Module Store - Building Blocks for Developers of Embedded Computing Systems
conga-TC570r
Price on request
| congatec conga-TC570r - COM Express Compact Type 6 CPU Module with Intel® Tiger Lake |
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| COM Express Type 6 Compact module based on 11th Gen Intel® Core™ processor family (code name "Tiger Lake") and soldered down memory |
| Overview |
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| Key Features | Supported CPUs |
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CPU-Product Family: Intel® Tiger Lake
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| CPU-Variants |
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| CPU | Intel® Core™ i7-1185GRE | Intel® Core™ i5-1145GRE | Intel® Core™ i3-1115GRE | Intel® Celeron® 6305E |
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| Processor Number | i7-1185GRE | i5-1145GRE | i3-1115GRE | 6305E |
| Cache | 12 MB Intel® Smart Cache | 8 MB Intel® Smart Cache | 6 MB Intel® Smart Cache | 4 MB Intel® Smart Cache |
| Total Cores | 4 | 4 | 2 | 2 |
| Total Threads | 8 | 8 | 4 | 2 |
| Max Turbo Frequency | 4.40 GHz | 4.10 GHz | 3.90 GHz |
| Specification |
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| Formfactor | COM Express Compact |
| CPU | Intel® Celeron® 6305E(2 x 1.8 GHz, 4MB cache, 15W)Intel® Core™ i7-1185GRE(4 x 1.8 GHz, 12 MB cache, 15W)Intel® Core™ i5-1145GRE(4 x 1.5 GHz, 8 MB cache, 15W)Intel® Core™ i3-1115GRE(2 x 2.2 GHz, 6 MB cache, 15W) |
| DRAM | Up to 32 GByte LPDDR4X 4266MT/s SDRAM | memory down | dual channel IBECC |
| Ethernet | 1 x 2.5 GbE with TSN support via Intel® i226 Ethernet controller series |
| I/O Interfaces | 8 x PCI Express GEN 3.0 lanesPEG support x4 (PCIe Gen4)4 x USB 3.1 Gen28 x USB 2.02 x SATA III (6Gb/s)SPI2 x UART8 x GPIOs |
| Graphics | Integrated Xe (Gen 12) graphics engine with up to 96 EU (Execution Units) | Supporting 4 independent display units (4x 4k/2x 8K) | Enhanced media (AV1/12b) with up to 2 Vdbox | Next Gen IPU6 with DPHY2.1 | DP 1.4 |
| congatec Board Controller | Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirection |
| Security | Trusted Platform Module (TPM 2.0) |
| Power Management | ACPI 5.0 with battery support |
| Hypervisor | RTS Real-Time Hypervisor |
| Temperature | Industrial: Operating: -40 to +85°C | Storage: -40 to +85°CCommercial: Operating: 0 to +60°C | Storage: -40 to +85°C |
| Humidity | Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond. |
| Video Interfaces | 3x DDI/DP++ | eDP/LVDS | VGA (optional) |
| Size | 95 x 95 mm (3,74" x 3,74") |
| Product Variants / Accessories |
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| 050330 | conga-TC570r/i7-1185GRE-32G | COM Express Type 6 Compact module based on Intel® Core™ i7-1185GRE 4-core processor with 1.8GHz up to 4.4GHz turbo boost, 12MB cache, Intel® Iris® Xe Graphics with 96EU and 32 GBytedual channel LPDDR4X 4266 MT/s memory down (Intel Tiger Lake). Industrial temperature range. |
| 050331 | conga-TC570r/i5-1145GRE-16G | COM Express Type 6 Compact module based on Intel® Core™ i5-1145GRE 4-core processor with 1.5GHz up to 4.1GHz turbo boost, 8MB cache, Intel® Iris® Xe Graphics with 80EU and 16GByte dual channel LPDDR4X 4266 MT/s memory down (Intel Tiger Lake). Industrial temperature range. |
| 050332 | conga-TC570r/i3-1115GRE-8G | COM Express Type 6 Compact module based on Intel® Core™ i3-1115G4E 2-core processor with 2.2GHz up to 3.9GHz turbo boost, 6MB cache, Intel® UHD Graphics with 48EU and 8 GBytedual channel LPDDR4X 4266 MT/s memory down (Intel Tiger Lake). Industrial temperature range. |
| 050320 | conga-TC570r/6305E-4G | COM Express Type 6 Compact module based on Intel® Celeron® 6305E2-core processor with 1.8GHz, 4MB cache, Intel® UHD Graphics with 48EU and 4 GBytedual channel LPDDR4X 4266 MT/s memory down (Intel Tiger Lake). Commercial temperature range. |
| Accessories |
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| 050350 | conga-TC570/CSA-HP-B | Standard active cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole. |
| 050351 | conga-TC570/CSA-HP-T | Standard active cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread. |
| 050352 | conga-TC570/CSP-HP-B | Standard passive cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are with 2.7mm bore hole. |
| 050353 | conga-TC570/CSP-HP-T | Standard passive cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are M2.5mm thread. |
