conga-MA5 - Intel® Atom™/Pentium®/Celeron®

conga-MA5 - COM Express® Type 10 with Intel® Atom™/Pentium™/Celeron™ "Apollo Lake"

The credit card sized conga-MA5 COM Express Mini Type 10 modules for the industrial and extended temperature range  are equipped with the latest Intel® Atom™, Celeron® and Pentium® processors (code name Apollo Lake) and impress with 30% more processing power and 45% more graphics performance on a very small standardized form factor.

Module Variants and Accesories

Part# Variant Description
048000 MA5/E3950-8G eMMC32 Intel® Atom™ E3950 quad core, 1.6GHz up to 2.0GHz, 2MB L2 cache, 8GB 1866MT/s DDR3L onboard memory and 32GB eMMC onboard flash.
048001 MA5/E3940-4G eMMC16 COM Express Mini Type10 module with Intel® Atom™ E3940 quad core, 1.6GHz up to 1.8GHz, 2MB L2 cache, 4GB 1866MT/s DDR3L onboard memory and 16GB eMMC onboard flash.
048002 MA5/E3930-2G eMMC16 COM Express Mini Type10 module with Intel® Atom™ E3930 dual core, 1.3GHz up to 1.8GHz, 2MB L2 cache, 2GB 1600MT/s DDR3L onboard memory and 16GB eMMC onboard flash.
048010 MA5/i-E3950-8G eMMC16 Intel® Atom™ E3950 quad core, 1.6GHz up to 2.0GHz, 2MB L2 cache, 8GB 1866MT/s DDR3L onboard memory and 16GB eMMC onboard flash. Industrial grade temperature range from -40°C to 85°C.
048011 MA5/i-E3940-4G eMMC16 Intel® Atom™ E3940 quad core, 1.6GHz up to 1.8GHz, 2MB L2 cache, 4GB 1866MT/s DDR3L onboard memory and 16GB eMMC onboard flash. Industrial grade temperature range from -40°C to 85°C.
048012 MA5/i-E3930-4G eMMC16 Intel® Atom™ E3930 dual core, 1.3GHz up to 1.8GHz, 2MB L2 cache, 4GB 1600MT/s DDR3L onboard memory and 16GB eMMC onboard flash. Industrial grade temperature range from -40°C to 85°C.
048020 MA5/N4200-8G eMMC32 Intel® Pentium® N4200 quad core, 1.5GHz up to 2.50GHz, 2MB L2 cache, 8GB 1866MT/s DDR3L onboard memory and 32GB eMMC onboard flash.
048022 MA5/N3350-4G eMMC16 Intel® Celeron™ N3350 dual core, 1.1GHz up to 2.3GHz, 2MB L2 cache, 4GB 1600MT/s DDR3L onboard memory and 16GB eMMC onboard flash.
048050 MA5/i-CSP-T Passive cooling solution for COM Express Mini Type10 module conga-MA5 with lidded Intel Atom processor. All standoffs are M2.5mm thread.
048051 MA5/i-CSP-B Passive cooling solution for COM Express Mini Type10 module conga-MA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole.
048052 MA5/i-HSP-T Standard heatspreader for COM Express Mini Type10 module conga-MA5 with lidded Intel Atom processor. All standoffs are M2.5mm thread.
048053 MA5/i-HSP-B Standard heatspreader for COM Express Mini Type10 module conga-MA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole.
048054 MA5/CSP-T Passive cooling solution for COM Express Mini Type10 module conga-MA5 with open silicon Intel Pentium and Celeron processor. All standoffs are M2.5mm thread.
048055 MA5/CSP-B Passive cooling solution for COM Express Mini Type10 module conga-MA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole.
048056 MA5/HSP-T Standard heatspreader for COM Express Mini Type10 module conga-MA5 with open silicon Intel Pentium and Celeron processor. All standoffs are M2.5mm thread.
048057 MA5/HSP-B Standard heatspreader for COM Express Mini Type10 module conga-MA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole.

