Module Store - Building Blocks for Developers of Embedded Computing Systems
EMX-TGLP
Price on request
| Avalue EMX-TGLP - Mini-ITX Single-Board-Computer with Intel® Tiger Lake |
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| 11th Gen Intel® Core™ SoC i7/i5/i3 & Celeron BGA Processor Mini ITX Motherboard |
| Overview |
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| Key Features | Supported CPUs |
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CPU-Product Family: Intel® Tiger Lake
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| CPU-Variants |
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| CPU | Processor Number | Cache | Total Cores | Total Threads | Max Turbo Frequency |
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| Intel® Core™ i7-1185GRE | i7-1185GRE | 12 MB Intel® Smart Cache | 4 | 8 | 4.40 GHz |
| Intel® Core™ i7-1185G7E | i7-1185G7E | 12 MB Intel® Smart Cache | 4 | 8 | 4.40 GHz |
| Intel® Core™ i5-1145GRE | i5-1145GRE | 8 MB Intel® Smart Cache | 4 | 8 | 4.10 GHz |
| Intel® Core™ i5-1145G7E | i5-1145G7E | 8 MB Intel® Smart Cache | 4 | 8 | 4.10 GHz |
| Intel® Core™ i3-1115GRE | i3-1115GRE | 6 MB Intel® Smart Cache | 2 | 4 | 3.90 GHz |
| Intel® Core™ i3-1115G4E | i3-1115G4E | 6 MB Intel® Smart Cache | 2 | 4 | 3.90 GHz |
| Intel® Celeron® 6305E | 6305E | 4 MB Intel® Smart Cache | 2 | 2 |
| Specification |
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-System Information-
| Processor | Intel® Core™ i7-1185G7E, i7-1185GRE (up to 4.4GHz, quad-core, 12M Cache, TDP: 28/15/12W)* Intel® Core™ i5-1145G7E, i5-1145GRE (up to 4.1GHz, quad-core, 8M Cache, TDP: 28/15/12W)* Intel® Core™ i3-1115G4E, i3-1115GRE (up to 3.9GHz, dual-core, 6M Cache, TDP: 28/15/12W)* Intel® Celeron® 6305E (up to 1.8GHz, dual-core, 4M Cache, TDP: 15W) |
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| System Memory | 2 x 260-pin DDR4 3200 MHz SO-DIMM supports up to 64GB (non ECC only) |
| I/O Chipset | EC iTE IT8528E |
| BIOS Information | AMI uEFI BIOS, 256Mbit SPI Flash ROM |
| Watchdog Timer | H/W Reset: 1sec. ~ 65535sec./min. and 1sec. or 1min./step |
| H/W Status Monitor | CPU temperature monitoring Voltages monitoring CPU fan speed control |
| TPM | Onboard NuvoTon NPCT754AADYX support TPM 2.0 |
Expansion
| Expansion | 1 x M.2 Type B 3042/3052/2242/2260/2280 (with 1 x PCI-e x1 (default) or SATA, USB 3.0 with 1 x SIM card slot, support WWAN+GNSS or NVMe SSD *SATA 2 share with M.2 key B SATA 1 x M.2 Key E 2230 support WiFi module and CNVi (1 x PCI-e x1 & USB 2.0 Signal) |
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I/O
| USB Port | 3 x USB 3.2 Gen2, 1 x USB 3.2 Gen1 at I/O 4 x USB2.0 by pin header |
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| COM Port | 4 x RS232 2 x RS232/422/485 |
| SATA | 1 x SATA Power 2 x SATA III |
| DIO | 1 x 16-bit GPIO |
Display
| Graphic Chipset | Intel® 12th Generation CPU integrated |
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| Spec. & Resolution | DP1+DP2 (DP1.4): Max: 7680 x 4320@60 Hz DP3+DP4 (DP1.4): Max: 7680 x 4320@60 Hz Single DP port (2021/2 Lab test): 5120 x 2160 @60 Hz, check Max: 7680 x 4329@60 Hz Intel resolution as below: 2 x DP++ : 1920 x 1080@60 Hz 2 x DP: 4096 x 2304@60 Hz LVDS: 1920 x 1080 Dual channel 18/24-bits LVDS (Chrontel CH7511B eDP to LVDS) eDP 4096 x 2304@60 Hz *2 x DP++, LVDS, eDP Default (Thin Mini ITX), Optional: DP3 and DP4 for full height (Maximum: 6 for quadruple independent displays) |
| Multiple Display | 2 x DP++/2 x DP++/1 x LVDS/1 x eDP (Maximum: 6 for quadruple independent displays) |
| LVDS | 2CH 18/24bits LVDS 1920 x 1080 Chrontel. CH7511B eDP to LVDS Converter |
Audio
| Audio Codec | Realtek ALC888S |
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| Audio Interface | Support Line-out & Mic-in & Front audio pin-header |
| Audio Amplifier | 2 x Stereo Class-D 6W Audio Amplifier |
Ethernet
| LAN Chipset | 1 x Intel® I226LM/IT 2.5 Gigabit Ethernet 1 x Intel® I219LM Gigabit Ethernet PHY 2 x Intel® I210AT/IT Gigabit Ethernet (BOM optional) |
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| Ethernet Interface | 10/100/1000 Base-Tx & & 2.5 GbE compatible |
| LAN Port | 4 x RJ45 |
Mechanical & Environmental
| Operating Temperature | Intel@ wide temperature CPU SKU Support: -20~60C Intel@ standard CPU SKU support: 0~60C |
