Module Store - Building Blocks for Developers of Embedded Computing Systems
ESM-TGH
Price on request
| Avalue ESM-TGH - COM Express Type 6 CPU Module with Intel® Tiger Lake |
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| PICMG COM R3.0 Type 6 module with Intel® 11th Generation Xeon®, Core™ i7/i5/i3, Celeron® BGA Processors |
| Overview |
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| Key Features | Supported CPUs |
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CPU-Product Family: Intel® Tiger Lake
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| CPU-Variants |
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| CPU | Processor Number | Cache | Total Cores | Total Threads | Max Turbo Frequency |
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| Intel® Core™ i7-11850HE | i7-11850HE | 24 MB Intel® Smart Cache | 8 | 16 | 4.70 GHz |
| Intel® Core™ i5-11500HE | i5-11500HE | 12 MB Intel® Smart Cache | 6 | 12 | 4.50 GHz |
| Intel® Core™ i3-11100HE | i3-11100HE | 8 MB Intel® Smart Cache | 4 | 8 | 4.40 GHz |
| Intel® Xeon® W-11865MRE | W-11865MRE | 24 MB Intel® Smart Cache | 8 | 16 | 4.70 GHz |
| Intel® Xeon® W-11155MRE | W-11155MRE | 8 MB Intel® Smart Cache | 4 | 8 | 4.40 GHz |
| Intel® Celeron® 6600HE | 6600HE | 8 MB Intel® Smart Cache | 2 | 2 |
| Specification |
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-System Information-
| Processor | Mobile 11th Generation Intel® Xeon® Core™ and Celeron® Processors - 10nm processer Xeon® W-11865MRE* 45W (35W cTDP), 8C/16T (ECC) Xeon® W-11155MRE* 45W (35W cTDP), 4C/8T (ECC) Core™ i7-11850HE* 45W (35W cTDP), 8C/16T (non-ECC) Core™ i5-11500HE* 45W (35W cTDP), 6C/12T (non-ECC) Core™ i3-11100HE* 45W (35W cTDP), 4C/8T (non-ECC) Celeron® 6600HE* 35W, 2C/2T (non-ECC) |
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| Platform Controller Hub | RM590E QM580E HM570E |
| System Memory | Up to 3x 260-pin DDR4-3200 SO-DIMM slot up to 32 GByte each (96 GByte total) |
| I/O Chipset | EC (ITE IT5571) |
| BIOS Information | AMI uEFI BIOS, 256 Mbit SPI Flash ROM |
| Watchdog Timer | H/W Reset, 1sec. ~ 65535sec. and 1sec./step |
| H/W Status Monitor | Monitoring System Temperature, Voltage and FAN Status with Auto Throttling Control |
| TPM | TPM2.0 |
I/O
| USB Port | 4 x USB 3.2 Gen.2x1 (10 Gbps) 8 x USB 2.0 |
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| SATA | 4 x SATA3.0 (6.0Gb/s) |
| DIO | 8bit GPIO(NCT5655Y) |
| MIO | 4 x SATAIII 6.0Gb/s 1xLPC (via eSPI to LPC bridge), I2C, SMBus, 2 x UART(2-wire) |
| HDMI | HDMI 2.0b |
Display
| Graphic Chipset | Gen 12 Intel® UHD Graphics (Xe architecture) |
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| Spec. & Resolution | HDMI 2.0b: 4096x 2304 @ 60Hz DP 1.4: 4096x 2304 @60Hz LVDS: 1920x 1080 @60Hz, support Dual-channel 18/24-bit LVDS (via eDP-to-LVDS IC CH7511B) VGA: 1920x 1200 @60Hz (via DP to VGA IC Chrontel® 7517A) eDP 1.4b: 4096x 2304 @60Hz (Optional) (Per Intel design guide, need to add Redriver, Redriver in carrier board to fine tune the signal of DP1.4) (Only support 4Lanes 2560x1440 & 2Lanes 1920x1080) |
| Multiple Display | Supporting 4 display up to 2K (3DDI+eDP) |
| DDI | HDMI/DP (default) |
| Interface | Dual-channel 18/24-bit LVDS (LVDS via CH7511B) |
Software Support
| OS | Microsoft® Windows 10 64-bit Linux (Kernel>5.8) |
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Ethernet
| LAN Chipset | Intel®i225LM/IT |
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| Ethernet Interface | 10/100/1000/2500 Base-Tx GbE compatible |
Mechanical & Environmental
| Operating Temperature | Operating Standard: 0 ~ 60 °C (32 ~ 140 °F) Operating Industrial (build option with selected SKUs): -40°C ~ 75°C (-40°F ~ 167°F) |
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| Storage Temperature | -40°C ~ 85°C (-40°F ~ 185°F) |
| Operating Humidity | 40°C @ 95% Relative Humidity, Non-condensing |
| Weight | 0.44lbs (0.2kg) |
| Power Requirement | +9~ +19V |
| ACPI | Single power ATX Support S0, S4, S5 ACPI 5.0a Compliant |
| Power Mode | AT/ATX |
| Dimension (L x W) | 125*95 mm (3.74” x 4.92”) |
| All data is for information purposes only. The specification is subject to change without notice in advance. Any configuration other than original product specification is not guaranteed. Although all the information contained within this website is carefully checked, no guarantee of correctness is implied or expressed. Please always double-check the latest version of the product specification of the product manufacturer. Manufacturer Product Website: ESM-TGH Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with MCTX Mobile & Embedded Computers GmbH. |
| OEM System Integration Support |
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We would be happy to assist you in selecting the optimal hardware platform for your application.
If you have any questions, whether technical or commercial, about our products or services, don’t hesitate to contact us. We look forward to hearing from you.
You can reach us by phone at +49 (0)7665/9390-185 (Monday to Friday from 8:00 AM to 8:00 PM). Alternatively, you are welcome to contact us anytime via the contact form at the end of this page. If you cannot reach us by phone, please send us a brief message via the contact form – we will get back to you as soon as possible.
Please note that we offer our services exclusively to Original Equipment Manufacturers. We do not sell to private persons or resellers.MCTX Mobile & Embedded Computers GmbH was founded in 2010 and focuses on the development and marketing of compact, high-performance, energy-efficient, and scalable computer systems and system components for mobile and stationary professional use in both indoor and outdoor environments.
We consider ourselves a reliable and experienced partner for companies and organizations that integrate these technologies into their processes or products. Our goal is to offer our customers SOLUTIONS that fully meet the requirements of their tasks.
Our company headquarters is located in southwestern Germany, in Gottenheim near Freiburg im Breisgau, close to the borders of France and Switzerland.
Service Portfolio
Depending on the project requirements, we offer our customers a wide range of products and outsourcing services: technology consulting for selecting the processor platform, delivery of key components, and the commissioned delivery of fully integrated, custom systems.
Over the years, our team has gained valuable experience in the integration of energy-efficient computing technologies. We provide this engineering know-how to our customers in order to optimize product and development costs as well as time-to-market.
Applications
Our boards and systems are used in a variety of applications in the field, in laboratories, in factory automation, and in OEM products, such as in the validation of semiconductor chips, in Lidar systems for 3D object measurement, in autonomous vehicles, various measurement and diagnostic systems, or in mobile data collection in the agricultural and forestry sectors.
Technologies
Our systems are based on state-of-the-art technologies used in modern servers, notebooks, tablet PCs, and navigation systems. The use of modular and industrial-grade system concepts enables long-lasting and scalable systems.