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conga-TS570
Price on request
Product number:
conga-TS570
Product information "conga-TS570"
| congatec conga-TS570 - COM Express Basic Type 6 CPU Module with Intel® Tiger Lake |
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| COM Express Type 6 Basic module based on 11th Generation Intel® Core™ processor family (code name "Tiger Lake-H") |
| Overview |
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| Key Features | Supported CPUs |
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CPU-Product Family: Intel® Tiger Lake
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| CPU-Variants |
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| CPU | Processor Number | Cache | Total Cores | Total Threads | Max Turbo Frequency |
|---|---|---|---|---|---|
| Intel® Core™ i7-11850HE | i7-11850HE | 24 MB Intel® Smart Cache | 8 | 16 | 4.70 GHz |
| Intel® Core™ i5-11500HE | i5-11500HE | 12 MB Intel® Smart Cache | 6 | 12 | 4.50 GHz |
| Intel® Core™ i3-11100HE | i3-11100HE | 8 MB Intel® Smart Cache | 4 | 8 | 4.40 GHz |
| Intel® Xeon® W-11865MRE | W-11865MRE | 24 MB Intel® Smart Cache | 8 | 16 | 4.70 GHz |
| Intel® Xeon® W-11865MLE | W-11865MLE | 24 MB Intel® Smart Cache | 8 | 16 | 4.50 GHz |
| Intel® Xeon® W-11555MRE | W-11555MRE | 12 MB Intel® Smart Cache | 6 | 12 | 4.50 GHz |
| Intel® Xeon® W-11555MLE | W-11555MLE | 12 MB Intel® Smart Cache | 6 | 12 | 4.40 GHz |
| Intel® Xeon® W-11155MRE | W-11155MRE | 8 MB Intel® Smart Cache | 4 | 8 | 4.40 GHz |
| Intel® Xeon® W-11155MLE | W-11155MLE | 8 MB Intel® Smart Cache | 4 | 8 | 3.10 GHz |
| Intel® Celeron® 6600HE | 6600HE | 8 MB Intel® Smart Cache | 2 | 2 |
| Specification |
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| Formfactor | COM Express Basic |
| CPU | Intel® Xeon® W-11155MLE(4 x 1.8 GHz, 8 MB cache, 25W)Intel® Xeon® W-11555MLE(6 x 1.9 GHz, 12 MB cache, 25W)Intel® Xeon® W-11865MLE(8 x 1.5 GHz, 24 MB cache, 25W)Intel® Xeon® W-11155MRE(4 x 2.4 GHz, 8 MB cache, 45W)Intel® Xeon® W-11555MRE(6 x 2.6 GHz, 12 MB cache, 45W)Intel® Xeon® W-11865MRE(8 x 2.6 GHz, 24 MB cache, 45W)Intel® Celeron® 6600HE(2 x 2.6 GHz, 8 MB cache, 35W)Intel® Core™ i3-11100HE(4 x 2.4 GHz, 8 MB cache, 45W)Intel® Core™ i5-11500HE(6 x 2.6 GHz, 12 MB cache, 45W)Intel® Core™ i7-11850HE(8 x 2.6 GHz, 24 MB cache, 45W) |
| DRAM | Up to 3 SO-DIMM sockets for DDR4 ECC memory modules up to 32 GByte each (96 GByte total) with 3200 MT/s |
| Ethernet | 1 x 2.5 GbE with TSN support via Intel® i226 Ethernet controller series |
| I/O Interfaces | 8 x PCIe Gen3LPC bus8 x GPIOs2 x UARTSPI4 x SATA III (6Gb/s)8 x USB 2.04 x USB 3.1 Gen2PEG support x16 (PCIe Gen4)I²C bus |
| Graphics | Integrated Xe (Gen 12) graphics engine with up to 32 EU (Execution Units) | Supporting 4 independent display units (4x 4k/2x 8K) | Enhanced media (AV1/12b) with up to 2 Vdbox | Next Gen IPU6 with DPHY2.1 | DP 1.4 |
| congatec Board Controller | Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirection |
| embedded BIOS Features | AMI Aptio UEFI32 MByte serial SPI firmware flashOEM LogoOEM CMOS DefaultsLCD ControlDisplay Auto DetectionBacklight ControlFlash Update |
| Security | Trusted Platform Module (TPM 2.0) |
| Power Management | ACPI 6.0 with battery support |
| Operating Systems | Microsoft® Windows® 10Microsoft® Windows 10 IoT EnterpriseLinuxYocto |
| Hypervisor | RTS Real-Time Hypervisor |
| Temperature | Commercial: Operating: 0 to +60°C | Storage: -20 to +80°CIndustrial: Operating: -40 to +85°C | Storage: -40 to +85°C |
| Humidity | Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond. |
| Video Interfaces | 3x DP/DP++ | 1x eDP /LVDS |
| Size | 95 x 125 mm (3.74" x 4.92") |
