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SOM-SMARC-EHL

SECO

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Product number: SOM-SMARC-EHL

Product information "SOM-SMARC-EHL"

SECO SOM-SMARC-EHL - SMARC CPU Module with Intel® Elkhart Lake SMARC® Rel. 2.1.1 Computer on Module (CoM) with Intel® Atom® x6000E Series and Intel® Pentium® and Celeron® N and J Series (Codename: Elkhart Lake) Processors for FuSa applications. (HALLEY - C93)

SECO SOM-SMARC-EHL - SMARC CPU Module with Intel® Elkhart Lake
SMARC® Rel. 2.1.1 Computer on Module (CoM) with Intel® Atom® x6000E Series and Intel® Pentium® and Celeron® N and J Series (Codename: Elkhart Lake) Processors for FuSa applications. (HALLEY - C93)

Overview

Key Features	Supported CPUs
Intel Atom x6000E Series and Intel Pentium and Celeron N and J Series processors Integrated Gen11 UHD Graphics controller supporting 3 independent displays 2x GbE with precision time protocol IEEE 1588, optional SERDES for external 3rd Ethernet, 6x USB 2.0, 3x USB 3.1, up to 4x PCI-e Quad Channel LPDDR4x Soldered Down with IBECC	CPU-Product Family: Intel® Elkhart Lake Intel® Pentium® N6415 (1.5M Cache, up to 3.00 GHz) Intel® Pentium® J6426 (1.5M Cache, up to 3.00 GHz) Intel® Celeron® N6211 (1.5M Cache, up to 3.00 GHz) Intel® Celeron® J6413 (1.5M Cache, up to 3.00 GHz)

CPU-Variants

CPU	Intel® Pentium® N6415	Intel® Celeron® N6211	Intel® Pentium® J6426	Intel® Celeron® J6413
Processor Number	N6415	N6211	J6426	J6413
Cache	1.5 MB L2 Cache	1.5 MB L2 Cache	1.5 MB L2 Cache	1.5 MB L2 Cache
Total Cores	4	2	4	4
Total Threads	4	2	4	4
PCI Express Revision	3.0	3.0	3.0	3.0

Specification

Description	SMARC® Rel. 2.1.1 Computer on Module (CoM) with Intel® Atom® x6000E Series and Intel® Pentium® and Celeron® N and J Series (formerly Elkhart Lake) Processors for FuSa applications
Cpu	Intel® Atom™ x6000E, Pentium® and Celeron® N and J Series “Elkhart Lake” CPUs: • Celeron® J6413 Quad Core @ 1.8GHz (3.0GHZ Turbo) 10W TDP - Comm. Temp. Range • Celeron® N6211 Dual Core @1.2GHz (3.0GHZ Turbo) 6.5W TDP - Comm. Temp. Range • Pentium® J6426 Quad Core @2GHz (3.0GHZ Turbo) 10W TDP - Comm. Temp. Range • Pentium® N6415 Quad Core @1.2GHz (3.0GHZ Turbo) 6.5W TDP - Comm. Temp. Range • Atom™ x6211E Dual Core @1.3GHz (3.0GHZ Turbo) 6W TDP w/ IBECC and IHS - Ind. Temp. Range • Atom™ x6413E Quad Core @1.5GHz (3.0GHZ Turbo) 9W TDP w/ IBECC and IHS - Ind. Temp. Range • Atom™ x6425E Quad Core @2GHz (3.0GHZ Turbo) 12W TDP w/ IBECC and IHS - Ind. Temp. Range • Atom™ x6212RE Dual Core @1.2GHz (no Turbo) 6W TDP w/ IBECC, IHS and TCC - Ind. Temp. Range • Atom™ x6414RE Quad Core @1.5GHz (no Turbo) 9W TDP w/ IBECC, IHS and TCC - Ind. Temp. Range • Atom™ x6425RE Quad Core @1.9GHz (no Turbo) 12W TDP w/ IBECC, IHS and TCC - Ind. Temp. Range • Atom™ x6427FE Quad Core @1.9GHz (no Turbo) 12W TDP w/ IBECC, IHS and TCC, FuSa Certified - Ind. Temp. Range • Atom™ x6200FE Dual Core @1.0GHz (no Turbo) 4.5W TDP no Graphics w/ IBECC, IHS and TCC, FuSa Certified - Ind. Temp. Range () IHS: Integrated Heatspreader; TCC: Time Coordinated Computing (*) FuSa Certified: Atom™ SKUs compliant to IEC 61508 and ISO 13849 requirements for Functional Safety and Safety Integrity levels
Max Cores	4
Memory	32-bit LPDDR4x Soldered Down Memory Up to 16GB Quad Channel with In-Band Error Correction Code (IBECC, Safety Related feature) supported 1GB or 2GB Single Channel, 4GB Dual Channel, 8GB or 16GB Quad Channel supported Speed: 4267MT/s single rank (1GB / 2GB / 4GB / 8GB), 3733MT/s dual rank (16GB)
Graphics	Up to 3 independent displays Integrated Gen11 UHD Graphics controller with up to 32 EU 4K HW decoding and encoding of HEVC (H.265), H.264, VP8/VP9, WMV9/VC1 (decoding only) DirectX 12.1, OpenGL ES 3.1, OpenGL 4.5, OpenCL™ 1.2, Vulkan 1.0
Video Interfaces	eDP 1.3 or Dual Channel 18/24bit LVDS interface (factory options) 2 x DP++ 1.4 or 1x DP++ 1.4 and 1x HDMI 1.4 interfaces
Video Resolution	Up to 4096x2160 @60Hz
Mass Storage	1 x external S-ATA Gen3 Channel SDIO interface Optional eMMC 5.1 drive soldered on-board (Safety Related)
Networking	2x Gigabit Ethernet PHY with precision clock synchronization and synchronous Ethernet clock output for IEEE 1588 (Safety Related – Black channel) Optional SERDES (SGMII) Interface for additional third Gigabit Ethernet (factory option, alternative to fourth PCI-e lane)
Usb	6 x USB 2.0 Host Ports 2 x USB 3.1 Gen2 Ports
Pci	Up to 4 x PCI-e Gen3 Lanes
Audio	HD Audio interface
Serial Ports	2 x HS-UARTs (Safety Related) 2 x UARTs
Other Interfaces	SM Bus Power Management Signals I2C Bus 1x SPI interface for boot 1x General Purpose SPI or eSPI (Factory Alternatives)
Power Supply	+5VDC and +3.3V_RTC
Operating System	Microsoft® Windows 10 Enterprise (64 bit) Linux Yocto 64-bit
Operating Temperature	-40°C ÷ +85°C (Industrial version)* *Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider applicationspecific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensions	50 x 82 mm

