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conga-TS370
Price on request
Product number:
conga-TS370
Product information "conga-TS370"
| congatec conga-TS370 - COM Express Basic Type 6 CPU Module with Intel® Coffee Lake |
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| COM Express Type 6 Basic module based on 8th Generation Intel® Core™ processor family |
| Overview |
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| Key Features | Supported CPUs |
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CPU-Product Family: Intel® Coffee Lake
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| CPU-Variants |
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| CPU | Processor Number | Cache | Total Cores | Total Threads | PCI Express Revision | Max Turbo Frequency |
|---|---|---|---|---|---|---|
| Intel® Core™ i7-9850HL | i7-9850HL | 9 MB | 6 | 12 | 3.0 | 4.10 GHz |
| Intel® Core™ i7-9850HE | i7-9850HE | 9 MB | 6 | 12 | 3.0 | 4.40 GHz |
| Intel® Core™ i7-8850H | i7-8850H | 9 MB Intel® Smart Cache | 6 | 12 | 3.0 | 4.30 GHz |
| Intel® Core™ i5-8400H | i5-8400H | 8 MB Intel® Smart Cache | 4 | 8 | 3.0 | 4.20 GHz |
| Intel® Core™ i3-9100HL | i3-9100HL | 6 MB | 4 | 4 | 3.0 | 2.90 GHz |
| Intel® Core™ i3-8100H | i3-8100H | 6 MB Intel® Smart Cache | 4 | 4 | 3.0 | |
| Intel® Celeron® G4932E | G4932E | 2 MB | 2 | 2 | 3.0 | 1.90 GHz |
| Intel® Celeron® G4930E | G4930E | 2 MB | 2 | 2 | 3.0 | 2.40 GHz |
| Intel® Xeon® E-2276ML | E-2276ML | 12 MB | 6 | 12 | 3.0 | 4.20 GHz |
| Intel® Xeon® E-2276ME | E-2276ME | 12 MB | 6 | 12 | 3.0 | 4.50 GHz |
| Intel® Xeon® E-2254ML | E-2254ML | 8 MB | 4 | 8 | 3.0 | 3.50 GHz |
| Intel® Xeon® E-2254ME | E-2254ME | 8 MB | 4 | 8 | 3.0 | 3.80 GHz |
| Intel® Xeon® E-2176M | E-2176M | 12 MB Intel® Smart Cache | 6 | 12 | 3.0 | 4.40 GHz |
| Specification |
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| Formfactor | COM Express Basic |
| CPU | Intel® Xeon® E-2176M(6 x 2.7 GHz, 12MB cache, 45W)Intel® Xeon® E-2276ME(6 x 2.8 GHz, 12MB cache, 45W)Intel® Xeon® E-2254ME(4 x 2.6 GHz, 8MB cache, 45W)Intel® Xeon® E-2276ML(6 x 2.0 GHz, 12MB cache, 25W)Intel® Xeon® E-2254ML(4 x 1.7 GHz, 8MB cache, 25W)Intel® Core™ i7-8850H(6 x 2.6 GHz, 9MB cache, 45W)Intel® Core™ i7-9850HE(6 x 2.7 GHz, 9MB cache, 45W)Intel® Core™ i7-9850HL(6 x 1.9 GHz, 9MB cache, 25W)Intel® Core™ i5-8400H(4 x 2.5 GHz, 8MB cache, 45W)Intel® Core™ i3-8100H(4 x 3.0 GHz, 6MB cache, 45W)Intel® Core™ i3-9100HL(4 x 1.6 GHz, 6MB cache, 25W)Intel® Celeron® G4930E(2 x 2.4 GHz, 2MB cache, 35W)Intel® Celeron® G4932E(2 x 1.9 GHz, 2MB cache, 25W) |
| DRAM | Dual channel DDR4 up to 2666 MT/s | 2x SO-DIMM | up to 2x 32 GByte (optionally with ECC support for Intel® Xeon®) |
| Ethernet | Intel® i219-LM GbE LAN Controller with AMT 12.0 support |
| I/O Interfaces | 8 x PCI Express GEN 3.0 lanes4 x Serial ATA Gen 34 x USB 3.1 Gen 2 @ 10 GBit/s8 x USB 2.01 x PEG x16 Gen 3LPC busI²C bus (fast mode, 400 kHz, multi-master)2 x UART |
| Graphics | Intel® Gen9 HD Graphics Engine with OpenCL 2.0, OpenGL 4.3/4.4 and DirectX 11/12up to three independent displays: DDI / DisplayPort 1.2 / eDP 1.4 | MPEG-2 , WMV9 (VC-1), H.265 decoding | HEVC, VP9 encoding |
| congatec Board Controller | Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | LVDS backlight control I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control |
| embedded BIOS Features | AMI AptioV® UEFI 2.x firmware32 MByte serial SPI firmware flash |
| Security | TPM 2.0 Infineon SLB9665 |
| Power Management | ACPI 4.0 with battery support |
