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EMX-WHLGP

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Product number: EMX-WHLGP

Product information "EMX-WHLGP"

Avalue EMX-WHLGP - Thin Mini-ITX Single-Board-Computer with Intel® Whiskey Lake Onboard 8th Gen Intel® Whiskey Lake U Core™ SoC i7/i5/i3 & Celeron® BGA Processor Thin Mini ITX Motherboard

Avalue EMX-WHLGP - Thin Mini-ITX Single-Board-Computer with Intel® Whiskey Lake
Onboard 8th Gen Intel® Whiskey Lake U Core™ SoC i7/i5/i3 & Celeron® BGA Processor Thin Mini ITX Motherboard

Overview

Key Features	Supported CPUs
Onboard 8th Gen Intel® Whiskey Lake U Core™ SoC i7/i5/i3 & Celeron®BGA Processor Two 260-pin DDR4 2400 MHz SO-DIMM socket, supports up to 32GB Max (non ECC only) 2 x HDMI + 1 x HDMI/Dual-channel LVDS (default LVDS) 1 x Intel® I219LM Gigabit Ethernet PHY, 2 x Intel® I210IT PCI-e Gigabit Ethernet (Co-lay Intel® I211AT/I210AT) Realtek ALC888S Audio Codec, TI TPA3113D2PWP Stereo Class-D 6W x 2 Audio Amplifier 1 x M.2 Key A 2230 support WiFi module ( 1 x PCI-e x 1 & USB 2.0 Signal), 1 x M.2 Key B 3042/2242/2260/2280 support WWAN+GNSS or SSD with 1 x SIM card slot 1 x SATA III, 1 x SATA Power, 4 x USB 2.0, 3 x USB 3.1, 1 x USB Type C(USB 3.1 Gen1) 1 x PCI-e x 8 Golden Finger (1 x PCI-e x 1, 1 x PCI-e x 4, 1 x SATA III, 1 x USB 2.0) 4 x RS232, 2 x RS232/422/485, 16-bit GPIO Mic-in, Line-out, 1 S/PIDF DC in +12V~24V	CPU-Product Family: Intel® Whiskey Lake Intel® Core™ i7-8665UE (8M Cache, up to 4.40 GHz) Intel® Core™ i5-8365UE (6M Cache, up to 4.10 GHz) Intel® Core™ i3-8145UE (4M Cache, up to 3.90 GHz) Intel® Celeron® 4305UE (2M Cache, 2.00 GHz)

Key Features

Supported CPUs

Onboard 8th Gen Intel® Whiskey Lake U Core™ SoC i7/i5/i3 & Celeron®BGA Processor
Two 260-pin DDR4 2400 MHz SO-DIMM socket, supports up to 32GB Max (non ECC only)
2 x HDMI + 1 x HDMI/Dual-channel LVDS (default LVDS)
1 x Intel® I219LM Gigabit Ethernet PHY, 2 x Intel® I210IT PCI-e Gigabit Ethernet (Co-lay Intel® I211AT/I210AT)
Realtek ALC888S Audio Codec, TI TPA3113D2PWP Stereo Class-D 6W x 2 Audio Amplifier
1 x M.2 Key A 2230 support WiFi module ( 1 x PCI-e x 1 & USB 2.0 Signal), 1 x M.2 Key B 3042/2242/2260/2280 support WWAN+GNSS or SSD with 1 x SIM card slot
1 x SATA III, 1 x SATA Power, 4 x USB 2.0, 3 x USB 3.1, 1 x USB Type C(USB 3.1 Gen1)
1 x PCI-e x 8 Golden Finger (1 x PCI-e x 1, 1 x PCI-e x 4, 1 x SATA III, 1 x USB 2.0)
4 x RS232, 2 x RS232/422/485, 16-bit GPIO
Mic-in, Line-out, 1 S/PIDF
DC in +12V~24V

