Module Store - Building Blocks for Developers of Embedded Computing Systems
conga-QMX6
Price on request
| congatec conga-QMX6 - Qseven CPU Module |
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| Qseven quad core ARM Module |
| Overview |
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| Key Features |
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| Specification |
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| Formfactor | Qseven |
| CPU | NXP i.MX6 Solo ARM Cortex A9(1 x 1.0 GHz, 512kB L2 cache, 3W)NXP i.MX6 Dual ARM Cortex A9(2 x 1.0 GHz, 1MB L2 cache, 3W)NXP i.MX6 Quad ARM Cortex A9(4 x 1.0 GHz, 1MB L2 cache, 3W)NXP i.MX6 Dual Lite ARM Cortex A9(2 x 1.0 GHz, 512kB L2 cache, 3W) |
| DRAM | Up to 4 GByte onboard DDR3L memory | 1066 MT/s |
| Ethernet | Gigabit Ethernet |
| I/O Interfaces | 4 x USB 2.01 x SATA1 x SDIO1 x I²C bus1 x CAN Bus1 x PCIe 2.01 x USB OTG client1 x SPI |
| Graphics | Integrated in NXP i.MX6 Series Video (VPU) | 2D Graphics (GPU2D) and 3D Graphics (GPU3D) | 3D graphics with 4 shaders up to 200MT/s dual stream 1080p/720p decoder/encoder. OpenGL | OpenCL and OpenVG 1.1 |
| Operating Systems | AndroidWindows Embedded Compact 7LinuxBSPs with OS drivers and tools |
| Temperature | Operating: 0 to +60°C commercial grade | -40 t o +85°C industrial grade / Storage: -40 to +85°C |
| Humidity | Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond. |
| Video Interfaces | 1 x DDILVDS 2x24 |
| Size | 70 x 70 mm (2,75" x 2,75") |
| Product Variants / Accessories |
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| 016300 | conga-QMX6/SC-1G eMMC32 | Qseven module with ultra low power NXP i.MX6 ARM Cortex-A9 1GHz Solo processor, 512kB L2 cache, 1GB onboard DDR3L memory and 32GB onboard eMMC. Commercial temperature range 0°C to 60°C. |
| 016301 | conga-QMX6/DCL-1G eMMC32 | Qseven module with ultra low power NXP i.MX6 ARM Cortex-A9 1GHz Dual Lite processor, 512kB L2 cache, 1GB onboard DDR3L memory and 32GB onboard eMMC. Commercial temperature range 0°C to 60°C. |
| 016302 | conga-QMX6/DC-1G eMMC32 | Qseven module with ultra low power NXP i.MX6 ARM Cortex-A9 1GHz Dual processor, 1MB L2 cache, 1GB onboard DDR3L memory and 32GB onboard eMMC. Commercial temperature range 0°C to 60°C. |
| 016303 | conga-QMX6/QC-1G eMMC32 | Qseven module with ultra low power NXP i.MX6 ARM Cortex-A9 1GHz Quad processor, 1MB L2 cache, 1GB onboard DDR3L memory and 32GB onboard eMMC. Commercial temperature range 0°C to 60°C. |
| 016304 | conga-QMX6/QC-2G eMMC32 | Qseven module with ultra low power NXP i.MX6 ARM Cortex-A9 1GHz Quad processor, 1MB L2 cache, 2GB onboard DDR3L memory and 32GB onboard eMMC. Commercial temperature range 0°C to 60°C. |
| 016310 | conga-QMX6/iSC-1G eMMC32 | Qseven module with ultra low power NXP i.MX6 ARM Cortex-A9 800MHz Solo processor, 512kB L2 cache, 1GB onboard DDR3L memory and 32GB onboard eMMC. Industrial temperature range -40°C to 85°C. |
| 016311 | conga-QMX6/iDCL-1G eMMC32 | Qseven module with ultra low power NXP i.MX6 ARM Cortex-A9 800MHz Dual Lite processor, 512kB L2 cache, 1GB onboard DDR3L memory and 32GB onboard eMMC. Industrial temperature range -40°C to 85°C. |
| 016312 | conga-QMX6/iDC-1G eMMC32 | Qseven module with ultra low power NXP i.MX6 ARM Cortex-A9 800MHz Dual processor, 1MB L2 cache, 1GB onboard DDR3L memory and 32GB onboard eMMC. Industrial temperature range -40°C to 85°C |
| 016313 | conga-QMX6/iQC-1G eMMC32 | Qseven module with ultra low power NXP i.MX6 ARM Cortex-A9 800MHz Quad processor, 1MB L2 cache, 1GB onboard DDR3L memory and 32GB onboard eMMC. Industrial temperature range -40°C to 85°C. |
| Accessories |
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| 016160 | QMX6/HSP1-T | Standard heatspreader with 1mm gap pad for Qseven module conga-QMX6 for processors with LIDDED FCBGA package. |
| 016161 | QMX6/HSP2-T | Standard heatspreader with 2mm gap pad for Qseven module conga-QMX6 for processors with plastic MAP BGA package. |