| Product Variants / Accessories |
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| 050700 | conga-TS570/i7-11850HE | COM Express Type 6 Basic module based on Intel® Core™ i7-11850HE 8-core processor with 2.6GHz up to 4.7GHz turbo boost, 24MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset QM580E | Intel® Tiger Lake-H | Commercial temperature range |
| 050701 | conga-TS570/i5-11500HE | COM Express Type 6 Basic module based on Intel® Core™ i5-11500HE 6-core processor with 2.6GHz up to 4.5GHz turbo boost, 12MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset QM580E | Intel® Tiger Lake-H | Commercial temperature range |
| 050702 | conga-TS570/i3-11100HE | COM Express Type 6 Basic module based on Intel® Core™ i3-11100HE 4-core processor with 2.4GHz up to 4.4GHz turbo boost, 8MB Intel® Smart Cache, Intel® UHD Graphics with 16EU and dual channel DDR4 3200 MT/s memory interface. | Chipset HM570E | Intel® Tiger Lake-H | Commercial temperature range |
| 050703 | conga-TS570/6600HE | COM Express Type 6 Basic module based on Intel® Celeron® 6600HE 2-core processor with 2.6GHz base frequency, 8MB Intel® Smart Cache, Intel® UHD Graphics with 16EU and dual channel DDR4 3200 MT/s memory interface. | Chipset HM570E | Intel® Tiger Lake-H | Commercial temperature range |
| 050710 | conga-TS570/W-11865MRE | COM Express Type 6 Basic module based on Intel® Xeon® W-11865MRE 8-core processor with 2.6GHz up to 4.7GHz turbo boost, 24MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Industrial temperature range |
| 050711 | conga-TS570/W-11555MRE | COM Express Type 6 Basic module based on Intel® Xeon® W-11555MRE 6-core processor with 2.6GHz up to 4.5GHz turbo boost, 12MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Industrial temperature range |
| 050712 | conga-TS570/W-11155MRE | COM Express Type 6 Basic module based on Intel® Xeon® W-11155MRE 4-core processor with 2.4GHz up to 4.4GHz turbo boost, 8MB Intel® Smart Cache, Intel® UHD Graphics with 16EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Industrial temperature range |
| 050713 | conga-TS570/W-11865MLE | COM Express Type 6 Basic module based on Intel® Xeon® W-11865MLE 8-core processor with 1.5GHz up to 4.5GHz turbo boost, 24MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Commercial temperature range |
| 050714 | conga-TS570/W-11555MLE | COM Express Type 6 Basic module based on Intel® Xeon® W-11555MLE 6-core processor with 1.9GHz up to 4.4GHz turbo boost, 12MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Commercial temperature range |
| 050715 | conga-TS570/W-11155MLE | COM Express Type 6 Basic module based on Intel® Xeon® W-11155MLE 4-core processor with 1.8GHz up to 3.1GHz turbo boost, 8MB Intel® Smart Cache, Intel® UHD Graphics with 16EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Embedded temperature range 0°C to 60°C. |
| Accessories |
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| 050750 | conga-TS570/CSA-HP-B | Standard active cooling solution for high performance COM Express module conga-TS570 with integrated heat pipes, 29mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole. |
| 050751 | conga-TS570/CSA-HP-T | Standard active cooling solution for high performance COM Express module conga-TS570 with integrated heat pipes, 29mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread. |
| 050752 | conga-TS570/CSP-HP-B | Standard passive cooling solution for high performance COM Express module conga-TS570 with integrated heat pipes, 28mm overall heat sink height. All standoffs are with 2.7mm bore hole. |
| 050753 | conga-TS570/CSP-HP-T | Standard passive cooling solution for high performance COM Express module conga-TS570 with integrated heat pipes, 28mm overall heat sink height. All standoffs are M2.5mm thread. |