CPU-Product Family: Intel® Whiskey Lake

CPU-Variants

CPU	Intel® Core™ i7-8665UE	Intel® Core™ i5-8365UE	Intel® Core™ i3-8145UE	Intel® Celeron® 4305UE
Processor Number	i7-8665UE	i5-8365UE	i3-8145UE	4305UE
Cache	8 MB Intel® Smart Cache	6 MB Intel® Smart Cache	4 MB Intel® Smart Cache	2 MB Intel® Smart Cache
Total Cores	4	4	2	2
Total Threads	8	8	4	2
PCI Express Revision	3.0	3.0	3.0	3.0
Max Turbo Frequency	4.40 GHz	4.10 GHz	3.90 GHz

Specification

-System Information-

Processor	Intel® Core™ i7-8665UE Processor (8M Cache, up to 4.40 GHz) Intel® Core™ i5-8365UE Processor (6M Cache, up to 4.10 GHz) Intel® Core™ i3-8145UE Processor (4M Cache, up to 3.9GHz) Intel® Celeron® Processor 4305UE (2M Cache, 2.00 GHz)
System Memory	Two 260-pin DDR4 2400 MHz SO-DIMM socket, supports up to 32GB Max (non ECC only)
I/O Chipset	EC IT8528E-I
BIOS Information	AMI 256Mbit SPI BIOS
Watchdog Timer	H/W Reset: 1sec. ~ 65535sec./min. and 1sec. or 1min./step
H/W Status Monitor	Monitoring System Temperature and Voltage with Auto Throttling Control
TPM	1 x onboard TPM2.0

Expansion

Expansion	1 x M.2 Key B 3042/2242/2260/2280 (with 1 x PCI-e x 1 (default) or SATA by BIOS), USB 2.0 with 1 x SIM card slot, support WWAN+GNSS or SSD with 1 x SIM card slot, support WWAN+GNSS or SSD. 1 x M.2 Key A 2230 support WiFi module ( 1 x PCI-e x 1 & USB 2.0 Signal)

I/O

USB Port	3 x USB 3.1, 1 x USB Type C (USB 3.1 Gen1, without DP signal) at I/O 4 x USB 2.0
COM Port	4 x RS232 2 x RS232/422/485
SATA	1 x SATA Power 1 x SATA III
DIO	1 x 16-bit GPIO

Display

Graphic Chipset	Intel® Processor Graphics
Spec. & Resolution	3 x HDMI 1.4b: 3840 x 2160 @ 30 Hz, 2560 x 1600@ 30 Hz 2CH 18/24bits LVDS 1920 x 1080 (Chrontel. CH7511B eDP to LVDS Converter)
Multiple Display	Triple Display
LVDS	2CH 18/24bits LVDS 1920 x 1080 Chrontel. CH7511B eDP to LVDS Converter

Audio

Audio Codec	Realtek ALC888S supports 2-CH
Audio Interface	Mic-in, Line-out
Audio Amplifier	TI TPA3113D2PWP Stereo Class-D 6W x 2

Ethernet

LAN Chipset	1 x Intel® I219LM Gigabit Ethernet PHYv 2 x Intel® I210IT PCI-e Gigabit Ethernet (Co-lay Intel® I211AT/I210AT)
Ethernet Interface	10/100/1000 Base-Tx GbE compatible
LAN Port	3 x RJ45

Mechanical & Environmental

Operating Temperature	-20~ 60°C (-68 ~ 140°F), 60°C with 0.5 m/s air flow
Storage Temperature	-40 ~ 75°C (-40 ~ 167°F)
Operating Humidity	40°C @ 95% Relative Humidity, Non-condensing
Weight	0.88lbs (0.4Kgs)
Power Requirement	+12V~24V
Power Mode	AT/ATX
Dimension (L x W)	6.69” x 6.69” (170mm x 170mm)

