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conga-HPC/cRLP
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congatec conga-HPC/cRLP - COM-HPC Client CPU Module with Intel® Raptor Lake |
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COM-HPC Client Size A high performance module based on 13th Gen Intel® Core™ processor series (code name "Raptor Lake") |
Overview |
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Key Features | Supported CPUs |
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CPU-Product Family: Intel® Raptor Lake
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CPU-Variants |
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CPU | Processor Number | Cache | Max Turbo Frequency | Total Cores | Total Threads | Processor Base Power |
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Intel® Core™ i7-13800HRE | i7-13800HRE | 24 MB Intel® Smart Cache | 5.00 GHz | 14 | 20 | 45 W |
Intel® Core™ i7-13800HE | i7-13800HE | 24 MB Intel® Smart Cache | 5.00 GHz | 14 | 20 | 45 W |
Intel® Core™ i7-1370PRE | i7-1370PRE | 24 MB Intel® Smart Cache | 4.80 GHz | 14 | 20 | 28 W |
Intel® Core™ i7-1370PE | i7-1370PE | 24 MB Intel® Smart Cache | 4.80 GHz | 14 | 20 | 28 W |
Intel® Core™ i7-1365UE | i7-1365UE | 12 MB Intel® Smart Cache | 4.90 GHz | 10 | 12 | 15 W |
Intel® Core™ i5-1350PRE | i5-1350PRE | 12 MB Intel® Smart Cache | 4.60 GHz | 12 | 16 | 28 W |
Intel® Core™ i5-1340PE | i5-1340PE | 12 MB Intel® Smart Cache | 4.50 GHz | 12 | 16 | 28 W |
Intel® Core™ i3-1315UE | i3-1315UE | 10 MB Intel® Smart Cache | 4.50 GHz | 6 | 8 | 15 W |
Specification |
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Formfactor | COM-HPC |
CPU | Intel® Core™ i7-13800HE(6 P-cores 2.5GHz up to 5.0GHz, 8 E-cores 1.8GHz up to 4.0GHz, 24MB cache, 45W)Intel® Core™ i7-1370PE(6 P-cores 1.9GHz up to 4.8GHz, 8 E-cores 1.2GHz up to 3.7GHz, 24MB cache, 28W)Intel® Core™ i7-1365UE(2 P-cores 1.7GHz up to 4.9GHz, 8 E-cores 1.2GHz up to 3.7GHz, 12MB cache, 15W)Intel® Core™ i7-13800HRE(6 P-cores 2.5GHz up to 5.0GHz, 8 E-cores 1.8GHz up to 4.0GHz, 24MB cache, 45W)Intel® Core™ i7-1370PRE(6 P-cores 1.9GHz up to 4.8GHz, 8 E-cores 1.2GHz up to 3.7GHz, 24MB cache, 28W)Intel® Core™ i7-1365URE(2 P-cores 1.7GHz up to 4.9GHz, 8 E-cores 1.2GHz up to 3.7GHz, 12MB cache, 15W)Intel® Core™ i5-1350PRE(4 P-cores 1.8GHz up to 4.6GHz, 8 E-cores 1.3GHz up to 3.4GHz, 12MB cache, 28W)Intel® Core™ i5-1340PE(4 P-cores 1.8GHz up to 4.5GHz, 8 E-cores 1.3GHz up to 3.3GHz, 12MB cache, 28W)Intel® Core™ i3-1315UE(2 P-cores 1.2GHz up to 4.5GHz, 4 E-cores 0.9GHz up to 3.3GHz, 10MB cache, 15W) |
DRAM | 2 SO-DIMM sockets for DDR5 memory modules up to 48 GB RAM each (max. 96 GB RAM system capacity) |up to 5200 MT/s |
Ethernet | 2 x 2.5 GbE with TSN support via Intel® i226 Ethernet controller series |
I/O Interfaces | 8 x PCIe Gen5 (only available on variants based on RPL-P H series)2 x4 PCIe Gen4up to 8 PCIe Gen32 x USB42 x USB 3.2 Gen2x1Up to 8x USB 2.0up to 2x SATA2 x UART12 x GPIOseSPISM-BusI²C busGSPI |
Mass storage | NVMe x1 SSD (optional) |
Graphics | Intel® UHD Graphics or Intel® Iris® Xe Graphics architecture | up to 80 EUs |
congatec Board Controller | Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirection |
embedded BIOS Features | AMI Aptio UEFI32 MByte serial SPI firmware flashOEM LogoOEM CMOS DefaultsLCD ControlDisplay Auto DetectionBacklight ControlFlash Update |
