conga-TS175 - Intel® Xeon® / Core® i7

conga-TS175 - COM Express Type 6 Server-on-Module with Intel Xeon & Core i7

The high-performance conga-TS175 COM Express Basic Type 6 Computer-on-Modules are equipped with the high-end dual chip versions of the brand new Intel® Xeon® and Gen 7 Intel® Core™ processors “Kaby Lake” it sets a new benchmark for module-based high-end embedded computers and modular industrial workstations that need to process massive workloads.

Everywhere where data intensive streams need to be processed and displayed in real time, application areas for these high-end COM Express Type 6 Server-on-Modules can be found. Target markets include big data processing embedded clouds, edge and fog servers, medical imaging systems, video surveillance and vision-based quality control, simulation equipment, host systems for virtualized control technology, vision systems in industrial control rooms and other plant-wide supervision systems or high-end professional gaming and digital signage.

The new modules host increased CPU frequencies and performance, more dynamic HDR graphics thanks to 10-bit video codecs and support super-fast 3D XPoint-based Intel® Optane™ memory compared to their predecessors “Sky Lake”. The dual chip versions set the latest state-of-the-art benchmark for high-end Server-on-Module applications in comparison to the single chip variations of the new Gen 7 Intel® Core™ processors. They apply to the high-end embedded use cases with hyper threading within the embedded power envelope of up to 45 Watts.

Product Variants

Part# Product Name Features
045950 conga-TS175/i7-7820EQ Intel® Core™ i7-7820EQ quad core processor with 3GHz up to 3.7GHz, 8MB Intel® Smart Cache, GT2 graphics and 2400MT/s dual channel DDR4 memory interface (Intel Kaby Lake-H). Chipset QM175 with support for Intel® Optane™ memory
045951 conga-TS175/i5-7440EQ Intel® Core™ i5-7440EQ quad core processor with 2.9GHz up to 3.6GHz, 6MB Intel® Smart Cache, GT2 graphics and 2400MT/s dual channel DDR4 memory interface (Intel Kaby Lake-H). Chipset QM175 with support for Intel® Optane™ memory
045952 conga-TS175/i5-7442EQ Intel® Core™ i5-7442EQ quad core processor with 2.1GHz up to 2.9GHz, 6MB Intel® Smart Cache, GT2 graphics and 2400MT/s dual channel DDR4 memory interface (Intel Kaby Lake-H). Chipset QM175 with support for Intel® Optane™ memory
045953 conga-TS175/i3-7100E Intel® Core™ i3-7100E dual core processor with 2.9GHz, 3MB Intel® Smart Cache, GT2 graphics and 2400MT/s dual channel DDR4 memory interface (Intel Kaby Lake-H). Chipset HM175 with support for Intel® Optane™ memory
045954 conga-TS175/i3-7102E Intel® Core™ i3-7102E dual core processor with 2.1GHz, 3MB Intel® Smart Cache, GT2 graphics and 2400MT/s dual channel DDR4 memory interface (Intel Kaby Lake-H). Chipset HM175 with support for Intel® Optane™ memory
045955 conga-TS175/E3-1505MV6 Intel® Xeon® E3-1505M V6 quad core processor with 3GHz up to 4GHz, 8MB Intel® Smart Cache, GT2 graphics and 2400MT/s dual channel DDR4 memory interface (Intel Kaby Lake-H). Chipset CM238 with ECC memory support
045956 conga-TS175/E3-1505LV6 Intel® Xeon® E3-1505L V6 quad core processor with 2.2GHz up to 3GHz, 8MB Intel® Smart Cache, GT2 graphics and 2400MT/s dual channel DDR4 memory interface (Intel Kaby Lake-H). Chipset CM238 with ECC memory support
068790 DDR4-SODIMM-2400 (4GB) DDR4 SODIMM memory module with 2400 MT/s and 4GB RAM
068791 DDR4-SODIMM-2400 (8GB) DDR4 SODIMM memory module with 2400 MT/s and 8GB RAM
068792 DDR4-SODIMM-2400 (16GB) DDR4 SODIMM memory module with 2400 MT/s and 16GB RAM


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Feature Set

The new conga-TS175 COM Express Basic module is available with two quadcore Intel® Xeon® processors with hyper threading as well as 5 different Intel® Core™ i7, i5 and i3 processors within a 45 to 25 W TDP envelope. Bandwidth intensive applications will benefit from up to 32 gigabytes of fast dual channel 2400 DDR4 memory – including ECC support option. In regards to visual experience, they feature the new Intel® HD630 graphics supporting up to three independent displays with up to 4k @ 60 Hz via DisplayPort 1.4 and HDMI 2.0 – both with HDCP 2.2, and eDP 1.4 support. Additionally, the modules also offer dual channel LVDS and VGA for legacy displays. Thanks to hardware-accelerated 10-bit encoding/decoding and high dynamic range of HEVC and VP9, HD streams are becoming more vivid and lifelike in both directions.

