Module Store - Building Blocks for Developers of Embedded Computing Systems
ESM-EHLC
Price on request
| Avalue ESM-EHLC - COM Express Type 6 CPU Module with Intel® Elkhart Lake |
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| CPU: Intel® Pentium® / Celeron® / Atom™ SoC BGA Processor, Chipset: Integrated, USB/SATA/COM/LAN: 12/2/1/1, Display: VGA / HDMI / DP / eDP / LVDS (By Option) |
| Overview |
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| Key Features | Supported CPUs |
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CPU-Product Family: Intel® Elkhart Lake
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| CPU-Variants |
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| CPU | Intel® Celeron® J6413 | Intel® Celeron® J6412 |
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| Processor Number | J6413 | J6412 |
| Cache | 1.5 MB L2 Cache | 1.5 MB L2 Cache |
| Total Cores | 4 | 4 |
| Total Threads | 4 | 4 |
| PCI Express Revision | 3.0 | 3.0 |
| Specification |
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-System Information-
| Processor | Intel® Celeron® J6413 4C 1.8 GHz/ 10W Intel® Celeron® J6412 4C 1.8 GHz/ 10W Intel® Atom® x6413E 4C 1.5 GHz/ 9W Intel® Atom® x6425RE 4C 1.9 GHz/ 12W |
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| Platform Controller Hub | Elkhart Lake SoC integrated |
| System Memory | Two 260-pin SODIMM DDR4 3200 SDRAM slot up to 32GB, support In-Band ECC memory protection (selected SKUs) |
| I/O Chipset | ITE IT5571 |
| BIOS Information | AMI uEFI BIOS, 256 Mbit SPI Flash ROM |
| Watchdog Timer | H/W Reset, 1sec. ~ 65535sec. and 1sec./step |
| H/W Status Monitor | Monitoring System Temperature, Voltage and FAN Status with Auto Throttling Control |
| TPM | TPM 2.0 (Optional) |
Expansion
| Expansion | 3 PCIex1 Gen3 (8.0 GT/s) |
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I/O
| USB Port | 8 x USB 2.0 4 x USB 3.2 Gen2x1 (10 Gbps) |
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| COM Port | 2 x COM Ports (RX/TX only) |
| SATA | 2 x SATA3.0 (6.0Gb/s) |
| DIO | 1 x 8bit GPIO |
| MIO | 1 x SMBus 1x LPC (via eSPI-to-LPC bridge), or 1x eSPI (Only support 20MHz), build option 1 x I2C 1 x I2C |
| Other | eMMC 5.1 up to 128GB (optional) |
Display
| Graphic Chipset | Intel® Elkhart Lake SoC Processor integrated Gen11 LP graphics |
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| Spec. & Resolution | HDMI 1.4b/2.0b: 4096x2160 @60Hz DP 1.4: 4096x2160 @60Hz *Per Intel design guide, need to add Redriver (Redriver in carrier board to fine tune the signal of DP1.4) eDP 1.3b (Optional): 4096x2160 @60Hz (Only support 4Lanes 2560x1440 & 2Lanes 1920x1080) LVDS(via eDP-to-LVDS): 1920x1080 @60Hz, LVDS via CH7511B VGA(via DP-to-VGA): 1920x1080 @60Hz, VGA via CH7517A (DP to VGA) |
| LVDS | CH7511B(eDP to LVDS) |
| DDI | HDMI DP DisplayPort |
Audio
| Audio Interface | Intel® HD Audio integrated in SoC |
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Certifications
| Certification Information | CE FCC Class B |
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Ethernet
| LAN Chipset | 1 x Intel KTI225LM for STD-Temp. SKU 1 x Intel KTI225IT for Wide-Temp. SKU |
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| Ethernet Interface | 1 x 10BASE-TE/100BASE-TX/1000BASE-T/2500BASE-T compatible Gigabit, above 70°C Tc, the recommended speed is 1G |
Mechanical & Environmental
| Operating Temperature | Operating Standard: 0°C ~ 60°C with 0.2m/s air flow Conditional extend: -40°C ~ 85°C with 0.5m/s air flow. (Note: Above 70°C Tc, the recommended ethernet speed is 1G.) |
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| Storage Temperature | -40°C ~ 75°C (-40°F ~ 167°F) |
| Operating Humidity | 40°C @ 95% Relative Humidity, Non-condensing |
| Weight | 0.44lbs (0.2kg) |
| Power Requirement | +9V ~ +19V |
| ACPI | Single power ATX Support S0, S3, S4, S5 ACPI 6.0 Compliant |
| Power Mode | AT/ATX |
| Dimension (L x W) | 95 x 95 mm (3,74" x 3,74") |
Software Support
| OS Information | Windows* 10 IoT Enterprise (64-bit) Linux |