Security | Trusted Platform Module (TPM 2.0) |
Power Management | ACPI 6.0 with battery support |
Operating Systems | Microsoft® Windows 11Microsoft® Windows 11 IoT EnterpriseMicrosoft® Windows® 10Microsoft® Windows 10 IoT EnterpriseLinuxYocto |
Hypervisor | RTS Real-Time Hypervisor |
Temperature | Commercial variants: Operation: 0° to +60°C | Storage: -20° to +80°CIndustrial variants: Operation: -40° to +85°C | Storage: -40° to +85°C |
Humidity | Operating: 10 to 85% r. H. non cond. / Storage 5 to 85% r. H. non cond. |
Video Interfaces | 3x DDI | eDP |
Size | 95 x 120 mm |
Product Variants / Accessories |
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045500 | conga-HPC/cRLP-i7-13800HE | COM-HPC Size A module based on Intel® Core™ i7-13800HE processor with 6 P-cores 2.5GHz up to 5.0GHz Turbo and 8 E-cores 1.8GHz up to 4.0GHz Turbo | 24MB Intel® Smart Cache | Intel® Iris® Xe Graphics architecture with 96 EUs | Dual channel DDR5 5200 MT/s memory interface | Intel® code name Raptor Lake-P (H-Series) |
045501 | conga-HPC/cRLP-i7-1370PE | COM-HPC Size A module based on Intel® Core™ i7-1370PE processor with 6 P-cores 1.9GHz up to 4.8GHz Turbo and 8 E-cores 1.2GHz up to 3.7GHz Turbo | 24MB Intel® Smart Cache | Intel® Iris® Xe Graphics architecture with 96 EUs | Dual channel DDR5 5200 MT/s memory interface | Intel® code name Raptor Lake-P (P-Series) |
045502 | conga-HPC/cRLP-i7-1365UE | COM-HPC Size A module based on Intel® Core™ i7-1365UE processor with 2 P-cores 1.7GHz up to 4.9GHz Turbo and 8 E-cores 1.2GHz up to 3.7GHz Turbo | 12MB Intel® Smart Cache | Intel® Iris® Xe Graphics architecture with 96 EUs | Dual channel DDR5 5200 MT/s memory interface | Intel® code name Raptor Lake-P (U-Series) |
045510 | conga-HPC/cRLP-i7-13800HRE | COM-HPC Size A module based on Intel® Core™ i7-13800HRE processor with 6 P-cores 2.5GHz up to 5.0GHz Turbo and 8 E-cores 1.8GHz up to 4.0GHz Turbo | 24MB Intel® Smart Cache | Intel® Iris® Xe Graphics architecture with 96 EUs | Dual channel DDR5 5200 MT/s memory interface | Industrial grade temperature range from -40°C to +85°C | Intel® code name Raptor Lake-P (H-Series) |
045511 | conga-HPC/cRLP-i7-1370PRE | COM-HPC Size A module based on Intel® Core™ i7-1370PRE processor with 6 P-cores 1.9GHz up to 4.8GHz Turbo and 8 E-cores 1.2GHz up to 3.7GHz Turbo | 24MB Intel® Smart Cache | Intel® Iris® Xe Graphics architecture with 96 EUs | Dual channel DDR5 5200 MT/s memory interface | Industrial grade temperature range from -40°C to +85°C | Intel® code name Raptor Lake-P (P-Series) |
045512 | conga-HPC/cRLP-i7-1365URE | COM-HPC Size A module based on Intel® Core™ i7-1365URE processor with 2 P-cores 1.7GHz up to 4.9GHz Turbo and 8 E-cores 1.2GHz up to 3.7GHz Turbo | 12MB Intel® Smart Cache | Intel® Iris® Xe Graphics architecture with 96 EUs | Dual channel DDR5 5200 MT/s memory interface | Industrial grade temperature range from -40°C to +85°C | Intel® code name Raptor Lake-P (U-Series) |
045514 | conga-HPC/cRLP-i5-1350PRE | COM-HPC Size A module based on Intel® Core™ i5-1350PRE processor with 4 P-cores 1.8GHz up to 4.6GHz Turbo and 8 E-cores 1.3GHz up to 3.4GHz Turbo | 12MB Intel® Smart Cache | Intel® Iris® Xe Graphics architecture with 80 EUs | Dual channel DDR5 5200 MT/s memory interface | Industrial grade temperature range from -40°C to +85°C | Intel® code name Raptor Lake-P (P-Series) |
