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SDM-3350L-HW

Product information "SDM-3350L-HW"
GIGAIPC SDM-3350L-HW - SDM CPU Module with Intel® Apollo Lake Intel® Smart Display Module with Intel® Celeron® N3350 Processor, Fanless Design
GIGAIPC SDM-3350L-HW - SDM CPU Module with Intel® Apollo Lake
Intel® Smart Display Module with Intel® Celeron® N3350 Processor, Fanless Design

Overview
Key FeaturesSupported CPUs
  • Intel® Celeron® N3350 Processor
  • Dual Channel DDR3L, 2 x SO-DIMMs
  • HDMI and DP for dual display outputs
  • 1 x GbE LAN Port
  • M.2 with SATA 6Gb/s
  • 4 x USB 3.2 Gen 1
  • 1 x eMMC 32GB
CPU-Product Family: Intel® Apollo Lake

Introduction
As display panels become thinner and power-effecient with high performance, Intel® is presenting Smart Display Module (SDM), it's almost one-third size of OPS, but still an all-in-one integrated board with full computing capability and scalability powered by Intel® Celeron® N3350 processor and Intel® HD Graphics 500 chipset to supports 2 independent display output of 1 x HDMI and 1 x Display Port up to 4K resolution as well as 4 x USB 3.2 Gen 1 for various peripheral connections. Its form factor without enclosure brings the benefit of cost-effective on total solution design and integration flexibility to meet space-limited requirement.  It can be built in or externally plugged into a display panel to work mainly for commercial and retail markets, such as Interactive Whiteboard, menuboard, video wall, KIOSK and digital signage, etc.   The end user can update software content from remote location, and furthermore, quickly remove and replace SDM for maintainance or hardware upgrade purpose to save CAPEX and OPEX.
CPU-Variants
CPU Intel® Celeron® N3350
Processor Number N3350
Cache 2 MB L2 Cache
Total Cores 2
Total Threads 2
PCI Express Revision 2.0
Specification
Form FactorSDM-Large 175W x 100D(mm)
CPUIntel® Celeron® N3350 Processor 14nm, 2 cores, 2 threads, up to 2.4 GHz TDP 6W
Socket1 x FCBGA 1296
Memory2 x DDR3L SO-DIMM sockets, Max. Capacity 8 GB Support Dual Channel DDR3L 1866 MHz memory modules
Ethernet1 x GbE LAN Port (Realtek® RTL8111HS)
VideoIntegrated Graphics Processor - Intel® HD Graphics 500:Support SDM interface : HDMI & DP (FHD) 1 x HDMI 1.4 port (SDM), supporting a maximum resolution of 3840x2160 @30Hz 1 x DP port (SDM), supporting a maximum resolution of 3840x2160 @30Hz (2 independent display outputs)
AudioIntel® Integrated Audio
Storage1 x eMMC 32GB
Expansion Slots1 x 2280 M.2 M-Key (SATA 6Gb/s) 1 x 2230 M.2 E-key (WiFi/BT)
Rear I/O1 x Display Port 1 x RJ45 LAN Port 4 x USB 3.2 Gen 1 1 x PWR LED 1 x HDD LED 2 x External Antenna Holes (Optional) 1 x Reset button 1 x Power button
OS CompatibilityWindows 10 (x64)
Operating PropertiesOperating temperature: 0°C to +55°C Operating humidity: 0-90% (non-condensing) Non-operating temperature: -40°C to +85°C Non-operating humidity: 0%-95% (non-condensing)
Packing ContentCarton size: 465 x 351 x 217 (mm) Packing Capacity: 10pcs Single Box size: 221 x 178 x 65 (mm) Single Box weight: Approx. 0.46kg Including: Screw Kit with #0 ZIPLOCK BAG SCREW-BIND M3.0*L5.0 NI x 2pcs (P/N: 25KSD-130053-S0R)
Order Information9MAPLKBLMR-HW (Box packing)
All data is for information purposes only. The specification is subject to change without notice in advance. Any configuration other than original product specification is not guaranteed. Although all the information contained within this website is carefully checked, no guarantee of correctness is implied or expressed.
Please always double-check the latest version of the product specification of the product manufacturer. Manufacturer Product Website: SDM-3350L-HW
Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with MCTX Mobile & Embedded Computers GmbH.

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MCTX Mobile & Embedded Computers GmbH was founded in 2010 and focuses on the development and marketing of compact, high-performance, energy-efficient, and scalable computer systems and system components for mobile and stationary professional use in both indoor and outdoor environments.  

We consider ourselves a reliable and experienced partner for companies and organizations that integrate these technologies into their processes or products.  Our goal is to offer our customers SOLUTIONS that fully meet the requirements of their tasks.

Our company headquarters is located in southwestern Germany, in Gottenheim near Freiburg im Breisgau, close to the borders of France and Switzerland.

Service Portfolio

Depending on the project requirements, we offer our customers a wide range of products and outsourcing services: technology consulting for selecting the processor platform, delivery of key components, and the commissioned delivery of fully integrated, custom systems.

Over the years, our team has gained valuable experience in the integration of energy-efficient computing technologies. We provide this engineering know-how to our customers in order to optimize product and development costs as well as time-to-market.


Applications

Our boards and systems are used in a variety of applications in the field, in laboratories, in factory automation, and in OEM products, such as in the validation of semiconductor chips, in Lidar systems for 3D object measurement, in autonomous vehicles, various measurement and diagnostic systems, or in mobile data collection in the agricultural and forestry sectors.

Technologies

Our systems are based on state-of-the-art technologies used in modern servers, notebooks, tablet PCs, and navigation systems. The use of modular and industrial-grade system concepts enables long-lasting and scalable systems.