Module Store - Building Blocks for Developers of Embedded Computing Systems
conga-TCR8
Price on request
Product number:
conga-TCR8
Product information "conga-TCR8"
| congatec conga-TCR8 - COM Express Compact Type 6 CPU Module |
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| COM Express Type 6 Compact module based on AMD Ryzen Embedded 8000 processor series |
| Overview |
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| Key Features |
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| Specification |
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| Formfactor | COM Express Compact |
| CPU | AMD Ryzen™ Embedded 8640U(6 cores 3.2GHz up to 4.9GHz, 22MB cache)AMD Ryzen™ Embedded 8645HS(6 cores 4.3GHz up to 5GHz, 22MB cache)AMD Ryzen™ Embedded 8840U(8 cores 3.3GHz up to 5.1GHz, 24MB cache)AMD Ryzen™ Embedded 8845HS(8 cores 3.8GHz up to 5.1GHz, 24MB cache) |
| DRAM | 2 SO-DIMM sockets for DDR5 memory modules up to 64 GB each (max. 128 GB RAM system capacity) |up to 5600 MT/s | ECC (option) |
| Ethernet | 2.5 GbE via Intel® i226 Ethernet controller series |
| I/O Interfaces | 4 x USB 3.2 Gen24 x USB 2.02 x SATA 6Gb/s (if NVMe™ SSD option is not used)6 x PCIe Gen4 (8 lanes)PEG x8 Gen41 x I²C bus1 x GPSPI2 x UART8 x GPIO1 x SM-Bus1 x LPC |
| Mass storage | NVMe™ SSD up to 1 TB capacity (option instead of SATA ports) |
| Graphics | Integrated AMD Radeon™ RDNA™ 3 Graphics with up to 6x WGPs (12 CUs) |
| NPU/AI Acceleration | Integrated XDNA™ NPU with up to 16 TOPs | Up to 39 TOPs total SoC performance |
| congatec Board Controller | Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirection |
| embedded BIOS Features | AMI Aptio® UEFI firmware32 Mbyte serial SPI with congatec Embedded BIOS featureOEM LogoOEM CMOS DefaultsLCD ControlDisplay Auto DetectionBacklight ControlFlash Update |
| Security | Trusted Platform Module (TPM 2.0) | AMD Secure Processor | AMD Memory Guard |
| Power Management | ACPI 6.0 with battery support |
| Operating Systems | Microsoft® Windows 11Microsoft® Windows 11 IoT EnterpriseMicrosoft® Windows® 10Microsoft® Windows 10 IoT EnterpriseLinux |
| Hypervisor | RTS Real-Time Hypervisor |
| Temperature | Embedded Temp.: Operating 0°C to 60°C | Storage -20°C to 80°C |
| Humidity | Operating: 10 to 85% r. H. non cond. / Storage 5 to 85% r. H. non cond. |
| Video Interfaces | Up to 3x DDILVDS or eDP4 x independent displays |
| Size | 95 x 95 mm (3,74" x 3,74") |
| Product Variants / Accessories |
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| 051700 | conga-TCR8/8845HS | COM Express Type 6 Compact module based on AMD Ryzen™ Embedded 8845HS with 8 cores | 3.8GHz up to 5.1GHz (boost) | Integrated XDNA™ NPU | Integrated RDNA™ 3 Graphics | 24MB cache | Dual channel SODIMM DDR5 5600 MT/s memory interface | Commercial temperature range 0 to +60°C. |
| 051701 | conga-TCR8/8840U | COM Express Type 6 Compact module based on AMD Ryzen™ Embedded 8840U with 8 cores | 3.3GHz up to 5.1GHz (boost) | Integrated XDNA™ NPU | Integrated RDNA™ 3 Graphics | 24MB cache | Dual channel SODIMM DDR5 5600 MT/s memory interface | Commercial temperature range 0 to +60°C. |
| 051702 | conga-TCR8/8645HS | COM Express Type 6 Compact module based on AMD Ryzen™ Embedded 8645HS with 6 cores | 4.3GHz up to 5.0GHz (boost) | Integrated XDNA™ NPU | Integrated RDNA™ 3 Graphics | 22MB cache | Dual channel SODIMM DDR5 5600 MT/s memory interface | Commercial temperature range 0 to +60°C. |
| 051703 | conga-TCR8/8640U | COM Express Type 6 Compact module based on AMD Ryzen™ Embedded 8640U with 6 cores | 3.2GHz up to 4.9GHz (boost) | Integrated XDNA™ NPU | Integrated RDNA™ 3 Graphics | 22MB cache | Dual channel SODIMM DDR5 5600 MT/s memory interface | Commercial temperature range 0 to +60°C. |