| 050354 | conga-TC570/HSP-HP-B | Standard heatspreader for high performance COM Express module conga-TC570 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole. |
| 050355 | conga-TC570/HSP-HP-T | Standard heatspreader for high performance COM Express module conga-TC570 with integrated heat pipes, 11mm overall heat sink height. All standoffs are M2.5mm thread. |
| 068793 | DDR4-SODIMM-3200 (4GB) | DDR4 SODIMM memory module with 3200 MT/s and 4GB RAM |
| 068794 | DDR4-SODIMM-3200 (8GB) | DDR4 SODIMM memory module with 3200 MT/s and 8GB RAM |
| 068798 | DDR4-SODIMM-3200 (16GB) | DDR4 SODIMM memory module with 3200 MT/s and 16GB RAM |
| 068825 | DDR4-SODIMM-3200 (4GB) / i-temp | DDR4 SODIMM memory module with up to 3200 MT/s and 4GB RAM, industrial temp -40°C to +85°C |
| 068827 | DDR4-SODIMM-3200 (16GB) / i-temp | DDR4 SODIMM memory module with up to 3200 MT/s and 16GB RAM, industrial temp -40°C to +85°C |
| 065810 | conga-TEVAL2 | Evaluation carrier board for COM Express Type6 Rev. 3.0 modules. |
| 27000001 | Design-In Training | Design-Training to develop carrier boards for Computer on Modules |
| All data is for information purposes only. The specification is subject to change without notice in advance. Any configuration other than original product specification is not guaranteed. Although all the information contained within this website is carefully checked, no guarantee of correctness is implied or expressed. Please always double-check the latest version of the product specification of the product manufacturer. Manufacturer Product Website: conga-TC570r Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with MCTX Mobile & Embedded Computers GmbH. |
| OEM System Integration Support |
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- Product Variants -
We would be happy to assist you in selecting the optimal hardware platform for your application.
If you have any questions, whether technical or commercial, about our products or services, don’t hesitate to contact us. We look forward to hearing from you.
You can reach us by phone at +49 (0)7665/9390-185 (Monday to Friday from 8:00 AM to 8:00 PM). Alternatively, you are welcome to contact us anytime via the contact form at the end of this page. If you cannot reach us by phone, please send us a brief message via the contact form – we will get back to you as soon as possible.
Please note that we offer our services exclusively to Original Equipment Manufacturers. We do not sell to private persons or resellers.MCTX Mobile & Embedded Computers GmbH was founded in 2010 and focuses on the development and marketing of compact, high-performance, energy-efficient, and scalable computer systems and system components for mobile and stationary professional use in both indoor and outdoor environments.
We consider ourselves a reliable and experienced partner for companies and organizations that integrate these technologies into their processes or products. Our goal is to offer our customers SOLUTIONS that fully meet the requirements of their tasks.
Our company headquarters is located in southwestern Germany, in Gottenheim near Freiburg im Breisgau, close to the borders of France and Switzerland.
Service Portfolio
Depending on the project requirements, we offer our customers a wide range of products and outsourcing services: technology consulting for selecting the processor platform, delivery of key components, and the commissioned delivery of fully integrated, custom systems.
Over the years, our team has gained valuable experience in the integration of energy-efficient computing technologies. We provide this engineering know-how to our customers in order to optimize product and development costs as well as time-to-market.
Applications
Our boards and systems are used in a variety of applications in the field, in laboratories, in factory automation, and in OEM products, such as in the validation of semiconductor chips, in Lidar systems for 3D object measurement, in autonomous vehicles, various measurement and diagnostic systems, or in mobile data collection in the agricultural and forestry sectors.
Technologies
Our systems are based on state-of-the-art technologies used in modern servers, notebooks, tablet PCs, and navigation systems. The use of modular and industrial-grade system concepts enables long-lasting and scalable systems.