| 016162 | QMX6/HSP3-T | Standard heatspreader with heat stack solution for Qseven module conga-QMX6 for processors with open silicon FCBGA package. |
| 011127 | conga-Qseven/MFG-Serial-Adapter | MFG-header adapter on the QEV2 baseboard for RS-232 console-communication with UMX6 / QMX6.This adapter provides the ability to access the console in/output of the conga-QMX6 and mainly the conga-UMX6 product family (due to the fact that there isn't any console-connector on the conga-UMX6 module) via the MFG-header on the congatec part number 007005 conga-QEVAL/Qseven 2.0 ARM evaluation carrier board. |
| 007005 | conga-QEVAL/Qseven 2.0 ARM | Evaluation carrier board for Qseven 2.0 modules based on ARM architecture. |
| 27000001 | Design-In Training | Design-Training to develop carrier boards for Computer on Modules |
| All data is for information purposes only. The specification is subject to change without notice in advance. Any configuration other than original product specification is not guaranteed. Although all the information contained within this website is carefully checked, no guarantee of correctness is implied or expressed. Please always double-check the latest version of the product specification of the product manufacturer. Manufacturer Product Website: conga-QMX6 Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with MCTX Mobile & Embedded Computers GmbH. |
| OEM System Integration Support |
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We would be happy to assist you in selecting the optimal hardware platform for your application.
If you have any questions, whether technical or commercial, about our products or services, don’t hesitate to contact us. We look forward to hearing from you.
You can reach us by phone at +49 (0)7665/9390-185 (Monday to Friday from 8:00 AM to 8:00 PM). Alternatively, you are welcome to contact us anytime via the contact form at the end of this page. If you cannot reach us by phone, please send us a brief message via the contact form – we will get back to you as soon as possible.
Please note that we offer our services exclusively to Original Equipment Manufacturers. We do not sell to private persons or resellers.MCTX Mobile & Embedded Computers GmbH was founded in 2010 and focuses on the development and marketing of compact, high-performance, energy-efficient, and scalable computer systems and system components for mobile and stationary professional use in both indoor and outdoor environments.
We consider ourselves a reliable and experienced partner for companies and organizations that integrate these technologies into their processes or products. Our goal is to offer our customers SOLUTIONS that fully meet the requirements of their tasks.
Our company headquarters is located in southwestern Germany, in Gottenheim near Freiburg im Breisgau, close to the borders of France and Switzerland.
Service Portfolio
Depending on the project requirements, we offer our customers a wide range of products and outsourcing services: technology consulting for selecting the processor platform, delivery of key components, and the commissioned delivery of fully integrated, custom systems.
Over the years, our team has gained valuable experience in the integration of energy-efficient computing technologies. We provide this engineering know-how to our customers in order to optimize product and development costs as well as time-to-market.
Applications
Our boards and systems are used in a variety of applications in the field, in laboratories, in factory automation, and in OEM products, such as in the validation of semiconductor chips, in Lidar systems for 3D object measurement, in autonomous vehicles, various measurement and diagnostic systems, or in mobile data collection in the agricultural and forestry sectors.
Technologies
Our systems are based on state-of-the-art technologies used in modern servers, notebooks, tablet PCs, and navigation systems. The use of modular and industrial-grade system concepts enables long-lasting and scalable systems.