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Ordering Information
| Ordering Information | ESM-EHLC-J6413-A1RIntel® Celeron® SoC Processor J6413 Type6 COMe Compact ModuleESM-EHLC-J6412-A1RIntel® Celeron® SoC Processor J6412 Type6 COMe Compact ModuleESM-EHLC-X13E-A1RIntel® Atom® SoC Processor x6413E Type6 COMe Compact Module ESM-EHLC-X25RE-A1RIntel® Atom® SoC Processor x6425RE Type6 COMe Compact ModuleEEV-EX16-B1RmATX Ev. Board for COMe Type 6ACC-ESMEHLC-SK-1R Heatsink of ESM-EHLC W/O FAN H=34mm for Standard Temp. SKUs ACC-ESMEHLC-CL-1R Cooler of ESM-EHLC W/FAN H=60mm for Wide Temp. SKUsACC-ESMEHLC-SD-1RHeatspreader for ESM-EHLC H=11mm for the Module W/ Standard Temp. CPU SKUs ACC-ESMEHLC-SD-2RHeatspreader for ESM-EHLC H=11mm for the Module W/ Wide Temp. CPU SKUs |
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| All data is for information purposes only. The specification is subject to change without notice in advance. Any configuration other than original product specification is not guaranteed. Although all the information contained within this website is carefully checked, no guarantee of correctness is implied or expressed. Please always double-check the latest version of the product specification of the product manufacturer. Manufacturer Product Website: ESM-EHLC Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with MCTX Mobile & Embedded Computers GmbH. |
| OEM System Integration Support |
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We would be happy to assist you in selecting the optimal hardware platform for your application.
If you have any questions, whether technical or commercial, about our products or services, don’t hesitate to contact us. We look forward to hearing from you.
You can reach us by phone at +49 (0)7665/9390-185 (Monday to Friday from 8:00 AM to 8:00 PM). Alternatively, you are welcome to contact us anytime via the contact form at the end of this page. If you cannot reach us by phone, please send us a brief message via the contact form – we will get back to you as soon as possible.
Please note that we offer our services exclusively to Original Equipment Manufacturers. We do not sell to private persons or resellers.MCTX Mobile & Embedded Computers GmbH was founded in 2010 and focuses on the development and marketing of compact, high-performance, energy-efficient, and scalable computer systems and system components for mobile and stationary professional use in both indoor and outdoor environments.
We consider ourselves a reliable and experienced partner for companies and organizations that integrate these technologies into their processes or products. Our goal is to offer our customers SOLUTIONS that fully meet the requirements of their tasks.
Our company headquarters is located in southwestern Germany, in Gottenheim near Freiburg im Breisgau, close to the borders of France and Switzerland.
Service Portfolio
Depending on the project requirements, we offer our customers a wide range of products and outsourcing services: technology consulting for selecting the processor platform, delivery of key components, and the commissioned delivery of fully integrated, custom systems.
Over the years, our team has gained valuable experience in the integration of energy-efficient computing technologies. We provide this engineering know-how to our customers in order to optimize product and development costs as well as time-to-market.
Applications
Our boards and systems are used in a variety of applications in the field, in laboratories, in factory automation, and in OEM products, such as in the validation of semiconductor chips, in Lidar systems for 3D object measurement, in autonomous vehicles, various measurement and diagnostic systems, or in mobile data collection in the agricultural and forestry sectors.
Technologies
Our systems are based on state-of-the-art technologies used in modern servers, notebooks, tablet PCs, and navigation systems. The use of modular and industrial-grade system concepts enables long-lasting and scalable systems.