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mITX-H61EC

Product information "mITX-H61EC"
GIGAIPC mITX-H61EC - Mini-ITX Single-Board-Computer Mini-ITX with Intel® H610E Chipset, support 14th/13th/12th Generation Intel® Core™ Processors, Dual channel DDR4 memory, PCIe, 2 x COM, 8 x USB, 2 x SATA 6Gb/s
GIGAIPC mITX-H61EC - Mini-ITX Single-Board-Computer
Mini-ITX with Intel® H610E Chipset, support 14th/13th/12th Generation Intel® Core™ Processors, Dual channel DDR4 memory, PCIe, 2 x COM, 8 x USB, 2 x SATA 6Gb/s

Overview
Key Features
  • Mini-ITX form factor
  • Support 14th/13th/12th Generation Intel® Core™ Processors
  • Intel® H610E Chipset
  • Dual Channel DDR4, 2 x SO-DIMMs
  • 6 x 2.5GbE LAN Ports
  • 2 x SATA 6Gb/s Ports
  • HDMI, VGA ports for multiple display
  • 1 x COM Port (RS-232/422/485 & RI/5V/12V)
  • 1 x COM Port (RS-232)
Specification
Form FactorMini-ITX 170W x 170D(mm)
CPUSupport for 14th/13th/12th Generation Intel® Core™ i9/i7/i5/i3, Pentium® and Celeron® processors in the LGA1700 package TDP under 65W
Socket1 x LGA 1700
ChipsetIntel® H610E Chipset
Memory2 x DDR4 SO-DIMM sockets, Max. Capacity 64 GB Support Dual channel DDR4 3200 MHz memory modules
Ethernet6 x 2.5GbE LAN Ports (Intel® I226V)
VideoIntegrated Graphics Processor - depends on CPU: 1 x HDMI 2.0 port, supporting a maximum resolution of 4096x2160 @60Hz 1 x VGA port, supporting a maximum resolution of 1920x1080 @60Hz (2 independent display outputs)
AudioRealtek® ALC897
Storage2 x SATA 6Gb/s Ports
Expansion Slots1 x PCIe x16 (Gen 4x16) 1 x 2280 M.2 M-Key (SATA 6Gb/s) 1 x 2230 M.2 E-Key (WiFi/BT)
Internal I/O1 x 4-pin ATX main power connector 1 x SATA power connector 1 x CPU fan header 1 x System fan header 1 x Front panel header 1 x Front panel audio header 4 x USB 2.0 headers 1 x COM header (RS-232/422/485 & RI/5V/12V) 1 x COM header (RS-232) 1 x GPIO (8-bits) & SMBus header 1 x Clear CMOS jumper 1 x Buzzer header 1 x AT/ATX mode select jumper
Rear I/O2 x Audio Jacks (Line out, Mic in) 1 x HDMI 1 x VGA 6 x RJ45 LAN Ports 4 x USB 3.2 Gen 1 1 x DC Jack (+12V/+19V~24VDC)
TPMOnboard TPM 2.0 security chip Infineon SLB9670VQ2.0
OS CompatibilityWindows 10/11 (x64)
Operating PropertiesOperating temperature: 0°C to 60°C Operating humidity: 0-90% (non-condensing) Non-operating temperature: -40°C to 85°C Non-operating humidity: 0%-95% (non-condensing)
Packing ContentCarton size: 465 x 351 x 217 (mm) Packing Capacity: 10pcs Single Box size : 221 x 178 x 65 (mm) Including: IO Shield x 1 (P/N: 12AIO-MH61EC-00R) SATA power Cable x 1 (P/N: 25CRI-300B01-K1R)
Order Information9MH61ECIMR-SI (Box packing)
Optional KitCPU Cooler : 25ST0-037820-Y0R CPU Cooler Backplate : 12KRH-0A1700-00R
All data is for information purposes only. The specification is subject to change without notice in advance. Any configuration other than original product specification is not guaranteed. Although all the information contained within this website is carefully checked, no guarantee of correctness is implied or expressed.
Please always double-check the latest version of the product specification of the product manufacturer. Manufacturer Product Website: mITX-H61EC
Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with MCTX Mobile & Embedded Computers GmbH.

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We would be happy to assist you in selecting the optimal hardware platform for your application.

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Please note that we offer our services exclusively to Original Equipment Manufacturers. We do not sell to private persons or resellers.
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MCTX Mobile & Embedded Computers GmbH was founded in 2010 and focuses on the development and marketing of compact, high-performance, energy-efficient, and scalable computer systems and system components for mobile and stationary professional use in both indoor and outdoor environments.  

We consider ourselves a reliable and experienced partner for companies and organizations that integrate these technologies into their processes or products.  Our goal is to offer our customers SOLUTIONS that fully meet the requirements of their tasks.

Our company headquarters is located in southwestern Germany, in Gottenheim near Freiburg im Breisgau, close to the borders of France and Switzerland.

Service Portfolio

Depending on the project requirements, we offer our customers a wide range of products and outsourcing services: technology consulting for selecting the processor platform, delivery of key components, and the commissioned delivery of fully integrated, custom systems.

Over the years, our team has gained valuable experience in the integration of energy-efficient computing technologies. We provide this engineering know-how to our customers in order to optimize product and development costs as well as time-to-market.


Applications

Our boards and systems are used in a variety of applications in the field, in laboratories, in factory automation, and in OEM products, such as in the validation of semiconductor chips, in Lidar systems for 3D object measurement, in autonomous vehicles, various measurement and diagnostic systems, or in mobile data collection in the agricultural and forestry sectors.

Technologies

Our systems are based on state-of-the-art technologies used in modern servers, notebooks, tablet PCs, and navigation systems. The use of modular and industrial-grade system concepts enables long-lasting and scalable systems.