Module Store - Building Blocks for Developers of Embedded Computing Systems
conga-B7E3
Price on request
| congatec conga-B7E3 - COM Express Basic Type 7 CPU Module |
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| COM Express Basic Type 7 Server Class module based on AMD EPYC™ 3000 processor series |
| Overview |
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| Key Features |
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| Specification |
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| Formfactor | COM Express Basic |
| CPU | AMD EPYC™ Embedded 3000 Model 3451(16 x 2.1 GHz, 32MB L3 cache, 100W)AMD EPYC™ Embedded 3000 Model 3351(12 x 1.90 GHz, 32MB L3 cache, 80W)AMD EPYC™ Embedded 3000 Model 3251(8 x 2.5 GHz, 16MB L3 cache, 55W)AMD EPYC™ Embedded 3000 Model 3255(8 x 2.5 GHz, 16MB L3 cache, 55W)AMD EPYC™ Embedded 3000 Model 3201(8 x 1.5 GHz, 16MB L3 cache, 30W)AMD EPYC™ Embedded 3000 Model 3151(4 x 2.7 GHz, 16MB L3 cache, 45W)AMD EPYC™ Embedded 3000 Model 3101(4 x 2.1 GHz, 8MB L3 cache, 35W) |
| DRAM | Up to 3 SO-DIMM sockets for DDR4 memory modules up to 32 GByte each (96 GByte total) with 2666 MT/s ECC and non-ECC memory |
| Ethernet | 4x 10GbE with KR interface support1 x Gigabit Ethernet |
| I/O Interfaces | 32 x PCI Express GEN 3.0 lanes4 x USB 3.1 Gen14 x USB 2.02 x SATA III (6Gb/s)LPC busSPI2 x UARTSM-Bus |
| congatec Board Controller | Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirection |
| embedded BIOS Features | OEM CustomizationFlash UpdateAMI Aptio UEFI |
| Security | Trusted Platform Module (TPM 2.0) | Secure Root of Trust | Secure Memory Encryption | Secure Encrypted Virtualization |
| Operating Systems | Microsoft® Windows 10 EnterpriseMicrosoft® Windows Server 2016RTS HypervisorYoctoLinux |
| Temperature | ExtendedCommercial : Operating: 0 to +60°C Storage: -20 to +70°C Industrial: Operating: -40 to +85°C Storage: -40 to +85°C |
| Humidity | Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond. |
| Size | 95 x 125 mm (3.74" x 4.92") |
| Product Variants / Accessories |
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| 048600 | conga-B7E3/3451 | COM Express Type 7 Basic module based on AMD embedded EPYC 3451 16-core processor (dual die) with 2.15GHz up to 3.0 GHz turbo boost, 32MB L3 cache and quad channel DDR4 2666 MT/s memory interface (formerly Snowy Owl). |
| 048602 | conga-B7E3/3351 | COM Express Type 7 Basic module based on AMD embedded EPYC 3351 12-core processor (dual die) with 1.9GHz up to 3.0 GHz turbo boost, 32MB L3 cache and quad channel DDR4 2666 MT/s memory interface (formerly Snowy Owl). |
| 048604 | conga-B7E3/i-3255 | COM Express Type 7 Basic module based on AMD embedded EPYC 3255 8-core processor (single die) with 2.5GHz up to 3.1 GHz turbo boost, 16MB L3 cache and dual channel DDR4 2666 MT/s memory interface (formerly Snowy Owl). |
| 048605 | conga-B7E3/3251 | COM Express Type 7 Basic module based on AMD embedded EPYC 3251 8-core processor (single die) with 2.5GHz up to 3.1 GHz turbo boost, 16MB L3 cache and dual channel DDR4 2666 MT/s memory interface (formerly Snowy Owl). |
| 048606 | conga-B7E3/3201 | COM Express Type 7 Basic module based on AMD embedded EPYC 3201 8-core processor (single die) with 1.5GHz up to 3.1 GHz turbo boost, 16MB L3 cache and dual channel DDR4 2133 MT/s memory interface (formerly Snowy Owl). |
| 048607 | conga-B7E3/3151 | COM Express Type 7 Basic module based on AMD embedded EPYC 3151 4-core processor (single die) with 2.7GHz up to 2.9 GHz turbo boost, 16MB L3 cache and dual channel DDR4 2666 MT/s memory interface (formerly Snowy Owl). |
| 048608 | conga-B7E3/3101 | COM Express Type 7 Basic module based on AMD embedded EPYC 3101 4-core processor (single die) with 2.1GHz up to 2.9 GHz turbo boost, 8MB L3 cache and dual channel DDR4 2666 MT/s memory interface (formerly Snowy Owl). |
| Accessories |
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| 048652 | conga-B7E3/HSP-HP-B | Standard heat spreader for high performance COM Express Type 7 module conga-B7E3 with integrated heat pipes. All stand-offs are bore hole. Suitable for all single die variants. |
| 048653 | conga-B7E3/HSP-HP-T | Standard heat spreader for high performance COM Express Type 7 module conga-B7E3 with integrated heat pipes. All stand-offs are M2.5 threaded. Suitable for all single die variants. |
| 048656 | conga-B7E3/SP4-HSP-HP-B | Standard heat spreader for high performance COM Express Type 7 module conga-B7E3 with integrated heat pipes. All stand-offs are bore hole. Suitable for all dual die variants. |
| 048657 | conga-B7E3/SP4-HSP-HP-T | Standard heat spreader for high performance COM Express Type 7 module conga-B7E3 with integrated heat pipes. All stand-offs are M2.5 threaded. Suitable for all dual die variants. |
| 048660 | conga-B7E3/HPA | Heat pipe Adapter for conga-B7E3 COM Express Type 7 module. This adapter can be used in combination with standard 8 mm heat pipes to optimize heat distribution. Suitable for all single die variants. |
| 048662 | conga-B7E3/HPA SP4 | Heat pipe Adapter for conga-B7E3 COM Express Type 7 module. This adapter can be used in combination with standard 8 mm heat pipes to optimize heat distribution. Suitable for all dual die variants. |
