GPU Computing
GIGAIPC QBiX-Pro-WHLA8265H-A1 - AI Inference_Platform KI Inferenz Plattform Industrial system with Intel® Core™ i5-8265U Processor/ Fanless Design / Dual Channel DDR4 up to 64GB/ 2 x HDMI
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GIGAIPC QBiX-Pro-WHLA8265H-A1 - AI Inference_Platform KI Inferenz PlattformIndustrial system with Intel® Core™ i5-8265U Processor/ Fanless Design / Dual Channel DDR4 up to 64GB/ 2 x HDMIÜbersichtKey FeaturesSystem Size : 178W x 125D x 52.7H (mm)Intel® Core™ i5-8265U ProcessorDual Channel DDR4, 2 x SO-DIMMs2 x HDMI for Dual display2 x GbE LAN PortsSpezifikationDimension178W x 125D x 52.7H(mm)CPUIntel® Core™ i5-8265U Processor 14nm, 4 cores, 8 threads, up to 3.9 GHz TDP 15WChipsetSoCMemory2 x DDR4 SO-DIMM sockets, Max. Capacity 64 GB Support Dual Channel DDR4 2400 MHz memory modulesEthernet2 x GbE LAN Ports (Intel® I219V and Intel® I211AT)Graphic SupportIntegrated Graphics Processor - Intel® UHD Graphics for 8th Generation Intel® Processors: 2 x HDMI 1.4 ports, supporting a maximum resolution of 4096x2160 @30Hz (2 independent display outputs)AudioRealtek® Audio CodecStorage1 x 2.5” HDD/SSD (SATA 6Gb/s)Expansion Slots1 x 2280 M.2 M-Key (PCIe x4, SATA 6Gb/s) 1 x 2230 M.2 E-Key (WiFi/BT) 1 x Full-size Mini PCIe with SIM slot (PCIe x1 + USB2.0) -- support 3G/4G moduleFront I/O2 x RJ45 LAN Ports 4 x USB 3.2 Gen 2x1 2 x HDMI 1 x Power button with LED 1 x HDD LED 1 x COM Port (RS-232/422/485 & RI/5V/12V)Rear I/O2 x USB 2.0 2 x COM Ports (RS-232) 1 x GPIO (8 bits) 1 x Headphone Jack 1 x 3-pin Terminal BlockSide I/O2 x External Antenna Holes (Optional)Power+9V~36VDC (Full Range)Operation TemperatureOperating temperature: 0°C to 50°C Operating humidity: 0-90% (non-condensing) Non-operating temperature: -40°C to 85°C Non-operating humidity: 0%-95% (non-condensing) Use wide temperature range memory and storageVibration During OperationOperation: IEC 60068-2-64, 5 Grms, random, 5 ~ 500 Hz, 1 hr / Per Axis, With SSD/M.2 2280Non-operation: IEC 60068-2-6, 2 G, Sine, 10 ~ 500 Hz, 1 Oct/min, 1 hr / Per AxisShock During OperationOperation: IEC 60068-2-27, 50 G, half sine, 11 ms duration, With SSDPackaging ContentCarton size: 505 x 333 x 231 (mm) Packing Capacity: 5pcs Single Box size: 313 x 191 x 95 (mm) Single Box weight: Approx. 2.1kg Including: Screw I Head For 2.5" HDD M3x8L x 4 (P/N: 25KSG-130081-K1R) Thermal Pad x 2 (P/N: 25ST3-200052-T5R) Thermal Pad x 1 (P/N: 25ST3-200051-T5R) SATA Cable x 1 (P/N: 25CF4-070020-S9R) Terminal Blocks Male Plug x 1 (P/N: 25IO0-5ESDV0-D2R)MountingWall mount (Optional)Order Information6BQP8265AMR-SI (Box packing)Optional KitTPM 2.0 module P/N: 9CTM000NR-00 TPM Cable P/N: 25CRZ-100600-S9RBitte stellen Sie sicher, dass Sie stets die aktuellsten Version der Produktspezifikationen des Herstellers verwenden. Hersteller-Produktseite: QBiX-Pro-WHLA8265H-A1MCTX Mobile & Embedded Computers GmbH IST UM DIE RICHTIGKEIT UND AKTUALITÄT DER DATEN AUF DIESER WEBSEITE BEMÜHT, ÜBERNIMMT JEDOCH KEINERLEI ZUSICHERUNG BEZÜGLICH DES INHALTS. EINE HAFTUNG ODER GARANTIE FÜR DIE AKTUALITÄT, RICHTIGKEIT UND VOLLSTÄNDIGKEIT DER ZUR VERFÜGUNG GESTELLTEN INFORMATIONEN IST FOLGLICH AUSGESCHLOSSEN.Technische Unterstützung & System Integration Services
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GIGAIPC QBiX-Pro-WHLA8145H-A2 - AI Inference_Platform KI Inferenz Plattform mit Intel® Whiskey Lake Industrial system with Intel® Core™ i3-8145UE Processor/ Fanless Design / Dual Channel DDR4 up to 64GB/ 2 x HDMI
