Module Store - Building Blocks for Developers of Embedded Computing Systems
SOM-COMe-CT6-V2000
Price on request
| SECO SOM-COMe-CT6-V2000 - COM Express CPU Module |
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| COM Express® 3.0 Type 6 Compact Computer on Module (CoM) with AMD Ryzen™ Embedded V2000 SoCs. (OPHELIA - D21) |
| Overview |
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| Key Features | Supported CPUs |
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| AMD Ryzen™ Embedded V2748 with AMD Radeon™ Graphics with 7CU, Eight Core Dual Thread @ 2.9GHz (4.15 Boost), TDP 35-54W |
| Specification |
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| Description | COM Express® 3.0 Type 6 Compact Computer on Module (CoM) with AMD Ryzen™ Embedded V2000 SoCs |
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| Cpu |
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| Max Cores | 8 |
| Memory | Two DDR4 SO-DIMM Slots supporting DDR4-3200, ECC and non- ECC modules Memory, up to 64GB |
| Graphics | AMD Radeon™ Graphics GPU with up to 7 Compute Units Up to 4 independent displays supported Support DirectX 12, OpenGL 4.6, OpenCL 2.1 and Vulkan HW accelerated Video Decode VP9 (8 and 10 bits), H.264/AVC (8bits), H.265/HEVC (8 and 10 bits), JPEG HW accelerated Video Encode H.264/AVC (8bits), H.265/HEVC (8 and 10 bits), JPEG |
| Video Interfaces | Up to 3 x Digital Display Interfaces (DDIs), supporting DVI, DP 1.4, HDMI 2.1 1 x eDP 1.3 or Single/Dual-Channel 18-/24-bit LVDS interface |
| Video Resolution | eDP, DP up to 4096x2160 @60Hz 10b with DSC 1.2 (HBR3) HDMI up to 4096x2160 @ 60Hz LVDS up to 1920x1200 @ 60Hz |
| Mass Storage | 2 x S-ATA Gen3 Channels |
| Networking | Gigabit Ethernet interface with Intel® I21x GbE Controller Optional M.2 1216 WiFi 802.11ac and BTLE 5.0 on-board |
| Usb | 1 x SuperSpeed USB 10Gbps Host ports 3 x SuperSpeed USB 5Gbps Host ports 8 x 2.0 Host ports |
| Pci | 8 x PCI-e x1 Gen3 lanes PCI-express Graphics (PEG) x8 Gen3 |
| Audio | HD Audio interface |
| Serial Ports | 2 x UARTs |
| Other Interfaces | SPI, I2C, SM Bus, Thermal Management, FAN management LPC bus Optional TPM 2.0 on-board LID#/SLEEP#/PWRBTN#, Watchdog 4 x GPI, 4 x GPO |
| Power Supply | +12VDC ± 10%, +5VSB (optional), +3VRTC (optional) |
| Operating System | Microsoft® Windows 10 |
| Operating Temperature | 0°C ÷ +60°C (Commercial version)*
* Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will depend on the application, enclosure, and/or environment. Each customer must consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated. |
| Dimensions | 95 x 95 mm (COM Express® Compact Form factor, Type 6 pinout) |
| Product Variants / Accessories |
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| All data is for information purposes only. The specification is subject to change without notice in advance. Any configuration other than original product specification is not guaranteed. Although all the information contained within this website is carefully checked, no guarantee of correctness is implied or expressed. Please always double-check the latest version of the product specification of the product manufacturer. Manufacturer Product Website: SOM-COMe-CT6-V2000 Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with MCTX Mobile & Embedded Computers GmbH. |
| OEM System Integration Support |
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We would be happy to assist you in selecting the optimal hardware platform for your application.
If you have any questions, whether technical or commercial, about our products or services, don’t hesitate to contact us. We look forward to hearing from you.
You can reach us by phone at +49 (0)7665/9390-185 (Monday to Friday from 8:00 AM to 8:00 PM). Alternatively, you are welcome to contact us anytime via the contact form at the end of this page. If you cannot reach us by phone, please send us a brief message via the contact form – we will get back to you as soon as possible.
Please note that we offer our services exclusively to Original Equipment Manufacturers. We do not sell to private persons or resellers.MCTX Mobile & Embedded Computers GmbH was founded in 2010 and focuses on the development and marketing of compact, high-performance, energy-efficient, and scalable computer systems and system components for mobile and stationary professional use in both indoor and outdoor environments.
We consider ourselves a reliable and experienced partner for companies and organizations that integrate these technologies into their processes or products. Our goal is to offer our customers SOLUTIONS that fully meet the requirements of their tasks.
Our company headquarters is located in southwestern Germany, in Gottenheim near Freiburg im Breisgau, close to the borders of France and Switzerland.
Service Portfolio
Depending on the project requirements, we offer our customers a wide range of products and outsourcing services: technology consulting for selecting the processor platform, delivery of key components, and the commissioned delivery of fully integrated, custom systems.
Over the years, our team has gained valuable experience in the integration of energy-efficient computing technologies. We provide this engineering know-how to our customers in order to optimize product and development costs as well as time-to-market.
Applications
Our boards and systems are used in a variety of applications in the field, in laboratories, in factory automation, and in OEM products, such as in the validation of semiconductor chips, in Lidar systems for 3D object measurement, in autonomous vehicles, various measurement and diagnostic systems, or in mobile data collection in the agricultural and forestry sectors.
Technologies
Our systems are based on state-of-the-art technologies used in modern servers, notebooks, tablet PCs, and navigation systems. The use of modular and industrial-grade system concepts enables long-lasting and scalable systems.