Module Store - Building Blocks for Developers of Embedded Computing Systems
conga-HPC/sILL
Price on request
| congatec conga-HPC/sILL - COM-HPC Server CPU Module with Intel® Ice Lake |
|---|
| COM-HPC Server Size D module based on Intel® Xeon® D processor series (code name "Ice Lake") |
| Overview |
|---|
| Key Features | Supported CPUs |
|---|---|
|
CPU-Product Family: Intel® Ice Lake
|
| CPU-Variants |
|---|
| CPU | Processor Number | Cache | Max Turbo Frequency | Total Cores | Total Threads | PCI Express Revision |
|---|---|---|---|---|---|---|
| Intel® Xeon® D-1746TER | D-1746TER | 15 MB | 3.10 GHz | 10 | 20 | 4.0 |
| Intel® Xeon® D-1735TR | D-1735TR | 15 MB | 3.40 GHz | 8 | 16 | 4.0 |
| Intel® Xeon® D-1732TE | D-1732TE | 15 MB | 3.00 GHz | 8 | 16 | 4.0 |
| Intel® Xeon® D-1715TER | D-1715TER | 10 MB | 3.50 GHz | 4 | 8 | 4.0 |
| Intel® Xeon® D-1712TR | D-1712TR | 10 MB | 3.10 GHz | 4 | 8 | 4.0 |
| Specification |
|---|
| Formfactor | COM-HPC |
| CPU | Intel® Xeon® D-1848TER(10 x 2.0 GHz, 15 MB cache, 100G Eth, 57W)Intel® Xeon® D-1712TR(4 x 2.0 GHz, 10 MB cache, 50G Eth, 39W)Intel® Xeon® D-1735TR(8 x 2.2 GHz, 15 MB cache, 50G Eth, 59W)Intel® Xeon® D-1715TER(4 x 2.4 GHz, 10 MB cache, 50G Eth, 50W)Intel® Xeon® D-1732TE(8 x 1.9 GHz, 15 MB cache, 50G Eth, 52W)Intel® Xeon® D-1746TER(10 x 2.0 GHz, 15 MB cache, 100G Eth, 67W) |
| DRAM | 4x DIMM sockets for DDR4 memory modules | Max. capacity = 256GB |
| Ethernet | 1 x 2.5GbE TSN Ethernet2x 40G / 4x 25G / 8x 10G/2.5G/1G/100M lanes | Maximum total bandwidth 100Gb (depending on CPU) |
| I/O Interfaces | 16 x PCIe Gen416 x PCIe Gen34 x USB 3.04 x USB 2.02 x SATA III (6Gb/s)2 x UART12 x GPIOs2 x SM-Bus2 x I²C bus |
| congatec Board Controller | Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirection |
| embedded BIOS Features | AMI Aptio UEFI64Mbyte serial SPI with congatec Embedded BIOS featureOEM LogoOEM CMOS DefaultsFlash Update |
| Security | Trusted Platform Module (TPM 2.0) |
| Power Management | ACPI 5.0 with battery support |
| Operating Systems | Microsoft® Windows® 10Microsoft® Windows 10 IoT EnterpriseMicrosoft® Windows IoT 10 CoreLinuxAndroidYocto |
| Hypervisor | RTS Real-Time Hypervisor |
| Temperature | Commercial: Operating Temperature: 0 to +60°C | Storage Temperature: -20 to +85°CIndustrial: Operating Temperature: -40 to +85°C | Storage Temperature: -40 to +85°C (depending on CPU) |
| Humidity | Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond. |
| Size | 160 x 160 mm |
| Product Variants / Accessories |
|---|
| 050412 | conga-HPC/sILL-D1848TER | COM-HPC Size D module based on Intel® Xeon® D-1848TER 10-core processor with 2.0 GHz, 15MB cache and dual channel DDR4 2666 MT/s memory interface (formerly Ice Lake-D Refresh LCC). Industrial temperature range from -40°C to 85°C. |
| 050400 | conga-HPC/sILL-D1746TER | COM-HPC Size D module based on Intel® Xeon® D1746TER 10-core processor with 2.0 GHz, 15MB cache and dual channel DDR4 up to 2667 MT/s memory interface (formerly Ice Lake-D LCC). Industrial temperature range from -40°C to 85°C. |
| 050401 | conga-HPC/sILL-D1732TE | COM-HPC Size D module based on Intel® Xeon® D1732TE 8-core processor with 1.9 GHz, 15MB cache and dual channel DDR4 up to 2667 MT/s memory interface (formerly Ice Lake-D LCC). Industrial temperature range from -40°C to 85°C. |
| 050402 | conga-HPC/sILL-D1715TER | COM-HPC Size D module based on Intel® Xeon® D1715TER 4-core processor with 2.4 GHz, 10MB cache and dual channel DDR4 up to 2667 MT/s memory interface (formerly Ice Lake-D LCC). Extended temperature range from -40°C to 80°C. |
