Module Store - Building Blocks for Developers of Embedded Computing Systems
conga-QA7
Price on request
congatec conga-QA7 - Qseven CPU Module with Intel® Elkhart Lake |
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Qseven module based on Intel® Atom® x6000E, Intel® Pentium® and Celeron® J processor series |
Overview |
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Key Features | Supported CPUs |
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CPU-Product Family: Intel® Elkhart Lake
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CPU-Variants |
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CPU | Processor Number | Cache | Total Cores | Total Threads | PCI Express Revision |
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Intel® Pentium® J6426 | J6426 | 1.5 MB L2 Cache | 4 | 4 | 3.0 |
Intel® Celeron® J6413 | J6413 | 1.5 MB L2 Cache | 4 | 4 | 3.0 |
Intel Atom® x6425RE | 6425RE | 1.5 MB L2 Cache | 4 | 4 | 3.0 |
Intel Atom® x6425E | 6425E | 1.5 MB L2 Cache | 4 | 4 | 3.0 |
Intel Atom® x6414RE | 6414RE | 1.5 MB L2 Cache | 4 | 4 | 3.0 |
Intel Atom® x6413E | 6413E | 1.5 MB L2 Cache | 4 | 4 | 3.0 |
Intel Atom® x6212RE | 6212RE | 1.5 MB L2 Cache | 2 | 2 | 3.0 |
Intel Atom® x6211E | 6211E | 1.5 MB L2 Cache | 2 | 2 | 3.0 |
Specification |
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Formfactor | Qseven |
CPU | Intel® Celeron® J6413(4 x 1.8 GHz, 1.5 MB cache, 10W)Intel® Pentium® J6426(4 x 2.0 GHz, 1.5 MB cache, 10W)Intel® Atom® x6414RE(4 x 1.5 GHz, 1.5 MB cache, 9W)Intel® Atom® x6425RE(4 x 1.9 GHz, 1.5 MB cache, 12W)Intel® Atom® x6212RE(2 x 1.2 GHz, 1.5 MB cache, 6W)Intel® Atom® x6211E(2 x 1.3 GHz, 1.5 MB cache, 6W)Intel® Atom® x6413E(4 x 1.5 GHz, 1.5 MB cache, 9W)Intel® Atom® x6425E(4 x 2.0 GHz, 1.5 MB cache, 12W) |
DRAM | max. 16GB onboard LPDDR4x with up to 4.267 MT/s |
Ethernet | Intel® GbE with TSN support | real-time trigger |
I/O Interfaces | up to 2x USB 3.1 Gen2up to 1x USB3.1 Dual RoleUp to 8x USB 2.02 x SATA III (6Gb/s)SDIO4 x PCIe Gen3LPC busI²C busSM-BusCAN BusUARTSPISPI (option) |
Mass storage | eMMC 5.1 onboard flash up to 64 Gbyte (optional up to 128 Gbyte) |
Graphics | Intel® UHD Graphics (Gen11 LP) |
congatec Board Controller | Multistage watchdog | non-volatile user data storage | manufacturing and board Information | board statistics | fast mode and multi-master I²C bus | power loss control |
embedded BIOS Features | AMI Aptio UEFI32 MByte serial SPI firmware flashOEM LogoOEM CMOS DefaultsLCD ControlDisplay Auto DetectionBacklight ControlFlash Update |
Power Management | ACPI 5 .0 compliant, Smart Battery Management |
Operating Systems | Microsoft® Windows 11 IoT EnterpriseMicrosoft® Windows® 10Microsoft® Windows 10 IoT EnterpriseLinuxYocto |
Hypervisor | RTS Real-Time Hypervisor |
Temperature | Commercial variants: Operation: 0° to +60°C | Storage: -20° to +80°CIndustrial variants: Operation: -40° to +85°C | Storage: -40° to +85°C |
Humidity | Operating: 10 to 85% r. H. non cond. / Storage 5 to 85% r. H. non cond. |
Video Interfaces | DP++18/24-bit Single/Dual Channel LVDS Interface,resolutions up to 1920X1200@60Hz, VESA standard or JEIDA data mapping, Automatic Panel Detection via EDID/EPI | shared with eDP 1.3 supporting up to 4096x2160@60Hz (option) or MIPI-DSI 1.2 supporting up to 3200x2000@60Hz |
Size | 70 x 70 mm (2,75" x 2,75") |
Product Variants / Accessories |
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015800 | conga-QA7/x6425E-16G eMMC64 | Qseven module with Intel® Atom® x6425E quad core processor with 2.0GHz core frequency up to 3.0GHz, 1.5MB cache, 16GB 3200MT/s LPDDR4x onboard memory and 64GB eMMC onboard flash. |
015801 | conga-QA7/x6413E-8G eMMC32 | Qseven module with Intel® Atom® x6413E quad core processor with 1.5GHz core frequency up to 3.0GHz, 1.5MB cache, 8GB 3200MT/s LPDDR4x onboard memory and 32GB eMMC onboard flash. |
015802 | conga-QA7/x6211E-4G eMMC32 | Qseven module with Intel® Atom® x6211E dual core processor with 1.3GHz core frequency up to 3.0GHz, 1.5MB cache, 4GB 3200MT/s LPDDR4x onboard memory and 32GB eMMC onboard flash. |
015810 | conga-QA7/i-x6425RE-8G eMMC32 | Qseven module with Intel® Atom® x6425RE quad core processor with 1.8GHz core frequency, 1.5MB cache, 8GB 4267MT/s LPDDR4x onboard memory and 32GB eMMC onboard flash. Industrial grade temperature range from -40°C to 85°C. |
015811 | conga-QA7/i-x6414RE-4G eMMC32 | Qseven module with Intel® Atom® x6414RE quad core processor with 1.5GHz core frequency, 1.5MB cache, 4GB 3200MT/s LPDDR4x onboard memory and 32GB eMMC onboard flash. Industrial grade temperature range from -40°C to 85°C. |
015812 | conga-QA7/i-x6212RE-4G eMMC32 | Qseven module with Intel® Atom® x6212RE dual core processor with 1.2GHz core frequency, 1.5MB cache, 4GB 3200MT/s LPDDR4x onboard memory and 32GB eMMC onboard flash. Industrial grade temperature range from -40°C to 85°C. |
015820 | conga-QA7/J6426-16G eMMC64 | Qseven module with Intel® Pentium® J6426 quad core processor with 2.0GHz core frequency up to 3.0GHz, 1.5MB cache, 16GB 3200MT/s LPDDR4x onboard memory and 64GB eMMC onboard flash. |
