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EPC-TGU

Product information "EPC-TGU"
Avalue EPC-TGU - Compact Computing System Embedded Box PC with Intel® Tiger Lake CPU: 11th Gen Intel® Core™ i7/i5/i3/Celeron® Processor, LAN: 2, COM: 2, USB: 6
Avalue EPC-TGU - Compact Computing System Embedded Box PC with Intel® Tiger Lake
CPU: 11th Gen Intel® Core™ i7/i5/i3/Celeron® Processor, LAN: 2, COM: 2, USB: 6

Overview
Key FeaturesSupported CPUs
  • Intel® 11th Tiger Lake-U Processor
  • Intel® Iris® Xe/UHD Graphics
  • Single Memory Socket, Max. Up to 32GB DDR4 3200MT/s
  • Dual Display, DP++ 1.4
  • Dual Intel® Gigabit Ethernet, Dual 2.5GbE
  • Triple Storage, 2.5” Drive Bay, 2-M.2 SSD
  • Triple M.2 Slot,  Key-E/B/M for Wi-Fi, LTE, SSD and I/O module
  • Support iAMT, SATA RAID 0/1
  • Default dTPM 2.0, Wall Mount Kit
CPU-Product Family: Intel® Tiger Lake

CPU-Variants
CPU Intel® Celeron® 6305E
Processor Number 6305E
Cache 4 MB Intel® Smart Cache
Total Cores 2
Total Threads 2
Specification

System Information

ProcessorIntel® Core™ Processor i7- 1185G7E (15W) Intel® Core™ Processor i5- 1145G7E (15W) Intel® Core™ Processor i3- 1115G4E (15W) Intel® Celeron® Processor 6305E (15W)
System Memory1 x 260-pin SODIMM socket Max. up to 32GB DDR4 3200MTs
I/O ChipsetEC ITE IT8882
BIOS InformationAMI uEFI BIOS 256 Mbit SPI Flash ROM
Watchdog TimerH/W Reset, 1sec. ~ 65535sec.
H/W Status MonitorSystem temperature monitoring and Voltages monitoring
RAIDRAID 0/1 (SATA)
TPMTPM 2.0
iAMTAbove Core i5 (selected SKUs)
SBCECM-TGU

-Expansion-

M.21 x M.2 Key-M 2242 (PCIe Gen4 x 4) 1 x M.2 Key-B 2242/3042 with Internal SIM Slot (SATA, USB 2.0) 1 x M.2 Key-E 2230 (PCIe, USB 2.0)

-Storage-

M.21 x M.2 Key-M 2242 NVMe (PCIe Gen4 x 4) 1 x M.2 Key-B 2242/3042 (SATA)
2.5” Drive Bay1 x Internal 2.5” Drive Bay (7mm)

-Front I/O-

COM Port2 x RS232/422/485 (BIOS)
Power Button1 x Power Button

-Rear I/O-

USB Port4 x USB 3.2 Gen.2 (10Gbp/s) 2 x USB 2.0
DP2 x DP++
Audio1 x Combo Jack (Mic-In, Line-Out)
RJ-452 x RJ45 (Max. Up to 3-RJ45 in project base)
LED Indicator1 x Power On/Off 1 x Storage Access
Antenna2 x Antenna Mounting with Dust Protection Cover

-Display-

Graphic ChipsetIntel® Iris® Xe Graphics (i7-1185G7E/i5-1145G7E) Intel® Iris® UHD Graphics (i3-1115G4E/6305E)
ResolutionDP++ 1.4: 4096x2304@60Hz DP1+DP2 (DP1.4): Max: 7680 x 4320@60 Hz

-Audio-

Audio CodecRealtek ALC888S

-Ethernet-

LAN Chipset2 x Intel® I226LM
Specification2 x 10/100/1000/2.5 Gigabit (I226LM)

-Power Requirement-

DC Input VoltageTypical 12/24Vdc
DC Input ConnectorLockable DC Jack
ACPISingle power ATX Support S0, S3, S4, S5 ACPI 5.0 Compliant
Power ModeAT/ATX (ATX is default setting)
Adapter60W AC to DC Adapter (Default)/ 120W AC to DC Adapter (Option) Note1: 60W for general mode (storage, communication, display, USB port, room temp.) Nore2: 120W for full load mode (general mode pluses max. workload and operating temp.)