| 050410 | conga-HPC/sILL-D1735TR | COM-HPC Size D module based on Intel® Xeon® D1735TR 8-core processor with 2.2 GHz, 15MB cache and dual channel DDR4 up to 2933 MT/s memory interface (formerly Ice Lake-D LCC). Commercial temperature range from 0°C to 60°C. |
| 050411 | conga-HPC/sILL-D1712TR | COM-HPC Size D module based on Intel® Xeon® D1712TR 4-core processor with 2.0 GHz, 10MB cache and dual channel DDR4 up to 2400 MT/s memory interface (formerly Ice Lake-D LCC). Commercial temperature range from 0°C to 60°C. |
| Accessories |
|---|
| 050450 | conga-HPC/sILL-CSA-HP | Standard active cooling solution for COM-HPC Server modules conga-HPC/sILL with integrated heat pipes, 35.2mm overall cooling height and integrated 12V fan. |
| 050451 | conga-HPC/sILL-CSP-HP | Standard passive cooling solution for COM-HPC Server modules conga-HPC/sILL with integrated heat pipes, 18.2mm overall cooling height. |
| 050452 | conga-HPC/sILL-HSP-HP-B | Standard heatspreader for COM-HPC Server modules conga-HPC/sILL with integrated heat pipes and 11mm overall cooling height. Through hole mounting with bore hole standoffs Ø2.7mm. |
| 050453 | conga-HPC/sILL-HSP-HP-T | Standard heatspreader for COM-HPC Server modules conga-HPC/sILL with integrated heat pipes and 11mm overall cooling height. Threaded mounting with threaded standoffs M2.5. |
| 050454 | conga-HPC/sILL-HPA | Heat pipe Adapter for COM-HPC Server modules conga-HPC/sILL. Suitable for standard 8 mm heat pipes to optimize heat distribution. |
| 050455 | conga-HPC/sILL-Retention Frame | Retention frame for conga-HPC/sILL |
| 065500 | conga-HPC/EVAL-Server | conga-HPC/EVAL-Server |
| 069000 | DDR4-UDIMM-3200 (16GB) | DDR4 UDIMM memory module with 3200 MT/s and 16GB RAM |
| 069003 | DDR4-UDIMM-3200 ECC (16GB) | DDR4 ECC UDIMM memory module with 3200 MT/s and 16GB RAM |
| 069002 | DDR4-UDIMM-3200 (16GB) / i-temp | Industrial DDR4 UDIMM memory module with 3200 MT/s and 16GB RAM |
| 069004 | DDR4-UDIMM-3200 ECC (16GB) / i-temp | Industrial DDR4 ECC UDIMM memory module with 3200 MT/s and 16GB RAM |
| 069001 | DDR4-UDIMM-3200 (32GB) | DDR4 UDIMM memory module with 3200 MT/s and 32GB RAM |
| 069006 | DDR4-UDIMM-3200 ECC (32GB) | DDR4 ECC UDIMM memory module with 3200 MT/s and 32GB RAM |
| 069005 | DDR4-UDIMM-3200 (32GB) / i-temp | Industrial DDR4 UDIMM memory module with 3200 MT/s and 32GB RAM |
| 069007 | DDR4-UDIMM-3200 ECC (32GB) / i-temp | Industrial DDR4 ECC UDIMM memory module with 3200 MT/s and 32GB RAM |
| 069200 | DDR4-RDIMM-3200 ECC (16GB) | DDR4 ECC RDIMM memory module with 3200 MT/s and 16GB RAM |
| 069210 | DDR4-RDIMM-3200 ECC (16GB) / i-temp | Industrial DDR4 ECC RDIMM memory module with 3200 MT/s and 16GB RAM |
| 069220 | DDR4-RDIMM-3200 ECC (32GB) | DDR4 ECC RDIMM memory module with 3200 MT/s and 32GB RAM |
| 069230 | DDR4-RDIMM-3200 ECC (32GB) / i-temp | Industrial DDR4 ECC RDIMM memory module with 3200 MT/s and 32GB RAM |
| 069240 | DDR4-RDIMM-3200 ECC (64GB) | DDR4 ECC RDIMM memory module with up to 3200 MT/s and 64GB RAM |
| 069250 | DDR4-RDIMM-3200 ECC (64GB) / i-temp | Industrial DDR4 ECC RDIMM memory module with 3200 MT/s and 64GB RAM |
| 069600 | VLP DDR4-RDIMM-3200 ECC (16GB) | DDR4 ECC VLP RDIMM memory module with up to 3200 MT/s and 16GB RAM |
| 069610 | VLP DDR4-RDIMM-3200 ECC (16GB) / i-temp | Industrial DDR4 ECC VLP RDIMM memory module with up to 3200 MT/s and 16GB RAM |