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GIGAIPC QBiX-Pro-WHLA8145H-A2 - AI Inference_Platform KI Inferenz Plattform mit Intel® Whiskey LakeIndustrial system with Intel® Core™ i3-8145UE Processor/ Fanless Design / Dual Channel DDR4 up to 64GB/ 2 x HDMIÜbersichtKey FeaturesCPUSystem Size : 178W x 125D x 52.7H (mm)Intel® Core™ i3-8145UE ProcessorDual Channel DDR4, 2 x SO-DIMMs2 x HDMI for Dual display2 x GbE LAN Ports
CPU Produktfamilie: Intel® Whiskey Lake
Intel® Core™ i3-8145UE (4M Cache, bis zu 3.90 GHz)CPU-Varianten
CPU
Intel® Core™ i3-8145UE
Processor Number
i3-8145UE
Cache
4 MB Intel® Smart Cache
Max Turbo Frequency
3.90 GHz
Total Cores
2
Total Threads
4
PCI Express Revision
3.0
SpezifikationDimension178W x 125D x 52.7H(mm)CPUIntel® Core™ i3-8145UE Processor 14nm, 2 cores, 4 threads, up to 3.9 GHz TDP 15W 4 MB SmartCacheChipsetSoCMemory2 x DDR4 SO-DIMM sockets, Max. Capacity 64 GB Support Dual Channel DDR4 2400 MHz memory modulesEthernet2 x GbE LAN Ports (Intel® I219V and Intel® I211AT)Graphic SupportIntegrated Graphics Processor - Intel® UHD Graphics 620: 2 x HDMI 1.4 ports, supporting a maximum resolution of 4096x2160 @30Hz (2 independent display outputs)AudioRealtek® Audio CodecStorage1 x 2.5” HDD/SSD (SATA 6Gb/s)Expansion Slots1 x 2280 M.2 M-Key (PCIe x4, SATA 6Gb/s) 1 x 2230 M.2 E-Key (WiFi/BT) 1 x Full-size Mini PCIe with SIM slot (PCIe x1 + USB2.0) -- support 3G/4G moduleFront I/O2 x RJ45 LAN Ports 4 x USB 3.2 Gen 2x1 2 x HDMI 1 x Power button with LED 1 x HDD LED 1 x COM Port (RS-232/422/485 & RI/5V/12V)Rear I/O2 x USB 2.0 2 x COM Ports (RS-232) 1 x GPIO (8 bits) 1 x Headphone Jack 1 x Screw Type DC JackSide I/O2 x External Antenna Holes (Optional)Power+9V~36VDC (Adapter 19V/90W)Operation TemperatureOperating temperature: 0°C to 50°C Operating humidity: 0-90% (non-condensing) Non-operating temperature:-40°C to 85°C Non-operating humidity: 0%-95% (non-condensing) Use wide temperature range memory and storageVibration During OperationOperation: IEC 60068-2-64, 5 Grms, random, 5 ~ 500 Hz, 1 hr / Per Axis, With SSD/M.2 2280Non-operation: IEC 60068-2-6, 2 G, Sine, 10 ~ 500 Hz, 1 Oct/min, 1 hr / Per AxisShock During OperationOperation: IEC 60068-2-27, 50 G, half sine, 11 ms duration, with SSDPackaging ContentCarton size: 505 x 333 x 231 (mm) Packing Capacity: 5pcs Single Box size: 313 x 191 x 95 (mm) Single Box weight: Approx. 2.1kg Including: Screw I Head For 2.5" HDD M3x8L x 4 (P/N: 25KSG-130081-K1R) Thermal Pad x 2 (P/N: 25ST3-200052-T5R) Thermal Pad x 1 (P/N: 25ST3-200051-T5R) SATA Cable x 1 (P/N: 25CF4-070020-S9R) Power Cord : Optional (by region) PSU ADP 19V 90W 100-240VAC x 1 (P/N: 25EP4-10090A-F3S)MountingWall mount (Optional)Order Information6BQP8145AMR-SI (Box packing)Optional KitTPM 2.0 module P/N: 9CTM000NR-00 TPM Cable P/N: 25CRZ-100600-S9RBitte stellen Sie sicher, dass Sie stets die aktuellsten Version der Produktspezifikationen des Herstellers verwenden. Hersteller-Produktseite: QBiX-Pro-WHLA8145H-A2MCTX Mobile & Embedded Computers GmbH IST UM DIE RICHTIGKEIT UND AKTUALITÄT DER DATEN AUF DIESER WEBSEITE BEMÜHT, ÜBERNIMMT JEDOCH KEINERLEI ZUSICHERUNG BEZÜGLICH DES INHALTS. EINE HAFTUNG ODER GARANTIE FÜR DIE AKTUALITÄT, RICHTIGKEIT UND VOLLSTÄNDIGKEIT DER ZUR VERFÜGUNG GESTELLTEN INFORMATIONEN IST FOLGLICH AUSGESCHLOSSEN.Technische Unterstützung & System Integration Services
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GIGAIPC MXM-A-A370M - MXM GPU Modules KI Beschleuniger MXM module type A with Intel® Arc™ A370M Graphics