| 067780 | DDR4-SODIMM-2666 (4GB) | DDR4 SODIMM memory module with 2666 MT/s and 4GB RAM |
| 067781 | DDR4-SODIMM-2666 (8GB) | DDR4 SODIMM memory module with 2666 MT/s and 8GB RAM |
| 067782 | DDR4-SODIMM-2666 (16GB) | DDR4 SODIMM memory module with 2666 MT/s and 16GB RAM |
| 068806 | DDR4-SODIMM-2666 (32GB) | DDR4 SODIMM memory module with 2666 MT/s and 32GB RAM |
| 067783 | DDR4-SODIMM-2666 ECC (4GB) | DDR4 ECC SODIMM memory module with 2666 MT/s and 4GB RAM |
| 067784 | DDR4-SODIMM-2666 ECC (8GB) | DDR4 ECC SODIMM memory module with 2666 MT/s and 8GB RAM |
| 067785 | DDR4-SODIMM-2666 ECC (16GB) | DDR4 ECC SODIMM memory module with 2666 MT/s and 16GB RAM |
| 068805 | DDR4-SODIMM-2666 ECC (32GB) | DDR4 ECC SODIMM memory module with 2666 MT/s and 32GB RAM |
| 068819 | DDR4-SODIMM-2666 (4GB) / i-temp | Industrial DDR4 SODIMM memory module with 2666 MT/s and 4GB RAM |
| 068820 | DDR4-SODIMM-2666 (8GB) / i-temp | Industrial DDR4 SODIMM memory module with 2666 MT/s and 8GB RAM |
| 068821 | DDR4-SODIMM-2666 (16GB) / i-temp | Industrial DDR4 SODIMM memory module with 2666 MT/s and 16GB RAM |
| 068807 | DDR4-SODIMM-2666 (32GB) / i-temp | Industrial DDR4 SODIMM memory module with 2666 MT/s and 32GB RAM |
| 068822 | DDR4-SODIMM-2666 ECC (4GB) / i-temp | Industrial DDR4 ECC SODIMM memory module with 2666 MT/s and 4GB RAM |
| 068823 | DDR4-SODIMM-2666 ECC (8GB) / i-temp | Industrial DDR4 ECC SODIMM memory module with 2666 MT/s and 8GB RAM |
| 068824 | DDR4-SODIMM-2666 ECC (16GB) / i-temp | Industrial DDR4 ECC SODIMM memory module with 2666 MT/s and 16GB RAM |
| 068808 | DDR4-SODIMM-2666 ECC (32GB) / i-temp | Industrial DDR4 ECC SODIMM memory module with 2666 MT/s and 32GB RAM |
| 065420 | conga-X7EVAL | congatec COM Express Type7 evaluation carrier with 4x 10Gbe Ethernet. Commercial temperature range. |
| 27000001 | Design-In Training | Design-Training to develop carrier boards for Computer on Modules |
| All data is for information purposes only. The specification is subject to change without notice in advance. Any configuration other than original product specification is not guaranteed. Although all the information contained within this website is carefully checked, no guarantee of correctness is implied or expressed. Please always double-check the latest version of the product specification of the product manufacturer. Manufacturer Product Website: conga-B7E3 Product names, logos, brands, and other trademarks featured or referred are the property of their respective trademark holders. These trademark holders are not affiliated with MCTX Mobile & Embedded Computers GmbH. |
| OEM System Integration Support |
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Product Variants / Acessories
We would be happy to assist you in selecting the optimal hardware platform for your application.
If you have any questions, whether technical or commercial, about our products or services, don’t hesitate to contact us. We look forward to hearing from you.
You can reach us by phone at +49 (0)7665/9390-185 (Monday to Friday from 8:00 AM to 8:00 PM). Alternatively, you are welcome to contact us anytime via the contact form at the end of this page. If you cannot reach us by phone, please send us a brief message via the contact form – we will get back to you as soon as possible.
Please note that we offer our services exclusively to Original Equipment Manufacturers. We do not sell to private persons or resellers.MCTX Mobile & Embedded Computers GmbH was founded in 2010 and focuses on the development and marketing of compact, high-performance, energy-efficient, and scalable computer systems and system components for mobile and stationary professional use in both indoor and outdoor environments.
We consider ourselves a reliable and experienced partner for companies and organizations that integrate these technologies into their processes or products. Our goal is to offer our customers SOLUTIONS that fully meet the requirements of their tasks.
Our company headquarters is located in southwestern Germany, in Gottenheim near Freiburg im Breisgau, close to the borders of France and Switzerland.
Service Portfolio
Depending on the project requirements, we offer our customers a wide range of products and outsourcing services: technology consulting for selecting the processor platform, delivery of key components, and the commissioned delivery of fully integrated, custom systems.
Over the years, our team has gained valuable experience in the integration of energy-efficient computing technologies. We provide this engineering know-how to our customers in order to optimize product and development costs as well as time-to-market.
Applications
Our boards and systems are used in a variety of applications in the field, in laboratories, in factory automation, and in OEM products, such as in the validation of semiconductor chips, in Lidar systems for 3D object measurement, in autonomous vehicles, various measurement and diagnostic systems, or in mobile data collection in the agricultural and forestry sectors.
Technologies
Our systems are based on state-of-the-art technologies used in modern servers, notebooks, tablet PCs, and navigation systems. The use of modular and industrial-grade system concepts enables long-lasting and scalable systems.