conga-IC175 - Thin Mini ITX with Intel® "Kaby Lake" Core™ U and Celeron™

conga-IC175 - Thin Mini ITX with Intel® "Kaby Lake" Core™ U and Celeron™

The professional grade conga-IC175 Thin Mini ITX is equipped with low power with Intel "Kaby Lake" Core U processors like e.g. Intel Core i7-7600U and i5-7300U.

The extremely low profile design of congatec’s new Thin Mini-ITX industrial motherboard family makes it perfectly suited for slim system designs such as industrial GUIs/HMIs, digital signage systems, point-of-sale terminals, and medical tablets. The boards excel through the option of ultra-fast Intel® Optane™ memory via M.2 connector, enabling extremely fast system boots, application starts, video recording and processing, and software updates.

The conga-IC175 Thin Mini-ITX motherboards can be universally employed in all the various embedded and IoT applications as the new low-power versions of the high-end 64-bit Intel® Core™ processors offer a highly configurable thermal design power (TDP) of 15W, with the flexibility to scale dissipation from 7.5W cTDP to 25W cTDP for an exceptional balance of power and performance. Perfectly tailored for the embedded and rugged industrial market, the new flagship motherboard design offers at least 7 years long term availability as well as a comprehensive set of industrial interfaces and drivers. Thanks to MCTX’s personal integration support, the design-in phase is highly simplified and becomes an easy job for OEM engineers.

Product Variants and Accessories

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052903 conga-IC175/i7-7600U

Thin Mini-ITX Mainboard auf Basis Intel "Kaby Lake-U" Core™ i7-7600U dual core processor 2.8 GHz, 4 MB cache, 2133 MT/s dual channel DDR4 SODIMM memory interface

052900 conga-IC175/i5-7300U

Thin Mini-ITX Mainboard auf Basis Intel "Kaby Lake-U" Core™ i5-7300U dual core processor 2.6 GHz, 3 MB cache,2133 MT/s dual channel DDR4 SODIMM memory interface

052901 conga-IC175/i3-7100U

Thin Mini-ITX Mainboard auf Basis Intel "Kaby Lake-U" Core™ i3-7100U dual core processor 2.4 GHz, 3 MB cache, 2133 MT/s dual channel DDR4 SODIMM memory interface

052902 conga-IC175/3965U

Thin Mini-ITX Main board auf Basis Intel "Kaby Lake-U" Celeron® 3965U dual core processor 2.2 GHz, 2 MB cache, 2133 MT/s dual channel DDR4 SODIMM memory interface

052252 conga-IC87/97-CSA Active cooling solution for conga-IC87, conga-IC97, conga-IC170 and conga-IC175 with 12V fan and Thin Mini-ITX height.
052254 conga-IC87/Retention Frame Retention frame for standard cooling for conga-IC87, conga-IC97, conga-IC170 and conga-IC175.
052256 conga-IC87/IO Shield - Standard IO shield for conga-IC87, conga-IC97, conga-IC170 and conga-IC175 with Standard Mini-ITX height
052257 conga-IC87/IO Shield - Thin IO shield for conga-IC87, conga-IC97, conga-IC170 and conga-IC175 with Thin Mini-ITX height
068790 DDR4-SODIMM-2400 (4GB) DDR4 SODIMM memory module with 2400 MT/s and 4GB RAM
068791 DDR4-SODIMM-2400 (8GB) DDR4 SODIMM memory module with 2400 MT/s and 8GB RAM
068792 DDR4-SODIMM-2400 (16GB) DDR4 SODIMM memory module with 2400 MT/s and 16GB RAM


The Feature Set in Detail

The new industrial grade conga-IC175 Thin Mini-ITX motherboards ship with 4 different dual-core variants of 7th Gen Intel® Core™ U SoC processors and have a configurable cTDP from 7.5 W to 25 W. Two SO-DIMM sockets support up to 32GB DDR4-2133 memory. For non-volatile memory the boards offer 1x M.2 slot supporting the new Intel® Optane™ memory for significantly lower latency and higher data rates mass storage devices. 2x SATA 3.0 interfaces allow additional HDDs or SSDs to be connected.

The IC175 connect the DirectX 12 capable Intel® HD Graphics 620 with up to three independent displays in 4k resolution @ 60 Hz via 2x DP++ plus eDP or dual channel LVDS. The new hardware-accelerated 10-bit encoding/decoding of HEVC and VP9 videos offloads the CPU while HDR support makes videos more vibrant and lifelike. The industrial grade I/O set includes 2x Gigabit Ethernet and 1x SIM card socket for 3G/4G or Narrow Band M2M and IoT connectivity, 1x PCIe x4 and 1x mPCIe for generic expansions, 4x USB 3.0, 6x USB 2.0, 8x GPIO, and 2x serial COM ports – one of which can be configured as ccTalk.

