Germany, in Gottenheim near Freiburg im Breisgau, close to the borders of France and Switzerland.

Service Portfolio

Depending on the project requirements, we offer our customers a wide range of products and outsourcing services: technology consulting for selecting the processor platform, delivery of key components, and the commissioned delivery of fully integrated, custom systems.

Over the years, our team has gained valuable experience in the integration of energy-efficient computing technologies. We provide this engineering know-how to our customers in order to optimize product and development costs as well as time-to-market.

Applications

Our boards and systems are used in a variety of applications in the field, in laboratories, in factory automation, and in OEM products, such as in the validation of semiconductor chips, in Lidar systems for 3D object measurement, in autonomous vehicles, various measurement and diagnostic systems, or in mobile data collection in the agricultural and forestry sectors.

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Our systems are based on state-of-the-art technologies used in modern servers, notebooks, tablet PCs, and navigation systems. The use of modular and industrial-grade system concepts enables long-lasting and scalable systems.