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conga-TS170
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Product number:
conga-TS170
Product information "conga-TS170"
| congatec conga-TS170 - COM Express Basic Type 6 CPU Module with Intel® Skylake |
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| COM Express Type 6 Basic module based on 6th Generation Intel® Core™ processor family |
| Overview |
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| Key Features | Supported CPUs |
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CPU-Product Family: Intel® Skylake
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| CPU-Variants |
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| CPU | Processor Number | Cache | Total Cores | Total Threads | PCI Express Revision | Max Turbo Frequency |
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| Intel® Core™ i7-6822EQ | i7-6822EQ | 8 MB Intel® Smart Cache | 4 | 8 | 3.0 | 2.80 GHz |
| Intel® Core™ i7-6820EQ | i7-6820EQ | 8 MB Intel® Smart Cache | 4 | 8 | 3.0 | 3.50 GHz |
| Intel® Core™ i5-6442EQ | i5-6442EQ | 6 MB Intel® Smart Cache | 4 | 4 | 3.0 | 2.70 GHz |
| Intel® Core™ i5-6440EQ | i5-6440EQ | 6 MB Intel® Smart Cache | 4 | 4 | 3.0 | 3.40 GHz |
| Intel® Core™ i3-6102E | i3-6102E | 3 MB Intel® Smart Cache | 2 | 4 | 3.0 | |
| Intel® Core™ i3-6100E | i3-6100E | 3 MB Intel® Smart Cache | 2 | 4 | 3.0 | |
| Intel® Celeron® G3902E | G3902E | 2 MB Intel® Smart Cache | 2 | 2 | 3.0 | |
| Intel® Celeron® G3900E | G3900E | 2 MB Intel® Smart Cache | 2 | 2 | 3.0 | |
| Intel® Xeon® E3-1558L v5 | E3-1558LV5 | 8 MB | 4 | 8 | 3.0 | 3.30 GHz |
| Intel® Xeon® E3-1515M v5 | E3-1515MV5 | 8 MB Intel® Smart Cache | 4 | 8 | 3.0 | 3.70 GHz |
| Specification |
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| Formfactor | COM Express Basic |
| CPU | Intel® Xeon™ E3-1505M V5(4 x 2.8 GHz, 8MB cache, 45W)Intel® Xeon™ E3-1505L V5(4 x 2.0 GHz, 8MB cache, 25W)Intel® Xeon® E3-1578L V5(4 x 2.0 GHz, 8MB cache, 45W)Intel® Xeon® E3-1558LV5(4 x 1.9 GHz, 8MB cache, 45W)Intel® Xeon® E3-1515MV5(4 x 2.8 GHz, 8MB cache, 45W)Intel® Core™ i7-6820EQ(4 x 2.8 GHz, 8MB cache, 45W)Intel® Core™ i7-6822EQ(4 x 2.0 GHz, 8MB cache, 25W)Intel® Core™ i5-6440EQ(4 x 2.7 GHz, 6MB cache, 45W)Intel® Core™ i5-6442EQ(4 x 1.9 GHz, 6MB cache, 25W)Intel® Core™ i3-6100E(2 x 2.7 GHz, 3MB cache, 35W)Intel® Core™ i3-6102E(2 x 1.9 GHz, 3MB cache, 25W)Intel® Celeron® G3900E(2 x 2.4 GHz, 2MB cache, 35W)Intel® Celeron® G3902E(2 x 1.6 GHz, 2MB cache, 25W) |
| DRAM | 2 Sockets, SO-DIMM DDR4 up to 2133 MT/s and 32GByte dual channel |
| Ethernet | Intel® i219-LM GbE LAN Controller with AMT 11 support |
| I/O Interfaces | 8 x PCI Express GEN 3.0 lanes4 x SATA III (6Gb/s)4 x USB 3.08 x USB 2.01 x PEG x16 Gen 3LPC busI²C bus2 x UART |
| Graphics | Intel® Gen9 HD Graphics Enginewith OpenCL 2.0, OpenGL 4.3 and DirectX12 (Windows 10) support | up to three independent displays: DisplayPort 1.2 | eDP 1.3 | VGA (optional) |
| congatec Board Controller | Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | LVDS backlight control I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control |
| embedded BIOS Features | 8/16 MByte serial SPI firmware flashAMI AptioV® UEFI 2.x firmware |
| Security | The conga-TS170 can be optionally equipped with a discrete ”Trusted Platform Module” (TPM 1.2 / 2.0) |
| Power Management | ACPI 4.0 with battery support |
| Operating Systems | Microsoft® Windows® 10Microsoft® Windows® 8.1Microsoft® Windows® 7LinuxMicrosoft® Windows® embedded Standard |
| Temperature | StandardOperating: 0 to +60°C Storage: -20 to +80°C |
| Humidity | Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond. |
| Size | 95 x 125 mm (3.74" x 4.92") |
| Product Variants / Accessories |
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| 045913 | conga-TS170/E3-1578LV5 | COM Express Type 6 Basic module with Skylake-H Intel® Xeon® E3-1578L V5 quad core processor with 2.0GHz up to 3.4GHz, 8MB L2 cache, GT4 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset CM236 with ECC memory support |
