Module Store - Building Blocks for Developers of Embedded Computing Systems
EMS-TGL-4COM isolation
Price on request
| Avalue EMS-TGL-4COM isolation - Modular Computer Embedded Box PC with Intel® Tiger Lake |
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| 11th Gen Intel® Core™ Processor i7/i5/i3Fanless Rugged Embedded System w_4COM isolation IET Module |
| Overview |
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| Key Features | Supported CPUs |
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CPU-Product Family: Intel® Tiger Lake
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| CPU-Variants |
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| CPU | Processor Number | Cache | Max Turbo Frequency | Total Cores | Total Threads |
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| Intel® Core™ i7-1185GRE | i7-1185GRE | 12 MB Intel® Smart Cache | 4.40 GHz | 4 | 8 |
| Intel® Core™ i7-1185G7E | i7-1185G7E | 12 MB Intel® Smart Cache | 4.40 GHz | 4 | 8 |
| Intel® Core™ i5-1145GRE | i5-1145GRE | 8 MB Intel® Smart Cache | 4.10 GHz | 4 | 8 |
| Intel® Core™ i5-1145G7E | i5-1145G7E | 8 MB Intel® Smart Cache | 4.10 GHz | 4 | 8 |
| Intel® Core™ i3-1115GRE | i3-1115GRE | 6 MB Intel® Smart Cache | 3.90 GHz | 2 | 4 |
| Intel® Core™ i3-1115G4E | i3-1115G4E | 6 MB Intel® Smart Cache | 3.90 GHz | 2 | 4 |
| Specification |
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-System Information-
| Processor | Intel® Core™ i7-1185GRE (15W, 12M Cache, up to 2.80 GHz), WT Intel® Core™ i5-1145GRE (15W, 8M Cache, up to 2.60 GHz), WT Intel® Core™ i3-1115GRE (15W, 6M Cache, up to 3.00 GHz), WT Intel® Core™ i7-1185G7E (15W, 12M Cache, up to 2.80 GHz), ST Intel® Core™ i5-1145G7E (15W, 8M Cache, up to 2.60 GHz), ST Intel® Core™ i3-1115G4E (15W, 6M Cache, up to 3.00 GHz), ST |
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| System Memory | 2 x 260-pin SODIMM socket Max. up to 64GB DDR4 3200 MT/s |
| I/O Chipset | EC ITE IT8528E |
| BIOS Information | AMI uEFI BIOS 256 Mbit SPI Flash ROM |
| Watchdog Timer | H/W Reset, 1sec. ~ 65535sec. |
| H/W Status Monitor | CPU & system temperature monitoring and Voltages monitoring |
| SBC | EBM-TGLS + AUX-M07 |
Expansion
| Expansion | 1 x M.2 Key-B 2242/3042/3052 support SATA3/ PCIeIII x1/ USB3.1 and SIM slot1 1 x M.2 Key-E 2230 for Wi-Fi & BT Module(CNVi) |
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Storage
| Storage | 1 x M.2 Key-M 2242/2280, support PCIe Gen. III x 4 (NVMe SSD) 1 x M.2 Key-B 2242, support SATA (share with expansion slot) |
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I/O
| USB Port | 2 x USB 3.1 Gen.2 (10Gbp/s) 2 x USB 3.1 Gen.1 (5Gbp/s) 2 x USB 2.0 |
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| COM Port | 2 x COM RS232/422/485 (select via BIOS, auto flow control via HW) 4 x COM RS232/422/485, w/2.5KV isolation |
| GPIO | 1 x 8-bit GPIO (DB9) |
| SIM Slot | 1 x internal SIM slot |
| Antenna | 8 x Antenna with dust cover (6 x LTE+GPS / 2 x Wifi) |
Display
| Graphic Chipset | Intel® Iris® Xe Graphics (i7-1185GRE/i5-1145GRE/i7-1185G7E/i5-1145G7E) Intel® UHD Graphics for 11th Gen Intel® Processors (i3-1115GRE/i3-1115G4E) |
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| Spec. & Resolution | DP++ 1.4: Max. resolution 4096x2304 @ 60Hz HDMI 2.0b : Max. resolution 4096x2304 @ 60Hz |
| Multiple Display | Dual Displays |
Audio
| Audio Codec | Realtek ALC888S HD codec |
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| Audio Interface | Mic-In, Line-Out |
Certifications
| Certification Information | CEFCC Class B |
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Ethernet
| LAN Chipset | 1 x Intel® I225-LM 1 x Intel® I219-LM |
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| Ethernet Interface | 1 x 10/100/1000/2.5G Base-Tx GbE compatible 1 x 10/100/1000Base-Tx GbE compatible. |
| LAN Port | 2 x RJ-45 |
Power Requirement
| DC Input | DC in 12/24V (+9V ~ +36V), wide voltage single power input TVS component for surge protection Reverse current/voltage protection (Max. Currency: 13A) |
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| DC Input Connector | 3-Pin Terminal Block (V+. V-, GND) |
| ACPI | Single power ATX Support S0,S3, S4, S5 ACPI 5.0 Compliant |
| Power Mode | AT/ATX (ATX is default setting) |
Mechanical & Environmental
