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Module Store - Building Blocks for Developers of Embedded Computing Systems

SDM-1185G7EL

Product information "SDM-1185G7EL"
GIGAIPC SDM-1185G7EL - SDM CPU Module with Intel® Tiger Lake Intel® Smart Display Module with Intel® 11th Generation Core™ i7-1185G7E Processor
GIGAIPC SDM-1185G7EL - SDM CPU Module with Intel® Tiger Lake
Intel® Smart Display Module with Intel® 11th Generation Core™ i7-1185G7E Processor

Overview
Key FeaturesSupported CPUs
  • 8K Smart Display Module (SDM)
  • Intel® Core™ i7-1185G7E Processor
  • 16GB LPDDR4x-4267 MT/s (Soldered)
  • 1 x 2.5GbE LAN Port
  • 2 x USB 3.2 Type A Gen 2x1
  • 1 x USB 3.2 Type C Gen 2x1 (with DP output)
  • 2 x HDMI 2.0
  • Environment : Operation 0°C to 55°C
CPU-Product Family: Intel® Tiger Lake

CPU-Variants
CPU Intel® Core™ i7-1185G7E
Processor Number i7-1185G7E
Cache 12 MB Intel® Smart Cache
Max Turbo Frequency 4.40 GHz
Total Cores 4
Total Threads 8
Specification
Form FactorSDM-Large 175W x 100D(mm)
CPUIntel® Core™ i7-1185G7E Processor 10nm SuperFin, 4 cores, 8 threads, up to 4.40 GHz TDP 28W
Socket1 x FCBGA1449
Memory16GB LPDDR4x-4267 MT/s (Soldered)
Ethernet1 x 2.5GbE LAN Port (Intel® I225LM)
VideoIntegrated Graphics Processor - Intel® Iris Xᵉ Graphics: 2 x HDMI 2.1 (SDM), supporting a maximum resolution of 7680x4320 @60Hz 2 x HDMI 2.0 (Rear), supporting a maximum resolution of 4096x2160 @60Hz 1 x DP 1.4 through USB type C (8k), supporting a maximum resolution of 7680x4320 @60Hz (4 independent display outputs)
AudioIntel® Integrated Audio
Storage1 x 2280 M.2 M-Key (Support NVME only) Default SSD supplied with 128GB and heatsink
Expansion Slots1 x 2230 M.2 E-Key (with Intel AX210 Wi-Fi Card) 1 x 3052 M.2 B-Key (Support 5G)
Rear I/O2 x HDMI 1 x RJ45 LAN Port 2 x USB 3.2 Type A Gen 2x1 1 x USB 3.2 Type C Gen 2x1 (with DP output) 1 x PWR LED 1 x HDD LED 4 x External Antenna Holes (Optional) 1 x Reset button 1 x Power button
TPM1 x TPM header (SPI interface)
OS CompatibilityWindows® 10/11 (x64)
Operating PropertiesOperating temperature: 0°C to 55°C Operating humidity: 0%-90% (non-condensing) Non-operating temperature: -40°C to 85°C Non-operating humidity: 0%-95% (non-condensing)
Packing ContentCarton size: 469 x 382 x 381 (mm) Packing Capacity: 10pcs Single Box size: 345 x 221 x 70 (mm) Single Box weight : Approx. 1.5kg Including : US power cord x 1 (P/N: 25CP0-007001-Q0R) PSU ADP 12V 120W 100-240VAC x 1 (P/N: 25EP4-201202-F3S) External Antenna for WiFi module x 2 (P/N: 25CA0-163002-A5S)
Order Information9MTGU7BLMR-IA (Box packing)
Optional KitTPM 2.0 module P/N: 9CTM010NR-00 TPM Cable P/N: 25CRZ-100600-S9R
All data is for information purposes only. The specification is subject to change without notice in advance. Any configuration other than original product specification is not guaranteed. Although all the information contained within this website is carefully checked, no guarantee of correctness is implied or expressed.
Please always double-check the latest version of the product specification of the product manufacturer. Manufacturer Product Website: SDM-1185G7EL
Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with MCTX Mobile & Embedded Computers GmbH.

OEM System Integration Support

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MCTX Mobile & Embedded Computers GmbH was founded in 2010 and focuses on the development and marketing of compact, high-performance, energy-efficient, and scalable computer systems and system components for mobile and stationary professional use in both indoor and outdoor environments.  

We consider ourselves a reliable and experienced partner for companies and organizations that integrate these technologies into their processes or products.  Our goal is to offer our customers SOLUTIONS that fully meet the requirements of their tasks.

Our company headquarters is located in southwestern Germany, in Gottenheim near Freiburg im Breisgau, close to the borders of France and Switzerland.

Service Portfolio

Depending on the project requirements, we offer our customers a wide range of products and outsourcing services: technology consulting for selecting the processor platform, delivery of key components, and the commissioned delivery of fully integrated, custom systems.

Over the years, our team has gained valuable experience in the integration of energy-efficient computing technologies. We provide this engineering know-how to our customers in order to optimize product and development costs as well as time-to-market.


Applications

Our boards and systems are used in a variety of applications in the field, in laboratories, in factory automation, and in OEM products, such as in the validation of semiconductor chips, in Lidar systems for 3D object measurement, in autonomous vehicles, various measurement and diagnostic systems, or in mobile data collection in the agricultural and forestry sectors.

Technologies

Our systems are based on state-of-the-art technologies used in modern servers, notebooks, tablet PCs, and navigation systems. The use of modular and industrial-grade system concepts enables long-lasting and scalable systems.