 

Angebot anfordern

Target Applications

Target applications can be found wherever a small footprint matters and where the rich eco system of COM Express is key for engineers, as is the case for handheld and rugged mobile applications as well as stationary mini devices and IoT gateways. Mobile devices benefit from approximately 15% longer battery life while connected industrial devices benefit especially from the enhanced real-time capabilities. Impressive for all applications is the massively improved graphics performance that now also includes the support of 4k displays.

Feature Set Details

The conga-MA5 COM Express Mini modules are available with the power saving Intel® Atom™ processors E3930, E3940 and E3950 for the extended temperature range of -40° C to +85° C, or are fitted with the more powerful low-power dual-core Intel® Celeron® N3350 and quad-core Intel® Pentium® N4200 processors. With up to 8 GB dual channel DDR3L RAM the modules offer best in class memory performance and significant bandwidth advantages compared to competing modules with only single channel memory. They also feature the high-performance Intel Gen9 graphics which provides up to 18 execution units to support up to 2 independent displays via single channel LVDS/eDP and the digital display interface for DP 1.2 or HDMI 1.4b. For IoT connectivity and generic extensions, there are 1x Gigabit Ethernet interface, 4x PCIe 2.0 lanes and 8 USB ports, two of which are provided as USB 3.0. Additional peripherals can be connected via 1x SPI, 1x LPC, 4x GPIO and 2x serial UART interfaces. For the storage media, up to 128 GB of on board flash memory with fast eMMC 5.1, or 2x 6 Gbps SATA are an option. Audio signals are carried via HDA.

Block Diagram

conga-MA5 block diagram

Supported Operating Systems

Software support is provided for Microsoft Windows 10, including the Microsoft Windows 10 IoT versions and all current Linux operating systems. The Board Support Package will also include support for the latest Wind River IDP 3.1. Customized integration support, a comprehensive range of accessories including cooling solutions and an evaluation carrier board as well as optional Embedded Design & Manufacturing services for application specific carrier board and system designs are also available.

Featureset

Data Sheet

Formfactor COM Express Mini
CPU Intel® Atom™ x7-E3950 (4 x 1.6 / 2.0 GHz, 2MB L2 cache, 12W)
Intel® Atom™ x5-E3940 (4 x 1.6 / 1.8 GHz, L2 cache 2MB, 9W)
Intel® Atom™ x5-E3930 (2 x 1.3 / 1.8 GHz, L2 cache 1MB, 6.5W)
Intel® Pentium® N4200 (4 x 1.1 / 2.5 GHz, L2 cache 2MB, 6W)
Intel® Celeron® N3350 (2 x 1.1 / 2.4 GHz, L2 cache 1MB, 6W)
DRAM Dual channel onboard DDR3L memory support for up to 8 GByte at 1866MT/s
Chipset Integrated in SoC
Ethernet Intel® I210 (Industrial) / I211 (Commercial) Gigabit Ethernet Controller
I/O Interfaces 4 x PCIe Gen2
2 x USB 3.0
6 x USB 2.0
2 x SATA3
SDIO
LPC bus
SM-Bus
I²C bus
2 x UART
Sound High Definition Audio Interface
Graphics Intel® HD Graphics Gen 9 | PAVP 2.0 | H.265/HEVC | VP9 | OpenCL 2.0 | OpenGL 4.3 | OpenGL ES 3.0 | DirectX12 | HDCP1.4
congatec Board Controller Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | LVDS backlight control I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control
embedded BIOS Features AMI AptioV® UEFI 2.x firmware
8 MByte serial SPI firmware flash
OEM Logo
OEM CMOS Defaults
LCD Control
Display Auto Detection
Backlight Control
Flash Update
Security Infineon’s Trusted Platform Module (TPM 2.0/1.2) SLB 9665/9660 option
Power Management ACPI 5 .0 compliant, Smart Battery Management
Operating Systems Microsoft® Windows 10 Enterprise
Microsoft® Windows IoT Core
Linux
Android
Power Consumption Typ. application <10 Watt
Typ. application <10 W @ 5 V, CMOS Battery Backup
Temperature Standard
Operating: 0 to +60°CStorage: -20 to +80°C
Humidity Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.
Size 55 x 84 mm (2.17" x 3.31")

 

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