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SOM-COMe-CT6-MBPF

SECO

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Product number: SOM-COMe-CT6-MBPF

Product information "SOM-COMe-CT6-MBPF"

SECO SOM-COMe-CT6-MBPF - COM Express CPU Module SOM-COMe-CT6-MBPF is a COM Express® Compact Type 6 Computer on Module (CoM) with the AMD Embedded 3rd generation R-Series SoC (formerly Merlin Falcon), G-Series SoC-I (formerly Brown Falcon) or G-Series SoC-J (formerly Prairie Falcon) designed by SECO th

SECO SOM-COMe-CT6-MBPF - COM Express CPU Module
SOM-COMe-CT6-MBPF is a COM Express® Compact Type 6 Computer on Module (CoM) with the AMD Embedded 3rd generation R-Series SoC (formerly Merlin Falcon), G-Series SoC-I (formerly Brown Falcon) or G-Series SoC-J (formerly Prairie Falcon) designed by SECO th

Overview

Key Features	Supported CPUs
AMD Embedded 3rd generation R-Series SOC, G-Series SOC-I or G-Series SoC-J AMD Radeon 3rd -Generation Graphics Core Next (GCN) 4x USB 3.0, 8x USB 2.0, 3x PCI-e x1 Gen3 Two SO-DIMM slots supporting DDR4 ECC and non-ECC modules	AMD RX-421BD, Quad Core @ 2.1 GHz (3.4 GHz Max), TDP 35W AMD RX-418GD, Quad Core @ 1.8 GHz (3.2 GHz Max), TDP 35W AMD RX-216GD, Dual Core @ 1.6GHz (3.0 GHz Max), TDP 15W AMD RX-416GD, Quad Core @ 1.6 GHz (2.4GHz Max), TDP 15W, Industrial Temperature range AMD GX-217GI, Dual Core @1.7GHz (2.0GHz Max), TDP 15W AMD GX-224IJ, Dual Core @ 2.4GHz (2.8GHz Max), cTDP 10-15W AMD GX-215IJ, Dual Core @1.5GHz (2.0GHz Max), cTDP 6-10W

Key Features

Supported CPUs

AMD Embedded 3rd generation R-Series SOC, G-Series SOC-I or G-Series SoC-J
AMD Radeon 3rd -Generation Graphics Core Next (GCN)
4x USB 3.0, 8x USB 2.0, 3x PCI-e x1 Gen3
Two SO-DIMM slots supporting DDR4 ECC and non-ECC modules

AMD RX-421BD, Quad Core @ 2.1 GHz (3.4 GHz Max), TDP 35W
AMD RX-418GD, Quad Core @ 1.8 GHz (3.2 GHz Max), TDP 35W
AMD RX-216GD, Dual Core @ 1.6GHz (3.0 GHz Max), TDP 15W
AMD RX-416GD, Quad Core @ 1.6 GHz (2.4GHz Max), TDP 15W, Industrial Temperature range

AMD GX-217GI, Dual Core @1.7GHz (2.0GHz Max), TDP 15W
AMD GX-224IJ, Dual Core @ 2.4GHz (2.8GHz Max), cTDP 10-15W
AMD GX-215IJ, Dual Core @1.5GHz (2.0GHz Max), cTDP 6-10W

Introduction

SOM-COMe-CT6-MBPF is a COM Express® Compact Type 6 Computer on Module (CoM) with the AMD Embedded 3rd generation R-Series SoC (formerly Merlin Falcon), G-Series SoC-I (formerly Brown Falcon) or G-Series SoC-J (formerly Prairie Falcon) designed by SECO that features up to 4 Excavator x86 CPU cores with the latest Radeon graphics and I / O Controller on a single Chip; each Processor can scale the TDP down to 15W. SOM-COMe-CT6-MBPF is ideal in applications where scalable graphics performance makes the difference.

