conga-TC175 - COM Express Module with Intel® „Kaby Lake“ Core™ CPUs

conga-TC175 - COM Express Module with Intel® „Kaby Lake“ Core™ CPUs

The new conga TC175 COM Express Compact modules with Intel's 7th generation of Intel® Core™ SoC processors “Kaby Lake” are better than their predecessors. It’s the second variant of the current 14nm microarchitecture. Compelling features include greater CPU performance, more dynamic HDR graphics thanks to 10-bit video codec, and support of the optional, super-fast 3D Xpoint-based Intel® Optane™ memory. Because of its compatibility with the previous generation, the widely improved microarchitecture can be integrated in existing embedded systems without additional design effort.

For developers it makes it particulary easy to integrate this new generation, depending on
standardized COM Express form factor, congatec's extensive industrial driver implementations as well as personal integration support and individual Embedded Design & Manufacturing services. Wherever fanless and completely sealed systems must offer high performance at 15 Watt TDP, target applications are found.

Intel® Optane™ memory

The new COM Express computer modules from congatec support Intel® Optane™ memory is based on 3D XPoint technology. It is capable to handle the same size of data packets, although it offers significantly lower latency of just 10 µs compared to NAND SSDs. Therefore it is about a thousand times lower than that of standard HDDs. The boundaries between main memory and storage are becoming fluent. Congatec’s evaluation carrier boards already support this fast memory technology, which is especially suited for big data processing, high-performance computing, virtualization, data storage, cloud, simulation, medical imaging and many other applications, in September 2016.


Feature set details

The new conga-TC175 COM Express Compact modules are equipped with 15 Watt dual-core variants of Gen 7 Intel® Core™ SoC processors. Specifically, these are the 2.8 GHz Intel® Core™ i7 7600U, the 2.6 GHz Intel® Core™ i5 7300U and the 2.4 GHz Intel® Core™ i3 7100U processors as well as the Intel® Celeron® 3695U processor with 2.2 GHz. The TDP of all variants is configurable from 7.5 to15 Watts, which makes it easier to adapt the application to the energy concept of the system. All modules support up to 32 GB dual channel memory which for DDR4 provides significantly more bandwidth and better energy efficiency than current conventional DDR3L implementations. The Intel® Gen 9 HD Graphics 620 offers high graphics performance with latest DirectX 12 capabilities and supports up to three independent displays with up to 4k @ 60 Hz via eDP 1.4, DisplayPort 1.2 and HDMI 2.0a. Thanks to hardware-accelerated 10-bit encoding/decoding and high dynamic range of HEVC and VP9, HD streams are becoming more vivid and lifelike in both directions. The new computer modules from congatec support the COM Express Type 6 pinout with PCI Express Gen 3.0, USB 3.0 and 2.0, SATA Gen 3, Gigabit Ethernet, and low-speed interfaces such as LPC, I²C and UART. Customized integration support, a comprehensive range of accessories and optional Embedded Design & Manufacturing services for application specific carrier board and system designs are also available.

Functional Diagram


 

Datasheet

 

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