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EMX-EHLP

Product information "EMX-EHLP"
Avalue EMX-EHLP - Mini-ITX Single-Board-Computer with Intel® Elkhart Lake CPU: Intel® Atom® x6000E and Celeron® Processor, Chipset: Integrated, USB/SATA/COM/LAN: 8/2/6/4, Display: 1 x HDMI / 1 x DP / 1 x LVDS / co-lay eDP
Avalue EMX-EHLP - Mini-ITX Single-Board-Computer with Intel® Elkhart Lake
CPU: Intel® Atom® x6000E and Celeron® Processor, Chipset: Integrated, USB/SATA/COM/LAN: 8/2/6/4, Display: 1 x HDMI / 1 x DP / 1 x LVDS / co-lay eDP

Overview
Key FeaturesSupported CPUs
  • Intel® Atom® x6000E and Celeron® Series processors
  • 1 x 260-pin DDR4 3200MHz SO-DIMM socket, supports up to 32GB Max (Only Atom® x6000E Series Processors support IBECC)
  • DP++, HDMI/DP, Dual channel 18/24-bits LVDS/co-lay eDP by switch IC
  • 4 x Intel® i226LM(IT) Gigabit Ethernet
  • Realtek ALC888S HD Audio Codec
  • TI TPA3113D2 Stereo Class-D 6W
  • 1 x M.2 Type B 3042/3052/2242/2260/2280 slots with SATAIII + USB 3.1 GEN2, USB 2.0, SIM Slot for SSD/LTE/IO Cards support WWAN+GNSS or SSD, 1 x M.2 Key E 2230 support WiFi module (1 x PCI-e x1 & USB 2.0 Signal)
  • 2 x SATA III, 2 x SATA Power, 4 x USB 2.0 by pin header, 2 x USB3.1 Gen2 and 2 x USB3.1 Gen1  at I/O
  • 4 x RS232, 2 x RS232/422/485, 16-bit GPIO
  • Support Line-out & Mic-in & Front audio pin-header
  • DC in +12V~24V (Minimum power input 11.6V)
CPU-Product Family: Intel® Elkhart Lake

CPU-Variants
CPU Intel® Celeron® J6413 Intel® Celeron® J6412
Processor Number J6413 J6412
Cache 1.5 MB L2 Cache 1.5 MB L2 Cache
Total Cores 4 4
Total Threads 4 4
PCI Express Revision 3.0 3.0
Specification

-System Information-

ProcessorIntel® Atom® x6000E and Celeron® Processor
System MemoryOne 260-pin DDR4 3200MHz SO-DIMM socket, supports up to 32GB Max (Only Atom® x6000E Series Processors support IBECC)
I/O ChipsetEC iTE IT5571
BIOS InformationAMI uEFI BIOS, 256Mbit SPI Flash ROM
Watchdog TimerH/W Reset: 1sec. ~ 65535sec./min. and 1sec. or 1min./step
H/W Status MonitorCPU temperature monitoring Voltages monitoring CPU fan speed control

Expansion

Expansion1 x M.2 Type B slot for 3042/3052/2242/2260/2280 size with SATAIII + USB 3.1 GEN2, USB 2.0, SIM Slot for SSD/LTE/IO Cards support WWAN+GNSS and SSD *3042/2242 bridge bracket to 3052 *SATA 2 share with M.2 key B SATA * Only supports one SIM card * Does not support I2S and PCM functions 1 x M.2 Key E 2230 support WiFi module (1 x PCI-e x1 & USB 2.0 Signal) * Does not support PCM/I2S and UART functions

I/O

USB Port4 x USB 2.0 by pin header 2 x USB3.1 Gen2 and 2 x USB3.1 Gen1 at I/O
COM Port4 x RS232, 2 x RS-232/RS422/485
SATA2 x SATA Power 2 x SATA III
DIO1 x 16-bit GPIO

Display

Graphic ChipsetIntel® UHD Graphics for 10th Gen Intel® Processors
Spec. & Resolution1 x DP++: 4096 x 2160@60 Hz (DP: 4096 x 2160@60Hz) 1 x HDMI 2.0b: 4096 x 2160@60 Hz LVDS: 1920 x 1080 Dual channel 18/24-bits LVDS (Chrontel CH7511B-BFI eDP to LVDS) 1 x eDP 4096 x 2160@60 Hz LVDS and eDP via switch IC, either one display is functional.
LVDS2CH 18/24bits LVDS 1920 x 1080 Chrontel. CH7511B eDP to LVDS Converter

