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conga-TS175
Price on request
Product number:
conga-TS175
Product information "conga-TS175"
| congatec conga-TS175 - COM Express Basic Type 6 CPU Module with Intel® Kaby Lake |
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| COM Express Type 6 Basic module based on 7th Generation Intel® Core™ processor family |
| Overview |
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| Key Features | Supported CPUs |
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CPU-Product Family: Intel® Kaby Lake
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| CPU-Variants |
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| CPU | Processor Number | Cache | Total Cores | Total Threads | PCI Express Revision | Max Turbo Frequency |
|---|---|---|---|---|---|---|
| Intel® Core™ i7-7820EQ | i7-7820EQ | 8 MB | 4 | 8 | 3.0 | 3.70 GHz |
| Intel® Core™ i5-7442EQ | i5-7442EQ | 6 MB | 4 | 4 | 3.0 | 2.90 GHz |
| Intel® Core™ i5-7440EQ | i5-7440EQ | 6 MB | 4 | 4 | 3.0 | 3.60 GHz |
| Intel® Core™ i3-7102E | i3-7102E | 3 MB | 2 | 4 | 3.0 | |
| Intel® Core™ i3-7100E | i3-7100E | 3 MB | 2 | 4 | 3.0 |
| Specification |
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| Formfactor | COM Express Basic |
| CPU | Intel® Xeon® E3-1505M V6(4 x 3.0 GHz, 8MB cache, 45W)Intel® Xeon® E3-1505L V6(4 x 2.2 GHz, 8MB cache, 25W)Intel® Core™ i7-7820EQ(4 x 3.0 GHz, 8MB cache, 45W)Intel® Core™ i5-7440EQ(4 x 2.9 GHz, 6MB cache, 45W)Intel® Core™ i5-7442EQ(4 x 2.1 GHz, 6MB cache, 25W)Intel® Core™ i3-7100E(2 x 2.9 GHz, 3MB cache, 35W)Intel® Core™ i3-7102E(2 x 2.1 GHz, 3MB cache, 25W) |
| DRAM | 2 Sockets, SO-DIMM DDR4 up to 2400 MT/s and 32GByte dual channel, optionally with ECC support |
| Ethernet | Intel® i219-LM GbE LAN Controller with AMT 11.6 support |
| I/O Interfaces | 8 x PCI Express GEN 3.0 lanes4 x Serial ATA Gen 34 x USB 3.08 x USB 2.0 (XHCI)1 x PEG x16 Gen 3LPC busI²C bus (fast mode, 400 kHz, multi-master)2 x UART |
| Graphics | Intel® Gen9 HD Graphics EngineOpenCL 2.0/2.1, OpenGL 4.4/4.5 and DirectX12 (for Windows 10) support | up to three independent displays: DDI / DisplayPort 1.2 / eDP 1.3 | High performance hardware MPEG-2 decoding | WMV9 (VC-1) and H.265 (HEVC) support Blu-ray support @ 40 MBit/s | HEVC, VP9 and VDENC encoding |
| congatec Board Controller | Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | LVDS backlight control I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control |
| embedded BIOS Features | AMI AptioV® UEFI 2.x firmware8/16 MByte serial SPI firmware flash |
| Security | The conga-TS175 can be optionally equipped with a discrete ”Trusted Platform Module” (TPM 1.2 / 2.0) |
| Power Management | ACPI 4.0 with battery support |
| Operating Systems | Microsoft® Windows 10 (64bit only)Microsoft® Windows 10 IoT Enterprise (64bit only)LinuxFedora 24UbuntuSuSeRed Hat EnterpriseYocto Project v2.2Chromium 2Wind River VxWorks |
| Temperature | Operating: 0 to +60°C Storage: -20 to +70°C |
| Humidity | Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond. |
| Video Interfaces | 3x DDI / DisplayPort 1.2 with support for Multi-Stream Transport (MST) | resolutions up to 4kDual channel LVDS transmitter, Supports flat panels 2x24 Bit interface | VESA and openLDI colour mappings | resolutions up to 1920x1200 Automatic Panel Detection via EDID/EPI1 x VGA (optional) |
| Size | 95 x 125 mm (3.74" x 4.92") |
| Product Variants / Accessories |
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| 045950 | conga-TS175/i7-7820EQ | COM Express Type 6 Basic module with Intel® Core™ i7-7820EQ quad core processor with 3GHz up to 3.7GHz, 8MB Intel® Smart Cache, GT2 graphics and 2400MT/s dual channel DDR4 memory interface (Intel Kaby Lake-H). Chipset QM175 with support for Intel® Optane™ memory |
| 045951 | conga-TS175/i5-7440EQ | COM Express Type 6 Basic modul Intel® Core™ i5-7440EQ quad core processor with 2.9GHz up to 3.6GHz, 6MB Intel® Smart Cache, GT2 graphics and 2400MT/s dual channel DDR4 memory interface (Intel Kaby Lake-H). Chipset QM175 with support for Intel® Optane™ memory |