Product Variants / Accessories

RC93-M441-4021-C3_	HALLEY (SM-C93) w/Intel® Pentium® J6426 (SKU2, QC up to 3.00 GHz, TDP 10W), 8GB RAM, 64GB eMMC, #4 PCIe x1 or #1 PCIe x4, LVDS, HDMI, DP++, TPM 2.0, GenPurp SPI, Comm.Temp.
RC93-Q361-4021-I3	SMARC 2.1 Elkhart Lake Atom SKU5 x6211E (1.5M Cache, up to 3.00 GHz), DC - TDP 6.0W, 4GB RAM, 32GB eMMC, 4x PCIe, LVDS + HDMI + DP++, TPM 2.0, GP SPI, Comm Temp
RC93-Q571-4021-I3	SMARC® Rel. 2.1.1 Computer on Module (CoM) with Intel® Atom® x6000E Series and Intel® Pentium® and Celeron® N and J Series (formerly Elkhart Lake) Processors for FuSa applications
RC93-R322-1021-I3	HALLEY (SM-C93) w/ Intel Atom® x6413E (SKU6 ,QC @ 3.0GHz, TDP 9W), w/ IBECC 4GB RAM, 16GB eMMC, SERDES, eDP/DP++/DP++, TPM 2.0, GP SPI, Ind Temp
RC93-R471-3021-I3	HALLEY (SM-C93) w/Intel® Atom® x6413E (SKU6, QC up to 3.00 GHz, TDP 9W), 8GB RAM, 64GB eMMC, #4 PCIe x1 or #1 PCIe x4, eDP, HDMI, DP++, TPM 2.0, GenPurp SPI, Ind.Temp.
RC93-S471-4021-I3	HALLEY (SM-C93) w/Intel Atom® x6425E (SKU7, QC up to 3.00 GHz, TDP 12W) w/IBECC 8GB RAM, 64GB eMMC, #4 PCIe x1 or #1 PCIe x4, LVDS, HDMI, DP++, TPM 2.0, GenPurp SPI, Ind. Temp.
RC93-T361-2021-I3	HALLEY (SM-C93) w/Intel Atom® x6212RE (SKU8, DC@1.20 GHz, TDP 6.0W), w/TCC and IBECC 4GB RAM, 32GB eMMC, #4 PCIe x1 or #1 PCIe x4, LVDS, 2x DP++, TPM 2.0, GenPurp SPI, Ind. Temp.
RC93-V471-2021-I3	HALLEY (SM-C93) w/Intel Atom® x6425RE (SKU10, QC@1.90 GHz, TDP 12W) w/TCC and IBECC 8GB RAM, 64GB eMMC, #4 PCIe x1 or #1 PCIe x4, LVDS, 2x DP++, TPM 2.0, GenPurp SPI, Ind. Temp.
RC93-V471-4021-I3	HALLEY (SM-C93) w/Intel Atom® x6425RE (SKU10, QC@1.90 GHz, TDP 12W) w/TCC and IBECC 8GB RAM, 64GB eMMC, #4 PCIe x1 or #1 PCIe x4, LVDS, HDMI, DP++, TPM 2.0, GenPurp SPI, Ind. Temp.
RC93-V571-1021-I3	HALLEY (SM-C93) w/Intel Atom® x6425RE (SKU10, QC@1.90 GHz, TDP 12W) w/TCC and IBECC 16GB RAM, 64GB eMMC, Opt #4 PCIE (w/ 1 x4),eDP, 2x DP++, TPM 2.0, GenPurp SPI, Ind. Temp.
RC93-W471-4021-I3	HALLEY (SM-C93) w/Intel Atom® x6427FE (SKU11, QC@1.90 GHz, TDP 12W) FuSa Certified, w/TCC and IBECC 8GB RAM, 64GB eMMC, LVDS, HDMI, DP++, #4 PCIe x1 or #1 PCIe x4, TPM 2.0, GenPurp SPI, Ind. Temp.
RC93-W472-1022-I3	HALLEY (SM-C93) w/Intel Atom® x6427FE (SKU11, QC@1.90 GHz, TDP 12W) FuSa Certified, w/TCC and IBECC 8GB RAM, 64GB eMMC, #3 PCIex1 and SERDES or #4 PCIe x1, TPM 2.0, eSPI, Ind. Temp.
RC93-W571-4021-I3	HALLEY (SM-C93) w/Intel Atom® x6427FE (SKU11, QC@1.90 GHz, TDP 12W) FuSa Certified, w/TCC and IBECC 16GB RAM, 64GB eMMC, LVDS, HDMI, DP++, #4 PCIe x1 or #1 PCIe x4, TPM 2.0, GenPurp SPI, Ind. Temp.