| Operating Systems | Microsoft® Windows 10 (64bit only)Microsoft® Windows 10 IoT Enterprise (64bit only)Linux |
| Temperature | Commercial: Operating: 0 .. +60°C | Storage: -40 .. +85°C |
| Extended Temperature | Screening service on request:-25 to +80°C (burn-in & cold-soak) | -40 to +85°C (burn-in & cold-soak) |
| Humidity | Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond. |
| Video Interfaces | 3x DDI / DisplayPort 1.2 with support for Multi-Stream Transport (MST) | resolutions up to 4kDual channel LVDS transmitter, Supports flat panels 2x24 Bit interface | VESA and openLDI colour mappings | resolutions up to 1920x1200 Automatic Panel Detection via EDID/EPI1 x VGA |
| Size | 95 x 125 mm (3.74" x 4.92") |
| Product Variants / Accessories |
|---|
| 049102 | conga-TS370/i7-9850HE | COM Express Type 6 Basic module with Coffeelake-H Refresh Intel® Core™ i7-9850HE, 45W hexa core processor with 2.7GHz, 9MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface. Chipset QM370. TPM 2.0. |
| 049112 | conga-TS370/i7-9850HL | COM Express Type 6 Basic module with Coffeelake-H Refresh Intel® Core™ i7-9850HL, 25W hexa core processor with 1.9GHz, 9MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface. Chipset QM370. TPM 2.0. |
| 049113 | conga-TS370/i3-9100HL | COM Express Type 6 Basic module with Coffeelake-H Refresh Intel® Core™ i3-9100HL, 25W quad core processor with 1.6GHz, 6MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface. Chipset HM370. TPM 2.0. |
| 049100 | conga-TS370/E-2276ME | COM Express Type 6 Basic module with Coffeelake-H Refresh Intel® Xeon® Processor E-2276ME, 45W hexa core processor with 2.8GHz, 12MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface with ECC support. Chipset CM246. TPM 2.0. |
| 049110 | conga-TS370/E-2276ML | COM Express Type 6 Basic module with Coffeelake-H Refresh Intel® Xeon® Processor E-2276ML, 25W hexa core processor with 2.0GHz, 12MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface with ECC support. Chipset CM246. TPM 2.0. |
| 049101 | conga-TS370/E-2254ME | COM Express Type 6 Basic module with Coffeelake-H Refresh Intel® Xeon® Processor E-2254ME, 45W quad core processor with 2.6GHz, 8MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface with ECC support. Chipset CM246. TPM 2.0. |
| 049111 | conga-TS370/E-2254ML | COM Express Type 6 Basic module with Coffeelake-H Refresh Intel® Xeon® Processor E-2254ML, 25W quad core processor with 1.7GHz, 8MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface with ECC support. Chipset CM246. TPM 2.0. |
| 049104 | conga-TS370/G4930E | COM Express Type 6 Basic module with Coffeelake-H Refresh Intel® Celeron® Processor G4930E, 35W dual core processor with 2.4GHz, 2MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface. Chipset HM370. TPM 2.0. |
| 049114 | conga-TS370/G4932E | COM Express Type 6 Basic module with Coffeelake-H Refresh Intel® Celeron® Processor G4932E, 25W dual core processor with 1.9GHz, 2MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface. Chipset HM370. TPM 2.0. |
| 049000 | conga-TS370/i7-8850H | COM Express Type 6 Basic module with Coffeelake-H Intel® Core™ i7-8850H hexa core processor with 2.6GHz, 9MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface. Chipset QM370. TPM 2.0. |
| 049001 | conga-TS370/i5-8400H | COM Express Type 6 Basic module with Coffeelake-H Intel® Core™ i5-8400H quad core processor with 2.5GHz, 8MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface. Chipset QM370. TPM 2.0. |
| 049003 | conga-TS370/i3-8100H | COM Express Type 6 Basic module with Coffeelake-H Intel® Core™ i3-8100H quad core processor with 3.0GHz, 6MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface. Chipset HM370. TPM 2.0. |