| Accessories |
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| 051750 | conga-TCR8/CSA-HP-B | Standard active cooling solution for high performance COM Express module conga-TCR8 with integrated heat pipes and 12V fan. All standoffs are with 2.7mm bore hole. |
| 051751 | conga-TCR8/CSA-HP-T | Standard active cooling solution for high performance COM Express module conga-TCR8 with integrated heat pipes and 12V fan. All standoffs are M2.5mm threaded. |
| 051752 | conga-TCR8/CSP-HP-B | Standard passive cooling solution for high performance COM Express module conga-TCR8 with integrated heat pipes. All standoffs are with 2.7mm bore hole. |
| 051753 | conga-TCR8/CSP-HP-T | Standard passive cooling solution for high performance COM Express module conga-TCR8 with integrated heat pipes. All standoffs are M2.5mm threaded. |
| 051754 | conga-TCR8/HSP-HP-B | Standard heatspreader for high performance COM Express module conga-TCR8 with integrated heat pipes. All standoffs are with 2.7mm bore hole. |
| 051755 | conga-TCR8/HSP-HP-T | Standard heatspreader for high performance COM Express module conga-TCR8 with integrated heat pipes. All standoffs are M2.5mm threaded. |
| 065820 | conga-TEVAL3/COMe3.1 | congatec COM Express Type 6 evaluation carrier compliant to COM Express 3.1 specification. Industrial temperature range. From -40°C to 85°C |
| 068930 | DDR5-SODIMM-5600 (8GB) | DDR5 SODIMM memory module with up to 5600 MT/s and 8GB RAM, commercial temp 0°C to +60°C |
| 068931 | DDR5-SODIMM-5600 (16GB) | DDR5 SODIMM memory module with up to 5600 MT/s and 16GB RAM, commercial temp 0°C to +60°C |
| 068932 | DDR5-SODIMM-5600 (32GB) | DDR5 SODIMM memory module with up to 5600 MT/s and 32GB RAM, commercial temp 0°C to +60°C |
| 068933 | DDR5-SODIMM-5600 (48GB) | DDR5 SODIMM memory module with up to 5600 MT/s and 48GB RAM, commercial temp 0°C to +60°C |
| 68940 | DDR5-SODIMM-5600 ECC (8GB) | DDR5 SODIMM memory module with up to 5600 MT/s and 8GB RAM with ECC, commercial temp 0°C to +60°C |
| 68941 | DDR5-SODIMM-5600 ECC (16GB) | DDR5 SODIMM memory module with up to 5600 MT/s and 16GB RAM with ECC, commercial temp 0°C to +60°C |
| 68942 | DDR5-SODIMM-5600 ECC (32GB) | DDR5 SODIMM memory module with up to 5600 MT/s and 32GB RAM with ECC, commercial temp 0°C to +60°C |
| 68943 | DDR5-SODIMM-5600 ECC (48GB) | DDR5 SODIMM memory module with up to 5600 MT/s and 48GB RAM with ECC, commercial temp 0°C to +60°C |
| 27000001 | Design-In Training | Design-Training to develop carrier boards for Computer on Modules |
| All data is for information purposes only. The specification is subject to change without notice in advance. Any configuration other than original product specification is not guaranteed. Although all the information contained within this website is carefully checked, no guarantee of correctness is implied or expressed. Please always double-check the latest version of the product specification of the product manufacturer. Manufacturer Product Website: conga-TCR8 Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with MCTX Mobile & Embedded Computers GmbH. |
| OEM System Integration Support |
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- Product Variants -
congatec
conga-TCR8/8845HS
COM Express Type 6 Compact module based on AMD Ryzen™ Embedded 8845HS with 8 cores | 3.8GHz up to 5.1GHz (boost) | Integrated XDNA™ NPU | Integrated RDNA™ 3 Graphics | 24MB cache | Dual channel SODIMM DDR5 5600 MT/s memory interface | Commercial temperature range 0 to +60°C.