| 045914 | conga-TS170/E3-1558LV5 | COM Express Type 6 Basic module with Skylake-H Intel Xeon® E3-1558L V5 quad core processor with 1.9GHz up to 3.3GHz, 8MB L2 cache, GT3e graphics and 2133MT/s dual channel DDR4 memory interface, Chipset CM236 with ECC memory support |
| 045912 | conga-TS170/E3-1515MV5 | COM Express Type 6 Basic module with Skylake-H Intel® Xeon® E3-1515M V5 quad core processor with 2.8GHz up to 3.7GHz, 8MB L2 cache, GT4 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset CM236 with ECC memory support |
| 045906 | conga-TS170/E3-1505MV5 | COM Express Type 6 Basic module with Intel® Xeon® E3-1505M V5 quad core processor with 2.8GHz up to 3.7GHz, 8MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset CM236 with ECC memory support |
| 045907 | conga-TS170/E3-1505LV5 | COM Express Type 6 Basic module with Intel® Xeon® E3-1505L V5 quad core processor with 2.0GHz up to 2.8GHz, 8MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset CM236 with ECC memory support |
| 045900 | conga-TS170/i7-6820EQ | COM Express Type 6 Basic module with Intel® Core™ i7-6820EQ quad core processor with 2.8GHz up to 3.5GHz, 8MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset QM170 |
| 045901 | conga-TS170/i7-6822EQ | COM Express Type 6 Basic module with Intel® Core™ i7-6822EQ quad core processor with 2.0GHz up to 2.8GHz, 8MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset QM170 |
| 045902 | conga-TS170/i5-6440EQ | COM Express Type 6 Basic module with Intel® Core™ i5-6440EQ quad core processor with 2.7GHz up to 3.4GHz, 6MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset QM170 |
| 045903 | conga-TS170/i5-6442EQ | COM Express Type 6 Basic module with Intel® Core™ i5-6442EQ quad core processor with 1.9GHz up to 2.7GHz, 6MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset QM170 |
| 045908 | conga-TS170/i3-6100E ECC | COM Express Type 6 Basic module with Intel® Core™ i3-6100E dual core processor with 2.7GHz, 3MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset CM236 with ECC memory support |
| 045909 | conga-TS170/i3-6102E ECC | COM Express Type 6 Basic module with Intel® Core™ i3-6102EQ dual core processor with 1.9GHz, 3MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset CM236 with ECC memory support |
| 045904 | conga-TS170/i3-6100E | COM Express Type 6 Basic module with Intel® Core™ i3-6100E dual core processor with 2.7GHz, 3MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset HM170 |
| 045905 | conga-TS170/i3-6102E | COM Express Type 6 Basic module with Intel® Core™ i3-6102EQ dual core processor with 1.9GHz, 3MB L2 cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface, Chipset HM170 |
| 045910 | conga-TS170/G3900E | COM Express Type 6 Basic module with Skylake-H Intel® Celeron® G3900E dual core processor with 2.4GHz, 2MB L2 cache, GT1 graphics and 2133MT/s dual channel DDR4 memory interface. Chipset HM170. |
| 045911 | conga-TS170/G3902E | COM Express Type 6 Basic module with Skylake-H Intel® Celeron® G3902E dual core processor with 1.6GHz, 2MB L2 cache, GT1 graphics and 2133MT/s dual channel DDR4 memory interface. Chipset HM170. |
| Accessories |
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| 045934 | conga-TS170/HSP-HP-B | Standard heatspreader for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes. All standoffs are with 2.7mm bore hole. |
| 045935 | conga-TS170/HSP-HP-T | Standard heatspreader for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes. All standoffs are M2.5mm thread. |
| 045932 | conga-TS170/CSP-HP-B | Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All standoffs are with 2.7mm bore hole. |
| 045933 | conga-TS170/CSP-HP-T | Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All standoffs are M2.5mm thread. |
| 045930 | conga-TS170/CSA-HP-B | Standard active cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole. |
| 045931 | conga-TS170/CSA-HP-T | Standard active cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread. |
| 068790 | DDR4-SODIMM-2400 (4GB) | DDR4 SODIMM memory module with 2400 MT/s and 4GB RAM |