045504 | conga-HPC/cRLP-i5-1340PE | COM-HPC Size A module based on Intel® Core™ i5-1340PE processor with 4 P-cores 1.8GHz up to 4.5GHz Turbo and 8 E-cores 1.3GHz up to 3.3GHz Turbo | 12MB Intel® Smart Cache | Intel® Iris® Xe Graphics architecture with 80 EUs | Dual channel DDR5 5200 MT/s memory interface | Intel® code name Raptor Lake-P (P-Series) |
045508 | conga-HPC/cRLP-i3-1315UE | COM-HPC Size A module based on Intel® Core™ i3-1315UE processor with 2 P-cores 1.2GHz up to 4.5GHz Turbo and 4 E-cores 0.9GHz up to 3.3GHz Turbo | 10MB Intel® Smart Cache | Intel® UHD Graphics with 64EUs | Dual channel DDR5 5200 MT/s memory interface | Intel® code name Raptor Lake-P (U-Series) |
Accessories |
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049550 | conga-HPC/cALP-CSA-HP-B | Standard active cooling solution for COM-HPC module conga-HPC/cALP and conga-HPC/cRLP with integrated heat pipes, 29mm height and integrated 12V fan. All standoffs are with 2.7mm bore hole. |
049551 | conga-HPC/cALP-CSA-HP-T | Standard active cooling solution for COM-HPC module conga-HPC/cALP and conga-HPC/cRLP with integrated heat pipes, 29mm height and integrated 12V fan. All standoffs are M2.5mm threaded. |
049552 | conga-HPC/cALP-CSP-HP-B | Standard passive cooling solution for COM-HPC module conga-HPC/cALP and conga-HPC/cRLP with integrated heat pipes, 28.2mm height. All standoffs are with 2.7mm bore hole. |
049553 | conga-HPC/cALP-CSP-HP-T | Standard passive cooling solution for COM-HPC module conga-HPC/cALP and conga-HPC/cRLP with integrated heat pipes, 28.2mm height. All standoffs are M2.5mm threaded. |
049554 | conga-HPC/cALP-HSP-HP-B | Standard heatspreader for COM-HPC module conga-HPC/cALP and conga-HPC/cRLP with integrated heat pipes, 13mm height. All standoffs are with 2.7mm bore hole. |
049555 | conga-HPC/cALP-HSP-HP-T | Standard heatspreader for COM-HPC module conga-HPC/cALP and conga-HPC/cRLP with integrated heat pipes, 13mm height. All standoffs are M2.5mm threaded. |
065620 | conga-HPC/uATX-Client | COM-HPC Client µATX Application Carrier Board suitable for congatec COM-HPC modules with Size A,B and C. |
065600 | conga-HPC/EVAL-Client | Evaluation Carrier Board for COM-HPC Client type Modules. |
27000001 | Design-In Training | Design-Training to develop carrier boards for Computer on Modules |
068930 | DDR5-SODIMM-5600 (8GB) | DDR5 SODIMM memory module with up to 5600 MT/s and 8GB RAM, commercial temp 0°C to +60°C |
068931 | DDR5-SODIMM-5600 (16GB) | DDR5 SODIMM memory module with up to 5600 MT/s and 16GB RAM, commercial temp 0°C to +60°C |
068932 | DDR5-SODIMM-5600 (32GB) | DDR5 SODIMM memory module with up to 5600 MT/s and 32GB RAM, commercial temp 0°C to +60°C |
068933 | DDR5-SODIMM-5600 (48GB) | DDR5 SODIMM memory module with up to 5600 MT/s and 48GB RAM, commercial temp 0°C to +60°C |
068935 | DDR5-SODIMM-5600 (8GB) / i-temp | DDR5 SODIMM memory module with up to 5600 MT/s and 8GB RAM, industrial temp -40°C to +85°C |
068936 | DDR5-SODIMM-5600 (16GB) / i-temp | DDR5 SODIMM memory module with up to 5600 MT/s and 16GB RAM, industrial temp -40°C to +85°C |
068937 | DDR5-SODIMM-5600 (32GB) / i-temp | DDR5 SODIMM memory module with up to 5600 MT/s and 32GB RAM, industrial temp -40°C to +85°C |