The modules offer all the common I/O interfaces of the Type 6 pinout. Powerful system extensions including Intel® Optane™ memory can be connected via PCI Express Gen 3.0 Lanes. 4x SATA 6G ports with RAID0/1 support are available for conventional storage media. Further I/O interfaces include 1x Gigabit Ethernet with Intel® AMT support, 4x USB 3.0, 8x USB 2.0, HDA, 4x GPIOs, LPC, SPI, I2C Bus, and 2x UART. The modules support the 64-bit versions of Microsoft Windows 10 and Windows 10 IoT as well as all common Linux operating systems. Individual integration support, an extensive range of accessories as well as optional Embedded Design & Manufacturing Services for individual carrierboard and system designs complete the package.

Functional Diagram

conga-TS175

Feature List
Datasheet

Formfactor COM Express Basic
CPU Intel® Core™ i7-7820EQ (4 x 3.0 / 3.7 GHz, 8MB Cache, 45W)
Intel® Core™ i5-7440EQ (4 x 2.9 / 3.6 GHz, 6MB Cache, 45W)
Intel® Core™ i5-7442EQ (4 x 2.1 / 2.9 GHz, 6MB Cache, 25W)
Intel® Core™ i3-7100E (2 x 2.9 GHz, 3MB Cache, 35W)
Intel® Core™ i3-7102E (2 x 2.1 GHz, 3MB Cache, 25W)
Intel® Xeon® E3-1505M V6 (4 x 3.0 / 4.0 GHz, 8MB Cache, 45W)
Intel® Xeon® E3-1505L V6 (4 x 2.2 / 3.0 GHz, 8MB Cache, 25W)
DRAM 2 Sockets, SO-DIMM DDR4 up to 2400 MT/s and 32GByte dual channel, optionally with ECC support
Chipset Mobile Intel® 100 Series Chipset
Ethernet Intel® i219-LM GbE LAN Controller with AMT 11.6 support
I/O Interfaces 8 x PCI Express GEN 3.0 lanes
4 x Serial ATA Gen 3
4 x USB 3.0 (XHCI)
8 x USB 2.0 (XHCI)
1 x PEG x16 Gen 3
LPC bus
I²C bus (fast mode, 400 kHz, multi-master)
2 x UART
Sound Digital High Definition Audio Interface with support for multiple audio codecs
Graphics Intel® Gen9 HD Graphics Engine
OpenCL 2.1, OpenGL 5.0 and DirectX12 (for Windows 10) support | up to three independent displays: HDMI 1.4a / DisplayPort 1.2 / eDP 1.3 | High performance hardware MPEG-2 decoding | WMV9 (VC-1) and H.265 (HEVC) support Blu-ray support @ 40 MBit/s | HEVC, VP9 and VDENC encoding
congatec Board Controller Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | LVDS backlight control I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control
embedded BIOS Features AMI AptioV® UEFI 2.x firmware
8/16 MByte serial SPI firmware flash
Security
The conga-TS175 can be optionally equipped with a discrete ”Trusted Platform Module” (TPM 1.2 / 2.0)
Power Management ACPI 4.0 with battery support
Power Consumption See User's Guide for full details
Temperature Standard
Operating: 0 to +60°CStorage: -20 to +80°C
Humidity Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.
Video Interfaces 3x TMDS (HDMI) / DisplayPort 1.2 with support for Multi-Stream Transport (MST) | resolutions up to 4k | VGA (optional)
Dual channel LVDS transmitter, Supports flat panels 2x24 Bit interface | VESA and openLDI colour mappings | resolutions up to 1920x1200 Automatic Panel Detection via EDID/EPI
Size 95 x 125 mm (3.74" x 4.92")


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