conga-B7E3 - AMD EPYC™ 3000

conga-B7E3 - COM Express® Typ 7 Module with AMD EPYC™ 3000

Congatec's new conga-B7E3 COM Express Type 7 modules are equipped with AMD EPYC Embedded 3000 processors with 4, 8, 12, or 16 high-performance cores, support simultaneous multi-threading (SMT) and up to 96 GB of DDR4 2666 RAM in the COM Express Basic form factor and up to 1TB in full custom designs.

Measuring just 125 x 95 mm, the COM Express Basic Type 7 module supports up 4x 10 GbE and up to 32 PCIe Gen 3 lanes.

For storage the module even integrates an optional 1 TB NVMe SSD and offers 2x SATA Gen 3.0 ports for conventional drives.

Further interfaces include 4x USB 3.1 Gen 1, 4x USB 2.0 as well as 2x UART, GPIO, I2C, LPC and SPI. Attractive features also include seamless support of dedicated high-end GPUs and improved floating-point performance, which is essential for emerging AI and HPC applications. congatec also offers advanced cooling solutions for its COM Express Type 7 Server-on-Modules that match the processor, support fanless cooling even beyond 65 W TDP.

COM Express 3.0 / COM Express Type 7

The new COM Express 3.0 standard that includes the new COM Express Type 7 Pinout– is introducing new Server-on-Modules with Intel® Xeon® D processors (codename Broadwell) parallel to the preview release of the COM Express Type 7 specification. Based on the world-leading COM Express Basic standard form factor (95 x 125 mm), the modules feature 10 Gigabit Ethernet interfaces, 32 PCIe lanes and headless server performance currently with up to 16 server cores and 48 gigabytes of DDR4 ECC RAM. Examples of target applications for the new Server-on-Modules are industrial automation, storage and networking appliances as well as modular server designs and base stations for telecom carriers, service providers‘ server farms as well as cloud, edge and fog servers for IoT and Industry 4.0 applications.

The application-ready, modular core of the long-term available congatec Server-on-Modules offers a standardized footprint, carrier board interfaces and a cooling concept, which significantly simplifies system designs – accelerating the launch of new, robust server technology. Plus, future performance upgrades can be carried out in a remarkably simple and cost-saving way, as only the Server-on-Module needs to be exchanged – even in case of a switch in the processor architecture. Without module technology, upgrading proprietary SBC designs and ATCA platforms used for carrier infrastructures is significantly more expensive.

 

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