An integrated Board Management Controller, HDA audio including a stereo amplifier, a MIPI CSI-2 interface for direct connection of low-cost CMOS cameras as well as optional TPM 2.0 round off the feature set. The boards support the 64-bit versions of Microsoft Windows 10 and Windows 10 IoT as well as all common Linux operating systems. A comprehensive choice of add-ons for easier design-in, including cooling solutions, I/O shields and cable sets, is also available.


Formfactor Mini ITX
CPU Intel® Core™ i5-7300U (2 x 2.6 / 3.5 GHz, 3MB Cache, 15W)
Intel® Core™ i3-7100U (2 x 2.4 GHz, 3MB Cache, 15W)
Intel® Celeron® 3965U (2 x 2.2 GHz, 2MB Cache, 15W)
Intel® Core™ i7-7600U (2 x 2.8 / 3.9 GHz, 4MB Cache, 15W)
DRAM Support for 2x SO DIMM Socket (dual channel DDR4 up to 2133 MT/s), max. 2x 16GB
Chipset Integrated in SoC
Ethernet Dual LAN Gbit / 100 Mbit / 10 Mbit; 1x Intel Gigabit Ethernet PHY i219LM (with AMT support); 1x Intel Gigabit Ethernet Controller i211 (i210 optional)
Internal Connectors 1x PCIe x4 slot (gen3)
1x Full/Half-size Mini PCIe slot
M.2 key B 2242/3042 connector (2x PCIe lanes for Intel® Optane™ key)
3x SATA (6G), one shared with M.2
1x SATA Power
4x USB 2.0
1x LVDS (2x24 bit)
1x Embedded DisplayPort (x4)
1x Backlight (Power, control)
1x Monitor OFF
1x Surround
1x Front Panel HD Audio
1 x Digital MIC or S/PDIF
1x Internal stereo speaker
2x Serial Port COM2 (opt. as ccTALK)
1x Feature connector - congatec custom (8 Bit General Purpose I/O)
Connector for Integrated Sensor Hub
1x Frontpanel (Power Switch, LEDs, Reset)
1x Intrusion (Case Open),
1x FAN System
1x internal power header (12-24V)
1x CEC
1x microSIM card slot
1x microSD card slot
1x opt. battery header signal + power (SBM3)
1x I²C Bus
External Connectors 2x DisplayPort dp++
Audio In
Line Out
2x LAN RJ45
4x USB 3.0/2.0
1x DC-In (external input) 12-24 V
congatec Board Controller Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | LVDS backlight control I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control
embedded BIOS Features AMI Aptio UEFI
BIOS Update
Logo Boot
Quiet Boot
HDD Password
Security The conga-IC175 can be optionally equipped with a discrete ”Trusted Platform Module 2.0”
t is capable of calculating efficient hash and RSA algorithms with key lengths up to 2048 bits and includes a real random number generator.
Power Management Power Management | ACPI S3/S4 DeepSx | Wake on time from S5 | Power Supply 12-24 V | 2x fan (CPU / system) monitored & controlled
Operating Systems Microsoft® Windows 10 (64bit only)
Microsoft® Windows 10 IoT Enterprise (64bit only)
Power Consumption See User's Guide for full details
Temperature Operating: 0 to +60°C Storage: -20 to +70°C
Humidity Operating: 10 - 90% r. H. non cond.
Size 170 x 170 mm (6.7” x 6.7”)




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Delivery of pre-assembled and pre-configured assemblies

On request, we can supply all of the assemblies we offer in series with cooling solutions, memory and I/O components and preconfigured BIOS default settings as per customer specifications. We will gladly assist you in creating the BIOS image with your bootlogo and the required default settings.

To match our CPU boards, we have a variety of system components, such as enclosures, cooling solutions, peripheral components, memory components and cable assemblies, with which we can offer short-term system configurations tailored to the requirements of the respective project. Many of these components can be delivered from stock in order to allow the rapid development of proof-of-concept prototypes.

Build-to-order service for customer-specific system configurations

Many of our customers would like to select the key components for their systems, but they see no added value in integrating the system components themselves and assembling the systems in production quantities.

Tailored solutions - even for smaller projects

With the right system concept, solutions that meet the requirements do not require high minimum order quantities. Bridging the gap to conventional information technology contributes to cost-optimized solutions in many of our projects.

Depending on the requirements of your project, we offer you a customized version of a standard product, a customer-specific solution based on modular function blocks or a completely customer-specific development.

On request we offer the following services:

- Design and implementation of project-specific system configurations according to requirements profile
- Configurable standard configurations based on pre-qualified components
- In-house development and SMD assembly of customer-specific assemblies and carrier boards
- 3D design of housing components, mechanical modifications and rebranding of standard systems
- Assembling customer-specific systems
- Configuration and installation of customer-specific BIOS and operating system / software images.
- Delivery of systems and preassembled material kits in customer-specific packaging including accessories such as documentation, power supply or cable sets.

Get in touch with us to discuss about your requirements. Together we work out a system concept tailored to your application.


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