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SOM-COMe-BT7-E3000

SECO

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Product number: SOM-COMe-BT7-E3000

Product information "SOM-COMe-BT7-E3000"

SECO SOM-COMe-BT7-E3000 - COM Express CPU Module This innovative Computer on Module (CoM) provides scalable offerings with outstanding performance and more connectivity. Networking and connectivity are improved with the 4x 10GBASE-KR interfaces + 1x 1GbE port with NC-SI and the 4 USB 3.1; 24x PCI-e Gen3

SECO SOM-COMe-BT7-E3000 - COM Express CPU Module
This innovative Computer on Module (CoM) provides scalable offerings with outstanding performance and more connectivity. Networking and connectivity are improved with the 4x 10GBASE-KR interfaces + 1x 1GbE port with NC-SI and the 4 USB 3.1; 24x PCI-e Gen3

Overview

Key Features	Supported CPUs
AMD EPYC Embedded 3000 family of SoCs N.A. 4x USB 3.1, 24x PCI-e Gen3 lanes Four DDR4 SO-DIMM Slots supporting DDR4-2666 Memory with ECC, up to 128GB	AMD EPYC™ Embedded 3000 family of SoCs: AMD EPYC™ Embedded 3451, Sixteen Core Dual Thread @ 2.14GHz (3.0 Boost), 32MB L3 shared Cache, TDP 80-100W AMD EPYC™ Embedded 3351, Twelve Core Dual Thread @ 1.9GHz (3.0 Boost), 32MB L3 shared Cache, TDP 60-80W AMD EPYC™ Embedded 3251, Eight Core Dual Thread @ 2.5GHz (3.1 Boost), 16MB L3 shared Cache, TDP 55W AMD EPYC™ Embedded 3201, Eight Core Single Thread @ 1.5GHz (3.1 Boost), 16MB L3 shared Cache, TDP 30W AMD EPYC™ Embedded 3151, Quad Core Dual Thread @ 2.7GHz (2.9 Boost), 16MB L3 shared Cache, TDP 45W AMD EPYC™ Embedded 3101, Quad Core Single Thread @ 2.1GHz (2.9 Boost), 8MB L3 shared Cache, TDP 35W AMD EPYC™ Embedded 3255, Eight Core Dual Thread @ 2.5GHz (3.1 Boost), 16MB L3 Shared Cache, TDP 55W, industrial grade

Key Features

Supported CPUs

AMD EPYC Embedded 3000 family of SoCs
N.A.
4x USB 3.1, 24x PCI-e Gen3 lanes
Four DDR4 SO-DIMM Slots supporting DDR4-2666 Memory with ECC, up to 128GB

AMD EPYC™ Embedded 3000 family of SoCs:

AMD EPYC™ Embedded 3451, Sixteen Core Dual Thread @ 2.14GHz (3.0 Boost), 32MB L3 shared Cache, TDP 80-100W
AMD EPYC™ Embedded 3351, Twelve Core Dual Thread @ 1.9GHz (3.0 Boost), 32MB L3 shared Cache, TDP 60-80W
AMD EPYC™ Embedded 3251, Eight Core Dual Thread @ 2.5GHz (3.1 Boost), 16MB L3 shared Cache, TDP 55W
AMD EPYC™ Embedded 3201, Eight Core Single Thread @ 1.5GHz (3.1 Boost), 16MB L3 shared Cache, TDP 30W
AMD EPYC™ Embedded 3151, Quad Core Dual Thread @ 2.7GHz (2.9 Boost), 16MB L3 shared Cache, TDP 45W
AMD EPYC™ Embedded 3101, Quad Core Single Thread @ 2.1GHz (2.9 Boost), 8MB L3 shared Cache, TDP 35W
AMD EPYC™ Embedded 3255, Eight Core Dual Thread @ 2.5GHz (3.1 Boost), 16MB L3 Shared Cache, TDP 55W, industrial grade