| 049002 | conga-TS370/E-2176M | COM Express Type 6 Basic module with Coffeelake-H Intel® Xeon® Processor E-2176M, hexa core processor with 2.7GHz, 12MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface with ECC support. Chipset CM246. TPM 2.0. |
| Accessories |
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| 045930 | conga-TS170/CSA-HP-B | Standard active cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole. |
| 045931 | conga-TS170/CSA-HP-T | Standard active cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread. |
| 045932 | conga-TS170/CSP-HP-B | Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All standoffs are with 2.7mm bore hole. |
| 045933 | conga-TS170/CSP-HP-T | Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All standoffs are M2.5mm thread. |
| 045934 | conga-TS170/HSP-HP-B | Standard heatspreader for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes. All standoffs are with 2.7mm bore hole. |
| 045935 | conga-TS170/HSP-HP-T | Standard heatspreader for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes. All standoffs are M2.5mm thread. |
| 067780 | DDR4-SODIMM-2666 (4GB) | DDR4 SODIMM memory module with 2666 MT/s and 4GB RAM |
| 067781 | DDR4-SODIMM-2666 (8GB) | DDR4 SODIMM memory module with 2666 MT/s and 8GB RAM |
| 067782 | DDR4-SODIMM-2666 (16GB) | DDR4 SODIMM memory module with 2666 MT/s and 16GB RAM |
| 068806 | DDR4-SODIMM-2666 (32GB) | DDR4 SODIMM memory module with 2666 MT/s and 32GB RAM |
| 067783 | DDR4-SODIMM-2666 ECC (4GB) | DDR4 ECC SODIMM memory module with 2666 MT/s and 4GB RAM |
| 067784 | DDR4-SODIMM-2666 ECC (8GB) | DDR4 ECC SODIMM memory module with 2666 MT/s and 8GB RAM |
| 067785 | DDR4-SODIMM-2666 ECC (16GB) | DDR4 ECC SODIMM memory module with 2666 MT/s and 16GB RAM |
| 068805 | DDR4-SODIMM-2666 ECC (32GB) | DDR4 ECC SODIMM memory module with 2666 MT/s and 32GB RAM |
| 065800 | conga-TEVAL | Evaluation Carrier Board for COM Express Type 6 Modules. |
| 27000001 | Design-In Training | Design-Training to develop carrier boards for Computer on Modules |
| All data is for information purposes only. The specification is subject to change without notice in advance. Any configuration other than original product specification is not guaranteed. Although all the information contained within this website is carefully checked, no guarantee of correctness is implied or expressed. Please always double-check the latest version of the product specification of the product manufacturer. Manufacturer Product Website: conga-TS370 Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with MCTX Mobile & Embedded Computers GmbH. |
| OEM System Integration Support |
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Product Variants / Acessories
congatec
conga-TS370/i7-9850HE
COM Express Type 6 Basic module with Coffeelake-H Refresh Intel® Core™ i7-9850HE, 45W hexa core processor with 2.7GHz, 9MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface. Chipset QM370. TPM 2.0.
Price on request
congatec
conga-TS370/i7-9850HL
COM Express Type 6 Basic module with Coffeelake-H Refresh Intel® Core™ i7-9850HL, 25W hexa core processor with 1.9GHz, 9MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface. Chipset QM370. TPM 2.0.
Price on request
congatec
conga-TS370/i3-9100HL
COM Express Type 6 Basic module with Coffeelake-H Refresh Intel® Core™ i3-9100HL, 25W quad core processor with 1.6GHz, 6MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface. Chipset HM370. TPM 2.0.