Price on request
congatec
conga-TCR8/8840U
COM Express Type 6 Compact module based on AMD Ryzen™ Embedded 8840U with 8 cores | 3.3GHz up to 5.1GHz (boost) | Integrated XDNA™ NPU | Integrated RDNA™ 3 Graphics | 24MB cache | Dual channel SODIMM DDR5 5600 MT/s memory interface | Commercial temperature range 0 to +60°C.
Price on request
congatec
conga-TCR8/8645HS
COM Express Type 6 Compact module based on AMD Ryzen™ Embedded 8645HS with 6 cores | 4.3GHz up to 5.0GHz (boost) | Integrated XDNA™ NPU | Integrated RDNA™ 3 Graphics | 22MB cache | Dual channel SODIMM DDR5 5600 MT/s memory interface | Commercial temperature range 0 to +60°C.
Price on request
congatec
conga-TCR8/8640U
COM Express Type 6 Compact module based on AMD Ryzen™ Embedded 8640U with 6 cores | 3.2GHz up to 4.9GHz (boost) | Integrated XDNA™ NPU | Integrated RDNA™ 3 Graphics | 22MB cache | Dual channel SODIMM DDR5 5600 MT/s memory interface | Commercial temperature range 0 to +60°C.
Price on request
- congatec Product Accessories -
congatec
conga-TEVAL3/COMe3.1
congatec conga-TEVAL3/COMe3.1 - Evaluation Board COM Express Type 6 Rev. 3.1 Evaluation Carrier Board
.product-menu-page {
font-family: 'Ubuntu', sans-serif;
color: #3f4c58;
}
.text_bold {
font-weight: bolder;
}
.product-menu-page {
display: none;
}
.product-menu-page:target {
display: block;
}
.head_sec {
background-color: #e9e9f0;
color: #4B70B2;}
.col_a {
background-color: #798490;
}
.head_subsec {color: CornflowerBlue;
padding-top: 10px;padding-left: 10px;
padding-right: 25px;
vertical-align: bottom;
}
.chead {
border: 1px solid Lavender;
font-size: 90%;
font-weight: bolder;}
.ckey {
width: 25%;white-space: nowrap;text-align: left;font-size: 90%;
font-weight: bolder;
border: 1px solid Lavender;word-break: break-word;
}
.copt {
width: 25%;text-align: left;font-size: 90%;
font-weight: bolder;
border: 1px solid Lavender;word-break: break-word;
}
.cval {
width: auto;text-align: left;
border: 1px solid Lavender;
word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;}
.rowspecsim {
font-size: 110%;
white-space: nowrap;text-align: left;
}
.column_1 {
width: 250px;white-space: nowrap;text-align: left;
}
.column_2 {
width: 250px;white-space: nowrap;text-align: left;
}
table {
margin-top: 10px;
width: 100%;
border-collapse: collapse;
table-layout: fixed;
}
th, td {
border: 1px solid White;text-align: left;
word-break: break-word;
font-size: 100%;
line-height: 1.5;
padding-top: 5px;
padding-left: 10px;
padding-bottom: 5px;
}
th {
font-size: 90%;
padding-left: 25px;
}
td {
word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;
}
#prod_kf {
font-size: 100%;width: 100%;}
#prod_spec {
font-size: 100%;word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;
}
#prod_spec_embed {
word-break: break-word;
font-size: 90%;
padding-top: 10px;width: 100%;}
#prod_disc {
font-size: 90%;
width: 100%;}
#prod_cpo {font-size: 90%;
width: 100%;
word-break: break-word;
}
#prod_var {
word-break: break-word;
font-size: 90%;
padding-top: 10px;
padding-left: 25px;
padding-right: 25px;
vertical-align: top;
}
congatec conga-TEVAL3/COMe3.1 - Evaluation BoardCOM Express Type 6 Rev. 3.1 Evaluation Carrier Board
Beispiel Menü
/* CSS-Variable für die Breite der schwarzen Buttons */
:root {
--black-button-width: 120px;
}
/* Menüleiste: Flexbox für gleichmäßig verteilte Menüeinträge */
ul.menu {
list-style-type: none;
margin: 0;
padding: 0;
background-color: white;
overflow: hidden;
font-family: 'Ubuntu', sans-serif;
display: flex; /* Flexbox */
width: 100%;
}
/* Menüeinträge */
li.menu-item {
padding: 0;
text-align: center;
border-right: 5px solid white;
display: block;
text-align: center;
text-decoration: none;
border-radius: 3px;
transition: background-color 0.3s, color 0.3s; /* Smooth transition for hover effect */
}
li.menu-item a {
display: block;
color: white;
text-align: center;
text-decoration: none;
padding: 10px 20px;
font-size: 16px;
font-weight: 500;
border-radius: 3px;
transition: background-color 0.3s, color 0.3s; /* Smooth transition for hover effect */
}
/* Stretch-Element */
.stretch {
flex-grow: 1;
height: 30px;
}
li.menu-item a:hover {
color: black !important; /* Ensures text color change on hover */