| Operating Temperature | -40°C ~ 70°C (w/SSD) ambient w/ air flow, WT sku 0°C ~ 70°C (w/SSD) ambient w/ air flow, ST sku |
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| Storage Temperature | -30°C ~ 70°C (-22°F ~ 158°F) |
| Operating Humidity | 40°C @ 95% Relative Humidity, Non-condensing |
| Dimension (W x L x H) | 240mm x 150mm x 69 mm (w/ IET module) |
| Weight | TBD |
| Vibration Test | With SSD : 5Grms, IEC 60068-2-64, Random, 5 ~ 500Hz, 1hr/axis |
| Shock Test | With SSD : 55Grms, IEC 60068-2-27, Half Sine, 11ms |
| IP Rating | IP 50 |
| Mounting Kit | Wall mount kit (standard) DIN RAIL (optional) |
Software Support
| OS Information | Win 10 64bit Linux |
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Ordering Information
| Ordering Information | EMS-TGL-4COM isolation11th Gen Intel® Core™ Processor i7/i5/i3 Fanless Rugged Embedded System, w_4COM isolation IET Module EMS-TGL-W85-A1-4R (i7-1185GRE)EMS-TGL-W45-A1-4R (i5-1145GRE)EMS-TGL-W15-A1-4R (i3-1115GRE)EMS-TGL-S85-A1-4R (i7-1185G7E)EMS-TGL-S45-A1-4R (i5-1145G7E)EMS-TGL-S15-A1-4R (i3-1115G4E) |
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| All data is for information purposes only. The specification is subject to change without notice in advance. Any configuration other than original product specification is not guaranteed. Although all the information contained within this website is carefully checked, no guarantee of correctness is implied or expressed. Please always double-check the latest version of the product specification of the product manufacturer. Manufacturer Product Website: EMS-TGL-4COM isolation Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with MCTX Mobile & Embedded Computers GmbH. |
| OEM System Integration Support |
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We would be happy to assist you in selecting the optimal hardware platform for your application.
If you have any questions, whether technical or commercial, about our products or services, don’t hesitate to contact us. We look forward to hearing from you.
You can reach us by phone at +49 (0)7665/9390-185 (Monday to Friday from 8:00 AM to 8:00 PM). Alternatively, you are welcome to contact us anytime via the contact form at the end of this page. If you cannot reach us by phone, please send us a brief message via the contact form – we will get back to you as soon as possible.
Please note that we offer our services exclusively to Original Equipment Manufacturers. We do not sell to private persons or resellers.MCTX Mobile & Embedded Computers GmbH was founded in 2010 and focuses on the development and marketing of compact, high-performance, energy-efficient, and scalable computer systems and system components for mobile and stationary professional use in both indoor and outdoor environments.
We consider ourselves a reliable and experienced partner for companies and organizations that integrate these technologies into their processes or products. Our goal is to offer our customers SOLUTIONS that fully meet the requirements of their tasks.
Our company headquarters is located in southwestern Germany, in Gottenheim near Freiburg im Breisgau, close to the borders of France and Switzerland.
Service Portfolio
Depending on the project requirements, we offer our customers a wide range of products and outsourcing services: technology consulting for selecting the processor platform, delivery of key components, and the commissioned delivery of fully integrated, custom systems.
Over the years, our team has gained valuable experience in the integration of energy-efficient computing technologies. We provide this engineering know-how to our customers in order to optimize product and development costs as well as time-to-market.
Applications
Our boards and systems are used in a variety of applications in the field, in laboratories, in factory automation, and in OEM products, such as in the validation of semiconductor chips, in Lidar systems for 3D object measurement, in autonomous vehicles, various measurement and diagnostic systems, or in mobile data collection in the agricultural and forestry sectors.
Technologies
Our systems are based on state-of-the-art technologies used in modern servers, notebooks, tablet PCs, and navigation systems. The use of modular and industrial-grade system concepts enables long-lasting and scalable systems.