Audio

Audio CodecRealtek ALC888S & ALC897 (Co-lay)
Audio InterfaceSupport Line-out & Mic-in & Front audio pin-header
Audio AmplifierTI TPA3113D2 Stereo Class-D 6W

Ethernet

LAN Chipset4 x Intel® i225/i226LM/IT(Default: i226LM/IT); (I225/i226IT for wide temp version) 2.5 Gigabit Ethernet (BOM optional for 1 x 2 RJ45 Thin Mini ITX Cost version design SKU)
Ethernet Interface10/100/1000/2500 Base-Tx GbE compatible Gigabit Ethernet
LAN Port4 x RJ-45

Mechanical & Environmental

Operating Temperature0 ~ 60°C (32 ~ 140 °F) Intel® Pentium®/Celeron®N/J Series CPU SKU -20~60°C (-8~140°F) Intel® Atom®x6000 Series CPU SKU w/HDD/SSD, ambient with 0.5 m/s Air flow
Storage Temperature-40 ~ 75°C (-40 ~ 167°F)
Operating Humidity40°C @ 95% Relative Humidity, Non-condensing
Weight0.88lbs (0.4Kgs)
Power Requirement+12V~24V
Power ModeAT/ATX
Dimension (L x W)6.69” x 6.69” (170mm x 170mm)

Software Support

OS InformationWin10 64bit, Linux

Ordering Information

Ordering InformationEMX-EHLP-J6412-A1R EMX-EHLP-J6413-A1R EMX-EHLP-X13E-A1R EMX-EHLP-X25RE-A1R EMX-EHLP-J12-A1-1R (2LAN (i226V version)) Intel® Celeron®/Atom™ SoC BGA Processor Thin Mini ITX SBC Motherboard
Product Variants / Accessories
EMX-EHLP-J6412-A1R
EMX-EHLP-J6413-A1R
EMX-EHLP-X13E-A1R
EMX-EHLP-X25RE-A1R
EMX-EHLP-J12-A1-1R (2LAN, i226V version)
All data is for information purposes only. The specification is subject to change without notice in advance. Any configuration other than original product specification is not guaranteed. Although all the information contained within this website is carefully checked, no guarantee of correctness is implied or expressed.
Please always double-check the latest version of the product specification of the product manufacturer. Manufacturer Product Website: EMX-EHLP
Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with MCTX Mobile & Embedded Computers GmbH.

OEM System Integration Support

All documents found on this page are subject to change without notification. Always ensure that you work with the latest version.

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MCTX Mobile & Embedded Computers GmbH was founded in 2010 and focuses on the development and marketing of compact, high-performance, energy-efficient, and scalable computer systems and system components for mobile and stationary professional use in both indoor and outdoor environments.  

We consider ourselves a reliable and experienced partner for companies and organizations that integrate these technologies into their processes or products.  Our goal is to offer our customers SOLUTIONS that fully meet the requirements of their tasks.

Our company headquarters is located in southwestern Germany, in Gottenheim near Freiburg im Breisgau, close to the borders of France and Switzerland.

Service Portfolio

Depending on the project requirements, we offer our customers a wide range of products and outsourcing services: technology consulting for selecting the processor platform, delivery of key components, and the commissioned delivery of fully integrated, custom systems.

Over the years, our team has gained valuable experience in the integration of energy-efficient computing technologies. We provide this engineering know-how to our customers in order to optimize product and development costs as well as time-to-market.


Applications

Our boards and systems are used in a variety of applications in the field, in laboratories, in factory automation, and in OEM products, such as in the validation of semiconductor chips, in Lidar systems for 3D object measurement, in autonomous vehicles, various measurement and diagnostic systems, or in mobile data collection in the agricultural and forestry sectors.

Technologies

Our systems are based on state-of-the-art technologies used in modern servers, notebooks, tablet PCs, and navigation systems. The use of modular and industrial-grade system concepts enables long-lasting and scalable systems.