| 050754 | conga-TS570/HSP-HP-B | Standard heatspreader for high performance COM Express module conga-TS570 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole. |
| 050755 | conga-TS570/HSP-HP-T | Standard heatspreader for high performance COM Express module conga-TS570 with integrated heat pipes, 11mm overall heat sink height. All standoffs are M2.5mm thread. |
| 050756 | conga-TS570/HPA | Standard heatpipe adapter for high performance COM Express module conga-TS570. |
| 068793 | DDR4-SODIMM-3200 (4GB) | DDR4 SODIMM memory module with 3200 MT/s and 4GB RAM |
| 068794 | DDR4-SODIMM-3200 (8GB) | DDR4 SODIMM memory module with 3200 MT/s and 8GB RAM |
| 068798 | DDR4-SODIMM-3200 (16GB) | DDR4 SODIMM memory module with 3200 MT/s and 16GB RAM |
| 068825 | DDR4-SODIMM-3200 (4GB) / i-temp | DDR4 SODIMM memory module with up to 3200 MT/s and 4GB RAM, industrial temp -40°C to +85°C |
| 068826 | DDR4-SODIMM-3200 (8GB) / i-temp | DDR4 SODIMM memory module with up to 3200 MT/s and 8GB RAM, industrial temp -40°C to +85°C |
| 068827 | DDR4-SODIMM-3200 (16GB) / i-temp | DDR4 SODIMM memory module with up to 3200 MT/s and 16GB RAM, industrial temp -40°C to +85°C |
| 068837 | DDR4-SODIMM-3200 (32GB) / i-temp | DDR4 SODIMM memory module with up to 3200 MT/s and 32GB RAM, industrial temp -40°C to +85°C |
| 068736 | DDR4-SODIMM-3200 ECC (4GB) | DDR4 ECC SODIMM memory module with 3200 MT/s and 4GB RAM |
| 068737 | DDR4-SODIMM-3200 ECC (8GB) | DDR4 ECC SODIMM memory module with 3200 MT/s and 8GB RAM |
| 068738 | DDR4-SODIMM-3200 ECC (16GB) | DDR4 ECC SODIMM memory module with 3200 MT/s and 16GB RAM |
| 065810 | conga-TEVAL2 | Evaluation carrier board for COM Express Type6 Rev. 3.0 modules. |
| 27000001 | Design-In Training | Design-Training to develop carrier boards for Computer on Modules |
| All data is for information purposes only. The specification is subject to change without notice in advance. Any configuration other than original product specification is not guaranteed. Although all the information contained within this website is carefully checked, no guarantee of correctness is implied or expressed. Please always double-check the latest version of the product specification of the product manufacturer. Manufacturer Product Website: conga-TS570 Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with MCTX Mobile & Embedded Computers GmbH. |
| OEM System Integration Support |
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Product Variants / Acessories
congatec
conga-TS570/i7-11850HE
COM Express Type 6 Basic module based on Intel® Core™ i7-11850HE 8-core processor with 2.6GHz up to 4.7GHz turbo boost, 24MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset QM580E | Intel® Tiger Lake-H | Commercial temperature range
Price on request
congatec
conga-TS570/i5-11500HE
COM Express Type 6 Basic module based on Intel® Core™ i5-11500HE 6-core processor with 2.6GHz up to 4.5GHz turbo boost, 12MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset QM580E | Intel® Tiger Lake-H | Commercial temperature range
Price on request
congatec
conga-TS570/i3-11100HE
COM Express Type 6 Basic module based on Intel® Core™ i3-11100HE 4-core processor with 2.4GHz up to 4.4GHz turbo boost, 8MB Intel® Smart Cache, Intel® UHD Graphics with 16EU and dual channel DDR4 3200 MT/s memory interface. | Chipset HM570E | Intel® Tiger Lake-H | Commercial temperature range
Price on request
congatec
conga-TS570/6600HE
COM Express Type 6 Basic module based on Intel® Celeron® 6600HE 2-core processor with 2.6GHz base frequency, 8MB Intel® Smart Cache, Intel® UHD Graphics with 16EU and dual channel DDR4 3200 MT/s memory interface. | Chipset HM570E | Intel® Tiger Lake-H | Commercial temperature range
