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ESM-ZXE

Product information "ESM-ZXE"
Avalue ESM-ZXE - COM Express Type 6 CPU Module PICMG COM R3.0 Type 6 module with Zhaoxin E KX-6000 series 4 core BGA CPU
Avalue ESM-ZXE - COM Express Type 6 CPU Module
PICMG COM R3.0 Type 6 module with Zhaoxin E KX-6000 series 4 core BGA CPU

Overview
Key Features
  • Zhaoxin E KX-6000 series 4 core BGA CPU Up to 35W Max
  • Two 260-pin SODIMM DDR4 2666 SDRAM slot up to 32GB
  • Support Dual Channel LVDS, Display Port, HDMI, VGA
  • Flexible I/O up to 4 SATAIII (6.0GB/s), 4 USB 3.0, 8 USB 2.0, 8-bit GPIO,5 PCIex1, 1 PCIex8
  • HD Audio Interface
  • 9~19V Wide Range Power Input
  • Intel 210AT Gigabit Ethernet
  • Type 6 Rev 3.0 Pin-out
  • Support TCM (Optional)
Specification

-System Information-

ProcessorZhaoxin E KX-6000 series KX- 6640A 4core 2.6 GHz BGA CPU TDP 35W KX- 6640MA 4core 2.2 GHz BGA CPU TDP 25W
System Memory2 x 260-Pin DDR4 2666MHz SO-DIMM, supports 8G/16G & up to 32GB (Non-ECC)
I/O ChipsetI/O extended IC ZX-200 (optional)
BIOS InformationAMI BIOS, 64 Mbit SPI Flash ROM (Not support BIOS Boot Selection (BIOS_DIS0#, BIOS_DIS1#)
Watchdog TimerH/W Reset, 1sec. ~ 65535sec. and 1sec./step
H/W Status MonitorMonitoring System Temperature, Voltage and FAN Status with Auto Throttling Control
TPMTCM (Nations IC-Z32H330TC-SQN-611) Optional,support under Linux and from Windows 10 RS3 version

I/O

USB PortMax. 6 x USB 2.0 (*Up to Max. 8 x USB 2.0 only on models KX- 6640A & KX- 6640MA with ZX-200) Max. 2 x USB3.0 (*Up to Max. 4 x USB3.0 Gen.1 (5 Gbps) only on models KX- 6640A & KX- 6640MA with ZX-200)
SMBusSMBus
SATAMax.2x SATAIII 6.0Gb/s (*Max. 4 x SATAIII 6.0Gb/s (when KX- 6640A+ ZX-200 & KX- 6640MA+ ZX-200)
DIO8bit GPIO, WDG/HW monitor/FAN
UART2 x UART(2-wire)
PCIeKX- 6640A Configuration1:5PCIEX1+1PCIEX8 (default) Configuration2:5PCIEX1+2PCIEX4 Configuration3:1PCIEX1+1PCIEX4+1PCIEX8 Configuration4:1PCIEX1+3PCIEX4 Configuration5:3PCIEX1+1PCIEX2+1PCIEX8 KX- 6640MA (CPU TDP will change from 25W to 26W when use PCIex8) Configuration1:5PCIEX1+1PCIEX4 (default) Configuration2:1PCIEX1+1PCIEX4+2PCIEX4 Configuration3:3PCIEX1+1PCIEX2+1PCIEX4 KX- 6640A+ZX200 Configuration1:4PCIEX1(Gen2) (default) Configuration2:1PCIEX4 (Gen2) KX- 6640MA+ZX200 Configuration1:4PCIEX1(Gen2) (default) Configuration2:1PCIEX4 (Gen2)
OtherLPC, I2C

Display

Graphic ChipsetN/A
Spec. & ResolutionHDMI 2.0: 4096 x 2160 @ 60Hz (only 3840x2160@60Hz is tested, 4096 x 2160 @ 60Hz needs to be further validated when device is available) DP 1.2a: 4096 x 2304 @60Hz, (only 3840 x 2160@60Hz is tested, 4096 x 2160 @ 60Hz needs to be further validated when device is available) LVDS (via eDP-to-LVDS 7511 IC): 1920x1080 @60Hz, Dual-channel 18/24-bit VGA: 1920x1080 @60Hz
Multiple DisplaySupporting 3 display (2 display with clone mode, 1 display with extend mode) LVDS (HDMI or DP) + VGA + DDI (HDMI or DP)
Digital Display InterfaceHDMI/DP