068938 | DDR5-SODIMM-5600 (48GB) / i-temp | DDR5 SODIMM memory module with up to 5600 MT/s and 48GB RAM, industrial temp -40°C to +85°C |
All data is for information purposes only. The specification is subject to change without notice in advance. Any configuration other than original product specification is not guaranteed. Although all the information contained within this website is carefully checked, no guarantee of correctness is implied or expressed. Please always double-check the latest version of the product specification of the product manufacturer. Manufacturer Product Website: conga-HPC/cRLP Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with MCTX Mobile & Embedded Computers GmbH. |
OEM System Integration Support |
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We would be happy to assist you in selecting the optimal hardware platform for your application.
If you have any questions, whether technical or commercial, about our products or services, don’t hesitate to contact us. We look forward to hearing from you.
You can reach us by phone at +49 (0)7665/9390-185 (Monday to Friday from 8:00 AM to 8:00 PM). Alternatively, you are welcome to contact us anytime via the contact form at the end of this page. If you cannot reach us by phone, please send us a brief message via the contact form – we will get back to you as soon as possible.
Please note that we offer our services exclusively to Original Equipment Manufacturers. We do not sell to private persons or resellers.MCTX Mobile & Embedded Computers GmbH was founded in 2010 and focuses on the development and marketing of compact, high-performance, energy-efficient, and scalable computer systems and system components for mobile and stationary professional use in both indoor and outdoor environments.
We consider ourselves a reliable and experienced partner for companies and organizations that integrate these technologies into their processes or products. Our goal is to offer our customers SOLUTIONS that fully meet the requirements of their tasks.
Our company headquarters is located in southwestern Germany, in Gottenheim near Freiburg im Breisgau, close to the borders of France and Switzerland.
Service Portfolio
Depending on the project requirements, we offer our customers a wide range of products and outsourcing services: technology consulting for selecting the processor platform, delivery of key components, and the commissioned delivery of fully integrated, custom systems.
Over the years, our team has gained valuable experience in the integration of energy-efficient computing technologies. We provide this engineering know-how to our customers in order to optimize product and development costs as well as time-to-market.
Applications
Our boards and systems are used in a variety of applications in the field, in laboratories, in factory automation, and in OEM products, such as in the validation of semiconductor chips, in Lidar systems for 3D object measurement, in autonomous vehicles, various measurement and diagnostic systems, or in mobile data collection in the agricultural and forestry sectors.
Technologies
Our systems are based on state-of-the-art technologies used in modern servers, notebooks, tablet PCs, and navigation systems. The use of modular and industrial-grade system concepts enables long-lasting and scalable systems.