RC93-Y361-0021-I3	HALLEY (SM-C93) w/Intel Atom® x6200FE (SKU12, DC@1.00 GHz, TDP 4.5W),w/o Graphics, FuSa Certified, w/TCC and IBECC 4GB RAM, 32GB eMMC, headless, #4 PCIe x1 or #1 PCIe x4, TPM 2.0, GenPurp SPI, Ind. Temp.

All data is for information purposes only. The specification is subject to change without notice in advance. Any configuration other than original product specification is not guaranteed. Although all the information contained within this website is carefully checked, no guarantee of correctness is implied or expressed.
Please always double-check the latest version of the product specification of the product manufacturer. Manufacturer Product Website: SOM-SMARC-EHL
Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with MCTX Mobile & Embedded Computers GmbH.

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MCTX Mobile & Embedded Computers GmbH was founded in 2010 and focuses on the development and marketing of compact, high-performance, energy-efficient, and scalable computer systems and system components for mobile and stationary professional use in both indoor and outdoor environments.

We consider ourselves a reliable and experienced partner for companies and organizations that integrate these technologies into their processes or products. Our goal is to offer our customers SOLUTIONS that fully meet the requirements of their tasks.

Our company headquarters is located in southwestern Germany, in Gottenheim near Freiburg im Breisgau, close to the borders of France and Switzerland.

Service Portfolio

Depending on the project requirements, we offer our customers a wide range of products and outsourcing services: technology consulting for selecting the processor platform, delivery of key components, and the commissioned delivery of fully integrated, custom systems.

Over the years, our team has gained valuable experience in the integration of energy-efficient computing technologies. We provide this engineering know-how to our customers in order to optimize product and development costs as well as time-to-market.

Applications

Our boards and systems are used in a variety of applications in the field, in laboratories, in factory automation, and in OEM products, such as in the validation of semiconductor chips, in Lidar systems for 3D object measurement, in autonomous vehicles, various measurement and diagnostic systems, or in mobile data collection in the agricultural and forestry sectors.

Technologies

Our systems are based on state-of-the-art technologies used in modern servers, notebooks, tablet PCs, and navigation systems. The use of modular and industrial-grade system concepts enables long-lasting and scalable systems.