| 068791 | DDR4-SODIMM-2400 (8GB) | DDR4 SODIMM memory module with 2400 MT/s and 8GB RAM |
| 068792 | DDR4-SODIMM-2400 (16GB) | DDR4 SODIMM memory module with 2400 MT/s and 16GB RAM |
| 068795 | DDR4-SODIMM-2400 ECC (4GB) | 4 GByte ECC DDR4 SODIMM memory module | 2400 MT/s (PC4-2400) | 260 pin | supply voltage 1,2V |
| 068796 | DDR4-SODIMM-2400 ECC (8GB) | 8 GByte ECC DDR4 SODIMM memory module | 2400 MT/s (PC4-2400) | 260 pin | supply voltage 1,2V |
| 068797 | DDR4-SODIMM-2400 ECC (16GB) | 16 GByte ECC DDR4 SODIMM memory module | 2400 MT/s (PC4-2400) | 260 pin | supply voltage 1,2V |
| 065800 | conga-TEVAL | Evaluation Carrier Board for COM Express Type 6 Modules. |
| 27000001 | Design-In Training | Design-Training to develop carrier boards for Computer on Modules |
| All data is for information purposes only. The specification is subject to change without notice in advance. Any configuration other than original product specification is not guaranteed. Although all the information contained within this website is carefully checked, no guarantee of correctness is implied or expressed. Please always double-check the latest version of the product specification of the product manufacturer. Manufacturer Product Website: conga-TS170 Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with MCTX Mobile & Embedded Computers GmbH. |
| OEM System Integration Support |
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We would be happy to assist you in selecting the optimal hardware platform for your application.
If you have any questions, whether technical or commercial, about our products or services, don’t hesitate to contact us. We look forward to hearing from you.
You can reach us by phone at +49 (0)7665/9390-185 (Monday to Friday from 8:00 AM to 8:00 PM). Alternatively, you are welcome to contact us anytime via the contact form at the end of this page. If you cannot reach us by phone, please send us a brief message via the contact form – we will get back to you as soon as possible.
Please note that we offer our services exclusively to Original Equipment Manufacturers. We do not sell to private persons or resellers.
Contact Form
Vielen Dank für Ihre Anfrage. Wir haben Ihre Anfrage erhalten und werden uns so schnell wie möglich mit Ihnen in Verbindung setzen.
MCTX Mobile & Embedded Computers GmbH was founded in 2010 and focuses on the development and marketing of compact, high-performance, energy-efficient, and scalable computer systems and system components for mobile and stationary professional use in both indoor and outdoor environments.
We consider ourselves a reliable and experienced partner for companies and organizations that integrate these technologies into their processes or products. Our goal is to offer our customers SOLUTIONS that fully meet the requirements of their tasks.
Our company headquarters is located in southwestern Germany, in Gottenheim near Freiburg im Breisgau, close to the borders of France and Switzerland.
Service Portfolio
Depending on the project requirements, we offer our customers a wide range of products and outsourcing services: technology consulting for selecting the processor platform, delivery of key components, and the commissioned delivery of fully integrated, custom systems.
Over the years, our team has gained valuable experience in the integration of energy-efficient computing technologies. We provide this engineering know-how to our customers in order to optimize product and development costs as well as time-to-market.
Applications
Our boards and systems are used in a variety of applications in the field, in laboratories, in factory automation, and in OEM products, such as in the validation of semiconductor chips, in Lidar systems for 3D object measurement, in autonomous vehicles, various measurement and diagnostic systems, or in mobile data collection in the agricultural and forestry sectors.
Technologies
Our systems are based on state-of-the-art technologies used in modern servers, notebooks, tablet PCs, and navigation systems. The use of modular and industrial-grade system concepts enables long-lasting and scalable systems.