Module Store - Building Blocks for Developers of Embedded Computing Systems
conga-TCV2
Price on request
| congatec conga-TCV2 - COM Express Compact Type 6 CPU Module |
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| COM Express Type 6 Compact module based on AMD Embedded Ryzen V2000 embedded processor series |
| Overview |
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| Key Features |
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| Specification |
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| Formfactor | COM Express Compact |
| CPU | AMD Ryzen Embedded V2516(6 x 2.1 GHz, 3MB L2 cache, 10W)AMD Ryzen Embedded V2546(6 x 3 GHz, 3MB L2 cache, 35W)AMD Ryzen Embedded V2718(8 x 1.7 GHz, 4MB L2 cache, 10W)AMD Ryzen Embedded V2748(8 x 2.9 GHz, 4MB L2 cache, 35W) |
| DRAM | Up to 2 SO-DIMM sockets for DDR4 memory modules up to 32 GByte each (64 GByte total) with 3200 MT/s and ECC support |
| Ethernet | 1 x Gigabit Ethernet via Intel® i226 |
| I/O Interfaces | 5 x PCIe Gen3 (8 lanes)PEG support x84 x USB 3.1 Gen28/4x USB 2.02 x SATA III (6Gb/s)2 x UART8 x GPIOsLPC bus |
| Graphics | Integrated Radeon™ graphics engine with up to 7 Compute Units | Supporting 4 independent display units (4x 4K) | DirectX 12 support | VCN2.2 (H.264/AVC HW 8b | H.265/HEVC HW 8/10b | VP9 HW 8/10b) | DP 1.4 |
| embedded BIOS Features | AMI Aptio® UEFI firmware16 Mbyte serial SPI with congatec Embedded BIOS featureOEM LogoOEM CMOS DefaultsLCD ControlDisplay Auto DetectionBacklight ControlFlash Update |
| Security | Trusted Platform Module (TPM 2.0) | AMD Secure Processor | AMD Memory Guard |
| Power Management | ACPI 5.0 with battery support |
| Operating Systems | Microsoft® Windows® 10Microsoft® Windows 10 IoT EnterpriseUbuntu Linux LTS |
| Hypervisor | RTS Real-Time Hypervisor |
| Temperature | Commercial: Operating Temperature: 0 to +60°C | Storage Temperature: -20 to +80°C |
| Humidity | Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond. |
| Video Interfaces | 3 x DP/DP++1 x LVDS up to FullHD 1920x1200@60HzeDP (optional) |
| Size | 95 x 95 mm (3,74" x 3,74") |
| Product Variants / Accessories |
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| 050500 | conga-TCV2/V2748 | COM Express Type 6 Compact module based on AMD Ryzen™ Embedded V2748 8-core processor with 2.9GHz up to 4.25GHz boost freq., 4MB L2 cache, Radeon™ Vega Graphics with 7 CU and dual channel DDR4 3200 MT/s memory interface with ECC support. Commercial temperature range 0 to +60°C. |
| 050501 | conga-TCV2/V2546 | COM Express Type 6 Compact module based on AMD Ryzen™ Embedded V2546 6-core processor with 3.0GHz up to 3.95GHz boost freq., 3MB L2 cache, Radeon™ Vega Graphics with 6 CU and dual channel DDR4 3200 MT/s memory interface with ECC support. Commercial temperature range 0 to +60°C. |
| 050502 | conga-TCV2/V2718 | COM Express Type 6 Compact module based on AMD Ryzen™ Embedded V2718 8-core processor with 1.7GHz up to 4.15GHz boost freq., 4MB L2 cache, Radeon™ Vega Graphics with 7 CU and dual channel DDR4 3200 MT/s memory interface with ECC support. Commercial temperature range 0 to +60°C. |
| 050503 | conga-TCV2/V2516 | COM Express Type 6 Compact module based on AMD Ryzen™ Embedded V2516 6-core processor with 2.1GHz up to 3.95GHz boost freq., 3MB L2 cache, Radeon™ Vega Graphics with 6 CU and dual channel DDR4 3200 MT/s memory interface with ECC support. Commercial temperature range 0 to +60°C. |
| Accessories |
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| 050550 | conga-TCV2/CSA-HP-B | Standard active cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole. |
| 050551 | conga-TCV2/CSA-HP-T | Standard active cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread. |
| 050552 | conga-TCV2/CSP-HP-B | Standard passive cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are with 2.7mm bore hole. |
| 050553 | conga-TCV2/CSP-HP-T | Standard passive cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are M2.5mm thread. |
| 050554 | conga-TCV2/HSP-HP-B | Standard heatspreader for high performance COM Express module conga-TCV2 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole. |