background-color: #f7c13d !important; /* Ensures background color change on hover */
}
/* Aktiver Menüeintrag: Hintergrundfarbe und Schriftgewicht bei Aktivierung */
li.menu-item a:active {
color: #2b3136; /* Textfarbe beim aktiven Zustand */
font-weight: bolder; /* Fettere Schrift */
background-color: CornflowerBlue; /* Hintergrundfarbe beim aktiven Zustand */
}
Datasheet
User Manual
System Integration
Get Expert Support Now: +49 (0)7665 9390 185
OverviewKey FeaturesEvaluation Carrier for COMe Type 6 modulesSupports COMe Compact and Basic modules using connector Pinout Type 6Compliant to latest COMe Spec Rev. 3.1Accessories065820conga-TEVAL3/COMe3.1congatec COM Express Type 6 evaluation carrier compliant to COM Express 3.1 specification. Industrial temperature range. From -40°C to 85°CAll data is for information purposes only. The specification is subject to change without notice in advance. Any configuration other than original product specification is not guaranteed. Although all the information contained within this website is carefully checked, no guarantee of correctness is implied or expressed.Please always double-check the latest version of the product specification of the product manufacturer. Manufacturer Product Website: conga-TEVAL3/COMe3.1Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with MCTX Mobile & Embedded Computers GmbH.OEM System Integration Support
All documents found on this page are subject to change without notification. Always ensure that you work with the latest version.Datasheet
Price on request
We would be happy to assist you in selecting the optimal hardware platform for your application.
If you have any questions, whether technical or commercial, about our products or services, don’t hesitate to contact us. We look forward to hearing from you.
You can reach us by phone at +49 (0)7665/9390-185 (Monday to Friday from 8:00 AM to 8:00 PM). Alternatively, you are welcome to contact us anytime via the contact form at the end of this page. If you cannot reach us by phone, please send us a brief message via the contact form – we will get back to you as soon as possible.
Please note that we offer our services exclusively to Original Equipment Manufacturers. We do not sell to private persons or resellers.
Contact Form
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MCTX Mobile & Embedded Computers GmbH was founded in 2010 and focuses on the development and marketing of compact, high-performance, energy-efficient, and scalable computer systems and system components for mobile and stationary professional use in both indoor and outdoor environments.
We consider ourselves a reliable and experienced partner for companies and organizations that integrate these technologies into their processes or products. Our goal is to offer our customers SOLUTIONS that fully meet the requirements of their tasks.
Our company headquarters is located in southwestern Germany, in Gottenheim near Freiburg im Breisgau, close to the borders of France and Switzerland.
Service Portfolio
Depending on the project requirements, we offer our customers a wide range of products and outsourcing services: technology consulting for selecting the processor platform, delivery of key components, and the commissioned delivery of fully integrated, custom systems.
Over the years, our team has gained valuable experience in the integration of energy-efficient computing technologies. We provide this engineering know-how to our customers in order to optimize product and development costs as well as time-to-market.
Applications
Our boards and systems are used in a variety of applications in the field, in laboratories, in factory automation, and in OEM products, such as in the validation of semiconductor chips, in Lidar systems for 3D object measurement, in autonomous vehicles, various measurement and diagnostic systems, or in mobile data collection in the agricultural and forestry sectors.
Technologies
Our systems are based on state-of-the-art technologies used in modern servers, notebooks, tablet PCs, and navigation systems. The use of modular and industrial-grade system concepts enables long-lasting and scalable systems.