015821 | conga-QA7/J6413-8G eMMC32 | Qseven module with Intel® Celeron® J6413 quad core processor with 1.8GHz core frequency up to 3.0GHz, 1.5MB cache, 8GB 3733 MT/s LPDDR4x onboard memory and 32GB eMMC onboard flash. |
Accessories |
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015850 | conga-QA7/i-CSP-B | Passive cooling solution for Qseven module conga-QA7 with lidded Intel Atom® x6000E processors. All standoffs are with 2.7mm bore hole. |
015851 | conga-QA7/i-HSP-B | Standard heatspreader for Qseven module conga-QA7 with lidded Intel Atom® x6000E processors. All standoffs are with 2.7mm bore hole. |
015852 | conga-QA7/HSP-B | Standard heatspreader for Qseven module conga-QA7 with open-die Intel® Pentium®/Celeron® J and N processors. All standoffs are with 2.7mm bore hole |
015853 | conga-QA7/CSP-B | Passive cooling solution for Qseven module conga-QA7 with open-die Intel® Pentium®/Celeron® J and N processors. All standoffs are with 2.7mm bore hole |
015854 | conga-QA7/i-CSP-T | Passive cooling solution for Qseven module conga-QA7 with lidded Intel Atom® x6000E processors. All standoffs are M2.5x0.45p threaded. |
015855 | conga-QA7/i-HSP-T | Standard heatspreader for Qseven module conga-QA7 with lidded Intel Atom® x6000E processors. All standoffs are M2.5x0.45p threaded. |
015856 | conga-QA7/HSP-T | Standard heatspreader for Qseven module conga-QA7 with open-die Intel Pentium/Celeron J and N processors. All standoffs are M2.5x0.45p threaded. |
015857 | conga-QA7/CSP-T | Passive cooling solution for Qseven module conga-QA7 with open-die Intel Pentium/Celeron J and N processors. All standoffs are M2.5x0.45p threaded. |
007003 | conga-QEVAL/Qseven 2.0 x86 | Evaluation carrier board for Qseven 2.0 modules based on x86 architecture. |
27000001 | Design-In Training | Design-Training to develop carrier boards for Computer on Modules |
All data is for information purposes only. The specification is subject to change without notice in advance. Any configuration other than original product specification is not guaranteed. Although all the information contained within this website is carefully checked, no guarantee of correctness is implied or expressed. Please always double-check the latest version of the product specification of the product manufacturer. Manufacturer Product Website: conga-QA7 Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with MCTX Mobile & Embedded Computers GmbH. |
OEM System Integration Support |
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We would be happy to assist you in selecting the optimal hardware platform for your application.
If you have any questions, whether technical or commercial, about our products or services, don’t hesitate to contact us. We look forward to hearing from you.
You can reach us by phone at +49 (0)7665/9390-185 (Monday to Friday from 8:00 AM to 8:00 PM). Alternatively, you are welcome to contact us anytime via the contact form at the end of this page. If you cannot reach us by phone, please send us a brief message via the contact form – we will get back to you as soon as possible.
Please note that we offer our services exclusively to Original Equipment Manufacturers. We do not sell to private persons or resellers.MCTX Mobile & Embedded Computers GmbH was founded in 2010 and focuses on the development and marketing of compact, high-performance, energy-efficient, and scalable computer systems and system components for mobile and stationary professional use in both indoor and outdoor environments.
We consider ourselves a reliable and experienced partner for companies and organizations that integrate these technologies into their processes or products. Our goal is to offer our customers SOLUTIONS that fully meet the requirements of their tasks.
Our company headquarters is located in southwestern Germany, in Gottenheim near Freiburg im Breisgau, close to the borders of France and Switzerland.
Service Portfolio
Depending on the project requirements, we offer our customers a wide range of products and outsourcing services: technology consulting for selecting the processor platform, delivery of key components, and the commissioned delivery of fully integrated, custom systems.
Over the years, our team has gained valuable experience in the integration of energy-efficient computing technologies. We provide this engineering know-how to our customers in order to optimize product and development costs as well as time-to-market.
Applications
Our boards and systems are used in a variety of applications in the field, in laboratories, in factory automation, and in OEM products, such as in the validation of semiconductor chips, in Lidar systems for 3D object measurement, in autonomous vehicles, various measurement and diagnostic systems, or in mobile data collection in the agricultural and forestry sectors.
Technologies
Our systems are based on state-of-the-art technologies used in modern servers, notebooks, tablet PCs, and navigation systems. The use of modular and industrial-grade system concepts enables long-lasting and scalable systems.