| 050555 | conga-TCV2/HSP-HP-T | Standard heatspreader for high performance COM Express module conga-TCV2 with integrated heat pipes, 11mm overall heat sink height. All standoffs are M2.5mm thread. |
| 068793 | DDR4-SODIMM-3200 (4GB) | DDR4 SODIMM memory module with 3200 MT/s and 4GB RAM |
| 068794 | DDR4-SODIMM-3200 (8GB) | DDR4 SODIMM memory module with 3200 MT/s and 8GB RAM |
| 068798 | DDR4-SODIMM-3200 (16GB) | DDR4 SODIMM memory module with 3200 MT/s and 16GB RAM |
| 068736 | DDR4-SODIMM-3200 ECC (4GB) | DDR4 ECC SODIMM memory module with 3200 MT/s and 4GB RAM |
| 068737 | DDR4-SODIMM-3200 ECC (8GB) | DDR4 ECC SODIMM memory module with 3200 MT/s and 8GB RAM |
| 068738 | DDR4-SODIMM-3200 ECC (16GB) | DDR4 ECC SODIMM memory module with 3200 MT/s and 16GB RAM |
| 065810 | conga-TEVAL2 | Evaluation carrier board for COM Express Type6 Rev. 3.0 modules. |
| 27000001 | Design-In Training | Design-Training to develop carrier boards for Computer on Modules |
| All data is for information purposes only. The specification is subject to change without notice in advance. Any configuration other than original product specification is not guaranteed. Although all the information contained within this website is carefully checked, no guarantee of correctness is implied or expressed. Please always double-check the latest version of the product specification of the product manufacturer. Manufacturer Product Website: conga-TCV2 Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with MCTX Mobile & Embedded Computers GmbH. |
| OEM System Integration Support |
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- Product Variants -
We would be happy to assist you in selecting the optimal hardware platform for your application.
If you have any questions, whether technical or commercial, about our products or services, don’t hesitate to contact us. We look forward to hearing from you.
You can reach us by phone at +49 (0)7665/9390-185 (Monday to Friday from 8:00 AM to 8:00 PM). Alternatively, you are welcome to contact us anytime via the contact form at the end of this page. If you cannot reach us by phone, please send us a brief message via the contact form – we will get back to you as soon as possible.
Please note that we offer our services exclusively to Original Equipment Manufacturers. We do not sell to private persons or resellers.MCTX Mobile & Embedded Computers GmbH was founded in 2010 and focuses on the development and marketing of compact, high-performance, energy-efficient, and scalable computer systems and system components for mobile and stationary professional use in both indoor and outdoor environments.
We consider ourselves a reliable and experienced partner for companies and organizations that integrate these technologies into their processes or products. Our goal is to offer our customers SOLUTIONS that fully meet the requirements of their tasks.
Our company headquarters is located in southwestern Germany, in Gottenheim near Freiburg im Breisgau, close to the borders of France and Switzerland.
Service Portfolio
Depending on the project requirements, we offer our customers a wide range of products and outsourcing services: technology consulting for selecting the processor platform, delivery of key components, and the commissioned delivery of fully integrated, custom systems.
Over the years, our team has gained valuable experience in the integration of energy-efficient computing technologies. We provide this engineering know-how to our customers in order to optimize product and development costs as well as time-to-market.
Applications
Our boards and systems are used in a variety of applications in the field, in laboratories, in factory automation, and in OEM products, such as in the validation of semiconductor chips, in Lidar systems for 3D object measurement, in autonomous vehicles, various measurement and diagnostic systems, or in mobile data collection in the agricultural and forestry sectors.
Technologies
Our systems are based on state-of-the-art technologies used in modern servers, notebooks, tablet PCs, and navigation systems. The use of modular and industrial-grade system concepts enables long-lasting and scalable systems.