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GIGAIPC MXM-A-A370M - MXM GPU Modules KI BeschleunigerMXM module type A with Intel® Arc™ A370M GraphicsÜbersichtKey FeaturesIntel® Arc™ A370M GraphicsGDDR6 4GB 64 bit MemorySupport Xe HPG ArchitectureSupport for XMX AI accelerationSupport 4 x DP2.0 (8K) resolutionSpezifikationDimensionMXM module type A 82W x 70D (mm)GPUIntel® Arc™ A370M Graphics Microarchitecture: Xe HPG Xe-cores: 8 Intel® XMX Engines: 128 Graphics clock: 1550 MHz TGP: 35-50WPCI Express configurationsPCI Express 4.0x8MemoryGDDR6 4GB, 64bit memory bus Memory speed: 14 Gbps Bandwidth: 112 GB/sGraphicsReserved 4 x DP 2.0 supporting a maximum resolution of 7680x4320 @60Hz (4 independent display outputs)OS CompatibilityWindows 10/11 (x64)Operating PropertiesOperating temperature: 0°C to 60°C Operating humidity: 0-90% (non-condensing) Non-operating temperature: -40°C to 85°C Non-operating humidity: 0%-95% (non-condensingPacking ContentCarton size: 384 x 251 x 211 (mm) Packing Capacity: 20pcs Single Box size : 168 x 112 x 34 (mm)Order Information9CMBIE1MR-SI (Box packing)Bitte stellen Sie sicher, dass Sie stets die aktuellsten Version der Produktspezifikationen des Herstellers verwenden. Hersteller-Produktseite: MXM-A-A370MMCTX Mobile & Embedded Computers GmbH IST UM DIE RICHTIGKEIT UND AKTUALITÄT DER DATEN AUF DIESER WEBSEITE BEMÜHT, ÜBERNIMMT JEDOCH KEINERLEI ZUSICHERUNG BEZÜGLICH DES INHALTS. EINE HAFTUNG ODER GARANTIE FÜR DIE AKTUALITÄT, RICHTIGKEIT UND VOLLSTÄNDIGKEIT DER ZUR VERFÜGUNG GESTELLTEN INFORMATIONEN IST FOLGLICH AUSGESCHLOSSEN.Technische Unterstützung & System Integration Services
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GIGAIPC CIEPI-SI - MXM GPU Modules KI Beschleuniger PCIe-to-MXM adapter with 4 x HDMI 2.1 outputs, compatible with GIGAIPC MXM modules
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GIGAIPC CIEPI-SI - MXM GPU Modules KI BeschleunigerPCIe-to-MXM adapter with 4 x HDMI 2.1 outputs, compatible with GIGAIPC MXM modulesÜbersichtKey FeaturesSupport 4 x HDMI 2.1 outputsCompatible with GIGAIPC MXM modulesCompatible with MXM 3.1 Type ASupport PCI Express 4.0SpezifikationDimension167.65 x 111.15 (mm)Compatible modelsMXM-A-A370MPCI Express configurationsPCI Express 4.0x8Display outputs4 x HDMI 2.1 port, supporting a maximum resolution of 7680x4320 @60HzSystem Fan Connector12V DC fan power connectorGPU Fan Connector12V DC fan power connectorPower Connector8-pin power connectorOS CompatibilityWindows 10/11 (x64)Operating PropertiesOperating temperature: 0°C to 60°C Operating humidity: 0-90% (non-condensing) Non-operating temperature: -40°C to 85°C Non-operating humidity: 0%-95% (non-condensing)Packing ContentCarton size: 310 x 257 x 234 (mm) Packing Capacity: 20pcs Single Box size : 250 x183 x 35 (mm) Including: I/O Bracket x 1 (P/N: 25HB2-CIEP60-H5R) Screws for I/O Bracket, M3x4L x 10 (P/N: 25982G-1C016-S00)Order Information9CIEPIMR-SI (Box packing)Bitte stellen Sie sicher, dass Sie stets die aktuellsten Version der Produktspezifikationen des Herstellers verwenden. Hersteller-Produktseite: CIEPI-SIMCTX Mobile & Embedded Computers GmbH IST UM DIE RICHTIGKEIT UND AKTUALITÄT DER DATEN AUF DIESER WEBSEITE BEMÜHT, ÜBERNIMMT JEDOCH KEINERLEI ZUSICHERUNG BEZÜGLICH DES INHALTS. EINE HAFTUNG ODER GARANTIE FÜR DIE AKTUALITÄT, RICHTIGKEIT UND VOLLSTÄNDIGKEIT DER ZUR VERFÜGUNG GESTELLTEN INFORMATIONEN IST FOLGLICH AUSGESCHLOSSEN.Technische Unterstützung & System Integration Services
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