Module Store - Building Blocks for Developers of Embedded Computing Systems
conga-SMX95
Price on request
| congatec conga-SMX95 - SMARC CPU Module |
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| SMARC 2.1 module based on NXP i.MX 95 processor series with up to 6-core ARM Cortex-A55 & NXP eIQ® Neutron NPU |
| Overview |
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| Key Features |
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| Specification |
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| Formfactor | SMARC |
| CPU | NXP i.MX 9596 (commercial)(6x ARM Cortex-A55 @ 2.0 GHz + 1x ARM Cortex-M7 + 1x ARM Cortex-M33 + eIQ Neutron NPU)NXP i.MX 9596 (industrial)(6x ARM Cortex-A55 @ 1.8 GHz + 1x ARM Cortex-M7 + 1x ARM Cortex-M33 + eIQ Neutron NPU) |
| DRAM | Up to 16 GByte onboard LPDDR5 memory | up to 6400 MT/s | inline ECC |
| Ethernet | 2x Gbit Ethernet with support for TSN | IEEE 1588 |
| I/O Interfaces | 1 x dual-role USB 2.02 x USB 2.02 x USB 3.01 x SDIO 3.02 x PCIe 3.0 1-lane1 x I²C busSPI1 x QSPIUp to 3x UART (2x with Handshake)2 x CAN FD14 x GPIOsoptional soldered M.2 1216 WiFi 6/BT 5.3 |
| Mass storage | eMMC 5.1 up to 256 GByte |
| Graphics | Integrated in SoC | Arm® Mali™ 3D GPU G310 | 2D GPU supporting blend graphics overlays | OpenGL® ES 3.2 | Vulkan® 1.2 | OpenCL 3.0 |
| Security | NXP EdgeLock® 2GO key management services | Cryptographic Acceleration and Assurance Module | Resource Domain Controller | ARM® TrustZone® | High Assurance Boot support |SHE, Encryption Engine AES-128, AES-256, 3DES, RC4, RSA4096, TRNG, SHA-1, SHA-2, SHA-256, MD-5 | RSA-1024, 2048, 3072, 4096 and secure key storage | side channel attack resistance |
| Boot Loader | U-Boot boot loader |
| Operating Systems | LinuxYoctoAndroid |
| Temperature | Commercial : Operating 0°C to 60°C | Storage -20°C to 80°CIndustrial: Operating -40°C to +85°C | Storage -40°C to +85°C |
| Humidity | Operating: 10 to 85% r. H. non cond. / Storage 5 to 85% r. H. non cond. |
| Video Interfaces | 1 x Dual channel 24-bit LVDS1 x Display Port 1.4 1080p60 through MIPI-DSI to DisplayPort Bridge (shared with MIPI-DSI)optional MIPI-DSI capable of supporting 4kp30 or 3840p60 shared with DisplayPort1 x optional HDMI 2.0a through MIPI-DSI to HDMI bridge (shared with MIPI-DSI)up to 2x MIPI-CSI 4-lanes2 x Integrated Image Signal Processor (ISP) for cameras with up to 12 MP resolution (on selected processor SKU’s) |
| Features | Watchdog TimerCortex-M7 and Cortex-M33 consoleoptional JTAG debug interfaceHigh Precision Real Time Clock |
| AI & Deep Learning | NXP eIQ® Neutron Neural Processing Unit (NPU) with up to 2 TOPSNXP eIQ® ML Software Development Environment |
| Size | 82 x 50 mm (3,23” x 1,97”) |
| Product Variants / Accessories |
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| 051600 | conga-SMX95/MX959-6C-8G-eMMC64 | SMARC Module with NXP i.MX 9596 6-core processor. Features 6x ARM Cortex-A55 @ 2 GHz, ARM Cortex-M7, ARM Cortex-M33, eIQ Neutron NPU, 8GB onboard LPDDR5 memory and 64GB onboard eMMC. Commercial grade temperature range from 0°C to 60°C. |
| 051601 | conga-SMX95/MX959-6C-4G eMMC32 | SMARC Module with NXP i.MX 9596 6-core processor. Features 6x ARM Cortex-A55 @ 1.8 GHz, ARM Cortex-M7, ARM Cortex-M33, eIQ Neutron NPU, 4GB onboard LPDDR5 memory and 32GB onboard eMMC. Commercial grade temperature range from 0°C to 60°C. |
| 051610 | conga-SMX95/i-MX959-6C-8G eMMC64 | SMARC Module with NXP i.MX 9596 6-core processor. Features 6x ARM Cortex-A55 @ 1.8 GHz, ARM Cortex-M7, ARM Cortex-M7, eIQ Neutron NPU, 8GB onboard LPDDR5 memory and 64GB onboard eMMC. Industrial grade temperature range from -40°C to 85°C. |
| 051611 | conga-SMX95/i-MX959-6C-4G eMMC32 | SMARC Module with NXP i.MX 9596 6-core processor. Features 6x ARM Cortex-A55 @ 1.8 GHz, ARM Cortex-M7, ARM Cortex-M33, eIQ Neutron NPU, 4GB onboard LPDDR5 memory and 32GB onboard eMMC. Industrial grade temperature range from -40°C to 85°C. |