Price on request
congatec
conga-TS370/E-2276ME
COM Express Type 6 Basic module with Coffeelake-H Refresh Intel® Xeon® Processor E-2276ME, 45W hexa core processor with 2.8GHz, 12MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface with ECC support. Chipset CM246. TPM 2.0.
Price on request
congatec
conga-TS370/E-2276ML
COM Express Type 6 Basic module with Coffeelake-H Refresh Intel® Xeon® Processor E-2276ML, 25W hexa core processor with 2.0GHz, 12MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface with ECC support. Chipset CM246. TPM 2.0.
Price on request
congatec
conga-TS370/E-2254ME
COM Express Type 6 Basic module with Coffeelake-H Refresh Intel® Xeon® Processor E-2254ME, 45W quad core processor with 2.6GHz, 8MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface with ECC support. Chipset CM246. TPM 2.0.
Price on request
congatec
conga-TS370/E-2254ML
COM Express Type 6 Basic module with Coffeelake-H Refresh Intel® Xeon® Processor E-2254ML, 25W quad core processor with 1.7GHz, 8MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface with ECC support. Chipset CM246. TPM 2.0.
Price on request
congatec
conga-TS370/G4930E
COM Express Type 6 Basic module with Coffeelake-H Refresh Intel® Celeron® Processor G4930E, 35W dual core processor with 2.4GHz, 2MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface. Chipset HM370. TPM 2.0.
Price on request
congatec
conga-TS370/G4932E
COM Express Type 6 Basic module with Coffeelake-H Refresh Intel® Celeron® Processor G4932E, 25W dual core processor with 1.9GHz, 2MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface. Chipset HM370. TPM 2.0.
Price on request
congatec
conga-TS370/i7-8850H
COM Express Type 6 Basic module with Coffeelake-H Intel® Core™ i7-8850H hexa core processor with 2.6GHz, 9MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface. Chipset QM370. TPM 2.0.
Price on request
congatec
conga-TS370/i5-8400H
COM Express Type 6 Basic module with Coffeelake-H Intel® Core™ i5-8400H quad core processor with 2.5GHz, 8MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface. Chipset QM370. TPM 2.0.
Price on request
congatec
conga-TS370/i3-8100H
COM Express Type 6 Basic module with Coffeelake-H Intel® Core™ i3-8100H quad core processor with 3.0GHz, 6MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface. Chipset HM370. TPM 2.0.
Price on request
congatec
conga-TS370/E-2176M
COM Express Type 6 Basic module with Coffeelake-H Intel® Xeon® Processor E-2176M, hexa core processor with 2.7GHz, 12MB L2 cache, GT2 graphics and 2666MT/s dual channel DDR4 memory interface with ECC support. Chipset CM246. TPM 2.0.
Price on request
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Vielen Dank für Ihre Anfrage. Wir haben Ihre Anfrage erhalten und werden uns so schnell wie möglich mit Ihnen in Verbindung setzen.
MCTX Mobile & Embedded Computers GmbH was founded in 2010 and focuses on the development and marketing of compact, high-performance, energy-efficient, and scalable computer systems and system components for mobile and stationary professional use in both indoor and outdoor environments.
We consider ourselves a reliable and experienced partner for companies and organizations that integrate these technologies into their processes or products. Our goal is to offer our customers SOLUTIONS that fully meet the requirements of their tasks.
Our company headquarters is located in southwestern Germany, in Gottenheim near Freiburg im Breisgau, close to the borders of France and Switzerland.
Service Portfolio
Depending on the project requirements, we offer our customers a wide range of products and outsourcing services: technology consulting for selecting the processor platform, delivery of key components, and the commissioned delivery of fully integrated, custom systems.
Over the years, our team has gained valuable experience in the integration of energy-efficient computing technologies. We provide this engineering know-how to our customers in order to optimize product and development costs as well as time-to-market.
Applications
Our boards and systems are used in a variety of applications in the field, in laboratories, in factory automation, and in OEM products, such as in the validation of semiconductor chips, in Lidar systems for 3D object measurement, in autonomous vehicles, various measurement and diagnostic systems, or in mobile data collection in the agricultural and forestry sectors.
Technologies
Our systems are based on state-of-the-art technologies used in modern servers, notebooks, tablet PCs, and navigation systems. The use of modular and industrial-grade system concepts enables long-lasting and scalable systems.