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SOM-COMe-BT6-RPL-P

SECO

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Product number: SOM-COMe-BT6-RPL-P

Product information "SOM-COMe-BT6-RPL-P"

SECO SOM-COMe-BT6-RPL-P - COM Express CPU Module with Intel® Raptor Lake COM Express® 3.1 Type 6 Basic Computer on Module (CoM) with 13th Gen Intel® Core™ processors (Codename: Raptor Lake-P). (CALLISTO - E03)

SECO SOM-COMe-BT6-RPL-P - COM Express CPU Module with Intel® Raptor Lake
COM Express® 3.1 Type 6 Basic Computer on Module (CoM) with 13th Gen Intel® Core™ processors (Codename: Raptor Lake-P). (CALLISTO - E03)

Overview

Key Features	Supported CPUs
13th Gen Intel Core processors targeted for IoT Applications embedded Intel Iris Xe graphics with up to 96 execution units 1x NBase-T 2.5GbE, 2x USB4.0 Gen2, 4x USB3.2 Gen 2, 8x USB 2.0, 8x PCI-e x1 Gen3, PEG x8 Gen4 and 2x PEG x4 Gen4. Two DDR5 SO-DIMM Slots supporting DDR5-4800 IBECC Memory, up to 64GB	CPU-Product Family: Intel® Raptor Lake Intel® U300E (8M Cache, up to 4.30 GHz)

CPU-Variants

CPU	Intel® U300E
Processor Number	U300E
Cache	8 MB Intel® Smart Cache
Max Turbo Frequency	4.30 GHz
Total Cores	5
Total Threads	6
Processor Base Power	15 W

Specification

Description	COM Express® 3.1 Type 6 Basic Computer on Module (CoM) with 13th Gen Intel® Core™ processors (formerly codenamed Raptor Lake-P)
Cpu	13th Gen Intel® Core™ processors (Raptor Lake U/P/H series) and Intel® Processor U300E: U series, up to 10C (2P+8E), up to 12M cache, 15W TDP P series, up to 14C (6P+8E), up to 24M cache, 28W TDP H series, up to 14C (6P+8E), up to 24M cache, 45W TDP
Memory	Two DDR5 SO-DIMM slots supporting DDR5-4800, IBECC modules memory, up to 64GB
Graphics	Intel® UHD Graphics/Intel® Iris® Xe Graphics architecture, up to 96 EU Improved image (IPU6EP) and video processing (AV1/GNA 3.0) Support up to 4 independent displays @ 4K
Video Interfaces	Up to 3x Digital Display Interfaces (DDIs), supporting DVI, DP 1.4, HDMI 2.1 1x VGA (factory option) 1x eDP 1.3 or single/dual-channel 18-/24-bit LVDS interface (factory alternatives)
Video Resolution	HDMI and DP up to 8K @ 60Hz via TCSS with Hayden Bridge eDP 1.4b up to 5K @ 120Hz (HBR3 with VDSC1.1) LVDS up to 1920x1200 @ 60Hz
Mass Storage	2x SATA Gen3 channels Up to 128 GB on-board NVMe SSD (factory alternative to one PCI-express Graphics (PEG) x4 Gen4)
Networking	1x NBase-T Ethernet interface with Intel® I225 GbE controller, with TSN and 2.5GbE supported.
Usb	Up to 2x USB 4 Gen2 host ports (depending on carrier board retimer implementation) 4x USB 3.2 Gen2 (10Gbps) host ports (depending on carrier board retimer implementation) 8x USB 2.0 host ports
Pci	Up to 8x PCI-e x1 Gen3 lanes 1x PCI-express Graphics (PEG) x8 Gen4 Up to 2x PCI-express Graphics (PEG) x4 Gen4
Audio	HD audio and Soundwire/i2S audio interfaces
Serial Ports	2x UARTs
Other Interfaces	SPI, I2C, SM Bus, Thermal Management, FAN management Optional eSPI or LPC bus (factory alternatives) Optional TPM 2.0 on-board LID#/SLEEP#/PWRBTN#, Watchdog 4 x GPI, 4 x GPO
Power Supply	+12VDC ± 10%, +5VSB (optional), +3VRTC (optional)
Operating System	Microsoft® Windows 10 Linux Ubuntu
Operating Temperature	0°C to +60°C (commercial version)* -40°C to +85°C (industrial version)* *Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensions	125 x 95 mm (COM Express® Basic Form factor, Type 6 pinout)

Product Variants / Accessories

All data is for information purposes only. The specification is subject to change without notice in advance. Any configuration other than original product specification is not guaranteed. Although all the information contained within this website is carefully checked, no guarantee of correctness is implied or expressed.
Please always double-check the latest version of the product specification of the product manufacturer. Manufacturer Product Website: SOM-COMe-BT6-RPL-P
Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with MCTX Mobile & Embedded Computers GmbH.

OEM System Integration Support

We would be happy to assist you in selecting the optimal hardware platform for your application.

If you have any questions, whether technical or commercial, about our products or services, don’t hesitate to contact us. We look forward to hearing from you.

You can reach us by phone at +49 (0)7665/9390-185 (Monday to Friday from 8:00 AM to 8:00 PM). Alternatively, you are welcome to contact us anytime via the contact form at the end of this page. If you cannot reach us by phone, please send us a brief message via the contact form – we will get back to you as soon as possible.

^{Please note that we offer our services exclusively to Original Equipment Manufacturers. We do not sell to private persons or resellers.}

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MCTX Mobile & Embedded Computers GmbH was founded in 2010 and focuses on the development and marketing of compact, high-performance, energy-efficient, and scalable computer systems and system components for mobile and stationary professional use in both indoor and outdoor environments.

We consider ourselves a reliable and experienced partner for companies and organizations that integrate these technologies into their processes or products. Our goal is to offer our customers SOLUTIONS that fully meet the requirements of their tasks.

Our company headquarters is located in southwestern Germany, in Gottenheim near Freiburg im Breisgau, close to the borders of France and Switzerland.

Service Portfolio

Depending on the project requirements, we offer our customers a wide range of products and outsourcing services: technology consulting for selecting the processor platform, delivery of key components, and the commissioned delivery of fully integrated, custom systems.

Over the years, our team has gained valuable experience in the integration of energy-efficient computing technologies. We provide this engineering know-how to our customers in order to optimize product and development costs as well as time-to-market.

Applications

Our boards and systems are used in a variety of applications in the field, in laboratories, in factory automation, and in OEM products, such as in the validation of semiconductor chips, in Lidar systems for 3D object measurement, in autonomous vehicles, various measurement and diagnostic systems, or in mobile data collection in the agricultural and forestry sectors.

Technologies

Our systems are based on state-of-the-art technologies used in modern servers, notebooks, tablet PCs, and navigation systems. The use of modular and industrial-grade system concepts enables long-lasting and scalable systems.