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EPX-EHLP

Product information "EPX-EHLP"
Avalue EPX-EHLP - 2.5" SBC Pico-ITX Single-Board-Computer with Intel® Elkhart Lake CPU: Intel® Atom® x6000E and Intel® Celeron® Series Processor, USB/SATA/COM/LAN: 6/0/2/2, Display: 2 x DP / 1 x LVDS
Avalue EPX-EHLP - 2.5" SBC Pico-ITX Single-Board-Computer with Intel® Elkhart Lake
CPU: Intel® Atom® x6000E and Intel® Celeron® Series Processor, USB/SATA/COM/LAN: 6/0/2/2, Display: 2 x DP / 1 x LVDS

Overview
Key FeaturesSupported CPUs
  • Intel® Atom® x6000E and Intel® Celeron® Series Processors with CPU Bottom Mounted
  • 1 x 260-pin DDR4 2666MHz SO-DIMM  supports up to 32GB (Only Atom® x6000 Series Processors support IBECC)
  • 1 x Dual stack DP, Single channel 18/24-bits LVDS
  • 2 x Intel® i226LM/IT 2.5G Gigabit Ethernet
  • 1 x M.2 (2242/2260) B-Key, 1 x M.2 (2230) E-Key support Wifi module
  • 4 x USB 2.0 by pin header, 1 x dual stack USB 3.1 Gen2 at I/O
  • 1 x RS232, 1 x RS232/422/485, 4-bit GPIO
  • DC in +12V
CPU-Product Family: Intel® Elkhart Lake

CPU-Variants
CPU Intel® Celeron® J6413 Intel® Celeron® J6412
Processor Number J6413 J6412
Cache 1.5 MB L2 Cache 1.5 MB L2 Cache
Total Cores 4 4
Total Threads 4 4
PCI Express Revision 3.0 3.0
Specification

-System Information-

ProcessorIntel® Atom® x6000E and Celeron® Series processors
System Memory1 x 260-pin DDR4 2666MHz SO-DIMM supports up to 32GB
I/O ChipsetEC iTE IT5571
BIOS InformationAMI 256Mbit SPI BIOS
Watchdog TimerH/W Reset: 1sec. ~ 65535sec./min. and 1sec. or 1min./step
H/W Status MonitorMonitoring System Temperature and Voltage with Auto Throttling Control

Expansion

Expansion1 x M.2 Type B 2242/2260 with (1 x PCI-e x2 via OEM BIOS request) or (1 x PCI-e x1 + USB3.1 GEN 1)-Default or (1 x SATA III + USB3.1 GEN 1), USB2.0 Signal support SSD. (Default: SATA)

I/O

USB Port4 x USB 2.0 by pin header 1 x dual stack USB 3.1 Gen2 at I/O
COM Port1 x RS232, 1 x RS232/422/485
DIO1 x 4-bit GPIO

Display

Graphic ChipsetIntel® UHD Graphics for 10th Gen Intel® Processors
Spec. & ResolutionOne dual deck DP(Upper DP, Lower DP++): 4096 x 2160@60 Hz LVDS: 1366x768 Single channel 18/24-bits LVDS (Chrontel CH7511B-BF (CH7511B-BFI for wide temp version) eDP to LVDS)
LVDS1CH 18/24bits LVDS 1366x768 Chrontel. CH7511B eDP to LVDS Converter

Ethernet

LAN Chipset2 x Intel® i226LM(i226IT for wide temp version) 2.5 Gigabit Ethernet
Ethernet Interface10/100/1000 Base-Tx GbE compatible 2.5 Gigabit Ethernet
LAN Port2 x RJ45

Mechanical & Environmental

Operating Temperature0~60°C (32~140°F) Elkhart Lake J Series CPU SKU -20~60°C (-4~140°F) Elkhart Lake Atom Series CPU SKU w/HDD/SSD, ambient with 0.5 m/s Air flow
Storage Temperature-40°C ~ 75°C (-40°F ~ 167°F)
Operating Humidity40°C @ 95% Relative Humidity, Non-condensing
Weight0.66lbs (0.3Kgs)
Power Requirement+12V
Power ModeAT/ATX
Dimension (L x W)3.94” x 2.83” (100mm x 72mm)

Ordering Information

Ordering InformationEPX-EHLP-J6412-A1R EPX-EHLP-J6413-A1R EPX-EHLP-X11E-A1R EPX-EHLP-X13E-A1R Intel® Celeron®/Atom™ SoC BGA Processor 2.5" Pico ITX SBC Motherboard
All data is for information purposes only. The specification is subject to change without notice in advance. Any configuration other than original product specification is not guaranteed. Although all the information contained within this website is carefully checked, no guarantee of correctness is implied or expressed.
Please always double-check the latest version of the product specification of the product manufacturer. Manufacturer Product Website: EPX-EHLP
Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with MCTX Mobile & Embedded Computers GmbH.

OEM System Integration Support

All documents found on this page are subject to change without notification. Always ensure that you work with the latest version.

We would be happy to assist you in selecting the optimal hardware platform for your application.

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MCTX Mobile & Embedded Computers GmbH was founded in 2010 and focuses on the development and marketing of compact, high-performance, energy-efficient, and scalable computer systems and system components for mobile and stationary professional use in both indoor and outdoor environments.  

We consider ourselves a reliable and experienced partner for companies and organizations that integrate these technologies into their processes or products.  Our goal is to offer our customers SOLUTIONS that fully meet the requirements of their tasks.

Our company headquarters is located in southwestern Germany, in Gottenheim near Freiburg im Breisgau, close to the borders of France and Switzerland.

Service Portfolio

Depending on the project requirements, we offer our customers a wide range of products and outsourcing services: technology consulting for selecting the processor platform, delivery of key components, and the commissioned delivery of fully integrated, custom systems.

Over the years, our team has gained valuable experience in the integration of energy-efficient computing technologies. We provide this engineering know-how to our customers in order to optimize product and development costs as well as time-to-market.


Applications

Our boards and systems are used in a variety of applications in the field, in laboratories, in factory automation, and in OEM products, such as in the validation of semiconductor chips, in Lidar systems for 3D object measurement, in autonomous vehicles, various measurement and diagnostic systems, or in mobile data collection in the agricultural and forestry sectors.

Technologies

Our systems are based on state-of-the-art technologies used in modern servers, notebooks, tablet PCs, and navigation systems. The use of modular and industrial-grade system concepts enables long-lasting and scalable systems.