Module Store - Building Blocks for Developers of Embedded Computing Systems
QBiX-Pro-RPLA1355H-A2
Price on request
| GIGAIPC QBiX-Pro-RPLA1355H-A2 - QBiX Pro Systems Embedded Box PC |
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| Industrial system with Intel® Core™ i7-1355U Processor/ Fanless Design / Dual Channel DDR4 up to 64GB/ 2 x HDMI |
| Overview |
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| Key Features |
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| Specification |
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| Dimension | 178W x 125D x 52.7H(mm) |
| CPU | Intel® Core™ i7-1355U Processor Intel® 7, 10 cores, 2P+8E, 12 threads, up to 5.0 GHz |
| Chipset | SoC |
| Memory | 2 x DDR4 SO-DIMM sockets, Max. Capacity 64 GB Support Dual Channel DDR4 3200 MHz memory modules |
| Ethernet | 2 x 2.5GbE LAN Ports (Intel® I226V) |
| Graphic Support | Integrated Graphics Processor - Intel® Iris® Xe Graphics : 2 x HDMI 2.0 ports, supporting a maximum resolution of 4096x2160 @60Hz (2 independent display outputs) |
| Audio | Realtek® ALC269 |
| Storage | 1 x 2.5” HDD/SSD (SATA 6Gb/s) |
| Expansion Slots | 1 x 2280 M.2 M-Key (PCIe Gen 4x4, SATA 6Gb/s) 1 x 2230 M.2 E-Key 1 x Full-size Mini PCIe with SIM slot |
| Front I/O | 2 x RJ45 LAN Ports 4 x USB 3.2 Gen 2x1 2 x HDMI 1 x Power button with LED 1 x HDD LED 1 x COM Port (RS-232/422/485 & RI/5V/12V) 1 x External Antenna Hole (Optional) |
| Rear I/O | 2 x USB 2.0 2 x COM Ports (RS-232/422/485) 1 x GPIO (8 bits) 1 x Headphone Jack 1 x Screw Type DC Jack |
| Side I/O | 2 x External Antenna Holes (Optional) |
| TPM | Onboard TPM 2.0 security chip INFINEON SLB9672VU2.0 |
| Power | +12V~36VDC (Adapter 19.5V/135W) |
| Operation Temperature | Operating temperature: 0°C to 50°C Operating humidity: 0-90% (non-condensing) Non-operating temperature: -40°C to 85°C Non-operating humidity: 0%-95% (non-condensing) Use wide temperature range memory and storage |
| Vibration During Operation | Operation: IEC 60068-2-64, 5 Grms, random, 5 ~ 500 Hz, 1 hr / Per Axis, With SSD/M.2 2280 Non-operation: IEC 60068-2-6, 2 G, Sine, 10 ~ 500 Hz, 1 Oct/min, 1 hr / Per Axis |
| Shock During Operation | Operation: IEC 60068-2-27, 50 G, half sine, 11 ms duration, With SSD |
| Packaging Content | Carton size: 505 x 333 x 231 (mm) Packing Capacity: 5pcs Single Box size: 313 x 191 x 95 (mm) Including: Screw I Head for 2.5" HDD M3x8L x 4 (P/N: 25KSG-130081-K1R) Thermal Pad for Memory x 1 (P/N: 25ST3-200086-T5R) SATA Cable x 1 (P/N: 25CRI-070000-S9R) Power Cord : Optional (by region) PSU ADP 19.5V 135W 100-240VAC x 1 (P/N: 25EP4-201352-C1S) |
| Mounting | Wall mount P/N: 25HB2-CGAA20-CHR x 1 (Optional) VESA 75/100 P/N: 25HB1-TPL021-S8R x 1 + 25KSD-000002-C0R x 1 (Screw) (Optional) |
| Order Information | 6BQP1355AMR-SI (Box packing) |
| All data is for information purposes only. The specification is subject to change without notice in advance. Any configuration other than original product specification is not guaranteed. Although all the information contained within this website is carefully checked, no guarantee of correctness is implied or expressed. Please always double-check the latest version of the product specification of the product manufacturer. Manufacturer Product Website: QBiX-Pro-RPLA1355H-A2 Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with MCTX Mobile & Embedded Computers GmbH. |
| OEM System Integration Support |
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We would be happy to assist you in selecting the optimal hardware platform for your application.
If you have any questions, whether technical or commercial, about our products or services, don’t hesitate to contact us. We look forward to hearing from you.
You can reach us by phone at +49 (0)7665/9390-185 (Monday to Friday from 8:00 AM to 8:00 PM). Alternatively, you are welcome to contact us anytime via the contact form at the end of this page. If you cannot reach us by phone, please send us a brief message via the contact form – we will get back to you as soon as possible.
Please note that we offer our services exclusively to Original Equipment Manufacturers. We do not sell to private persons or resellers.MCTX Mobile & Embedded Computers GmbH was founded in 2010 and focuses on the development and marketing of compact, high-performance, energy-efficient, and scalable computer systems and system components for mobile and stationary professional use in both indoor and outdoor environments.
We consider ourselves a reliable and experienced partner for companies and organizations that integrate these technologies into their processes or products. Our goal is to offer our customers SOLUTIONS that fully meet the requirements of their tasks.
Our company headquarters is located in southwestern Germany, in Gottenheim near Freiburg im Breisgau, close to the borders of France and Switzerland.
Service Portfolio
Depending on the project requirements, we offer our customers a wide range of products and outsourcing services: technology consulting for selecting the processor platform, delivery of key components, and the commissioned delivery of fully integrated, custom systems.
Over the years, our team has gained valuable experience in the integration of energy-efficient computing technologies. We provide this engineering know-how to our customers in order to optimize product and development costs as well as time-to-market.
Applications
Our boards and systems are used in a variety of applications in the field, in laboratories, in factory automation, and in OEM products, such as in the validation of semiconductor chips, in Lidar systems for 3D object measurement, in autonomous vehicles, various measurement and diagnostic systems, or in mobile data collection in the agricultural and forestry sectors.
Technologies
Our systems are based on state-of-the-art technologies used in modern servers, notebooks, tablet PCs, and navigation systems. The use of modular and industrial-grade system concepts enables long-lasting and scalable systems.