Price on request
congatec
conga-TS570/W-11865MRE
COM Express Type 6 Basic module based on Intel® Xeon® W-11865MRE 8-core processor with 2.6GHz up to 4.7GHz turbo boost, 24MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Industrial temperature range
Price on request
congatec
conga-TS570/W-11555MRE
COM Express Type 6 Basic module based on Intel® Xeon® W-11555MRE 6-core processor with 2.6GHz up to 4.5GHz turbo boost, 12MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Industrial temperature range
Price on request
congatec
conga-TS570/W-11155MRE
COM Express Type 6 Basic module based on Intel® Xeon® W-11155MRE 4-core processor with 2.4GHz up to 4.4GHz turbo boost, 8MB Intel® Smart Cache, Intel® UHD Graphics with 16EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Industrial temperature range
Price on request
congatec
conga-TS570/W-11865MLE
COM Express Type 6 Basic module based on Intel® Xeon® W-11865MLE 8-core processor with 1.5GHz up to 4.5GHz turbo boost, 24MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Commercial temperature range
Price on request
congatec
conga-TS570/W-11555MLE
COM Express Type 6 Basic module based on Intel® Xeon® W-11555MLE 6-core processor with 1.9GHz up to 4.4GHz turbo boost, 12MB Intel® Smart Cache, Intel® UHD Graphics with 32EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Commercial temperature range
Price on request
congatec
conga-TS570/W-11155MLE
COM Express Type 6 Basic module based on Intel® Xeon® W-11155MLE 4-core processor with 1.8GHz up to 3.1GHz turbo boost, 8MB Intel® Smart Cache, Intel® UHD Graphics with 16EU and dual channel DDR4 3200 MT/s memory interface. | Chipset RM590E | Intel® Tiger Lake-H | Embedded temperature range 0°C to 60°C.
Price on request
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MCTX Mobile & Embedded Computers GmbH was founded in 2010 and focuses on the development and marketing of compact, high-performance, energy-efficient, and scalable computer systems and system components for mobile and stationary professional use in both indoor and outdoor environments.
We consider ourselves a reliable and experienced partner for companies and organizations that integrate these technologies into their processes or products. Our goal is to offer our customers SOLUTIONS that fully meet the requirements of their tasks.
Our company headquarters is located in southwestern Germany, in Gottenheim near Freiburg im Breisgau, close to the borders of France and Switzerland.
Service Portfolio
Depending on the project requirements, we offer our customers a wide range of products and outsourcing services: technology consulting for selecting the processor platform, delivery of key components, and the commissioned delivery of fully integrated, custom systems.
Over the years, our team has gained valuable experience in the integration of energy-efficient computing technologies. We provide this engineering know-how to our customers in order to optimize product and development costs as well as time-to-market.
Applications
Our boards and systems are used in a variety of applications in the field, in laboratories, in factory automation, and in OEM products, such as in the validation of semiconductor chips, in Lidar systems for 3D object measurement, in autonomous vehicles, various measurement and diagnostic systems, or in mobile data collection in the agricultural and forestry sectors.
Technologies
Our systems are based on state-of-the-art technologies used in modern servers, notebooks, tablet PCs, and navigation systems. The use of modular and industrial-grade system concepts enables long-lasting and scalable systems.