| 069620 | VLP DDR4-RDIMM-3200 ECC (32GB) | DDR4 ECC VLP RDIMM memory module with up to 3200 MT/s and 32GB RAM |
| 27000001 | Design-In Training | Design-Training to develop carrier boards for Computer on Modules |
| All data is for information purposes only. The specification is subject to change without notice in advance. Any configuration other than original product specification is not guaranteed. Although all the information contained within this website is carefully checked, no guarantee of correctness is implied or expressed. Please always double-check the latest version of the product specification of the product manufacturer. Manufacturer Product Website: conga-HPC/sILL Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with MCTX Mobile & Embedded Computers GmbH. |
| OEM System Integration Support |
|---|
Product Variants / Acessories
We would be happy to assist you in selecting the optimal hardware platform for your application.
If you have any questions, whether technical or commercial, about our products or services, don’t hesitate to contact us. We look forward to hearing from you.
You can reach us by phone at +49 (0)7665/9390-185 (Monday to Friday from 8:00 AM to 8:00 PM). Alternatively, you are welcome to contact us anytime via the contact form at the end of this page. If you cannot reach us by phone, please send us a brief message via the contact form – we will get back to you as soon as possible.
Please note that we offer our services exclusively to Original Equipment Manufacturers. We do not sell to private persons or resellers.MCTX Mobile & Embedded Computers GmbH was founded in 2010 and focuses on the development and marketing of compact, high-performance, energy-efficient, and scalable computer systems and system components for mobile and stationary professional use in both indoor and outdoor environments.
We consider ourselves a reliable and experienced partner for companies and organizations that integrate these technologies into their processes or products. Our goal is to offer our customers SOLUTIONS that fully meet the requirements of their tasks.
Our company headquarters is located in southwestern Germany, in Gottenheim near Freiburg im Breisgau, close to the borders of France and Switzerland.
Service Portfolio
Depending on the project requirements, we offer our customers a wide range of products and outsourcing services: technology consulting for selecting the processor platform, delivery of key components, and the commissioned delivery of fully integrated, custom systems.
Over the years, our team has gained valuable experience in the integration of energy-efficient computing technologies. We provide this engineering know-how to our customers in order to optimize product and development costs as well as time-to-market.
Applications
Our boards and systems are used in a variety of applications in the field, in laboratories, in factory automation, and in OEM products, such as in the validation of semiconductor chips, in Lidar systems for 3D object measurement, in autonomous vehicles, various measurement and diagnostic systems, or in mobile data collection in the agricultural and forestry sectors.
Technologies
Our systems are based on state-of-the-art technologies used in modern servers, notebooks, tablet PCs, and navigation systems. The use of modular and industrial-grade system concepts enables long-lasting and scalable systems.