-Software Support-

OS InformationWin10, Win11, Linux

-Certification-

Certification InformationCE, FCC Class B, UKCA

Mechanical & Environmental

Operating TemperatureWith extended temperature peripherals: 0°C ~ 50°C (32°F ~ 122°F) with 0.5m/s air flow
Storage Temperature-30~70C° (-22°F ~ 158°F)
Operating Humidity40°C @ 95% Relative Humidity, Non-condensing
Dimension (W x L x H)177mm x 123mm x 55mm (7” x 4.8” x 2.2")
Vibration TestWith SSD : 5Grms, IEC 60068-2-64, Random, 5 ~ 500Hz, 1hr/axis
Shock TestWith SSD : 55Grms, IEC 60068-2-27, Half Sine, 11ms
Drop TestISTA 2A, IEC-60068-2-32 Test : Ed, 1 Corner, 3 Edges, 6 Faces
Mounting KitStand Wall Mount kit
ConstructionAluminum + Metal

Ordering Information

Ordering InformationEPC-TGU-85-B1-1R 11th Gen Intel®Core™ Processor i7-1185G7E Fanless Compact System EPC-TGU-45-B1-1R 11th Gen Intel®Core™ Processor i5-1145G7E Fanless Compact System EPC-TGU-15-B1-1R 11th Gen Intel®Core™ Processor i3-1115G4E Fanless Compact System EPC-TGU-05-B1-1R 11th Gen Intel®Celeron 6305E Fanless Compact SystemE1702031831R Australia Power Cord E1702031833R USA Power CordE1702031834R Japan Power Cord E170P060380R UK Power Cord E1702031000R EU Power Cord
All data is for information purposes only. The specification is subject to change without notice in advance. Any configuration other than original product specification is not guaranteed. Although all the information contained within this website is carefully checked, no guarantee of correctness is implied or expressed.
Please always double-check the latest version of the product specification of the product manufacturer. Manufacturer Product Website: EPC-TGU
Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with MCTX Mobile & Embedded Computers GmbH.

OEM System Integration Support

All documents found on this page are subject to change without notification. Always ensure that you work with the latest version.

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MCTX Mobile & Embedded Computers GmbH was founded in 2010 and focuses on the development and marketing of compact, high-performance, energy-efficient, and scalable computer systems and system components for mobile and stationary professional use in both indoor and outdoor environments.  

We consider ourselves a reliable and experienced partner for companies and organizations that integrate these technologies into their processes or products.  Our goal is to offer our customers SOLUTIONS that fully meet the requirements of their tasks.

Our company headquarters is located in southwestern Germany, in Gottenheim near Freiburg im Breisgau, close to the borders of France and Switzerland.

Service Portfolio

Depending on the project requirements, we offer our customers a wide range of products and outsourcing services: technology consulting for selecting the processor platform, delivery of key components, and the commissioned delivery of fully integrated, custom systems.

Over the years, our team has gained valuable experience in the integration of energy-efficient computing technologies. We provide this engineering know-how to our customers in order to optimize product and development costs as well as time-to-market.


Applications

Our boards and systems are used in a variety of applications in the field, in laboratories, in factory automation, and in OEM products, such as in the validation of semiconductor chips, in Lidar systems for 3D object measurement, in autonomous vehicles, various measurement and diagnostic systems, or in mobile data collection in the agricultural and forestry sectors.

Technologies

Our systems are based on state-of-the-art technologies used in modern servers, notebooks, tablet PCs, and navigation systems. The use of modular and industrial-grade system concepts enables long-lasting and scalable systems.