conga-TC170 - COM Express Type 6 Compact Module with Intel® "Skylake-U"

conga-TC170 - COM Express Type 6 Compact Module with Intel® "Skylake-U"

The conga-TC170 COM Express Compact Type 6 Modules are equipped with 6th Generation Core™ Mobile Processors ("Skylake-U SoC") from the Intel® Embedded Roadmap. The TC170 modules are equipped with2 SODIMM sockets and support up to 32GB fast dual channel DDR4 memory modules. The conga-TC170 modules support Windows 10, Windows 8.1 and Windows 7 as well as the latest Linux distributions.

Intel® Core™ i7-6600U (2 x 2.6 GHz, 4MB L2 cache)
Intel® Core™ i5-6300U (2 x 2.4 GHz, 3MB L2 cache)
Intel® Core™ i3-6100U (2 x 2.3 Ghz, 3MB L2 cache)
Intel® Celeron® 3955U (2 x 2.0 Ghz, 2MB L2 cache)

The conga-TC170 COM Express compact type 6 module from our partner congatec AG is based on the new 6th generation Intel®  Core™  processors (codename Skylake). The conga-TC170 was designed for demanding applications that requires high computing performance in sealed, fanless systems. The TC170 module features a 15 watt configurable TDP and are equipped exclusively with the energy-saving ULV-SoC editions based on new 14nm microarchitecture.Compared to 15 watt modules with fifth generation processors (codename Broadwell), users benefit from improvements in graphics and processing performance, enhanced energy efficiency and more high-speed I/Os.

The conga-TC170 module is currently offered in the following variants:

Artikelnummer Titel Beschreibung

045200

conga-TC170/i7-6600U

COM Express Type 6 Compact module with Intel® "Skylake-U" Core™ i7-6600U dual core processor with 2.6GHz, 4MB L2 cache and 2133MT/s dual channel DDR4 memory interface.

045201

conga-TC170/i5-6300U

COM Express Type 6 Compact module with Intel® "Skylake-U" Core™ i5-6300U dual core processor with 2.4GHz, 3MB L2 cache and 2133MT/s dual channel DDR4 memory interface.

045202

conga-TC170/i3-6100U

COM Express Type 6 Compact module with Intel® "Skylake-U" Core™ i3-6100U dual core processor with 2.3GHz, 3MB L2 cache and 2133MT/s dual channel DDR4 memory interface.

045203 conga-TC170/3955U COM Express Type 6 Compact-Module mit Intel® "Skylake-U" Celeron® 3955U Dual Core CPU mit 2.0GHz, 2MB Level-2-Cache, GT1-Grafik und 2133MT/s Dual Channel DDR4 Speicherinterface.

 

 

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Target Applications
Typical fanless applications for congatec COM Express compact modules can be found in medical and industrial imaging, central control room technology, shop floor terminals, HMIs, robotics, professional gaming, infotainment, professional AV, smart video surveillance, autonomous vehicle control, computer-aided situational awareness as well as high-end digital signage applications. Graphics card free, triple-head systems – for example in the areas of retail and kiosks, where embedded systems control up to three independent cash or vending machines – present a further application example.
 

Ultra Low Power CPUs with configurable TDP
The conga-TC170 modules, with COM Express Type 6 pinout, are equipped with the ULV- SoC editions of the sixth generation Intel Core i3/i5/i7 processors. For the first time, they offer a configurable TDP (Thermal Design Power) of 8.5 to 15 watts, which simplifies matching the application to the system’s thermal design. The power supply has also been optimized, which in addition to the new microarchitecture also contributes to the energy efficiency and allows a longer turbo-boost.

conga-TC170 - Overview CPU Variants
 

Memory Support
The conga-TC170 modules support up to 16GB of fast dual channel RAM, which in the DDR4 version provides significantly more bandwidth and is much more energy efficient than the DDR3 version.
Integrated Graphics
The integrated Intel Gen 9 Graphics provide up to three independently operated 4k displays with 60 Hz via DisplayPort 1.2. Version 2.0 of HDMI is also supported for the first time as well as version 12 of DirectX for even faster, Windows 10 based  3D graphics. Now not only the decoding but also the encoding of HEVC, VP8, VP9 and VDENC is hardware-supported. Energy-efficient streaming of HD videos in both directions is possible for the first time. Additional enhancements are the number of USB 3.0 ports (now 4) SATA Gen 3 (now 3) PCIe Gen 3 (now 6) as well as AMT (now version 11.0).
 

IO-Interfaces
Further COM Express Type 6 pinout-compliant interfaces include PEG, Gigabit Ethernet, 8x USB 2.0, LPC plus I²C and UART. Thanks to the optional MIPI camera interfaces, CSI2 camera sensors can also be connected directly.


Block Diagram

conga-TC170 Block Diagram

 

Scalability and Long Time Availablility
Users of the new TC170 module will benefit from the high level of standardization and scalability of the COM Express modules combined with congatec’s extensive documentation, industry-grade driver implementations and extensive customer support, which enable OEMs to integrate the latest processor technology quickly and efficiently into their individual applications. All modules are offered with long-term availability and software support of at least seven years. The software support includes, for example, enhanced security features as well as regular UEFI/BIOS updates and BSP patches. Customers thus benefit from reliable support over the entire lifetime of their applications.


Supported Operating Systems
The conga-TC170 supports all popular Linux distributions and Microsoft Windows variants – including Microsoft Windows 10. Extensive, design-in-simplifying options – such as heatsinks, carrier boards and starter kits as well as SMART Battery Management Modules – round out congatec’s offering.

Data Sheet

 

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