Introduction

This innovative Computer on Module (CoM) provides scalable offerings with outstanding performance and more connectivity. Networking and connectivity are improved with the 4x 10GBASE-KR interfaces + 1x 1GbE port with NC-SI and the 4 USB 3.1; 24x PCI-e Gen3 lanes. Moreover, the performance is enhanced by the four DDR4 SO-DIMM slots supporting DDR4-2666 memory with ECC, up to 128GB. The AMD EPYC™ Embedded 3000 shows major improvements in power, optimization, and security. The main features of this new processor are I/O integration, flexibility, and security capabilities, scalable offering, harnessing the power of the new “Zen” CPU architecture. Performance-per-dollar is greatly improved, making it a great choice for development.

Specification

Description	This innovative Computer on Module (CoM) provides scalable offerings with outstanding performance and more connectivity. Networking and connectivity are improved with the 4x 10GBASE-KR interfaces + 1x 1GbE port with NC-SI and the 4 USB 3.1; 24x PCI-e Gen3 lanes. Moreover, the performance is enhanced by the four DDR4 SO-DIMM slots supporting DDR4-2666 memory with ECC, up to 128GB. The AMD EPYC™ Embedded 3000 shows major improvements in power, optimization, and security. The main features of this new processor are I/O integration, flexibility, and security capabilities, scalable offering, harnessing the power of the new “Zen” CPU architecture. Performance-per-dollar is greatly improved, making it a great choice for development.
Cpu	AMD EPYC™ Embedded 3000 family of SoCs: AMD EPYC™ Embedded 3451, Sixteen Core Dual Thread @ 2.14GHz (3.0 Boost), 32MB L3 shared Cache, TDP 80-100W AMD EPYC™ Embedded 3351, Twelve Core Dual Thread @ 1.9GHz (3.0 Boost), 32MB L3 shared Cache, TDP 60-80W AMD EPYC™ Embedded 3251, Eight Core Dual Thread @ 2.5GHz (3.1 Boost), 16MB L3 shared Cache, TDP 55W AMD EPYC™ Embedded 3201, Eight Core Single Thread @ 1.5GHz (3.1 Boost), 16MB L3 shared Cache, TDP 30W AMD EPYC™ Embedded 3151, Quad Core Dual Thread @ 2.7GHz (2.9 Boost), 16MB L3 shared Cache, TDP 45W AMD EPYC™ Embedded 3101, Quad Core Single Thread @ 2.1GHz (2.9 Boost), 8MB L3 shared Cache, TDP 35W AMD EPYC™ Embedded 3255, Eight Core Dual Thread @ 2.5GHz (3.1 Boost), 16MB L3 Shared Cache, TDP 55W, industrial grade
Memory	Up to 4x DDR4 SO-DIMM Slots supporting DDR4-2666 Memory (both ECC and not-ECC supported), up to 128GB
Mass Storage	2x S-ATA Gen3 Channels
Networking	1x Gigabit Ethernet LAN port with NC-SI (Network Controller Sideband Interface) functionality, managed by an Intel® I210 Gigabit Ethernet Controller 4x 10Gigabit Ethernet interfaces (10GBASE-KR), directly managed by the EPYC™ SoCs
Usb	4 x USB 3.1 Host ports (SS + USB 2.0 interfaces)
Pci	24x PCI-e Gen3 lanes
Serial Ports	2x legacy UARTs, 16C550 compatible
Other Interfaces	SPI, SM Bus, LPC bus
Security	Optional TPM 2.0 module on-board AMD Secure Processor for Crypto Co-processing Hardware Validated Boot capabilities Secure Memory Encryption Secure Encrypted Virtualization
Power Supply	+12VDC ± 10% and + 5VSB (optional)
Operating System	Microsoft® Windows 10 Microsoft® Windows Server 2016 Linux OS 64-bit
Operating Temperature	0°C ÷ +60 °C (Commercial version) -40°÷+85°C (Industrial Range, when available) *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensions	125 x 95 mm (Com Express™ Basic Form factor, Type 7 pinout)