| 045952 | conga-TS175/i5-7442EQ | COM Express Type 6 Basic module with Intel® Core™ i5-7442EQ quad core processor with 2.1GHz up to 2.9GHz, 6MB Intel® Smart Cache, GT2 graphics and 2400MT/s dual channel DDR4 memory interface (Intel Kaby Lake-H). Chipset QM175 with support for Intel® Optane™ memory |
| 045953 | conga-TS175/i3-7100E | COM Express Type 6 Basic module with Intel® Core™ i3-7100E dual core processor with 2.9GHz, 3MB Intel® Smart Cache, GT2 graphics and 2400MT/s dual channel DDR4 memory interface (Intel Kaby Lake-H). Chipset HM175 with support for Intel® Optane™ memory |
| 045954 | conga-TS175/i3-7102E | COM Express Type 6 Basic module with Intel® Core™ i3-7102E dual core processor with 2.1GHz, 3MB Intel® Smart Cache, GT2 graphics and 2400MT/s dual channel DDR4 memory interface (Intel Kaby Lake-H). Chipset HM175 with support for Intel® Optane™ memory |
| 045955 | conga-TS175/E3-1505MV6 | COM Express Type 6 Basic module with Intel® Xeon® E3-1505M V6 quad core processor with 3GHz up to 4GHz, 8MB Intel® Smart Cache, GT2 graphics and 2400MT/s dual channel DDR4 memory interface (Intel Kaby Lake-H). Chipset CM238 with ECC memory support |
| 045956 | conga-TS175/E3-1505LV6 | COM Express Type 6 Basic module with Intel® Xeon® E3-1505L V6 quad core processor with 2.2GHz up to 3GHz, 8MB Intel® Smart Cache, GT2 graphics and 2400MT/s dual channel DDR4 memory interface (Intel Kaby Lake-H). Chipset CM238 with ECC memory support |
| Accessories |
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| 045934 | conga-TS170/HSP-HP-B | Standard heatspreader for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes. All standoffs are with 2.7mm bore hole. |
| 045935 | conga-TS170/HSP-HP-T | Standard heatspreader for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes. All standoffs are M2.5mm thread. |
| 045932 | conga-TS170/CSP-HP-B | Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All standoffs are with 2.7mm bore hole. |
| 045933 | conga-TS170/CSP-HP-T | Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All standoffs are M2.5mm thread. |
| 045930 | conga-TS170/CSA-HP-B | Standard active cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole. |
| 045931 | conga-TS170/CSA-HP-T | Standard active cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread. |
| 068790 | DDR4-SODIMM-2400 (4GB) | DDR4 SODIMM memory module with 2400 MT/s and 4GB RAM |
| 068791 | DDR4-SODIMM-2400 (8GB) | DDR4 SODIMM memory module with 2400 MT/s and 8GB RAM |
| 068792 | DDR4-SODIMM-2400 (16GB) | DDR4 SODIMM memory module with 2400 MT/s and 16GB RAM |
| 068795 | DDR4-SODIMM-2400 ECC (4GB) | 4 GByte ECC DDR4 SODIMM memory module | 2400 MT/s (PC4-2400) | 260 pin | supply voltage 1,2V |
| 068796 | DDR4-SODIMM-2400 ECC (8GB) | 8 GByte ECC DDR4 SODIMM memory module | 2400 MT/s (PC4-2400) | 260 pin | supply voltage 1,2V |
| 068797 | DDR4-SODIMM-2400 ECC (16GB) | 16 GByte ECC DDR4 SODIMM memory module | 2400 MT/s (PC4-2400) | 260 pin | supply voltage 1,2V |
| 065810 | conga-TEVAL2 | Evaluation carrier board for COM Express Type6 Rev. 3.0 modules. |
| 27000001 | Design-In Training | Design-Training to develop carrier boards for Computer on Modules |
| All data is for information purposes only. The specification is subject to change without notice in advance. Any configuration other than original product specification is not guaranteed. Although all the information contained within this website is carefully checked, no guarantee of correctness is implied or expressed. Please always double-check the latest version of the product specification of the product manufacturer. Manufacturer Product Website: conga-TS175 Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with MCTX Mobile & Embedded Computers GmbH. |
| OEM System Integration Support |
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Product Variants / Acessories
congatec
conga-TS175/i7-7820EQ
COM Express Type 6 Basic module with Intel® Core™ i7-7820EQ quad core processor with 3GHz up to 3.7GHz, 8MB Intel® Smart Cache, GT2 graphics and 2400MT/s dual channel DDR4 memory interface (Intel Kaby Lake-H). Chipset QM175 with support for Intel® Optane™ memory
Price on request
congatec
conga-TS175/i5-7440EQ
COM Express Type 6 Basic modul Intel® Core™ i5-7440EQ quad core processor with 2.9GHz up to 3.6GHz, 6MB Intel® Smart Cache, GT2 graphics and 2400MT/s dual channel DDR4 memory interface (Intel Kaby Lake-H). Chipset QM175 with support for Intel® Optane™ memory