Audio

Audio CodecZhaoxin HD audio I/F

Ethernet

LAN Chipset1xIntel 210AT Gigabit Ethernet

Mechanical & Environmental

Operating Temperature0 ~ 60 °C (32 ~ 140 °F), with airflow 0.5m/s
Storage Temperature-40°C ~ 75°C (-40°F ~ 167°F)
Operating Humidity40°C @ 95% Relative Humidity, Non-condensing
Weight0.44lbs (0.2kg)
Power Requirement+9~ +19V
ACPISingle power ATX Support S0, S3, S5 ACPI 5.0 Compliant
Power ModeAT/ATX
Dimension (L x W)125 x 95 mm (3.74” x 4.92”)

Software Support

OS InformationMicrosoft® Windows 10 64-bit/Windows 7 Linux (NeoKylin DT V7.0), Ubuntu 16.04.5

Ordering Information

Ordering InformationESM-ZXE-6640A-A1RZhaoxin COM Express Module Type 6 on board KX-6640A CPU (0~+60 degrees), without TCM ESM-ZXE-6640MA-A1R Zhaoxin COM Express Module Type 6 on board KX-6640MA CPU (0~+60 degrees),without TCM ESM-ZXE-40AZ-A1RZhaoxin COM Express Module Type 6 on board KX-6640A CPU+ZX-200 (0~+60 degrees),without TCM ESM-ZXE-40MAZ-A1RZhaoxin COM Express Module Type 6 on board KX-6640MA CPU+ZX-200 (0~+60 degrees),without TCM EEV-EX16-A1RmATX Ev. Board for COMe Type 6 A1 ACC-ESMZXE-CL-1RCooler for ESM-ZXE  W/FAN H=61mm ACC-ESMZXE-CL-2RCooler for ESM-ZXE  W/FAN H=61mm with pad for board with ZX-200ACC-ESMZXE-SD-1RHeatspreader for ESM-ZXE H=8 mmACC-ESMZXE-SD-2RHeatspreader for ESM-ZXE H=8 mm  with pad for board with ZX-200
All data is for information purposes only. The specification is subject to change without notice in advance. Any configuration other than original product specification is not guaranteed. Although all the information contained within this website is carefully checked, no guarantee of correctness is implied or expressed.
Please always double-check the latest version of the product specification of the product manufacturer. Manufacturer Product Website: ESM-ZXE
Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with MCTX Mobile & Embedded Computers GmbH.

OEM System Integration Support

All documents found on this page are subject to change without notification. Always ensure that you work with the latest version.

We would be happy to assist you in selecting the optimal hardware platform for your application.

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MCTX Mobile & Embedded Computers GmbH was founded in 2010 and focuses on the development and marketing of compact, high-performance, energy-efficient, and scalable computer systems and system components for mobile and stationary professional use in both indoor and outdoor environments.  

We consider ourselves a reliable and experienced partner for companies and organizations that integrate these technologies into their processes or products.  Our goal is to offer our customers SOLUTIONS that fully meet the requirements of their tasks.

Our company headquarters is located in southwestern Germany, in Gottenheim near Freiburg im Breisgau, close to the borders of France and Switzerland.

Service Portfolio

Depending on the project requirements, we offer our customers a wide range of products and outsourcing services: technology consulting for selecting the processor platform, delivery of key components, and the commissioned delivery of fully integrated, custom systems.

Over the years, our team has gained valuable experience in the integration of energy-efficient computing technologies. We provide this engineering know-how to our customers in order to optimize product and development costs as well as time-to-market.


Applications

Our boards and systems are used in a variety of applications in the field, in laboratories, in factory automation, and in OEM products, such as in the validation of semiconductor chips, in Lidar systems for 3D object measurement, in autonomous vehicles, various measurement and diagnostic systems, or in mobile data collection in the agricultural and forestry sectors.

Technologies

Our systems are based on state-of-the-art technologies used in modern servers, notebooks, tablet PCs, and navigation systems. The use of modular and industrial-grade system concepts enables long-lasting and scalable systems.