Product Variants / Accessories

MC42-2002-1110-C1-V	COMe-C42-BT7 w/AMD EPYC™ Embedded 3201, Eight Core Single Thread @ 1.5GHz (3.1 Boost), 16MB L3 Shared Cache, TDP 30W, 4x SO-DIMM DDR4 slots, TPM 2.0, I210 GbE ctrl, 4-wire fan - Comm. Temp
MC42-4002-1110-C1-V	COM Express® Rel.3.0 Basic Type 7 module with the AMD EPYC™ Embedded 3000 Series of SoCsCOMe-C42-BT7 w/AMD EPYC™ Embedded 3101, Quad Core Single Thread @ 2.1GHz (2.9 Boost), 8MB L3 Shared Cache, TDP 35W, 4x SO-DIMM DDR4 slots, TPM 2.0, I210 GbE ctrl, 4-wire fan - Comm. Temp
MC42-7002-1110-I1-V	COMe-C42-BT7 w/AMD EPYC™ Embedded 3255, Eight Core Dual Thread @ 2.5GHz (3.1 Boost), 16MB L3 Shared Cache, TDP 55W, 4x SO-DIMM DDR4 slots, TPM 2.0, I210 GbE ctrl, 4-wire fan - Ind. Temp

All data is for information purposes only. The specification is subject to change without notice in advance. Any configuration other than original product specification is not guaranteed. Although all the information contained within this website is carefully checked, no guarantee of correctness is implied or expressed.
Please always double-check the latest version of the product specification of the product manufacturer. Manufacturer Product Website: SOM-COMe-BT7-E3000
Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with MCTX Mobile & Embedded Computers GmbH.

OEM System Integration Support

We would be happy to assist you in selecting the optimal hardware platform for your application.

If you have any questions, whether technical or commercial, about our products or services, don’t hesitate to contact us. We look forward to hearing from you.

You can reach us by phone at +49 (0)7665/9390-185 (Monday to Friday from 8:00 AM to 8:00 PM). Alternatively, you are welcome to contact us anytime via the contact form at the end of this page. If you cannot reach us by phone, please send us a brief message via the contact form – we will get back to you as soon as possible.

^{Please note that we offer our services exclusively to Original Equipment Manufacturers. We do not sell to private persons or resellers.}

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MCTX Mobile & Embedded Computers GmbH was founded in 2010 and focuses on the development and marketing of compact, high-performance, energy-efficient, and scalable computer systems and system components for mobile and stationary professional use in both indoor and outdoor environments.

We consider ourselves a reliable and experienced partner for companies and organizations that integrate these technologies into their processes or products. Our goal is to offer our customers SOLUTIONS that fully meet the requirements of their tasks.

Our company headquarters is located in southwestern Germany, in Gottenheim near Freiburg im Breisgau, close to the borders of France and Switzerland.

Service Portfolio

Depending on the project requirements, we offer our customers a wide range of products and outsourcing services: technology consulting for selecting the processor platform, delivery of key components, and the commissioned delivery of fully integrated, custom systems.

Over the years, our team has gained valuable experience in the integration of energy-efficient computing technologies. We provide this engineering know-how to our customers in order to optimize product and development costs as well as time-to-market.

Applications

Our boards and systems are used in a variety of applications in the field, in laboratories, in factory automation, and in OEM products, such as in the validation of semiconductor chips, in Lidar systems for 3D object measurement, in autonomous vehicles, various measurement and diagnostic systems, or in mobile data collection in the agricultural and forestry sectors.

Technologies

Our systems are based on state-of-the-art technologies used in modern servers, notebooks, tablet PCs, and navigation systems. The use of modular and industrial-grade system concepts enables long-lasting and scalable systems.