Price on request
congatec
conga-TS175/i5-7442EQ
COM Express Type 6 Basic module with Intel® Core™ i5-7442EQ quad core processor with 2.1GHz up to 2.9GHz, 6MB Intel® Smart Cache, GT2 graphics and 2400MT/s dual channel DDR4 memory interface (Intel Kaby Lake-H). Chipset QM175 with support for Intel® Optane™ memory
Price on request
congatec
conga-TS175/i3-7100E
COM Express Type 6 Basic module with Intel® Core™ i3-7100E dual core processor with 2.9GHz, 3MB Intel® Smart Cache, GT2 graphics and 2400MT/s dual channel DDR4 memory interface (Intel Kaby Lake-H). Chipset HM175 with support for Intel® Optane™ memory
Price on request
congatec
conga-TS175/i3-7102E
COM Express Type 6 Basic module with Intel® Core™ i3-7102E dual core processor with 2.1GHz, 3MB Intel® Smart Cache, GT2 graphics and 2400MT/s dual channel DDR4 memory interface (Intel Kaby Lake-H). Chipset HM175 with support for Intel® Optane™ memory
Price on request
congatec
conga-TS175/E3-1505MV6
COM Express Type 6 Basic module with Intel® Xeon® E3-1505M V6 quad core processor with 3GHz up to 4GHz, 8MB Intel® Smart Cache, GT2 graphics and 2400MT/s dual channel DDR4 memory interface (Intel Kaby Lake-H). Chipset CM238 with ECC memory support
Price on request
congatec
conga-TS175/E3-1505LV6
COM Express Type 6 Basic module with Intel® Xeon® E3-1505L V6 quad core processor with 2.2GHz up to 3GHz, 8MB Intel® Smart Cache, GT2 graphics and 2400MT/s dual channel DDR4 memory interface (Intel Kaby Lake-H). Chipset CM238 with ECC memory support
Price on request
We would be happy to assist you in selecting the optimal hardware platform for your application.
If you have any questions, whether technical or commercial, about our products or services, don’t hesitate to contact us. We look forward to hearing from you.
You can reach us by phone at +49 (0)7665/9390-185 (Monday to Friday from 8:00 AM to 8:00 PM). Alternatively, you are welcome to contact us anytime via the contact form at the end of this page. If you cannot reach us by phone, please send us a brief message via the contact form – we will get back to you as soon as possible.
Please note that we offer our services exclusively to Original Equipment Manufacturers. We do not sell to private persons or resellers.
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MCTX Mobile & Embedded Computers GmbH was founded in 2010 and focuses on the development and marketing of compact, high-performance, energy-efficient, and scalable computer systems and system components for mobile and stationary professional use in both indoor and outdoor environments.
We consider ourselves a reliable and experienced partner for companies and organizations that integrate these technologies into their processes or products. Our goal is to offer our customers SOLUTIONS that fully meet the requirements of their tasks.
Our company headquarters is located in southwestern Germany, in Gottenheim near Freiburg im Breisgau, close to the borders of France and Switzerland.
Service Portfolio
Depending on the project requirements, we offer our customers a wide range of products and outsourcing services: technology consulting for selecting the processor platform, delivery of key components, and the commissioned delivery of fully integrated, custom systems.
Over the years, our team has gained valuable experience in the integration of energy-efficient computing technologies. We provide this engineering know-how to our customers in order to optimize product and development costs as well as time-to-market.
Applications
Our boards and systems are used in a variety of applications in the field, in laboratories, in factory automation, and in OEM products, such as in the validation of semiconductor chips, in Lidar systems for 3D object measurement, in autonomous vehicles, various measurement and diagnostic systems, or in mobile data collection in the agricultural and forestry sectors.
Technologies
Our systems are based on state-of-the-art technologies used in modern servers, notebooks, tablet PCs, and navigation systems. The use of modular and industrial-grade system concepts enables long-lasting and scalable systems.