Specification

Description	SOM-COMe-CT6-MBPF is a COM Express® Compact Type 6 Computer on Module (CoM) with the AMD Embedded 3rd generation R-Series SoC (formerly Merlin Falcon), G-Series SoC-I (formerly Brown Falcon) or G-Series SoC-J (formerly Prairie Falcon) designed by SECO that features up to 4 Excavator x86 CPU cores with the latest Radeon graphics and I / O Controller on a single Chip; each Processor can scale the TDP down to 15W. SOM-COMe-CT6-MBPF is ideal in applications where scalable graphics performance makes the difference.
Cpu	AMD RX-421BD, Quad Core @ 2.1 GHz (3.4 GHz Max), TDP 35W AMD RX-418GD, Quad Core @ 1.8 GHz (3.2 GHz Max), TDP 35W AMD RX-216GD, Dual Core @ 1.6GHz (3.0 GHz Max), TDP 15W AMD RX-416GD, Quad Core @ 1.6 GHz (2.4GHz Max), TDP 15W, Industrial Temperature range AMD GX-217GI, Dual Core @1.7GHz (2.0GHz Max), TDP 15W AMD GX-224IJ, Dual Core @ 2.4GHz (2.8GHz Max), cTDP 10-15W AMD GX-215IJ, Dual Core @1.5GHz (2.0GHz Max), cTDP 6-10W
Max Cores	4
Memory	R-Series: Two SO-DIMM slots supporting DDR4 ECC / nonECC modules up to 2133MHz G-Series SoC-I: Two SO-DIMM slots supporting DDR4 ECC / non-ECC modules up to 1600MHz G-Series SoC-J: One SO-DIMM slot supporting DDR4 nonECC modules up to 2133MHz
Graphics	AMD Radeon 3rd -Generation Graphics Core Next (GCN) AMD RX-421BD - Radeon R7 AMD RX-418GD, RX-416GD - Radeon R6 AMD-RX-216GD - Radeon R5 AMD GX-217GI - Radeon R6E AMD GX-224IJ - Radeon R4E AMD GX-215IJ - Radeon R2E Up to 3 independent displays supported (up to 2 with G-Series SoC-I and SoC-J) DirectX® 12 supported UVD 6 (4K H.265 and H.264 decode) and VCE 3.1 (4KH.264 encode) supported
Video Interfaces	Up to 3 x Digital Display Interfaces (DDIs), supporting eDP1.4, DP 1.2, DVI and HDMI 1.4b/2.0 (up to 2x DDIs with G-Series SoC-I and SoC-J) Optional VGA interface (excludes one DDI Port) Optional eDP or Single / Dual-Channel 18- / 24- bit LVDS interface (excludes one DDI Port)
Video Resolution	DDIs: up to 4K LVDS, VGA: up to 1920 x 1200 @ 60Hz
Mass Storage	2 x SATA Gen3 Channels SD interface shared with GPI/Os
Networking	Gigabit Ethernet interface Intel® I210 / I211 GbE Controller
Usb	4 x USB 3.0 Host ports 8 x USB 2.0 Host ports
Pci	3 x PCI-e x 1 lanes PCI-express Graphics (PEG) x8 (R-Series SoCs) or x4 (G-Series SOC-I and SoC-J)
Audio	HD Audio Interface
Serial Ports	2 x HS UARTs
Other Interfaces	SPI, I2C Bus, SM Bus, LPC Bus, 2 x Express Card, FAN management LID# / SLEEP# / PWRBTN#, Watchdog 4 x GPI, 4 x GPO (multiplexed with SD interface) Optional TPM 1.2 or 2.0 module onboard
Power Supply	+12VDC ± 10% and + 5VSB (optional)
Operating System	Microsoft® Windows 7 Microsoft® Windows 10 Microsoft® Windows 10 IoT Linux
Operating Temperature	0°C ÷ +60 °C (Commercial version) -40°C ÷ +85°C (Industrial version) *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensions	95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout)

Product Variants / Accessories

All data is for information purposes only. The specification is subject to change without notice in advance. Any configuration other than original product specification is not guaranteed. Although all the information contained within this website is carefully checked, no guarantee of correctness is implied or expressed.
Please always double-check the latest version of the product specification of the product manufacturer. Manufacturer Product Website: SOM-COMe-CT6-MBPF
Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with MCTX Mobile & Embedded Computers GmbH.

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MCTX Mobile & Embedded Computers GmbH was founded in 2010 and focuses on the development and marketing of compact, high-performance, energy-efficient, and scalable computer systems and system components for mobile and stationary professional use in both indoor and outdoor environments.

We consider ourselves a reliable and experienced partner for companies and organizations that integrate these technologies into their processes or products. Our goal is to offer our customers SOLUTIONS that fully meet the requirements of their tasks.

Our company headquarters is located in southwestern Germany, in Gottenheim near Freiburg im Breisgau, close to the borders of France and Switzerland.

Service Portfolio

Depending on the project requirements, we offer our customers a wide range of products and outsourcing services: technology consulting for selecting the processor platform, delivery of key components, and the commissioned delivery of fully integrated, custom systems.

Over the years, our team has gained valuable experience in the integration of energy-efficient computing technologies. We provide this engineering know-how to our customers in order to optimize product and development costs as well as time-to-market.

Applications

Our boards and systems are used in a variety of applications in the field, in laboratories, in factory automation, and in OEM products, such as in the validation of semiconductor chips, in Lidar systems for 3D object measurement, in autonomous vehicles, various measurement and diagnostic systems, or in mobile data collection in the agricultural and forestry sectors.

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Our systems are based on state-of-the-art technologies used in modern servers, notebooks, tablet PCs, and navigation systems. The use of modular and industrial-grade system concepts enables long-lasting and scalable systems.