| 051620 | conga-SMX95/i-MX959-6C-8G eMMC64 NX611 | SMARC Module with NXP i.MX 9596 6-core processor. Features 6x ARM Cortex-A55 @ 1.8 GHz, ARM Cortex-M7, ARM Cortex-M33, eIQ Neutron NPU, 8GB onboard LPDDR5 memory and 64GB onboard eMMC. Industrial grade temperature range from -40°C to 85°C. With Wifi/BT module NX611. |
| Accessories |
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| 051650 | conga-SMX95/CSP-B | Passive cooling solution for SMARC module conga-SMX95 with NXP i.MX 95 lidded ARM processor. All standoffs are with 2.7mm bore hole. |
| 051651 | conga-SMX95/HSP-B | Heat spreader solution for SMARC module conga-SMX95 with NXP i.MX 95 lidded ARM processor. All standoffs are with 2.7mm bore hole. |
| 27000001 | Design-In Training | Design-Training to develop carrier boards for Computer on Modules |
| All data is for information purposes only. The specification is subject to change without notice in advance. Any configuration other than original product specification is not guaranteed. Although all the information contained within this website is carefully checked, no guarantee of correctness is implied or expressed. Please always double-check the latest version of the product specification of the product manufacturer. Manufacturer Product Website: conga-SMX95 Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with MCTX Mobile & Embedded Computers GmbH. |
| OEM System Integration Support |
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We would be happy to assist you in selecting the optimal hardware platform for your application.
If you have any questions, whether technical or commercial, about our products or services, don’t hesitate to contact us. We look forward to hearing from you.
You can reach us by phone at +49 (0)7665/9390-185 (Monday to Friday from 8:00 AM to 8:00 PM). Alternatively, you are welcome to contact us anytime via the contact form at the end of this page. If you cannot reach us by phone, please send us a brief message via the contact form – we will get back to you as soon as possible.
Please note that we offer our services exclusively to Original Equipment Manufacturers. We do not sell to private persons or resellers.MCTX Mobile & Embedded Computers GmbH was founded in 2010 and focuses on the development and marketing of compact, high-performance, energy-efficient, and scalable computer systems and system components for mobile and stationary professional use in both indoor and outdoor environments.
We consider ourselves a reliable and experienced partner for companies and organizations that integrate these technologies into their processes or products. Our goal is to offer our customers SOLUTIONS that fully meet the requirements of their tasks.
Our company headquarters is located in southwestern Germany, in Gottenheim near Freiburg im Breisgau, close to the borders of France and Switzerland.
Service Portfolio
Depending on the project requirements, we offer our customers a wide range of products and outsourcing services: technology consulting for selecting the processor platform, delivery of key components, and the commissioned delivery of fully integrated, custom systems.
Over the years, our team has gained valuable experience in the integration of energy-efficient computing technologies. We provide this engineering know-how to our customers in order to optimize product and development costs as well as time-to-market.
Applications
Our boards and systems are used in a variety of applications in the field, in laboratories, in factory automation, and in OEM products, such as in the validation of semiconductor chips, in Lidar systems for 3D object measurement, in autonomous vehicles, various measurement and diagnostic systems, or in mobile data collection in the agricultural and forestry sectors.
Technologies
Our systems are based on state-of-the-art technologies used in modern servers, notebooks, tablet PCs, and navigation systems. The use of modular and industrial-grade system concepts enables long-lasting and scalable systems.