Module Store - Building Blocks for Developers of Embedded Computing Systems
SOM-SMARC-ADL-N
Price on request
| SECO SOM-SMARC-ADL-N - SMARC CPU Module with Intel® Alder Lake-N |
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| SMARC® Rel. 2.1 compliant Computer on Module (CoM) with Intel® Atom® processors x7000E Series, Intel® Core™ i3 processor, Intel® Processors N Series (Codename: Alder Lake N). (FINLAY - E08) |
| Overview |
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| Key Features | Supported CPUs |
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CPU-Product Family: Intel® Alder Lake-N
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| CPU-Variants |
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| CPU | Intel® Core™ i3-N305 | Intel® N97 | Intel® N50 | Intel® N200 |
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| Processor Number | i3-N305 | N97 | N50 | N200 |
| Cache | 6 MB Intel® Smart Cache | 6 MB Intel® Smart Cache | 6 MB | 6 MB Intel® Smart Cache |
| Max Turbo Frequency | 3.80 GHz | 3.60 GHz | 3.40 GHz | 3.70 GHz |
| Total Cores | 8 | 4 | 2 | 4 |
| Total Threads | 8 | 4 |
| Specification |
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| Description | SMARC® Rel. 2.1 compliant Computer on Module (CoM) with Intel® Atom® processors x7000E Series, Intel® Core™ i3 processor, Intel® Processors N Series (Codename: Alder Lake N) |
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| Cpu | Intel® Atom® processors x7000E Series, Intel® Core™ i3 processor and Intel® Processors N Series (Codename: Alder Lake N): · Intel® Atom® x7213E, 2 Cores @1.7 GHz (3.2 GHz Turbo), 10W TDP, with TSN and TCC* · Intel® Atom® x7425E, 4 Cores @1.5 GHz (3.4 GHz Turbo), 12W TDP, with TSN and TCC* · Intel® Atom® x7211E, 2 Cores @1.0 GHz (3.2 GHz Turbo), 6W TDP, with TSN and TCC* · Intel® Core™ i3-N305, 8 Cores @1.8 GHz (3.8 GHz Turbo), 15W TDP · Intel® Processor N200, 4 Cores @1.0 GHz (3.7 GHz Turbo), 6W TDP · Intel® Processor N97, 4 Cores @2.0 GHz (3.6 GHz Turbo), 12W TDP · Intel® Processor N50, 2 Cores @1 GHz (3.4 GHz Turbo), 6W TDP * Time Sensitive Network and Time Coordinate Computing |
| Memory | Up to 16GB LPDDR5-4800 soldered down memory with IBECC (in-band error correction code) |
| Graphics | Integrated Intel® UHD Graphics driven by Intel® Xe architecture:
AVX256 & VNNI support for faster AI inference and media transcoding Support with up to 3 independent 4K60 SDR displays |
| Video Interfaces | Integrated Intel® UHD Graphics driven by Intel® Xe architecture, supporting 3 independent displays each up to 4K resolution |
| Video Resolution | Up to 4096x2160 @60Hz |
| Mass Storage | 1x external S-ATA Gen3.2 channel Optional eMMC 5.1 drive soldered on-board |
| Networking | 2x NBase-T Ethernet ports (2.5GbE supported) with Time-Sensitive Networking functionality, implemented using as many Intel® i225 Gigabit Ethernet controllers, managed by two integrated PCH PCI-e ports Optional SERDES (SGMII) interface for additional third Gigabit Ethernet (factory option, alternative to fourth PCI-e lane) |
| Usb | 6x USB 2.0 host ports 2x USB 3.2 Gen2 ports |
| Pci | 4x PCIe Gen3 lanes Possible channel aggregations:
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| Audio | HD Audio and Soundwire/i2S Audio interfaces |
| Serial Ports | 2x UARTs 2x HS-UARTs |
| Other Interfaces | Up to 14x GPIOs SM bus I2C bus 1x SPI interface for boot 1x General Purpose SPI or eSPI (factory alternatives) Power management signals, watchdog |
| Power Supply | +5VDC and +3VDC for RTC |
| Operating System | Microsoft® Windows 10 Linux Kernel LTS |
| Operating Temperature | 0°C to +60°C (Commercial version) *
*Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature depends on the application, enclosure, and/or environment. It is the customer’s responsibility to implement an application-specific cooling solution for the customer’s system that keeps the heat spreader temperature in the range indicated. |
| Dimensions | 50 x 82 mm |
| Product Variants / Accessories |
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| All data is for information purposes only. The specification is subject to change without notice in advance. Any configuration other than original product specification is not guaranteed. Although all the information contained within this website is carefully checked, no guarantee of correctness is implied or expressed. Please always double-check the latest version of the product specification of the product manufacturer. Manufacturer Product Website: SOM-SMARC-ADL-N Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with MCTX Mobile & Embedded Computers GmbH. |
| OEM System Integration Support |
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We would be happy to assist you in selecting the optimal hardware platform for your application.
If you have any questions, whether technical or commercial, about our products or services, don’t hesitate to contact us. We look forward to hearing from you.
You can reach us by phone at +49 (0)7665/9390-185 (Monday to Friday from 8:00 AM to 8:00 PM). Alternatively, you are welcome to contact us anytime via the contact form at the end of this page. If you cannot reach us by phone, please send us a brief message via the contact form – we will get back to you as soon as possible.
Please note that we offer our services exclusively to Original Equipment Manufacturers. We do not sell to private persons or resellers.MCTX Mobile & Embedded Computers GmbH was founded in 2010 and focuses on the development and marketing of compact, high-performance, energy-efficient, and scalable computer systems and system components for mobile and stationary professional use in both indoor and outdoor environments.
We consider ourselves a reliable and experienced partner for companies and organizations that integrate these technologies into their processes or products. Our goal is to offer our customers SOLUTIONS that fully meet the requirements of their tasks.
Our company headquarters is located in southwestern Germany, in Gottenheim near Freiburg im Breisgau, close to the borders of France and Switzerland.
Service Portfolio
Depending on the project requirements, we offer our customers a wide range of products and outsourcing services: technology consulting for selecting the processor platform, delivery of key components, and the commissioned delivery of fully integrated, custom systems.
Over the years, our team has gained valuable experience in the integration of energy-efficient computing technologies. We provide this engineering know-how to our customers in order to optimize product and development costs as well as time-to-market.
Applications
Our boards and systems are used in a variety of applications in the field, in laboratories, in factory automation, and in OEM products, such as in the validation of semiconductor chips, in Lidar systems for 3D object measurement, in autonomous vehicles, various measurement and diagnostic systems, or in mobile data collection in the agricultural and forestry sectors.
Technologies
Our systems are based on state-of-the-art technologies used in modern servers, notebooks, tablet PCs, and navigation systems. The use of modular and industrial-grade system concepts enables long-lasting and scalable systems.