Ordering Information

Ordering Information	Onboard 8th Gen Intel® Whiskey Lake U Core™ SoC i7/i5/i3 & Celeron® BGA Processor Thin Mini ITX MotherboardEMX-WHLGP-430-B1R (w/o heatsink)/ EMX-WHLGP-43B1-01R (w/heatsink and heater, wide temp)EMX-WHLGP-814-B1R (w/o heatsink)/ EMX-WHLGP-81B1-01R (w/heatsink and heater, wide temp)EMX-WHLGP-836-B1R (w/o heatsink)/ EMX-WHLGP-83B1-01R (w/heatsink and heater, wide temp)EMX-WHLGP-866-B1R (w/o heatsink)/ EMX-WHLGP-86B1-01R (w/heatsink and heater, wide temp)Note: EMX-WHLGP standard package does not include I/O shields due to LAN 2 & 3 port exceed standard Thin MiniITX chassis. Customer need to make customized changes on chassis.

Onboard 8th Gen Intel® Whiskey Lake U Core™ SoC i7/i5/i3 & Celeron® BGA Processor Thin Mini ITX MotherboardEMX-WHLGP-430-B1R (w/o heatsink)/ EMX-WHLGP-43B1-01R (w/heatsink and heater, wide temp)EMX-WHLGP-814-B1R (w/o heatsink)/ EMX-WHLGP-81B1-01R (w/heatsink and heater, wide temp)EMX-WHLGP-836-B1R (w/o heatsink)/ EMX-WHLGP-83B1-01R (w/heatsink and heater, wide temp)EMX-WHLGP-866-B1R (w/o heatsink)/ EMX-WHLGP-86B1-01R (w/heatsink and heater, wide temp)Note: EMX-WHLGP standard package does not include I/O shields due to LAN 2 & 3 port exceed standard Thin MiniITX chassis. Customer need to make customized changes on chassis.

All data is for information purposes only. The specification is subject to change without notice in advance. Any configuration other than original product specification is not guaranteed. Although all the information contained within this website is carefully checked, no guarantee of correctness is implied or expressed.
Please always double-check the latest version of the product specification of the product manufacturer. Manufacturer Product Website: EMX-WHLGP
Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with MCTX Mobile & Embedded Computers GmbH.

OEM System Integration Support

We would be happy to assist you in selecting the optimal hardware platform for your application.

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You can reach us by phone at +49 (0)7665/9390-185 (Monday to Friday from 8:00 AM to 8:00 PM). Alternatively, you are welcome to contact us anytime via the contact form at the end of this page. If you cannot reach us by phone, please send us a brief message via the contact form – we will get back to you as soon as possible.

^{Please note that we offer our services exclusively to Original Equipment Manufacturers. We do not sell to private persons or resellers.}

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MCTX Mobile & Embedded Computers GmbH was founded in 2010 and focuses on the development and marketing of compact, high-performance, energy-efficient, and scalable computer systems and system components for mobile and stationary professional use in both indoor and outdoor environments.

We consider ourselves a reliable and experienced partner for companies and organizations that integrate these technologies into their processes or products. Our goal is to offer our customers SOLUTIONS that fully meet the requirements of their tasks.

Our company headquarters is located in southwestern Germany, in Gottenheim near Freiburg im Breisgau, close to the borders of France and Switzerland.

Service Portfolio

Depending on the project requirements, we offer our customers a wide range of products and outsourcing services: technology consulting for selecting the processor platform, delivery of key components, and the commissioned delivery of fully integrated, custom systems.

Over the years, our team has gained valuable experience in the integration of energy-efficient computing technologies. We provide this engineering know-how to our customers in order to optimize product and development costs as well as time-to-market.

Applications

Our boards and systems are used in a variety of applications in the field, in laboratories, in factory automation, and in OEM products, such as in the validation of semiconductor chips, in Lidar systems for 3D object measurement, in autonomous vehicles, various measurement and diagnostic systems, or in mobile data collection in the agricultural and forestry sectors.

Technologies

Our systems are based on state-of-the-art technologies used in modern servers, notebooks, tablet PCs, and navigation systems. The use of modular and industrial-grade system concepts enables long-lasting and scalable systems.