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| Storage Temperature | -40 ~ 75°C (-40 ~ 167°F) |
| Operating Humidity | 40°C @ 95% Relative Humidity, Non-condensing |
| Weight | 0.88lbs (0.4Kgs) |
| Power Requirement | +12V~24V |
| Power Mode | AT/ATX |
| Dimension (L x W) | 6.69” x 6.69” (170mm x 170mm) |
Software Support
| OS Information | Win10 64bit Linux |
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Ordering Information
| Ordering Information | EMX-TGLP-S05-A2R (Celeron, Thin, 2DP/2LAN, Standard Temp.) EMX-TGLP-S15-A2R (Core i3, Thin, 2DP/2LAN, Standard Temp.) EMX-TGLP-S45-A2R (Core i5, Thin, 2DP/2LAN, Standard Temp.) EMX-TGLP-S85-A2R (Core i7, Thin, 2DP/2LAN, Standard Temp.) EMX-TGLP-W15-A2-1R (Core i3, Thin, 2DP/2LAN, Wide Temp.) EMX-TGLP-W45-A2-1R (Core i5, Thin, 2DP/2LAN, Wide Temp.) EMX-TGLP-W85-A2-1R (Core i7, Thin, 2DP/2LAN, Wide Temp.) EMX-TGLP-W15-A2R (Core i3, Full, 4DP/4LAN, Wide Temp.) EMX-TGLP-W45-A2R (Core i5, Full, 4DP/4LAN, Wide Temp.) EMX-TGLP-W85-A2R (Core i7, Full, 4DP/4LAN, Wide Temp.) Intel® 11th Gen. Core™ SoC i7/i5/i3 & Celeron®BGA Processor Mini ITX Motherboard |
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| All data is for information purposes only. The specification is subject to change without notice in advance. Any configuration other than original product specification is not guaranteed. Although all the information contained within this website is carefully checked, no guarantee of correctness is implied or expressed. Please always double-check the latest version of the product specification of the product manufacturer. Manufacturer Product Website: EMX-TGLP Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with MCTX Mobile & Embedded Computers GmbH. |
| OEM System Integration Support |
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We would be happy to assist you in selecting the optimal hardware platform for your application.
If you have any questions, whether technical or commercial, about our products or services, don’t hesitate to contact us. We look forward to hearing from you.
You can reach us by phone at +49 (0)7665/9390-185 (Monday to Friday from 8:00 AM to 8:00 PM). Alternatively, you are welcome to contact us anytime via the contact form at the end of this page. If you cannot reach us by phone, please send us a brief message via the contact form – we will get back to you as soon as possible.
Please note that we offer our services exclusively to Original Equipment Manufacturers. We do not sell to private persons or resellers.MCTX Mobile & Embedded Computers GmbH was founded in 2010 and focuses on the development and marketing of compact, high-performance, energy-efficient, and scalable computer systems and system components for mobile and stationary professional use in both indoor and outdoor environments.
We consider ourselves a reliable and experienced partner for companies and organizations that integrate these technologies into their processes or products. Our goal is to offer our customers SOLUTIONS that fully meet the requirements of their tasks.
Our company headquarters is located in southwestern Germany, in Gottenheim near Freiburg im Breisgau, close to the borders of France and Switzerland.
Service Portfolio
Depending on the project requirements, we offer our customers a wide range of products and outsourcing services: technology consulting for selecting the processor platform, delivery of key components, and the commissioned delivery of fully integrated, custom systems.
Over the years, our team has gained valuable experience in the integration of energy-efficient computing technologies. We provide this engineering know-how to our customers in order to optimize product and development costs as well as time-to-market.
Applications
Our boards and systems are used in a variety of applications in the field, in laboratories, in factory automation, and in OEM products, such as in the validation of semiconductor chips, in Lidar systems for 3D object measurement, in autonomous vehicles, various measurement and diagnostic systems, or in mobile data collection in the agricultural and forestry sectors.
Technologies
Our systems are based on state-of-the-art technologies used in modern servers, notebooks, tablet PCs, and navigation systems. The use of modular and industrial-grade system concepts enables long-lasting and scalable systems.