Module Store - Building Blocks for Developers of Embedded Computing Systems
SOM-SMARC-MX8X
Price on request
| SECO SOM-SMARC-MX8X - SMARC CPU Module |
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| SMARC® Rel. 2.1.1 Computer on Module (CoM) with NXP i.MX 8X Applications Processors. (SWAN - D16) |
| Overview |
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| Key Features |
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| Specification |
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| Description | SMARC® Rel. 2.1.1 Computer on Module (CoM) with NXP i.MX 8X Applications Processors |
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| Cpu | NXP i.MX 8X family SoCs: Dual or Quad ARM Cortex®-A35 Cores + 1x Cortex® M4F core for real-time processing
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| Max Cores | 4+1 |
| Memory | Soldered down LPDDR4 memory @ 1200MHz, 32-bit interface, up to 4GB |
| Graphics | Embedded GC7000Lite GPU Supports OpenGL 3.0, 2.1, OpenGL ES 3.1, OpenCL 1.2 Full Profile and 1.1, OpenVG 1.1, and Vulkan Embedded VPU, supports HW decoding of HEVC/H.265, AVC/H.264, MPEG-2, VC-1, RV10, VP8, H.263 and MPEG4.2t, HW encoding of AVC/H.264 2 independent displays supported |
| Video Interfaces | Factory alternatives: · 2x LVDS / Mipi-DSI Single Channel or 1xLVDS / Mipi-DSI Dual Channel 18-/24-bit interface · LVDS / Mipi-DSI Single Channel 18-/24-bit interface + HMDI interface · eDP 4-lane interface + LVDS / Mipi-DSI single Channel 18-/24-bit interface · eDP 4-lane interface + HMDI interface |
| Video Resolution | MIPI-DSI, LVDS, eDP, HDMI: Up to 1920 x 1080 @ 60Hz |
| Mass Storage | Optional Soldered onboard eMMC 5.1 Drive, up to 64GB SD 4-bit interface QSPI NOR Flash soldered on-board |
| Networking | Up to 2 x Gigabit Ethernet interfaces On-board WiFi 802.11 a/b/g/n + BT LE 5.0 module, optional |
| Usb | Up to 3 x USB 2.0 Host Ports 2 x USB 3.0 Host Ports |
| Pci | 1x PCI-e 3.0 x1 port |
| Audio | Up to 2x I2S Audio interfaces |
| Serial Ports | 2x 2-wires UART 2x 4-wires UART |
| Other Interfaces | 1x 4-lanes CSI camera interface 2x PWM Up to 14x GPIOs I2C bus SM bus SPI interface QuadSPI interface Watchdog Boot select signals Power Management Signals |
| Power Supply | +5VDC and +3.3V_RTC |
| Operating System | Linux Android |
| Operating Temperature | 0°C ÷ +60°C ** (Commercial version) -40°C ÷ +85°C (Industrial version)
**Measured at any point of the heatspreader/heatsink during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system. |
| Dimensions | 50 x 82 mm (1.97” x 3.23”) |
| Product Variants / Accessories |
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| RD16-2242-3100-C3 | SWAN- SMARC module with NXP Quad8XPlus w/DSP, 2GB RAM, 32GB eMMC, LVDS Single Channel, HDMI, 2xGbE, Comm. Temp |
| RD16-2243-3100-I3 | SWAN- SMARC module with NXP Quad8XPlus w/DSP, 2GB RAM, 32GB eMMC, LVDS Single Channel, eDP, 2xGbE, Ind. Temp |
| All data is for information purposes only. The specification is subject to change without notice in advance. Any configuration other than original product specification is not guaranteed. Although all the information contained within this website is carefully checked, no guarantee of correctness is implied or expressed. Please always double-check the latest version of the product specification of the product manufacturer. Manufacturer Product Website: SOM-SMARC-MX8X Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with MCTX Mobile & Embedded Computers GmbH. |
| OEM System Integration Support |
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We would be happy to assist you in selecting the optimal hardware platform for your application.
If you have any questions, whether technical or commercial, about our products or services, don’t hesitate to contact us. We look forward to hearing from you.
You can reach us by phone at +49 (0)7665/9390-185 (Monday to Friday from 8:00 AM to 8:00 PM). Alternatively, you are welcome to contact us anytime via the contact form at the end of this page. If you cannot reach us by phone, please send us a brief message via the contact form – we will get back to you as soon as possible.
Please note that we offer our services exclusively to Original Equipment Manufacturers. We do not sell to private persons or resellers.MCTX Mobile & Embedded Computers GmbH was founded in 2010 and focuses on the development and marketing of compact, high-performance, energy-efficient, and scalable computer systems and system components for mobile and stationary professional use in both indoor and outdoor environments.
We consider ourselves a reliable and experienced partner for companies and organizations that integrate these technologies into their processes or products. Our goal is to offer our customers SOLUTIONS that fully meet the requirements of their tasks.
Our company headquarters is located in southwestern Germany, in Gottenheim near Freiburg im Breisgau, close to the borders of France and Switzerland.
Service Portfolio
Depending on the project requirements, we offer our customers a wide range of products and outsourcing services: technology consulting for selecting the processor platform, delivery of key components, and the commissioned delivery of fully integrated, custom systems.
Over the years, our team has gained valuable experience in the integration of energy-efficient computing technologies. We provide this engineering know-how to our customers in order to optimize product and development costs as well as time-to-market.
Applications
Our boards and systems are used in a variety of applications in the field, in laboratories, in factory automation, and in OEM products, such as in the validation of semiconductor chips, in Lidar systems for 3D object measurement, in autonomous vehicles, various measurement and diagnostic systems, or in mobile data collection in the agricultural and forestry sectors.
Technologies
Our systems are based on state-of-the-art technologies used in modern servers, notebooks, tablet PCs, and navigation systems. The use of modular and industrial-grade system concepts enables long-lasting and scalable systems.